QUANTIFYING THE IMPROVEMENTS IN THE SOLDER PASTE PRINTING PROCESS FROM STENCIL NANOCOATINGS AND ENGINEERED UNDER WIPE SOLVENTS

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1 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 QUANTIFYING THE IMPROVEMENTS IN THE SOLDER PASTE PRINTING PROCESS FROM STENCIL NANOCOATINGS AND ENGINEERED UNDER WIPE SOLVENTS Chrys Shea, Shea Engineering Services Mike Bixenman and Debbie Carboni, Kyzen Brook Sandy-Smith and Greg Wade, Indium Ray Whittier, Vicor Corporation Joe Perault, Parmi Eric Hanson, Aculon Abstract Over the past several years, much research has been performed and published on the benefits of stencil nano-coatings and solvent under wipes. The process improvements are evident and well-documented in terms of higher print and end-of-line yields, in improved print volume repeatability, in extended under wipe intervals, and in photographs of the stencil s PCB-seating surface under both white and UV light. But quantifying the benefits using automated Solder Paste Inspection (SPI) methods has been elusive at best. SPI results using these process enhancements typically reveal slightly lower paste transfer efficiencies and less variation in print volumes to indicate crisper print definition. However, the improvements in volume data do not fully account for the overall improvements noted elsewhere in both research and in production. This paper and presentation outlines a series of tests performed at three different sites to understand the SPI measurement processes and algorithms, and suggests inspection parameters to better capture and quantify the correlation between nanocoatings and solvent under wipes with overall print quality and process performance. Introduction With smaller electronic component features, it is imperative that solder paste deposits and volume transfer be repeatable and reproducible from board to board. Numerous factors can adversely affect the reproducibility and repeatability of print process. For smaller pad features, solder paste transfer efficiency is critical to prevent poor solder joints. Solder paste build up onto the aperture walls and bottom side of the stencil lead to insufficient transfer of solder paste onto small pads. The criticalities of high solder paste release from apertures and under stencil cleanliness increases when printing small feature deposits. During the solder paste transfer process, the goal is for the solder paste to have a stronger attraction to the printed circuit board pads than to the walls of the stencil apertures. The process is affected by the stencil design; solder paste properties, print pressure and board separation speed. The adhesive forces of the solder paste to the aperture opening must be reduced when stencil printing to small feature pads. As the area ratio decreases, the force applied to the paste by the aperture walls increases, causing a decrease in solder paste transfer efficiency. A smooth wall and clean surface exerts less adhesion for the solder paste to stick. Additionally, modifying the stencil surface with a hydrophobic coating allows the solder paste to repel against the stencil aperture, rending a crisper print. Research Hypothesis The purpose of the research is gain knowledge as to the effects of hydrophobic coatings and understencil cleaning on print quality, yield and process performance. H 1 ~ Hydrophobic Coated Stencils improve transfer effectiveness on small feature prints H 2 ~ Engineered Wipe Solvents improve transfer print yields on small feature prints Hydrophobic Surface Coatings Hydrophobic surface coatings modify the stencil surface using a coating that adheres to the metal surface. The self-assembled phosphonate monolayer imparts hydrophobicity by adhering to the metal complex. The thickness of the coating is 3-5 nanometers. The coating contains a reactive head group and tail groups connected through a stable phosphorous carbon bond (figure 1). The head group reacts with the surface while forming strong and stable metal phosphorous bonds. 1 The tail group 1

2 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 sticks out from the surface rendering a non-stick surface improving paste release, there is less solder paste buildup next to property. The strength of the covalent chemical bond renders a the apertures on the bottom side of the stencil. Transferring coating that can withstand numerous print and cleaning cycles. sufficient solder paste to small pads improves the strength of the solder joint and reduces opens. Functional Tail Group Repels flux Phosphonate Head Group Bonds to stencil 5 nm max Understencil Wipe Process The understencil wipe process is designed with a roll of fibrous wiping material for wiping across the underside of the stencil. The stencil printing machine software provides the operator a recipe of options for programming the wipe sequence. A common wipe sequence is a dry wipe, followed by a wet wipe with solvent, followed by a vacuum wipe to attract stray solder balls and to remove trace levels of the wipe solvent into the wiper roll.. Each wiper sequence traverses back across the stencil in the opposite direction of the previous wiper sequence. Figure 1: Reactive Head and Tail Groups Treating the stencil with hydrophobic surface treatments provides the potential to improve solder paste release, reduce flux build-up away from the aperture and increase the number of prints before wiping the bottom side of the stencil. Nano-coated stencils work in two complementary ways to reduce the adhesive force between the solder paste and aperture wall. First, by adding the extremely thin coating, the roughness of the aperture is reduced. Additionally, the coating fills in some of the valleys in the surface topology. This coating on the aperture wall decreases the adhesion forces. The coating chemically modifies the surface of the aperture while decreasing the chemical attraction that the paste has to the metal surface. The theory behind nano-coating has to do with surface energy, terms that denote how liquids interact with surfaces. Unmodified metal surfaces are typically high in surface energy. Surfaces with high surface energy are held together by strong or high energy chemical bonds (ionic, covalent or metallic). High energy surfaces are typically able to be wetted (a liquid can readily spread over the surface of the material) by most liquids due to the interaction of the surface and the liquid being stronger than the interaction between liquid molecules. Low energy solids, on the other hand, are held together primarily through physical interactions, such as hydrogen bonds (Van der Waals attractive forces). Since these surfaces interact with liquids via weaker methods, the surface tension of the liquid is too great for the surface to overcome, and the liquid does not spread. Nano-coatings impart low surface energy, which is specifically important within the sidewalls of the aperture. Small levels of solder paste buildup along the aperture sidewall can result in transferring insufficient solder paste. The nano-coating repulsive force leaves less solder paste buildup and improves release. By 2 Isopropyl alcohol (IPA) is the common solvent used when a wet wipe is programmed into the wiping recipe. IPA has been the go-to solvent for cleaning unreflowed solder paste. Historically, the choice of IPA made sense, as most solder flux packages dissolved in IPA. The vapor pressure of IPA allowed for a solvent that evaporated and absorbed into the wipe paper. This beneficial property left a clean and dry surface. The problems with IPA are flammability and poor solubility match for many lead-free no-clean solder pastes (Figure 2). Figure 2: IPA is a Poor Match on many No-Clean Solder Pastes A critical requirement in cleaning the bottom side of the stencil is the ability to rapidly dissolve the flux component within the solder paste. By doing so, the solder spheres release and can be picked up with the wiping paper. Secondly, the flux stickiness and spread on the bottom side of the stencil is effectively cleaned. If flux builds up on the bottom side of the stencil, the flux bleed-out will transfer to the next board printed. It can create immediate stencil-pcb separation issues, and can also create longer-term electrochemical reliability issues. The flux bleed will eventually bridge solder pads, which can increase leakage risks when running no-clean processes (Figure 3). On

3 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 fine feature parts, removal of flux bleed is critical in preventing A factorial experiment was designed to study the effect of nanocoating and wet wiping using an engineered solvent. The the flux from spreading away from and bridging across solder pads. response variable relates to transfer effectiveness on fine aperture prints. It was executed in Indium Corporation s test laboratory. Good Figure 3: Preventing Flux Bleed Bad An ideal wipe solvent is non-toxic, compatible with the stencil printer, rapidly dissolves a wide range of flux compositions and dries similar to IPA. The drying feature is a critical design factor. Slow drying wipe solvents leave the bottom side of the stencil wet (Figure 4). Low evaporating wipe solvents can cross contaminate the solder paste as well as transfer the wipe solvent up the apertures and onto the board being printed. Test Vehicle: The test vehicle used in the study is a popular industry standard board that is commonly referred to as the Jabil Solder Paste Test Board, available through Practical Components. It is a 3- up panel that measures approximately 5 x 8in. Each of the 3 boards on the panel contains numerous test patterns, including square, circular and rectangular pads that are both solder mask defined (SMD) and non-solder mask defined (NSMD) in sizes ranging from 3-15mils; bridging/slump patterns from 0.1 to 0.25mm; and area array patterns for 0.4 and 0.5mm pitch BGA devices. The area array patterns were used in the majority of the data analysis. Figure 5: Jabil Three up Test Board Factors: Surface Treatment: The stencil for the 3-up test panel contained the following treatments in each print area: 1. Board 1: Nano-Coating #1 2. Board 2: No Treatment 3. Board 3: Nano-Coating #2 Figure 4: Slow evaporating wipe solvent The engineered wipe solvent used in this study is a solventbased stencil cleaning fluid specifically designed to clean leadfree wet solder paste. The wipe solvent dissolves the flux vehicle, which allows solder spheres to release from the stencil during the stencil cleaning process. Methodology 3 Wipe Solvents: 1. No-wipe solvent (Dry Wiping) 2. IPA 3. Engineered Wipe Solvent Solder Paste: 1. Lead-free no-clean solder paste with ultra-violet (UV) tracer added Number of Prints before Wiping: 1. Wipe after every print a. Dry Wipe

4 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, Wipe after six prints a. Vacuum Wipe The average volumes did not vary substantially among the b. Wet or Dry Wipe different wipe cycles or coatings, as seen in Figures 5 and 6. c. Vacuum Wipe Over the course of the tests, the volume range average for the Wipe Possibilities: 0.5mm BGA deposits was cu mils and the range on the 1. D: Dry Wipe 0.4mm BGA deposits ran from cu mils. Within each 2. DV: Dry Wipe /Vacuum dataset, the standard deviations were approximately 6% or less. 3. Wet / Vacuum 4. Vacuum / Wet / Vacuum 5. Dry / Wet / Vacuum Responses: 1. Solder Paste Inspection using a Koh Young 3020 Moire-based SPI system 2. Visual assessment of under wipe efficacy using digital camera and UV light source One trend appeared to emerge; nano-coating #2 consistently deposited slightly lower volumes than the untreated print area or the one treated with nano-coating #1. While the differences are small - on the order of approximately 3% - they are consistent not only within this set of experiments, but with many previous tests as well. 2-3 The continued findings of slightly lower transfer efficiencies led to Hypothesis #1, that the hydrophobic coated stencils improve transfer effectiveness. Solder Paste Inspection Data Findings The results of the initial review of the volume and variation data generated in the DOE were inconclusive. Transfer effectiveness refers not only to the amount of solder paste deposited, but also to the desired shape of the deposit. Ideally, solder paste deposits have vertical walls and flat tops, but as apertures get smaller and area ratios get tighter, that crisp print definition gives way to domed-shaped deposits with angled walls and rounded tops. Hypothesis #1 asserts that the coating on the stencil enables crisper print definition by limiting flux and paste spread on the bottom of the stencil, allowing cleaner release during PCB-stencil separation. Empirical data has supported Hypothesis #1 with numerous visual observations. To attempt to characterize print definition quantitatively, a test was devised to use SPI equipment to numerically capture the shape of the deposit. Figure 5. Average Deposit volumes for 0.5mm BGAs measured on Indium s Moire SPI Figure 6. Average deposit volumes for 0.4mm BGAs measured on Indium s Moire SPI 4 The SPI system used in the first trials was a popular 2-camera benchtop system based on Moire interferometry. Like most SPI systems, it sets a measurement threshold at a known distance above the PCB surface, precisely measuring everything above the threshold, and estimating volumes below the threshold. The volume estimate is calculated by multiplying the area at the threshold by the height of the threshold. Typical default thresholds are 40µm, or roughly 1.5mils, above the PCB surface. This distance is sufficient to stay above the topographical features of the PCB that could introduce noise into the solder paste measurement, such as copper traces, solder mask, or ink. This distance may, however, be too high to capture the subtle shape differences at the base of the deposits that are related to the cleanliness of the stencil s bottom. To characterize the deposits shapes, successive measurements of the same deposits were taken using thresholds at 60, 50, 40, 30, 20 and 10µm above the PCB surface. The area measurements at each level were used to calculate the edge

5 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 length of the square deposits, which were then divided by 2 and The results showed that differences in readings among the plotted in bar chart format to represent deposit profiles. The different stencil treatments are only apparent at the 10 and 20µm measurements for the 0.5mm and 0.4mm BGAs are shown in threshold levels. Above these levels, the areas all look the Figures 7 and 8. same, indicating they would produce similar estimates for the volumes under the thresholds. To explore the effect of SPI parameters on area and volume readings, a similar experiment was run on Vicor s NPI line using a similar Moire interferometry SPI (KY 3020) machine (Figures 9 and 10). Additionally, SPI experts from Parmi, a leading manufacturer of laser-based SPI machines were consulted and similar tests were run on the Parmi Sigma X in the Parmi laboratory. Figure 7. Paste deposit profiles for 0.5mm BGA constructed from area reading at decreasing measurement thresholds on Indium s Moire SPI Figure 9. Increasing volume reading with decreasing measurement thresholds (no coating on stencil) on Vicor s Moire SPI Figure 8. Paste deposit profiles for 0.5mm BGA constructed from area reading at decreasing measurement thresholds on Indium s Moire SPI 5

6 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 Figure 10. Increasing area readings with decreasing measurement thresholds (no coating on stencil) on Vicor s Moire SPI Similar tests repeated in the Parmi laboratory demonstrated similar results, shown in Figures 11 and 12. Figure 13. Different volume readings at different measurement thresholds Figure 11. Increasing volume reading with decreasing measurement threshold (no coating on stencil) on Parmi s laserbased SPI In all three sets of tests, area and volume readings increased as measurement thresholds decreased. Figure 13 shows the comparison of the Moire and laser SPI volume readings at descending thresholds. Note that different prints were measured in the different laboratories so volume readings should not be compared between machines, and accuracy assessments should not be made based on this data. Figure 14. Differentiation in area data more obvious at low measurement threshold Figure 12. Increasing area reading with decreasing measurement threshold (no coating on stencil) on Parmi s laser-based SPI. At the typical default 40µm threshold, differences between prints are not obvious; at the 10µm threshold, they are. Figure 14 shows area data generated with three different sets of print parameters (labeled B, C and D) at Vicor. Print parameter set C was the same as B, except for 1.5mil offsets in X and Y to purposely create gasketing issues. The effects of the 6

7 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 compromised gasketing are noticeable at the 10µm level, but not The solder paste used for this research was a lead-free no-clean at the 40µm level. solder paste. An ultraviolet tracer was blended into the solder Calculations based on the readings taken at all three test sites paste. After the six boards were printed, an understencil wipe indicate that for the 0.5mm BGA s deposit (11.4mil square) at was completed. Following the wipe, the stencil was removed the 40µm threshold, the SPI machines measure the top 55-60% from the stencil printer, turned over to the back side and imaged of the deposit, and estimate the bottom 40-45% of it based on its using a black light flash. The black light captured the flux left on cross-sectional area 40µm above the PCB pad. At the 10µm the bottom side of the stencil. level, the machines measure the top 85-88% of the deposit and estimate the bottom 12-15% based on the cross-sectional area 10µm above the PCB pad. Note that the Type 4 solder paste used in this test, and in many fine feature applications, has a typical particle size in the range of 20-38µm. Theoretically, it is possible for an entire layer of solder paste pump out to go undetected at the 40µm threshold, particularly with pastes comprised of smaller, more uniformly sized and shaped particles. It should be stressed that a 10µm SPI measurement threshold is not advisable for production monitoring because the noise that nearby topographical features can introduce into the measurement system can affect measurement accuracy. However, for laboratory exploration of the quantifiable effects of a clean stencil contact surface, the lower measurement thresholds may be required. In Moire-based SPI machines used in this experiment, the threshold setting is global only, applying to all measurements taken off a PCB. In the Parmi laser-based machine used in this test, the threshold is adjustable locally for individual devices or pads, offering more flexibility for both laboratory and production-based studies. Visual Assessment of Under Wipe Efficacy An understencil wipe was performed after six stencil prints. The three-up board allowed for comparing and contrasting both the nano-coating and wipe solvents. The stencil was set up where the stencil s print area for first board was coated with nanocoating #1, the second board with no-coating and the third board with nano-coating #2. The understencil wipe data findings that are reported used a programmed sequence into the stencil printer menu: 1. Vacuum wipe 2. Wet or dry wipe 3. Vacuum wipe The data findings in Table 1 show the influence of the wipe recipes, nano-coating influence and wipe solvent influences. Dry Wipe /Vacuum Wipe: The dry wipe followed by a vacuum wipe recipe found that the nano-coatings reduced the level of flux stains on the underside of the stencil. On the non-coated stencil, a more pronounced level of visible flux stains was present across the bottom side of the stencil. Vacuum Wipe / IPA Wipe / Vacuum Wipe: The levels of flux next to and within the apertures were more pronounced for both the nano-coated and non-coated stencil areas. The data indicates that IPA was not very compatible with the flux vehicle. IPA s poor match for the flux composition resulted in significantly higher levels of flux remaining on the bottom side of the stencil. Vacuum Wipe / Engineered Solvent Wipe / Vacuum Wipe: The levels of flux on both nano-coated and noncoated stencil areas were very low. The data indicates that an engineered solvent matched to the flux composition removes flux build-up on the bottom side of the stencil and renders more consistency from the understencil wipe process. 7

8 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 Wipe Type Nano-Coating #1 No Coating Nano-Coating #2 VDV VWV IPA VWV Eng Solv Table 1: Visual results of the understencil wipe recipes on the PCB contact surface of the stencil Inferences from the SPI Data Findings Initial findings indicated no significant, measureable difference in recorded transfer efficiencies among the different test parameters, with the exception of the continuing trend of nanocoating #2 consistently showing slightly lower paste transfer than nano-coating #1 or the untreated stencil areas. The investigation into deposit shape quantification, however, revealed definite differences in shape geometries as measurement thresholds were set closer to the PCB surface. Subsequent investigations and calculations confirmed the inability to adequately capture shape differences at the base of the deposits using standard production measurement parameters. Inferences from Visual Assessment of Under Wipe Efficacy The visual findings show a reduced level of flux buildup by coating the stencils with a nano-coating. If a wipe solvent is not used, the nano-coatings are effective at reducing the level of flux 8 buildup on the bottom side of the stencil. The nano-coating provided two benefits: (1) Better paste release, and (2) Lower levels of flux buildup next to the aperture on the bottom side of the stencil. The visual findings also indicate the effects of a poorly matched solvent to the flux composition. When a solvent does not dissolve the flux composition, the flux tends to agglomerate as sticky goo. As such, the flux spreads across the bottom side of the stencil. The data leads the researchers to think that this condition could get worse over the course of a print run. The visual findings indicate the effects of a properly engineered solvent to the flux composition. When the solvent dissolves the flux composition, the level of flux on the bottom side of the stencil is significantly reduced. A properly engineered solvent

9 Originally published at the International Conference on Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 worked well for both coated and non-coated stencils. A critical laboratory test vehicles and inspection parameters should be consideration when selecting an engineered solvent is the developed that enable lowering the measurement threshold while solvent s vapor pressure to assure that the solvent is evaporated maintaining accuracy. quickly once a wipe cycle is complete. Conclusions Measuring the effects of solvent under wipes and stencil nanocoatings on individual solder paste deposits is challenging. On a large scale, data from production lines clearly indicate better SMT yields when either engineered solvent wipes or nanocoatings (or both) are employed in the printing process. Visually, the difference in stencil cleanliness when solvent under wipes or nano-coatings are used is easy to see; intuitively, it is obvious that a cleaner stencil contact surface enables better gasketing to produce better print quality, and clearer apertures release more consistent paste volumes. Quantitatively, however, automated SPI measurements have historically given only slight indications of print quality differences. Visual results indicate that, when dry wiping, nanocoated stencils clean up more readily than non-coated stencils. They also indicate that the wet wipe with engineered solvent effectively cleans solder paste from all stencil areas, regardless of coating type. SPI results that consistently show slightly lower TEs for nanocoated areas continue to support the hypothesis that nanocoatings improve print definition and therefore transfer effectiveness. Initial attempts at quantitatively profiling paste deposits also support the hypothesis; however, the small amount of data is not sufficient to draw a firm conclusion, and more testing is needed. Research relies heavily on quantitative analysis to characterize the levers that influence a process. Performance differences that can be measured can be compared to understand the relationships among a system s inputs and its outputs. Quantifying the effects of solvent under wipes and stencil nanocoatings on typical solder paste deposits requires measurements that capture the differences in deposit volumes and shapes. SPI measurements taken using typical production parameters do not fully capture the differences in critical areas of paste deposits their bases, where pump out, slump and the effects of poor alignment, gasketing or release close the gaps between the PCB pads. To effectively study the influence of solvent under wipes and stencil nanocoatings in these critical areas which may be the key to higher yields and future process improvements - Continuing Research Research on the effects of solvent under wiping and stencil nano-coating continues with both SPI data collection and visual assessments. More SPI work is being performed with lower measurement thresholds, and paste release videos are being recorded and analyzed. The results of these studies will be published as they become available. REFERENCES 1. Aculon (2013). NanoClear Features and Benefits. Aculon Incorporated. 2. Evaluation of Stencil Materials, Suppliers and Coatings, C. Shea and R. Whittier, Proceedings of SMTA International, October, Fine Tuning the Stencil Manufacturing Process and Other Stencil Printing Experiments, C. Shea and R. Whittier, Proceedings of SMTA International, October,

10 Originally published at the International Conference for Soldering and Reliability, Toronto, Ontario, Canada, May 13, 2014 QUANTIFYING THE IMPROVEMENTS IN THE SOLDER PASTE PRINTING PROCESS FROM STENCIL NANOCOATINGS AND ENGINEERED UNDER WIPE SOLVENTS Debbie Carboni and Mike Bixenman, Kyzen Chrys Shea, Shea Engineering Services Ray Whittier, Vicor Corporation Brook Sandy-Smith and Greg Wade, Indium Joe Perault, Parmi USA Eric Hanson, Aculon

11 Agenda Research Purpose / Hypotheses Background Hydrophobic Surface Coatings Understencil Wipe Solvents Accurately Characterize Print Efficiency

12 Purpose of Research Understand SPI Measurement processes and algorithms Print quality and process performance Quantify the correlation between Nano-coatings Solvent under wipes

13 Hypotheses H 1 ~ Hydrophobic Coated Stencils improve transfer effectiveness on small feature prints H 2 ~ Engineered Wipe Solvents improve transfer print yields on small feature prints Outputs Visual assessment using a digital camera and UV light source Solder paste inspection results

14 Transfer Effectiveness Represents Amount of solder paste deposited Desired shape of the deposit SPI Methodology Moire interferometry with 2 cameras Sets a measurement threshold at a known distance above the PCB surface Measures everything above the threshold Estimates volumes below the threshold

15 Deposit Geometry and SPI Threshold Location Influence Accuracy 5mil 3mil IDEAL SOLDER PASTE DEPOSIT Accurate measurement REAL SOLDER PASTE DEPOSIT Not-so-accurate measurement

16 SPI Measurement Threshold Volume of base estimated using crosssectional area and height at threshold Volume Calculation = X-Sect Area * Height Ignored volume based on estimate Everything measured ABOVE the threshold is accurate Everything measured BELOW the threshold is an estimate

17 Causes for Poor Transfer Poor release of solder paste from aperture Paste and flux stays in the aperture walls Pad and aperture size or design mismatch Gasketing Space between stencil and pad allows bleed out under stencil Poor registration creates gasketing issues bleed out. Solder paste characteristics Solder paste spheres accumulate around apertures and underside of stencil gradually creating poor gasket Flux build-up on underside can cause a tacky film which will require off line stencil cleaning and a production delay.

18 Improving Paste Transfer Encourage paste release from apertures Repel solder paste and flux bleed out on stencil underside Effectively remove solder paste and flux from the stencil under side

19 HYDROPHOBIC SURFACE COATINGS

20 Hydrophobic Surface Coatings Repellency Water repellent: hydrophobic Oil repellent: oleophobic Examples of Common Water and Oil Repellency Treatments On fabric On carpet On paper food containers

21 Flux Repellent: Fluxophobic Example of Fluxophobic Stencil Treatment Untreated stencil Flux wicks out on the bottom surface away from the apertures Treated stencil Flux is repelled from the bottom surface and is contained primarily within the apertures

22 Flux Repellency on Stencils Flux Treated with UV Tracer Dye Untreated stencil Flux wicks out on the bottom surface away from the apertures Treated stencil Flux is repelled from the bottom surface and is contained primarily within the apertures

23 Hydrophobic Surface Coatings Modify the stencil surface Coating adheres to the metal surface Imparts hydrophobicity

24 Isopropyl Alcohol (IPA) Common wipe solvent Fast evaporation Ineffective on many lead-free solder pastes

25 Engineered Wipe Solvent Matched to the solder paste flux (like dissolves like) Fast Evaporation Non-flammable Environmentally friendly Low odor

26 Drying Fast drying is a critical design factor Slow drying wipe solvents leave the bottom side of the stencil wet Light enhanced image

27 Jabil Solder Paste Test Vehicle

28 Factors Surface Treatment Board 1: Nano-Coating #1 Board 2: No Treatment Board 3: Nano-Coating #2 Wipe Solvents No-wipe solvent (Dry Wiping) IPA Engineered Wipe Solvent Solder Paste Lead-free no-clean solder paste with ultra-violet (UV) tracer added Prints before Wiping Wipe after 1 & 6 prints Wipe Possibilities: D: Dry Wipe DV: Dry Wipe /Vacuum Wet / Vacuum Vacuum / Wet / Vacuum Dry / Wet / Vacuum

29 Visual Wipe Assessment Ultraviolet tracer added flux which glows more clearily in photos. Underside stencils photographed with black light illumination after each wipe set. Easily reveals flux build up and clogged apetures Light enhanced image

30 Solvent/Paste Compatibility Poorly matched under wipe solvent Visible flux trails on stencil underside Tacky film Build-up of flux over time will interrupt production Properly Engineered under wipe solvent Dissolves all flux components to remove all the spheres Evaporates quickly (Vapor pressure is critical) Improve underside stencil cleanliness with or without use of a coating

31 Wipe Type Nano-Coating #1 No Coating Nano-Coating #2 VDV VWV IPA VWV Eng Solv

32 Wipe Effectiveness Vac/ Dry/ Vac Wipe Less residual flux with coatings Stencil with no coating showed most prominent flux Vac/ Wet/ Vac with IPA More flux seen in and around apertures for all coatings IPA was not very compatible with this flux vehicle Poor compatibility led to more residual flux on stencil Vac/ Wet/ Vac with Engineered Solvent Very little flux seen for all coatings Engineered solvent a strong match for flux vehicle Removed flux build-up and kept stencil clean More consistent clean after repeated cycles

33 SOLDER INSPECTION DATA FINDINGS

34 Solder Paste Deposits 0.5mm BGAs 0.4mm BGAs Volume and variation data inconclusive Coefficient of variations approximately 6% or less

35 SPI Measurement Threshold Volume of base estimated using crosssectional area and height at threshold Volume Calculation = X-Sect Area * Height Ignored volume based on estimate Everything measured ABOVE the threshold is accurate Everything measured BELOW the threshold is an estimate

36 How do Volume Measurements Differ at Different Thresholds? Moire µm 30µm 20µm 10µm 40µm 30µm 20µm 10µm Laser The effects of nanocoating and underwiping may not be getting captured using 40µm measurement thresholds On this experiment s 0.5mm BGA, 40-45% of the reported volumes are estimates of volumes below the threshold Measurements at 10µm began to show differentiation

37 Findings Lead Us to Additional Experiments. Vicor Corp. NPI Line Moire interferometry SPI (KY 3020) SPI experts from Parmi Laser-based SPI machines Similar tests were run on the Parmi Sigma X in the Parmi laboratory.

38 Volume and Area Measurements Data from Vicor trials on Jabil board using KY 3020 Print speed: 0.79 in/sec, Print Pressure 1.1 lb/in Volume (cu mils) Area (sq mils) Volume Estimated 10µm 20µm 30µm 40µm diff % 10µm 20µm 30µm 40µm diff % 10µm 20µm 30µm 40µm Bd % % Bd % % Bd % % % of Volume Estimated % of Volume Measured 25.4um= 1 mil 40u= µm 20µm 30µm 40µm 10µm 20µm 30µm 40µm 30u= Bd 1 15% 26% 36% 45% 85% 74% 64% 55% 20u= Bd 2 15% 25% 36% 45% 85% 75% 64% 55% 10u= Bd 3 15% 26% 37% 46% 85% 74% 63% 54% At 40um, our SPI data is giving us information about the top 55% of each paste deposit, but not telling us much about the bottom half of it. At 10um, our SPI machine is measuring 85% of the deposit and only estimating 15% of it.

39 What if Area measurements at each threshold level were used to calculate the edge length of the square deposits, Then divided by 2 Plot in bar chart format to represent deposit profiles

40 0.5 mm BGA 0.4 mm BGA Dashed blue line represents aperture edge

41 Decreased Measurement Thresholds No coating on stencil Increased volume and area reading Vicor KY SPI Parmi SPI

42 Area Measurement Comparison At 10µm threshold, the SPI machine detects differences in the print. At 40µm threshold, all the deposits have basically the same area. To the SPI machine, they all look the same from 40µm down. Our SPI data at 40um is giving us information about the top portion of each paste deposit, but not telling us anything about the bottom portion of them. We need to get closer to capture the differences

43 Experiment Continued to Capture Differences Boards B & C Parameters were identical; however C has X & Y off set parameters to force bad gasketing. At 40µm threshold, differences between prints are not obvious At 10µm threshold, differences are: Area data three different sets of print parameters (labeled B, C and D) showed increased areas measuring closer to the board Poor gasketing is noticeable at the 10µm level, but not at the 40µm level Theoretically, it is possible for an entire layer of solder paste bleed out to go undetected at the 40µm threshold Particularly with pastes comprised of smaller, more uniformly sized and shaped particles Type 4 solder powder (20-38µm)

44 Legal Disclaimer 10µm and 20µm is NOT for Production Monitoring Will cause Noise - topographical features can affect measurement accuracy However, for laboratory exploration of the quantifiable effects of a clean stencil contact surface, the lower measurement thresholds may be required

45 CONCLUSIONS

46 H 1 ~ Hydrophobic Coated Stencils improve transfer effectiveness on small feature prints Transfer effectiveness encompasses transfer efficiency, volume repeatability, print definition, and under stencil bleed-out Difficult to quantify using production SPI threshold. Advanced SPI methods indicates better print definition with coated stencils 10µm & 20µm SPI thresholds Measurements indicate better print definitions when stencils are coated vs noncoated. Benefits are not limited to small feature only. Visual inspection of coated revealed less flux bleed-out on stencil underside

47 H 2 ~ Engineered Wipe Solvents improve transfer print yields on small feature prints IPA was not effective on this solder paste Engineered solvent was the most effective at solder paste and flux removal regardless of coating. Visually the difference is apparent, initiatively a clean under stencil side is better, however, numerically, it is challenging to quantify the benefits using standard production SPI parameters. Engineered Solvent in combination with nano-coating produces the most effective print process.

48 Best-Practices for Stencil Wipe Comparing numerical transfer efficiencies does not give the full picture of printing effectiveness Deposit base is the location for improvement: Reduced bleed out, improved slump resistance, less flux around deposits, proper gasketing from clean stencil To maintain the most print definition and consistency: Combination of coating and compatible engineered solvent showed cleanest stencil underside Less frequent wiping still effective (frequency depends on solder paste) Transfer efficiencies are not the only benefits seen in the printing process.

49 Continuing Research Research on the effects of solvent under wiping and stencil nano-coating continues with both SPI data collection and visual assessments More SPI work is being performed with lower measurement thresholds, and paste release videos are being recorded and analyzed Results of these studies will be published as they become available

50 Questions