Modular Jack With LED, Magnetics CONNECTOR

Transcription

1 Modular Jack With LED, Magnetics CONNECTOR (MOLEX P/N: ) CONNECTOR 1 of 7

2 1.0 PURPOSE: This test is provided you the result of evaluation of Modular Jack With LED Magnetics connector per product specification PS , Rev. B 2.0 CONCLUSION: The Modular Jack With LED, Magnetics connector passed all pplicable testing in accordance with the product specification PS Rev B 3.0 PPLICBLE DOCUMENTS ND SPECIFICTIONS: MIL-STD-202. PS ED SPECIMEN: 4.1 Connectors: The specific part numbers ( Receptacle: ) in each test group are listed preceding the test results for each test group. 4.2 Fixtures: Standard RJ45 plug 5.0 TEST ITEMS ND SEQUENCE: Group : Examination of product Contact Resistance Mechanical shock Vibration Contact Resistance Examination of product. Group B: Examination of product Connector mating force Contact Resistance Durability Connector mating force Contact Resistance Thermal shock Contact Resistance Humidity (cycle) Contact Resistance Examination of product Group C: Examination of product Dielectric withstanding voltage Insulation resistance Thermal shock Humidity (cycle) Insulation resistance Dielectric withstanding voltage Examination of product Group D: Examination of product Contact Resistance Durability Thermal ging Salt Spray Contact Resistance Examination of product CONNECTOR 2 of 7

3 6.0 TEST METHODS ND REQUIREMENT: 6.1 Examination: Visual inspection. Requirement: No physical damaged. It shall be met the requirements of product drawing. 6.2 DC Resistance: Measure J6~J3 or J2~J1 Open voltage: Less than 20mV. Test current: Less than 100m. Requirement: 1.2ohms max. 6.3 Insulation Resistance: Test voltage: D.C. 100V was applied between each adjacent contact of Un mated connector. Requirement: 500 Mega-ohm min. 6.4 Dielectric Strength: Test voltage: C 1500V was applied for 1 minute between each adjacent contact of unmated connector. Requirement: No breakdown. No creeping discharge or flash over shell occurred. Current leakage: 1.0 m max. 6.5 Connector Mating Forces: Mating connector at a rate of 25+/-6 mm per minute. Requirement: Mating force is 35N max. per connector. 6.6 Plug retention Force: pply axial pull out force on the plug at a rate of 25 +/- 6 mm per minute. Requirement: 89N min. 6.7 Durability: Number of cycles: 750 cycles at a rate of 10 cycles per minute. Requirement: 1.2ohms max. after test. 6.8 Temperature Rise: Mate connector and measure the temperature rise at the rated current (1.5 ) fter 1 hour. Requirement: The temperature rise shall not exceed 30 degrees C. 6.9 Vibration (Random): mplitude: 1.5 mm P-P. Frequency: Hz in one minute. CONNECTOR 3 of 7

4 Duration: 15 minutes. Direction: X,Y,Z axis (45 minutes total) Requirement: 1.2ohms max. discontinuity is 1 microsecond max. and no physical damaged in appearance after test Shock (Mechanical): Mated connectors and shock at 50G half-sine, 11 ms form shocks in the X,Y, Z axis (9 shocks total). Requirement: 1.2ohms max. discontinuity is 1 microsecond max. nd no physical damaged in appearance after test Thermal ging: Mate connector; expose to: 48 hours at 85+/-2 degrees C Requirement: No traffic test fail.1.2ohms max. nd no physical damaged in appearance fter test 6.12 Humidity (Cycle): Specimens were subjected to Humidity cycle test in accordance with MIL-STD-202F method 106F (without -10 degrees C dip) Requirement: Mated connectors and expose to10 cycles at 90 to 95 RH% relevant humidity with temperature at +25 degrees C and 65 degrees C. No traffic test fail.1.2ohms max. and no physical damaged in appearance after test Thermal Shock: Mating connectors and expose to 10 cycles of -40 degrees C to+85 degrees C. 30 Minutes dwell. Requirement: No traffic test fail.1.2ohms max. and no physical damaged in ppearance after test 6.14 Salt Spray: Salt solution: 5+/-1% Duration: 48hours Requirement: No traffic test fail.1.2ohms max. and no physical damaged in appearance after test Solder ability: Temperature: 245 +/- 5 degrees C. Duration: 5 +/- 1seconds, up to 1.0 mm from the bottom of the HSG. Requirement: 95% coverage min. CONNECTOR 4 of 7

5 6.16 IR Reflow: Requirement: No traffic test fail.1.2ohms max. and no physical damaged in appearance after test. 7.0 TEST EQUIPMENT: Milliohm Meter (GW /801G) Withstanding Voltage/insulation nalyzer (GW/735) utomatic Load Tester (IKOH / 1310N ) Thermal Shock HOLINK / H-TS-501 Micro Processor Tem. Humidity test Chamber (HOLINK /H-TH-1BP-DHR) Salt Spray test Chamber (HL-60-SS) Reactive Type Vibration Tester (U.CHIHEN/UVS-5060M) Forced Convection Oven (WIT/WPO-090) TRNSMIT! BIDIRECTIOL! TESTER (HP / HP-8712ET) IR Reflow (SM/2000) 8.0 TEST ENVIRONMENT: 25 degree C, 45 RH%. CONNECTOR 5 of 7

6 9.0 TEST RESULTS: 9.1 Electrical Performance Test Results (continued): ITEM DESCRIPTIO N 2 3 Contact Rated Current Insulation Resistance TRETMENT REQUIREMENT MEN MXIMU M Initial 1.2Ω! MXIMUM 0.91Ω 0.87Ω 0.94Ω fter Durability 1.2Ω! MXIMUM 0.95Ω 0.90Ω 0.98Ω 1.2Ω! MXIMUM 0.94Ω 0.92Ω 0.97Ω fter Vibration fter Shock (Mechanical) fter Shock(Thermal) fter Humidity fter Thermal ging fter Salt Spray fter IR Reflow Initial fter Humidity (Cyclic) fter Shock (Thermal) 1.2Ω! MXIMUM 0.96Ω 0.91Ω 0.98Ω 1.2Ω! MXIMUM 0.97Ω 0.91Ω 1.02Ω 1.2Ω! MXIMUM 0.96Ω 0.93Ω 0.98Ω 1.2Ω! MXIMUM 0.94Ω 0.89Ω 0.97Ω 1.2Ω! MXIMUM 0.95Ω 0.90Ω 0.98Ω 1.2Ω! MXIMUM 0.98Ω 0.92Ω 1.01Ω 500 MΩ 500 MΩ 500 MΩ Pass Pass Pass CONNECTOR 6 of 7

7 4 Dielectric Withstanding Voltage Initial fter Humidity (Cyclic) fter Shock (Thermal) 1500 Volts C 1500 Volts C 1500 Volts C No Breakdown No Breakdown No Breakdown 9.2 Mechanical Performance Test Results: ITEM DESCRIPTION TRETMENT REQUIREMENT MEN MXIMUM 5 6 Connector Mate Force Plug Retention Force Initial 35N MXIMUM 8.5 N 7.8N 8.9 N Initial 89 N 167N 145 N 185N 7 Durability See ITEM 2 [TRETMENT: fter Durability] 9.3 Environmental Performance Test Results: ITEM DESCRIPTION Equipment Condition Temperature Rise Vibration (Random) Shock (Mechanical) Humidity (Cycles) Requirement: The temperature rise shall not exceed 30 degrees C. The ambient condition is still air at 25 degrees C. Test Results: Under 30 degrees C rised. See ITEM 2 [TRETMENT: fter Vibration] See ITEM 2 [TRETMENT: fter Mechanical Shock] See ITEM 2 [TRETMENT: fter Humidity Steady State] 12 Thermal ging See ITEM 2 [TRETMENT: fter Thermal ging] 13 Solder ability 95% coverage Over 95% coverage 14 Thermal Shock See ITEM 2 [TRETMENT: fter Thermal Shock] 15 Salt Spray See ITEM 2 [TRETMENT: fter Salt Spray] 16 IR Reflow See ITEM 2 [TRETMENT: fter IR Reflow ] CONNECTOR 7 of 7