ADVANCED LAER TECHNOLOGY

Transcription

1 Since ADVANCED LAER TECHNOLOGY

2 Advanced Laserr Technology at KORTherm Science S Since founded in 1999 we put our endeavor intto building a specialized business, focusing on the application of lasers and NANO/MEMS with highesst quality. quality With the laser micro micro-machining machining system and LD laser system at our research center, we have e been dedicating ourselves to develop a total laser solution such as solar cell scribing, hole drilling, las ser patterning, welding and grooving tools. As one of the leading laser system integrators of photovoltaiic industry, we promise to provide the best products worldwide with respect to value, performance, range e, and efficiency. Thanks to ceaseless encouragement g from our custtomers and p partners over the world, we have g greatly y achieved so much success to place KORTherm am mong the best companies in the laser micro-machining sector. By responding to our customer's needs more proacttively with continuous efforts in R&D and management innovation, we will promise to keep growing to be b the world's leading company in the laser micromachining sector. Sincerely, Ju-Sam Byeon, CEO

3 Contribution to green industry through our technology and experience we have accumulated. Creation of value through technical renovation. Leaping to the best enterprise in order to make better world. Solar cell Patterning Laser Cutting FPD ELA The Laser Total Solution Medical Device Laser Drilling Laser Patterning Marking Scribing

4 HISTORY µ-solar, a solar cell scribing tool, has been launched Currently developing a laser water-jet production technology. - Headquarter moved to Bupyeong, Incheon. - Uniquely deveoped proprietary software - Head office moved to Seoul. 10th anniversary Selected as an INNO-BIZ novation ompany in response to inn technology. technology esearch Set up the center of the re institute for laser applicatio on technology. Developed laser patterning technology for large sized glass Developed KOS series laser micro machining system Founded at Saha-Gu, Busan,Korea.

5 Advanced Laser Technology KOS LP Series The KOS LP Series are large flat panel multipurpose laser cutting sys tems built from state of the art technology. These systems are equipp ed with a high power energy-efficient DPSS Laser, and advanced lin ear motion control p latform. μ-combo µ-combo is a compact and versatile laser micromachining tool with multiple wavelengths applying to drilling, scribing and cutting operations. Specifically designed for the development of high- precision micromachining applications. KOS Ablator Series The KOS Ablator Series are designed to cut the wafer with a high powered and energy efficient DPSS laser. Comparable to other laser cutting machine, the KOS Ablator Series has a lighter weight design and the fastest cutting speed. μ-solar μ-solar provide ideal solutions for photovoltaic cell production with a high-precision laser technology. KORtherm Science offers a range of powers and frequencies of micromachining systems for Scribing of accurate and small width of line pattern (30 ~50 um). )With the appropriate choice of lasers, this system provides users with powerful solution for Si wafer and Thin-Film Solar cell production. Laser Diode System We produce Laser Diode System (LSD) with UV, visible, and IR wavelength. Especially, current and temperature controller can offer laser power up to 10W and wavelength with promising high current and temperature stability

6 KOS LP Series Micromachining Tool for Large Area Laser processing of display devices The KOS 1000LP is an ideal laser micromachining system to pattern various kinds of substrates. It has been specially developed by KORTherm in order to meet the demanding challenges of large area tools for in-line: LCD, PDP, OLED, and a solar cell line. The KOS 1000LP has reduced running costs with a high efficiency. Coping with the various requirements, we are always ready to follow up the customer s needs whatever it takes. Less than 20µm band scribing Raster scanning to cover large areas with micro-structures Automatically loading/unloading This tool comes with robot loading and manual sheet loading High speed processing up to 600mm/s Alternative tool replacing chemical KOS LP Series can scribe glass panel and thin film with a high speed. Auto alignment system High resolution alignment optics module corrects the glass panel position spatially with angular offset. Customized beam relay and homogenization optics Air-floating chuck system process When patterning the wider area with a laser, the glass panel and this film can be conveyed by air floating chuck and air base clamp

7 Large substrate t capability Microstructuring and selective ablation Micro-drilling and engraving PDP/LCD panel cutting Environmentally friendly process High accuracy Advanced optical technique transp-orts the high quality laser beam incident on the solar cell substrate. Work piece Laser Wavelength Cooling Line Width Stage Resolution Processing Speed Power Consumption Processed Material Dimension Weight 1400mmx1100mm Diode Pumped 1064nm Water Cooled 5~100μm 400 mm x 400 mm x 10 mm 0.5 um Up to 600 mm/sec 6.0 kva ITO, metal, Si, ceramic, GaAs 6000 mm x 4000 mm x 2000mm 4800 kg

8 µ-combo Dual Laser Microprocessing System Dual laser stand alone system for R&D µ-combo is a compact and versatile laser micromachining tool with multiple wavelengths applying to drilling, scribing and cutting operations. Specifically designed for the development of high-precision micromachining applications, it can be implemented in R&D environments as a stand-alone system. µ-combo machining tool covers a range of micro sized materials on glass including metal, Si, polymer, and etc. High quality processing Proven laser technologies guarantee high precision processing. µ-combo has high speed scribing more than 600mm/s processing substrate less than 5µm Dual head laser tool Multi leveled layers can be processed with both diode pumped laser and excimer laser µ-combo fits with both a solid-state laser and a high pulsed repetition rate of excimer laser. Polymer masters for replication in metal Micro feature mastering Auto alignment with spatial and angular offset Dual vision systems makes easier to align offset Software An easy-to-use Windows user interface enables rapid and powerful control of the operation of the µ-combo

9 Dual laser system with various applications 3D manufacturing Laser hole drilling and engravingg Solar cell scribing Wafer / PCB/ metal cutting Single step process (eliminating complex lithography) ITO layer on polyester substrate Work piece Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption N2 Gas Cutting Thickness Dimension(mm) Weight 300mm (10 inches) Nd:YAG 193, 248, 355, 532, 1064nm Water Cooled 20um 0.5 um Up to 600 mm/sec 6.0 kva 0.7 MPa ~50um 1800 x 1700 x 2000(mm) 1800 kg

10 KOS Ablator Series Laser Ablating System High-precision and powerful laser method for wafer-cutting! KOS Ablator Series provides ideal solutions for ultra-thin wafers with a high-precision laser technology created by KORtherm Science. With a dual vision system, KOS Ablator Series recognizes the state-of-the-art alignment together with a high performance stage. The visualized software designed to control all units makes it possible to cut curvilinear shape as well as process 3D structures including trenches in controlled depth. KOS Ablator Series also gives better performance in damages for patterned materials on gla ass and running costs than Blade dicing. The KOS Ablator series is a laser-base micromachining tool specifically designed for the rapid removal of thin layers of material from wafers in a chemical-free, single-state process. Improved dicing speed The KOS Ablator Series recognizes high speed cutting for 200µm thickness at a speed than 500mm/s Improved yield As the wafer is cut internally by avoiding any damage to the wafer surface, KOS Ablator Series minimizes chipping/cracking on the bottom surface of the wafer and improves flexural strength and tact in the die bonding process as well as contributes to better yield. High Reliability When irradiating the reverse side with a laser r, the wafer can be conveyed by support handing. Low cost s of ownership When processed, the modification layer is formed inside Si that dust is radically reduced, and resources are not spent on waste water disposal costs. No use of blades reduces the running costs, and labor is not required for blade replacement and quality control of blade wear and tear.

11 High precision i and powerful metho od for cutting and dicing i Plastic/Fabric cutting Metal cutting PCB cutting Glass cutting Ceramic cutting Flex circuit machining Wafer Size Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption N2 Gas Cutting Thickness Dimension Weight 300mm (12 inches) DPSS Nd:YAG 266, 355, 532, 1064nm Air/ water cooled Less than 50um 0.5 um More than 500 mm/sec 6.0 kva 0.7 Mpa Up to 300μm 1800 mm x 1600 mm x 1900mm 1800 kg

12 µ-solar Laser Solar Cell Scribing Tool Laser scribing tool for silicon based solar cell µ-solar provides us with ideal solutions for Photovoltaic Cell Production with a high-precision laser technology. KO ORTherm Science offers a range of powers and frequencies of micromachining systems for Scribing of accurate and small width of line pattern (30 ~50 um). With the appropriate choice of lasers, this system provides users with powerful solutions for Si wafer and thin-film Solar Cell production. The visualized software designed to control all units makes it possible to process line shape aswellas edge isolation. µ-solar also provides us with the low damage and low cost during wafer/thin film patterning process comparing to lithography /etching process. High quality processing Solar cell scribing thin layers High speed scribing up to 800mm/s of c-si and thin films Large throughput Faster scribing than chemical process u-solar is able to scribe wafer/glass of thickness 100um or thinner at a speed of 800mm/s, contributing significantly to improved throughput Improved yield As wafers are scribing internally, u-solar avoids damage on the wafer surface and chipping on the bottom surface of the wafer. Wafer s support handling helps loading time Low cost of ownership

13 Powerful Laser method for phot tovoltaic c-si Edge Isolation c-si Wafer Marking V-shape Grooving on Wafer Laser Drilling for Back-Contact Ce ll Design Laser Fired contact Si- wafer Patterning CIGS Patterning Glass Cutting Customized optics shape, homogenise and transport the laser beam for optimumfibre exposure illumination Wafer Size Laser Wavelength Cooling Line Width Resolution Processing Speed Power Consumption N2 Gas Dimension Weight Up to 210mm x 210mm DPSS Nd:YAG 355, 532, 1064nm Air/ water cooled 20 ~ 50um 0.5 um Up to 1200 mm/sec 6.0 kva 0.7 Mpa 1800 mm x 1600 mm x 1900mm 1800 kg

14 Laser Diode Driver Bench-top Laser Diode Current and Temperature Controller By improving both the current and temperature stability, it becomes small and light-weighed powered laser diode light source. With our advanced laser technology for a decade, we have access to both expertise and processes that allow us to create unique and cost effective solutions for both our standard products as well as our OEM partners. Applications Solid-state laser pumping Medical/ophthalmic Fiberoptic Communication Beacons Scientific experimentation Industrial Specifications Current Control characteristics Current control Drive current Analog modulation Current display resolution Constant current mode with analog modulation DC 1.5A, 5A, 10A, 20A, 50A External input 0.1mA, 1 ma, 5mA, 10mA Temperature Control characteristics Temperature control Temperature monitor I.C. sensor for temperature display Temperature display resolution TEC Currents PID control Internal thermistor LM35D(Accuracy@25 : ±1.0 ) 0.1 ±4A

15 Laser Diode System Bench-top Laser Diode Current and Temperature Controller KORTherm Science produces Laser Diode System (LSD) with UV, visible, and IR wavelength. Especially, current and temperature controller can offer laser power up to 10W and wavelength with ih promising i highh current and temperature stability. The controller supplying user adjustable rise and fall time offers both laboratory/bench-top and OEM application with high performance pulse characteristics and integrated diode protection. LDS can be equipped with a fiber laser if required. Blue-Violet Laser Diode System High Power Laser Diode System RED INFRARED Pulsed Laser Diode System Wavelength 375 nm 405 nm 445 nm Wavelength 650 nm 680 nm 690 nm 730 ~ 795 nm 808 nm 940 ~ 980 nm 1064 ~ 1930 nm Wavelength 850 nm 870 nm 905 nm 1550 nm Power 20 mw 5, 35, 120, 200 mw 50 mw Power < 0.5 W <10 W <10 W <20 W 3, 4.5 W < 10 W <10W Power <10 W <20, 25, 30 W <25, 75W <12 W

16 C-1203B, Woolim Lions Valley, 425, Chengchen-dong, Bupyeong-gu, Incheon, South Korea Phone : ~ 4 Fax : sales@kortherm.co.kr