Memory Configuration Guide



Similar documents
Memory Configuration Guide

Dell PowerEdge Servers Memory

Configuring and using DDR3 memory with HP ProLiant Gen8 Servers

Table Of Contents. Page 2 of 26. *Other brands and names may be claimed as property of others.

Kingston Technology. Server Architecture and Kingston Memory Solutions. May Ingram Micro. Mike Mohney Senior Technology Manager, TRG

Memory Configuration for Intel Xeon 5500 Series Branded Servers & Workstations

Enabling Cloud Computing and Server Virtualization with Improved Power Efficiency

DDR3 memory technology

DDR4 Memory Technology on HP Z Workstations

Server: Performance Benchmark. Memory channels, frequency and performance

Up to 4 PCI-E SSDs Four or Two Hot-Pluggable Nodes in 2U

Intel Xeon Processor E5-2600

Optimized dual-use server and high-end workstation performance

HP DDR4 SmartMemory Is finding reliable DRAM memory for your HP ProLiant Server series in your data center a major challenge?

High Performance 2U Storage Server. Mass Storage Capacity in a 2U Chassis

Configuring Memory on the HP Business Desktop dx5150

HP ProLiant WS460c Gen8 Workstation Blade User Guide

DDR4 Module Part Numbering System The part numbering system is available at

White Paper FUJITSU Server PRIMERGY & PRIMEQUEST Memory Performance of Xeon E7 v3 (Haswell-EX) based Systems

Best Practices. Server: Power Benchmark

High Performance 1U Server. High Performance 1U Storage Server. Front Parallel CPU Design features better cooling

How To Build A Cisco Ukcsob420 M3 Blade Server

Intel Virtualization and Server Technology Update

Kingston Technology. KingstonConsult WHD Local. October 2014

Technical Information Jumpers, Connectors and Memory JXM7031 (7031-xxx) MicroATX Motherboard Dual Jasper Forest Processors

HP ProLiant BL460c Gen9 Server Blade User Guide

Cisco UCS C240 M4 High-Density Rack Server (Small Form Factor Disk Drive Model)

24/12/8 UP Nodes in 3U Optimized for Web Hosting, CDN and Social Networking

ThinkServer TS140 - Overview

HP ProLiant BL660c Gen9 Server Blade User Guide

ThinkServer PC DDR2 FBDIMM and PC DDR2 SDRAM Memory options boost overall performance of ThinkServer solutions

DDR3 DIMM Slot Interposer

LABS. Boston Solutions. Future Intel Xeon processor E v3 product families. September Powered by

PSREF W.E. Product Specifications Reference. ThinkStation WorkStations. Version 479, September 2015

FatTwin. 16% Lower Power Consumption 30% More Storage Capacity. Evolutionary 4U Twin Architecture. 4 Nodes in 4U 8 Hot-swap 3.

PSREF W.E. Product Specifications Reference. ThinkStation WorkStations. Version 479, September 2015

ThinkServer PC DDR3 1333MHz UDIMM and RDIMM PC DDR3 1066MHz RDIMM options for the next generation of ThinkServer systems TS200 and RS210

TREND MICRO SOFTWARE APPLIANCE SUPPORT

TS500-E5. Configuration Guide

Emerging storage and HPC technologies to accelerate big data analytics Jerome Gaysse JG Consulting

OpenSPARC T1 Processor

Technical Note FBDIMM Channel Utilization (Bandwidth and Power)

HP ProLiant BL660c Gen8 Server Blade User Guide

Network Security Appliance. Overview Performance Platform Mainstream Platform Desktop Platform Industrial Firewall

C460 M4 Flexible Compute for SAP HANA Landscapes. Judy Lee Released: April, 2015

Memory technology evolution: an overview of system memory technologies

How System Settings Impact PCIe SSD Performance

CONFIGURATION CONCEPTS SUN SPARC ENTERPRISE M-SERIES SERVERS. James Hsieh, Sun Systems Group. Sun BluePrints Online

24/12/8 UP Server Nodes in 3U

Cisco UCS C240 M3 High-Density Rack Server (Small Form Factor Disk Drive Model)

Achieving a High Performance OLTP Database using SQL Server and Dell PowerEdge R720 with Internal PCIe SSD Storage

Chapter 5 Cubix XP4 Blade Server

Stovepipes to Clouds. Rick Reid Principal Engineer SGI Federal by SGI Federal. Published by The Aerospace Corporation with permission.

Maximum performance, minimal risk for data warehousing

Family 12h AMD Athlon II Processor Product Data Sheet

Cisco 7816-I5 Media Convergence Server

Intel X38 Express Chipset Memory Technology and Configuration Guide

Intel Xeon Processor 3400 Series-based Platforms

ACANO SOLUTION VIRTUALIZED DEPLOYMENTS. White Paper. Simon Evans, Acano Chief Scientist

Motherboard- based Servers versus ATCA- based Servers

Cisco UCS B200 M3 Blade Server

Redpaper. IBM BladeCenter HS22V Technical Introduction. Randall Davis David Watts

QUESTIONS & ANSWERS. ItB tender 72-09: IT Equipment. Elections Project

Cisco UCS C220 M4 High-Density Rack Server (Small Form Factor Disk Drive Model)

EVGA Z97 Classified Specs and Initial Installation (Part 1)

Istech Enterprise, SU905 Jalan Bandar Baru 5, Jalan Penara Jaya, Masjid Tanah, Melaka, Fax:

SUN FIRE X4170, X4270, AND X4275 SERVER ARCHITECTURE Optimizing Performance, Density, and Expandability to Maximize Datacenter Value

FPO. Expanding Intel Architecture Flexibility in the Data Center. Markus Leberecht Data Center Solutions Architect, Intel EMEA March 20, 2013

Server Forum Copyright 2014 Micron Technology, Inc

The MAX5 Advantage: Clients Benefit running Microsoft SQL Server Data Warehouse (Workloads) on IBM BladeCenter HX5 with IBM MAX5.

Referencia: Dell PowerEdge SC YMJ3J Nettó Ár: Db: 1 Tag Number: 37YMJ3J

Intel 965 Express Chipset Family Memory Technology and Configuration Guide

HP ProLiant Server Booklet. Virtualization Reliability Efficiency Agility

An Oracle White Paper. Oracle s Sun Server X4-2 and Sun Server X4-2L System Architecture

HP ProLiant DL165 G7 Server. Installation Instructions

Improve Power saving and efficiency in virtualized environment of datacenter by right choice of memory. Whitepaper

Oracle Database Reliability, Performance and scalability on Intel Xeon platforms Mitch Shults, Intel Corporation October 2011

HP ProLiant SL230s Gen8 Server User Guide

U.S. Product Specifications Reference PSREF. Version 483, December ThinkServer Servers. Visit for the latest version

HP ProLiant DL580 Gen8 Server User Guide

Data Sheet FUJITSU Server PRIMERGY RX200 S8 Dual socket 1U rack server

Intel Ivy Bridge Powered Network Security Barebone With 3rd Gen BYPASS

Intel Q35/Q33, G35/G33/G31, P35/P31 Express Chipset Memory Technology and Configuration Guide

Flash Performance in Storage Systems. Bill Moore Chief Engineer, Storage Systems Sun Microsystems

Family 10h AMD Phenom II Processor Product Data Sheet

Cisco UCS B200 M3 Blade Server

Cisco UCS C24 M3 High-Density Small Form Factor Rack-Mount Server

Chapter 4 System Unit Components. Discovering Computers Your Interactive Guide to the Digital World

Data Sheet Graphic Cards for Fujitsu ESPRIMO PCs

Dragon NaturallySpeaking and citrix. A White Paper from Nuance Communications March 2009

How To Configure Your Computer With A Microsoft X86 V3.2 (X86) And X86 (Xo) (Xos) (Powerbook) (For Microsoft) (Microsoft) And Zilog (X

The Foundation for Better Business Intelligence

HP Z640 Workstation. Table of contents. Flexible, powerful, ready to work

Data Sheet FUJITSU Server PRIMERGY CX272 S1 Dual socket server node for PRIMERGY CX420 cluster server

System Configuration and Order-information Guide ECONEL 100 S2. March 2009

H97M-E/CSM. Chipset. Memory. Graphic. Expansion Slots. Storage

Transcription:

Super Micro Computer, Inc. Memory Configuration Guide X10 Series DP Motherboards (Socket R3) 9/8/2014

Introduction This document is designed to provide the reader with an easy-to-use guide for proper memory configuration in an X10 E5-2600 v3 (Haswell) system utilizing DDR4 RDIMM or LRDIMM. Memory Insertion Order X10 DIMM s are populated using the Fill First method. The DIMM slot within a channel which is located the farthest from the processor is populated first. This is DIMM slot 0 and it is always denoted by its blue connector color. Additionally, when populating a quad-rank DIMM with a single or dual-rank DIMM in the same channel, the quad-rank DIMM must be populated farthest from the processor. Always be sure to populate the DIMM channels in a balanced configuration (all channels populated evenly) otherwise system memory performance will suffer. Table 1 DIMM insertion order (12 DIMM per CPU example) C1 C2 C3 D1 D2 D3 B3 B2 B1 A3 A2 A1 E5-2600 Series Processor Channel 1 Channel 2 Channel 3 Channel 4 # DIMMs per Channel A Few Rules to Keep Closely in Mind: Population Order DIMM2 DIMM1 DIMM0 3 3 rd 2 nd 1 st 2-2 nd 1 st 1 - - 1 st All DIMMs must be DDR4 Registered DIMMs must be ECC only Unbuffered DIMMs (UDIMM) are not supported A maximum of 8 logical ranks per channel is allowed When 1 DIMM is used it must be populated in DIMM Slot 0 (furthest away from the CPU) of a given channel Mixing of Physical DIMM s within a channel is allowed Mixing of LRDIMM with any other DIMM type is not allowed Mixing of different DDR4 operating frequencies is not advised. If DIMM s with different frequencies are mixed, all DIMMs will run at the lowest common frequency DIMMs with different timing parameters can be installed on different slots within the same channel, but only timings that support the slowest DIMM will be applied to all DIMMs When single, dual, or quad rank DIMMs are populated for 2DPC or 3DPC, always populate the higher number rank DIMM first (starting from the farthest slot) Unbalanced memory configurations will result in a performance loss so always populate memory channels evenly for best performance 2

What is DIMM ranking? The Intel Xeon E5-2600 v3 architecture has a maximum number of logic ranks per memory channel which limits how many physical DIMMs may be used for any given configuration. The processor can only see up to eight logical ranks per channel, therefore whatever combination of DIMMs that are physically added they can never exceed this limit. RDIMMs typically come in single, dual, or quad rank configurations. The examples below demonstrate this effect. Table 2 Dual RDIMM Example (Haswell) Processor Memory Channel (Socket R3) Logical Limit DIMM Total Number of RDIMM Dual DIMMs DIMM1 DIMM2 DIMM3 Channel 1 8 6 2133 1866 1600 Channel 2 8 6 2133 1866 1600 Channel 3 8 6 2133 1866 1600 Channel 4 8 6 2133 1866 1600 As illustrated in the table above, three of the dual ranked RDIMMs could be populated per channel without violating the Processors logical rank limit. If these had been Quad ranked RDIMM s, the rank total would be 12 and would have exceeded the logical rank limit of the processor and would not have been recognized by the Processor. Table 3 Quad LRDIMM Example (Haswell) Processor Memory Channel (Socket R) Logical Limit DIMM Total Number of LRDIMM Quad DIMMs DIMM1 DIMM2 DIMM3 Channel 1 8 6 2133 2133 1600 Channel 2 8 6 2133 2133 1600 Channel 3 8 6 2133 2133 1600 Channel 4 8 6 2133 2133 1600 Because LRDIMM are buffered, a quad ranked LRDIMM appears to the Processor as a dual rank DIMM. Because of this it s possible to populate all three DIMM slots without violating the logical limit. However by doing so, the memory speed drops to 1600MT/s as a result of the added memory. As of this publication date, Quad rank RDIMM s are not supported on the Haswell microarchitecture 3

E5-2600 v3 (Haswell) Socket R3 Memory Configuration Four Channels per Socket, up to 3 DIMMS per Channel, and speeds up to DDR4 2133MT/s Maximum Number of DIMM s support per CPU s per DIMM Maximum UDIMMs per CPU Maximum RDIMMs per CPU Maximum LRDIMMs per CPU Octal Not Supported Not Supported 12 Quad Not Supported Not Supported 12 Dual Not Supported 12 Not Supported Single Not Supported 12 Not Supported Maximum memory speed When populating DIMM modules it s important to evenly distribute the modules across the channels. For example, if each CPU has four DIMMs populated, put one DIMM in Channel 1, Channel 2, Channel 3, and Channel 4 respectively. If each CPU has six DIMMs populated. Put the fifth DIMM in Channel 1 and the sixth in Channel 2. Socket R3 (2011 pins): DIMM slots present per CPU DDR4 DIMM Type DIMM modules populated per CPU s per DIMM Memory speeds supported 1 to 4 Single or dual 1600,1866,2133 12 RDIMM LRDIMM 5 to 8 Single or dual 1600,1866 9 to 12 Single or dual 1600 1 to 4 Quad or Octal 1600,1866,2133 5 to 8 Quad or Octal 1600,1866,2133 9 to 12 Quad or Octal 1600 8 RDIMM LRDIMM 1 to 4 Single or dual 1600,1866,2133 5 to 8 Single or dual 1600,1866 1 to 4 Quad or Octal 1600, 1866, 2133 5 to 8 Quad or Octal 1600, 1866, 2133 4 RDIMM 1 to 4 Single or dual 1600,1866,2133 LRDIMM 1 to 4 Quad or Octal 1600, 1866, 2133 4

DDR4 DIMM Modules Mechanical Specification RDIMM: LRDIMM: Features 30.75mm x 133.35mm 288 pins 1.2V Registered Only x72 JEDEC MO-309E Features 30.75mm x 133.35mm 288 pins 1.2V Registered Only x72 JEDEC MO-309E 5

Memory FAQ Question/Answer Can I mix different types of DDR4 RDIMM, say 8GB & 16GB on the same CPU? What if I use only 8GB on CPU0 and use 16GB on CPU2? Supermicro does not recommend any mixing of different DIMM sizes within or across CPUs. Can I mix RDIMM with LRDIMM? No, mixing of the two types is not allowed. Can I use ECC/Non-ECC UDIMM on my X10 Motherboard? No, Intel no longer supports UDIMM (Unbuffered DIMM) memory on the E5-2600 v3 platform. Will DDR4 NVDIMM and ULLtraDIMM technology be supported on X10? Supermicro continues to work closely with memory vendors to support these new technologies on our X10 DDR4 based platform as the technology becomes available. Please contact your Supermicro sales representative for more information. Do I have to populate all CPU memory channels? What if I only put one or two DIMMs per processor? It s ok to run with as little as one RDIMM/LRDIMM per system or per CPU (unbalanced configurations) but it will impact CPU performance. Socket R3 CPU s have four memory channels and for best performance it s recommended to have a minimum of one DIMM in per channel. A channel left unpopulated will reduce the memory bandwidth by 25%, so with only one RDIMM per CPU memory bandwidth performance is reduced by 75%. Will reducing the memory speed affect PCI-E performance? No, the memory and PCI-E subsystems operate independently and have no impact on each other. Will I see improved memory power savings with DDR4 compared to DDR3? Yes, DDR4 can consumer up to 50% less power than DDR3 in 3DPC configurations. 6