PRODUCT: 3528 SURFACE MOUNT LED SANAN CHIP FEATURES: 3.5 mm 2.8 mm x 1.8 mm surface-mount LED 120 emission angle 90 min CRI DESCRIPTION Yuji LED s high CRI 3528 SMD provides the best color rendering possible using violet die technology. Providing 93 CRI (typical) at 115 lm/w, this LED can be used in a variety of applications demanding high color quality and performance. ABSOLUTE MAXIMUM RATING (T C = 25 C) PARAMETER SYMBOL LIMIT UNIT Power Consumption PD 98 mw DC Forward Current IF 30 ma Pulse Current IP 50 ma Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +85 1 C Storage Temperature Tstg -40 ~ +100 C Soldering Temperature Tsol 260±5 2 C ELECTRICAL-OPTICAL CHARACTERISTICS (TC = 25 C) PARAMETER SYMBOL VALUE MIN. TYP. MAX. UNIT TOLERANCE CONDITION Forward Voltage Vf 3.0 -- 3.4 V ±0.05 If=20mA Φ2700K 4.5 Luminous flux Φ3200K 5.5 6.5 -- Φ4000K 6.0 7.0 lm -- If=20mA Φ5600K 6.5 7.5 CCT2700K 2550 2700 2850 Color temperature CCT3200K 3050 3200 3350 CCT4000K 3800 4000 4200 K -- If=20mA CCT5600K 5300 5600 5900 Color rendering index Ra 90 93 95 -- ±0.5 If=20mA Chromaticity coordinates (X,Y) -- -- -- -- ±0.005 Reverse Current Ir 5 μa ±0.1 Vr=5V Viewing angle 2θ1/2 120 Deg ±5 If=20mA 5.5
ORDERING INFORMATION PART NUMBER CCT CHROMATICTY BINS VOLTAGE RANGE BX-3528-27 2700K ± 150K VxF47, VxF58, VxF710, VxF811 0.1 V BX-3528-32 3200K ± 150K VxF4-2, VxF7-2, VxF5-1, VxF8-1 0.1 V BX-3528-40 4000K ± 200K VxD4-1, VxD4-2, VxD6-1, VxD6-2 0.1 V BX-3528-56 5600K ± 300K VxB8-2, VxB10-2, VxC3-1, VxC5-1 0.1 V BX-3528-XX CUSTOM CUSTOM CUSTOM PRODUCT CODES XG0.4-13-X 3SL95-R(X 4)-CA-V X4 CHROMATICITY BIN SEE BELOW X3 COLOR TEMPERATURE WW: CCT < 3500K NW: 3500K < CCT < 5300K CW: CCT > 5300K VOLTAGE BIN CODES Bin V30 V31 V32 V33 V F 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4
CCT 5600K 4000K 3200K 2700K CHROMATICITY BINS & COORDINATES CIE 1931 COORDINATES BIN X0 Y0 X1 Y1 X2 Y2 X3 Y3 B8-2 0.3236 0.3459 0.3243 0.3326 0.3300 0.3390 0.3300 0.3530 B10-2 0.3243 0.3326 0.3249 0.3194 0.3300 0.3250 0.3300 0.3390 C3-1 0.3300 0.3530 0.3300 0.3390 0.3369 0.3450 0.3375 0.3591 C5-1 0.3300 0.3390 0.3300 0.3250 0.3363 0.3308 0.3369 0.3450 D4-1 0.3761 0.3889 0.3723 0.3727 0.3814 0.3787 0.3861 0.3957 D4-2 0.3861 0.3957 0.3814 0.3787 0.3905 0.3848 0.3960 0.4027 D6-1 0.3723 0.3727 0.3686 0.3565 0.3768 0.3617 0.3814 0.3787 D6-2 0.3814 0.3787 0.3768 0.3617 0.3850 0.3669 0.3905 0.3848 F4-2 0.4237 0.4160 0.4158 0.3969 0.4259 0.4017 0.4346 0.4213 F7-2 0.4158 0.3969 0.4081 0.3779 0.4173 0.3822 0.4259 0.4017 F5-1 0.4346 0.4213 0.4259 0.4017 0.4388 0.4051 0.4486 0.4249 F8-1 0.4259 0.4017 0.4173 0.3822 0.4291 0.3853 0.4388 0.4051 F6-1 0.4626 0.4285 0.4517 0.4085 0.4648 0.4118 0.4767 0.4323 F9-1 0.4517 0.4085 0.4409 0.3885 0.4530 0.3913 0.4648 0.4118 F5-2 0.4515 0.4254 0.4410 0.4055 0.4517 0.4085 0.4626 0.4285 F8-2 0.4410 0.4055 0.4312 0.3858 0.4409 0.3885 0.4517 0.4085
PACKAGE LAYOUT ITEM DIE MATERIAL LEAD FRAME MATERIAL ENCAPSULANT RESIN MATERIAL ELECTRODES MATERIAL PACKAGE MATERIALS DESCRIPTION InGaN PCT SILICONE + PHOSPHOR SILVER-PLATED COPPER RECOMMENDED SOLDER PAD LAYOUT NOTES: 1. All dimensions are in millimeters 2. Tolerance is ±0.1 (0.004) mm unless otherwise noted. 3. Specifications are subject to change without notice.
CHARACTERISTIC CURVES FORWARD CURRENT VS FORWARD VOLTAGE (TA=25 C) FORWARD CURRENT VS RELATIVE LUMINOUS OUTPUT (TA=25 C) FORWARD CURRENT DERATING BASED ON SOLDER POINT Luminous Intensity V S A mbient
2700K TYPICAL SPECTRAL DISTRIBUTION GRAPHS 3200K 4000K 5600K REFLOW PROFILE LEAD-FREE SOLDERING NOTE: Soldering paste with the melting point at 230 C is recommended
TEST CIRCUIT AND HANDLING PRECAUTIONS Test circuit Handling precautions 1. Over-current-proof 1.1 Customer must apply resistors for protection; otherwise, a slight voltage increase will cause a significant increase in current, causing the LED to burn out. 2. Storage - It is recommended to store the products in the following conditions: 2.1 Humidity: 60% R.H. Max. 2.2 Temperature : 5 C ~30 C (41 F ~86 F ) 2.3 Shelf life in sealed bag: 12 months at <5 C ~30 C and <60% R.H. After the opening the package, the products should be used within a week or they should be kept stored at less than 20% R.H. with zip-lock sealed. 3. Re-heating 3.1 If a package remains unsealed for longer than 24 hours, re-heating of the LEDs is recommended prior to soldering. The required conditions are as follows: 3.2 60±3 C x (12~24hrs) and <5% RH, taped reel type 3.3 130±3 C x (3~4hr), bulk type 3.4 150±3 C x (2 hr), bulk type
RELIABILITY TEST ITEMS AND CONDITIONS TEST ITEM TEST CONDITIONS NOTE NUMBER DAMAGED -45 C 30min Temperature Cycle 20 min 105 C 30 min 100 cycles 0/22-10 C 15 min Thermal Shock 5 sec 100 C 15 min 100 cycles 0/22 High Humidity Heat Cycle 30 C Û 65 C 90% RH 24 hrs / 1 cycle 10 cycles 0/22 High Temperature Storage Ta=100 C 1000 hrs 0/22 Humidity Heat Storage Ta=85 C RH=85% 1000 hrs 0/22 Low Temperature Storage Ta=-40 C 1000 hrs 0/22 Life Test Ta=25 C IF=120 ma 1000 hrs 0/22 High Humidity Heat Life Test 85 C RH=85% IF=120 ma 1000 hrs 0/22 Low Temperature Life Test Ta=-20 C IF=120 ma 1000 hrs 0/22
PACKAGING SPECIFICATIONS FEEDING DIRECTION REEL APPEARANCE (UNIT: MM) NOTES: 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing SMDs is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 3,000 pcs/reel SHIPPING INFORMATION NOTES: 1. Reeled products (max 3,000 pcs / reel) are packed in a moisture-proof bag along with a moisture desiccant pack. 2. Each inner box contains up to 5 moisture-proof bag of (total maximum number of SMDs is 15,000pcs). Box package size: 246 mm x 225 mm x 76 mm. 3. Each outer package contains 10 inner boxes. Box size: 490 mm x 400 mm x 262 mm. 4. Outer package is sealed with protective bubble wrap and foam. (Part numbers, lot numbers, quantity should appear on the label on the moisture-proof bag, part numbers). 5. This packaging merely intended as a reference for standard quantity orders only please note that actual packaging can differ depending on the order circumstances.