Agilent T-1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet

Transcription

1 Agilent T-1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-36, HLMP-361 Description The 5 volt and 12 volt series lamps contain an integral current limiting resistor in series with the LED. This allows the lamp to be driven from a 5 volt/12 volt source without an external current limiter. The red LEDs are made from GaAsP on a GaAs substrate. The High Efficiency Red and Yellow devices use GaAsP on a GaP substrate. Features Integral current limiting resistor TTL compatible Requires no external current Limiter with 5 volt/12 volt supply Cost effective Saves space and resistor cost Wide viewing angle Available in all colors Red, High Efficiency Red, Yellow, and High Performance Green in T-1 and T-1 3 / packages The green devices use GaP on a GaP substrate. The diffused lamps provide a wide off-axis viewing angle. Package Dimensions 6.35 (.25) 5.5 (.22) 3.3 (.135) 2.92 (.115) 3.1 (.125) 2.67 (.15).7 (.15).19 (.165) (.55) 1. (.25) 5. (.2).57 (.1).9 (.35).6 (.25) 9.19 (.362).3 (.332) The T-1 3 / lamps are provided with sturdy leads suitable for wire wrap applications. The T-1 3 / lamps may be front panel mounted by using the HLMP-13 clip and ring. 1.2 (.) NOM (.52) 1.2 (.) CATHODE 2.13 (.95) MIN..5 (.1) SQUARE NOM. 23. (.9) MIN..6 (.25) SQUARE NOMINAL 1.27 (.5) NOM. 2.5 (.1) NOM (.5) NOM. 6.1 (.2) 5.6 (.22) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (.") DOWN THE LEADS. CATHODE 2.5 (.1) NOM. Figure A. T-1 package. Figure B. T-1 3 / package.

2 Selection Guide Luminous Intensity Package Operating Part Number Iv (mcd) Color Package Description Outline 2q1/2 [1] Voltage (V) HLMP- Min. Max T-1 Tinted Diffused A 16-Dxx Red Dxx GHxx T-1 3/ Tinted Diffused B 36-Dxx Dxx Cxx T-1 Tinted Diffused A 162-CBxx EFBxx Yellow Cxx T-1 3/ Tinted Diffused B 365-Cxx Cxx Bxx T-1 Tinted Diffused A 16-BDxx DExx Green Bxx T-1 3/ Tinted Diffused B 36-Bxx Bxx Note: 1. q 1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity. 2

3 Part Numbering System HLMX-X 6 X X X X X XX Mechanical Option : Bulk 1: Tape & Reel, Crimped Leads 2: Tape & Reel, Straight Leads A1,B1: Right Angle Housing, Uneven Leads A2,B2: Right Angle Housing, Even Leads Color Bin Options : Full color bin distribution B: Color bin 2&3 only D: Color bin &5 only Maximum Iv Bin Options : Open (No. max. limit) Others: Please refer to the Iv bin Table Minimum Iv Bin Options Please refer to the Iv bin Table Operating Voltage : 5 V 1: 12 V Color Options : GaP HER 2,5: GaP Yellow,: GaP Green Package Options 3: T-1 3 / (5 mm) 1: T-1 (3 mm) Absolute Maximum Ratings at T A = 25 C Red/HER/Yellow Red/HER/Yellow Green Green 5 Volt Lamps 12 Volt Lamps 5 Volt Lamps 12 Volt Lamps DC Forward Voltage (T A = 25 C) 7.5 Volts [2] 15 Volts [3] 7.5 Volts [2] 15 Volts [3] Reverse Voltage (I R = 1 µa) 5 Volts 5 Volts 5 Volts 5 Volts Operating Temperature Range - C to 5 C - C to 5 C -2 C to 5 C -2 C to 5 C Storage Temperature Range -55 C to 1 C -55 C to 1 C -55 C to 1 C -55 C to 1 C Notes: 2. Derate from T A = 5 C at.71 V/ C, see Figure Derate from T A = 5 C at.6 V/ C, see Figure. 3

4 Electrical/Optical Characteristics at T A = 25 C High Efficiency Red Yellow Green Test Symbol Description Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Condition l P Peak nm Wavelength l d Dominant nm Note Wavelength Dl 1 / 2 Spectral Line 36 2 nm Halfwidth Rq J-PIN Thermal C/W Junction to Resistance Cathode Lead (Note 6) Rq J-PIN Thermal C/W Junction to Resistance Cathode Lead (Note 7) I F Forward Current ma V F = 12 V 12 V Devices I F Forward Current ma V F = 5 V 5 V Devices h V Luminous lumen Note 2 Efficacy /Watt V R Reverse V I R = 1 µa Breakdown Voltage Notes:. The dominant wavelength, l d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 5. Radiant intensity, I e, in watts/steradian, may be found from the equation I e = l V /h V, where l V is the luminous intensity in candelas and h V is the luminous efficacy in lumens/watt. 6. For Figure A package type. 7. For Figure B package type.

5 2 2 I F FORWARD CURRENT ma I F FORWARD CURRENT ma V CC APPLIED FORWARD VOLTAGE V V CC APPLIED FORWARD VOLTAGE V Figure 1. Forward current vs. applied forward voltage. 5 volt devices. Figure 2. Forward current vs. applied forward voltage. 12 volt devices. V CC APPLIED FORWARD VOLTAGE V V CC APPLIED FORWARD VOLTAGE V T A AMBIENT TEMPERATURE C T A AMBIENT TEMPERATURE C Figure 3. Maximum allowed applied forward voltage vs. ambient temperature Rq JA = 175 C/W. 5 volt devices. Figure. Maximum allowed applied forward voltage vs. ambient temperature Rq JA = 175 C/W. 12 volt devices Figure 5. Relative luminous intensity vs. angular displacement for T-1 package. Figure 6. Relative luminous intensity vs. angular displacement for T-1 3 / package. 5

6 RELATIVE I V GaAsP HIGH EFFICIENCY RED, YELLOW, GREEN RELATIVE I V 1..5 GaAsP HIGH EFFICIENCY RED, YELLOW, GREEN VOLT DEVICES VOLT DEVICES Figure 7. Relative luminous intensity vs. applied forward voltage. 5 volt devices. Figure. Relative luminous intensity vs. applied forward voltage. 12 volt devices. Intensity Bin Limit Intensity Range (mcd) Color Bin Min. Max. D E F G H I J K L M N Red O P Q R S T U V W X Y Z (Cont'd) Intensity Range (mcd) Color Bin Min. Max. C 2.5. D. 6.5 E F G H I J K Yellow L M N O 51.. P Q R S T U V W (Cont'd) Intensity Range (mcd) Color Bin Min. Max. B C D E F G H I J K Green L M N O P Q R S T U V W 25.. Maximum tolerance for each bin limit is ±1%. 6

7 Color Categories Lambda (nm) Color Cat # Min. Max Green Yellow Tolerance for each bin limit is ±.5 nm. Mechanical Option Matrix Mechanical Option Code Definition Bulk Packaging, minimum increment 5 pcs/bag 1 Tape & Reel, crimped leads, minimum increment 13 pcs/bag 2 Tape & Reel, straight leads, minimum increment 13 pcs/bag A1 T-1, Right Angle Housing, uneven leads, minimum increment 5 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 5 pcs/bag B1 T-1 3 / Angle Housing, uneven lead, minimum increment 5 pcs/bag B2 T-1 3 / Angle Housing, even leads, minimum increment 5 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 7

8 Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions Care must be taken during PCB assembly and soldering process to prevent damage to LED component. The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Recommended soldering conditions: Manual Solder Wave Soldering Dipping Pre-heat Temperature 15 C Max. Pre-heat Time 3 sec Max. Peak Temperature 25 C Max. 26 C Max. Dwell Time 3 sec Max. 5 sec Max. Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 C, before handling. Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. Recommended PC board plated through hole sizes for LED component leads: LED Component Plated Through Lead Size Diagonal Hole Diameter.57 x.57 mm.66 mm.976 to 1.7 mm (.1 x.1 inch) (.25 inch) (.3 to.2 inch).5 x.5 mm.71 mm 1.9 to 1.15 mm (.2 x.2 inch) (.2 inch) (.1 to.5 inch) Note: Refer to application note AN127 for more information on soldering LED components. TEMPERATURE C TURBULENT WAVE FLUXING PREHEAT LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.3 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 C (1 C PCB) SOLDER WAVE TEMPERATURE = 25 C AIR KNIFE AIR TEMPERATURE = 39 C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE TIME SECONDS Figure 9. Recommended wave soldering profile.

9 For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 () or (916) Europe: +9 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+1 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright Agilent Technologies, Inc. Obsoletes EN November 13, EN