Data Sheet. HLMP-Yxxx T-1 (3 mm) AlInGaP LED Lamps. Description. Features. Applications. Package Dimension
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1 HLMP-Yxxx T-1 (3 mm) AlInGaP LED Lamps Data Sheet Description This family of T-1 lamps is widely used in general purpose indicator and back lighting applications. The optical design is balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility. Applications Status indicator Backlighting front panels Light pipe sources Lighted switches Package Dimension ± ± ± ±.8 1. (MAX).4 Features High luminous intensity output Low power consumption Choice of bright colors Deep Red Red Red-Orange Orange Amber Green High efficiency Versatile mounting on PCB or panel I.C. Compatible/low current requirement Popular T-1 diameter package Reliable and rugged RoHS compliant 24. (MIN).945 CATHODE 1. (MIN) Notes: 1. All dimensions are in millimeter (inches). 2. Tolerance is ±.25mm (.1) unless otherwise stated. 3. Lead spacing is measured where the leads emerge from the package..45 x.4 TYP (.18 x.16)
2 Selection Guide Color Part Number Package Description Luminous Intensity, Iv 2 ma Min. Typ. Max. Deep Red HLMP-Y651-Gxx Untinted, Non-diffused Red HLMP-Y61-Jxx Untinted, Non-diffused Red-Orange -Kxx Untinted, Non-diffused Yellow Orange HLMP-Y91-Jxx Untinted, Non-diffused HLMP-Y92-Jxx Tinted, Non-diffused Amber HLMP-Y71-Gxx Untinted, Non-diffused 14 4 Green HLMP-Y82-Fxx Tinted, Non-diffused Viewing Angle, 2θ½ ( ) Part Numbering System HLMP - Y x x x - x x x xx Mechanical Options : Bulk Color Bin Options : Full Color Bin Distribution Maximum IV Bin Options : Open (no max. limit) Others: Please refer to the IV Bin Table Minimum IV Bin Options Please refer to the IV Bin Table 2
3 Absolute Maximum Ratings at T A = 25 C Parameter HLMP-Yxxx Units DC Forward Current 2 ma Peak Forward Current (1/1 Duty Cycle,.1ms Pulse Width) 6 ma Reverse Voltage (I R = 1µA) 5 V Junction Temperature 11 C Power Dissipation 48 mw Storage Temperature Range -4 to +1 C Operating Temperature Range -4 to +1 C Electrical /Optical Characteristic at T A = 25 C Description Symbol Part Number Min. Typ. Max. Units Test Conditions Peak Wavelength λ PEAK HLMP-Y651 HLMP-Y61 HLMP-Y9x HLMP-Y71 HLMP-Y82-Fxx Dominant Wavelength λ d HLMP-Y651 HLMP-Y61 HLMP-Y9x HLMP-Y71 HLMP-Y82-Fxx Spectrum Half Width λ HLMP-Y651 HLMP-Y61 HLMP-Y9x HLMP-Y71 HLMP-Y82-Fxx Forward Voltage V F HLMP-Y651 HLMP-Y61 HLMP-Y9x HLMP-Y71 HLMP-Y82-Fxx Notes: 1. The dominant wavelength, λ d, is derived from the Chromaticity Diagram and represents the color of the lamp nm nm Note 1 nm V Measurement at peak I F = 2mA (Figure 1) 3
4 FORWARD CURRENT-mA GREEN DEEP RED, RED RED-ORANGE, AMBER YELLOW-ORANGE FORWARD VOLTAGE-V Figure 1. Forward Current vs. Forward Voltage. RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2mA) DC FORWARD CURRENT - ma Figure 2. Relative Luminous Intensity vs. Forward Current FORWARD CURRENT - ma NORMALIZED INTENSITY AMBIENT TEMPERATURE - C ANGULAR DISPLACEMENT - DEGREES Figure 3. Ambient Temperature vs. Maximum DC Forward Current. Figure 4. Relative Luminous Intensity vs. Angular Displacement for HLMP-Y651, HLMP-Y61, and HLMP-Y71. 1 NORMALIZED INTENSITY ANGULAR DISPLACEMENT - DEGREES Figure 5. Relative Luminous Intensity vs. Angular Displacement for HLMP-Y9x and HLMP-Y8x. Figure 6. Wavelength vs. Relative Luminous Intensity. 4
5 Intensity Bin Limits Bin Intensity Range (mcd) Min. Max. F G H J K L M N P Q 1 Tolerance for each bin limit is %. Color Bin Limits Table Color Category # Lambda (nm) Min. Max. Red-Orange Yellow- Orange Amber Green Tolerance for each bin limit is ±1. nm. Precautions: Assembly method: This product is not meant for auto-insertion. Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. During lead forming, the leads should be bent at a point at least 3mm from the base of the lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering at normal temperature. It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. 5
6 Precautions: (cont.) Soldering Conditions: Care must be taken during PCB assembly and soldering process to prevent damage to LED component. The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Recommended soldering conditions: Wave Soldering Pre-heat Temperature C Max. Pre-heat Time 6 sec Max. Manual Solder Dipping Peak Temperature 25 C Max. 26 C Max. Dwell Time 3 sec Max. 5 sec Max. Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 C, before handling. Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size.457 x.457 mm (.18 x.18 inch).58 x.58 mm (.2 x.2 inch) Diagonal.646 mm (.25 inch).718 mm (.28 inch) Plated Through Hole Diameter.976 to 1.78 mm (.38 to.42 inch) 1.49 to 1. mm (.41 to.45 inch) Note: Refer to application note AN127 for more information on soldering LED components. 25 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC35 (Lead free solder alloy) Flux: Rosin flux TEMPERATURE ( C) PREHEAT Solder bath temperature: 245 C± 5 C (maximum peak temperature = 25 C) Dwell time: 1.5 sec - 3. sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force TIME (SECONDS) Figure 7. Recommended wave soldering profile. Avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. AV2-1664EN - July 26, 214
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