Specification MWT801-S

Transcription

1 Specification MWT801S Drawn SSC Approval Customer Approval.com

2 MWT801S 1. Features 2. Absolute Maimum Ratings 3. Electro Characteristics 4. Optical characteristics 5. CIE Chromaticit Diagram 6. Outline Dimension 7. Packing 8. Soldering 9. Precaution for use 10. Handling of Silicone Resin LEDs.com

3 Description MWT801S This surfacemount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavit and the cavit is encapsulated b epo or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliabilit in a larger temperature range 40 to 100. The high reliabilit feature is crucial to Automotive interior and Indoor ESS. 사진 MWT801S Features Industr Standard PLCC SMT package High brightness using AlInGaP and InGaN dice technologies Available in multiple colors High volume, high reliabilit Applications Interior automotive Electronic Signs and Signals Office Automation, Electrical Appliances, Industrial Equipment

4 1. Features White colored SMT package Material InGaN/SiC Suitable for all SMT assembl methods Suitable for all soldering methods RoHS Compliant

5 2. Absolute maimum ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Smbol P d I F I *2 FM V R T opr Value ~ +110 Unit mw ma ma V o C Storage Temperature T stg 40 ~ +110 o C *1 Care is to be taken that power dissipation does not eceed the absolute maimum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of dut ratio. 3. Electric characteristics Parameter Smbol Condition Min Tp Ma Unit Rank A V F V Forward Voltage Rank B Rank C V F V F V V Rank D V F V Reverse Current I R V R =5V 50 μa Luminous Intensit *1 Rank P Rank O Rank N I V I V I V mcd mcd mcd Viewing Angle *2 2θ 1/2 120 deg. *1. The luminous intensit IV was measured at the peak of the spatial pattern which ma not be aligned with the mechanical ais of the LED package. Luminous Intensit Measurement allowance is ±10% *2. 2θ½ is the offais where the luminous intensit is 1/2 of the peak intensit.

6 Forward Current I F [ma] 4. Optical characteristics Forward Current vs. Forward Voltage 10 2 (T a =25 O C ) 10 1 Relative Luminous Intensit [%] Relative Luminous Intensit vs Forward Current ( T a = OC ) Forward Voltage V F (V) Forward Current Derating Curve (T a =25 O C ) Forward Current I F [ma] Radiation Diagram Forward Current I F [ma] Ambient Temperature T A [ O C] Luminous Intensit vs. Ambient Temperature IF=20mA B Color Coordinate Variation B Time coordinate coordinate Relative Optical Intensit CIE () Coordinate CIE () Coordinate Ambient Temperature Measurement Time [hr]

7 CIE () CIE Chromaticit Diagram C I E ()

8 CIE Coord. (Y) a b c e d f g h CIE Coord. (X) COLOR RANK <IF=20mA, Ta=25 > a b c d e f g h * Measurement Uncertaint of the Color Coordinates : ± 0.01

9 outline dimension Anode Recommended Solder Pattern Cathode Mark 7. packing Cathode 2.2 ( Tolerance: ±0.2, Unit: mm ) 1.75± ± ± ± ±0.05 8± ± ± ± ± ± ± LABLE ± ± ± (1) Quantit : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantit to be indicated on a damp proof Package

10 Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Bo Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a b c 7inch SIDE c QUANTITY : XXXX 1 LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. a RoHS b

11 8. soldering (1) Lead Solder Preheat Preheat time PeakTemperature Lead Solder 120~ sec. Ma. 240 Ma. 2.5~5 C / sec. 2.5~5 o C / sec. Preheating 120~150 o C Lead Solder 60sec. Ma. Above 200 o C o 240 C Ma. 10 sec. Ma. Soldering time Condition 10 sec. Ma. 120sec. Ma. (2) LeadFree Solder Preheat Preheat time PeakTemperature Lead Free Solder 150~ sec. Ma. 260 Ma. 1~5 oc / sec. 1~5 oc / sec. Preheating 150~200 o C Leadfree Solder 60sec. Ma. Above 220 o C o 260 C Ma. 10 sec. Ma. Soldering time Condition 10 sec. Ma. 120sec. Ma. (3) Hand Soldering conditions Do not eceed 4 seconds at maimum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don t guarantee the products.

12 9. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dr bo (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidit : maimum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation ma affect the light transmission efficienc, causing the light intensit to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidit : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 1012hr. at 60±5ºC. (4) An mechanical force or an ecess vibration shall not be accepted to appl during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ra design is not considered for the products. (8) This device should not be used in an tpe of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maimum temperature. (10) The LEDs must be soldered within seven das after opening the moistureproof packing. (11) Repack unused products with antimoisture packing, fold to close an opening and then store in a dr place. (12) The appearance and specifications of the product ma be modified for improvement without notice.

13 10. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all tpes should not be used to pierce the sealing compound. (2) In general, LEDs should onl be handled from the side. B the wa, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basicall no restrictions regarding the form of the pick and place nozzle, ecept that mechanical pressure on the surface of the resin must be prevented. This is assured b choosing a pick and place nozzle which is larger than the LED s reflector area. (4) Silicone differs from materials conventionall used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generall softer, and the surface is more likel to attract dust. As mentioned previousl, the increased sensitivit to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning ma cause damage to the LED.