50W EdiStar. Approved By Customer. Designer Checker Approval. Ultra High Power LED



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Ultra High Power LED 50W EdiStar EdiStar Emitter Approved By Customer Designer Checker Approval Date:2006/12/04 Version:Preliminary V0.1 4F, No. 800, Chung-Cheng Rd, Chung-Ho, Taipei 235, Taiwan Tel: 886-2-8227-6996 Fax: 886-2-8227-6997 http://www.edison-opto.com.tw

50W EdiStar EdiStar emitters are the brightenss LEDs in the world by Edison Opto. EdiStar emitters are designed to satisfy more and more Solid-State lighting High Power LED applications for brilliant world such as general lighting, street light and projector light engine. EdiStar emitters are designed by particular package for High Power LED. 50W EdiStar white has typical 1800 lumens @2400mA. Unlike the fluorescent sources, EdiStar contains no mercury and has more energy efficient than other incandescent light source. Features Outstanding thermal performance LED lighting engine Ultra high power LED Typical Applications General lighting Ceiling lights Indoor and Outdoor Commercial lighting Technology Tjmax = 125 O C High Lumen performance Low thermal resistance 0.5~1 O C/W RoHS compliant Industrial best lumen maintenance - 50,000hrs life at I Fmax with 70% lumen if Tj is lower than 65 O C 1

Package Outlines: 50W Notes: 1. All dimensions are in mm. 2. Drawings are not to scale. 2

Absolute Maximum Ratings Parameter Symbol Rating Units DC Forward Current I F 4900 ma Peak pulse current;(tp 100µs, Duty cycle=0. 25) I pulse 7000 ma Reverse Current I R 50 μa Transient Surge Voltage V TS 50 V Isolation Voltage Vi 1000 V LED Junction Temperature T j 125 LED Substrate Temperature Ts 100 Operating Temperature T opr -30 ~ +60 Storage Temperature T stg -40 ~ +60 ESD Sensitivity V B 500 V Manual Soldering Time at 400 (Max.) T sol 5 seconds Notes: 1. Proper current derating must be observed to maintain junction temperature below the maximum. 2. LEDs are not designed to be driven in reserve bias. 3

Luminous Flux & Electrical Characteristics (Tj=25 ): Power Consumption Part Name Color Typ. Voltage (V) Current (A) Luminous Flux (lm) Thermal Resistance ( /W) 50W ENEW-05-0707-DA White 23 2.4 1800 0.5 ENEX-05-0707-DC Warm White 23 2.4 1400 0.5 Luminous Flux Characteristics at I F =2400mA (Tj=25 ): Power Consumption Part Name Color Flux Min. Typ. Max. Units 50W ENEW-05-0707-DA White 1600 1800 -- lm ENEX-05-0707-DC Warm White 1250 1400 -- lm Color Temperature Characteristics at I F =2400mA (Tj=25 ): Power Consumption 50W Part Name Color λd/λp [1] /CCT Min. Typ. Max. ENEW-05-0707-DA White 4000 -- 8000 K ENEX-05-0707-DC Warm White 2800 -- 3800 K Units Emission Angle Characteristics at I F =2400mA (Tj=25 ): Part Name Color 2Θ½(Typ.) Units ENEW-05-0707-DA White 140 Degrees ENEX-05-0707-DC Warm White 140 Degrees Note 1. Flux is measured with an accuracy of ± 10%. 2. CCT selection acc. To CCT groups and an accuracy of ± 300K 3. Forward Voltage is measured with an accuracy of ± 0.1V 3 All white and warm white emitters are built with InGaN 4

Operating life and environmental tests performed on EdiStar TM package: Stress Test Stress Conditions Stress Duration Failure Criteria Room Temperature Operating Life 25, I F = max DC (Note 1) 1000 hours Note 2 High Temperature High Humidity 85 / 85%RH 1000 hours Note 2 Temperature Cycle -40 /100,30 min dwell /<5min transfer 200 cycles Note 2 High Temperature Storage Life 110 1000 hours Note 2 Low Temperature Storage Life -55 1000 hours Note 2 Thermal Shock -40 / 120, 20 min dwell /<20 sec transfer 200 cycles No catastrophics Note 1. Depending on the maximum derating curve. 2. Failure Criteria: Electrical failures V F shift >=10% I R <50uA @Vr=5V Light Output Degradation % Iv shift >= 20% @1,000hrs or 200cycle Visual failures Broken or damaged package or lead Solderability < 95% wetting Dimension out of tolerance How to Know Tj in Your Application? If it is white EdiStar TM Rth(junction to case)=0.5 o C/W The thermal grease is 200um. K(thermal conductiveity)=3 W/mk Then Rth(case to board)= 200 3x(18) 2 =0.2 o C/W The Rth between board and air is mainly dependent on the total surface air. Rth(board-air) 500 Area(cm 2 ) If Area is 3000cm 2 Rth=0.167 T(junction-air)=(0.5+0.2+0.167)x50=43.35 o C If Area is 5000cm 2 Rth=0.1 T (junction-air)=(0.5+0.2+0.1)x50=40 o C If Area is 8000cm 2 Rth=0.0625 T (junction-air)=(0.5+0.2+0.0625)x50=38.125 o C 5

Electrical & Optical Curves-Spectrum 100 80 White V(λ ) Standard eye response curve Irel(%) 60 40 20 0 400 425 450 475 500 525 550 575 600 625 650 675 700 725 λ -Wavelength(nm 100 Standard eye response curve 80 Warm White Irel(%) 60 40 20 0 400 425 450 475 500 525 550 575 600 625 650 675 700 725 750 775 λ-wavelength(nm) Typical Radiation Pattern for white and warm white 100 80 Relative Intensity(%) 60 40 20 0-100 -80-60 -40-20 0 20 40 60 80 100 Angular Displacement(Degree) 6

Adhesive for Emitter to Aluminum PCB Suggestion: Ease of use Non-solvent, One-part Fast tack free 3 minutes at 25 o C No corrosion Alcohol type of RTV Low volatility Low weight loss of silicone volatiles Adhesion Excellent adhesion to most materials without use of a primer Dielectric properties Cured rubber exhibits good dielectric properties Excellent thermal stability and cold resistance Cured rubber provides wide service temperature range Typical Properties Specification Thermal grease Take-free time Suggested Properties Silicone base 3~10 minutes Specific gravity < 3 g/cm 2 Thermal conductivity Rth in using Volume resistance > 3.5 W/mK < 1 o C/W > 1x10 6 MΩm Lap shear adhesion strength > 200 N/ cm 2 Tensile strength Bond Line Thickness > 4 Mpa <40um 7

Instruction for Proper Usage: Anode Do not touch and press this area Cathode Driver: Input Constant Current=2.1~2.4A Input Voltage (min) =24V Assembly Steps: 1. Spread thermal grease on heat sink or the bottom of EdiStar uniformly. 2. Place EdiStar on heat sink and press it lightly. 3. The heat sink should be anodized. 4. Wire up EdiStar and connect to driver. 5. Use constant current driver. Thermal grease: GE TIG825FX or thermal conductivity is greater than 4 w/mk. The thickness of thermal grease between LED and heat sink should be less than 200 µm Surface area of heat sink: Larger than 5000 cm 2 (suggestion) 8