Product Guide SMSUNG ELECTRONICS RESERVES THE RIGHT TO CHNGE PRODUCTS, INFORMTION ND SPECIFICTIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. ll information discussed herein is provided on an "S IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. ll brand names, trademarks and registered trademarks belong to their respective owners. c 2012 Samsung Electronics Co., Ltd. ll rights reserved. - 1 -
1. DDR3 SDRM MEMORY ORDERING INFORMTION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 K 4 X X X X X X X - X X X X SMSUNG Memory DRM DRM Type Density it Organization Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) # of Internal anks 1. SMSUNG Memory : K 2. DRM : 4 3. DRM Type : DDR3 SDRM 4~5. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 8G : 8Gb G : 16Gb 6~7. it Organization 04 : x 4 08 : x 8 16 : x16 33 : x32 8. # of Internal anks 3 : 4 anks 4 : 8 anks 5 : 16 anks 9. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 10. Revision M : 1st Gen. : 2nd Gen. : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. H : 9th Gen. 11. "-" 12. Package Type H M E O 13. Temp & Power C Y K : (Halogen-free & Lead-free) : (Halogen-free & Lead-free, DDP) : (Halogen-free & Lead-free, Flip Chip) : (Lead-free & Halogen-free, QDP) : (Lead-free & Halogen-free, QDP for 64G LRDIMM) : Commercial Temp.( 0 C ~ 85 C) & Normal Power(1.5V) : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) & RS( Reduced Standby ) 14~15. Speed F7 : DDR3-800 (400MHz @ CL=6, trcd=6, trp=6) F8 : DDR3-1066 (533MHz @ CL=7, trcd=7, trp=7) H9 : DDR3-1333 (667MHz @ CL=9, trcd=9, trp=9) K0 : DDR3-1600 (800MHz @ CL=11, trcd=11, trp=11) M: DDR3-1866 (933MHz @ CL=13, trcd=13, trp=13) - 2 -
2. DDR3 SDRM Component Product Guide Density anks Part Number 1Gb G-die 2Gb C-die 2Gb D-die 2Gb E-die 4Gb -die 4Gb C-die 4Gb D-die 8anks 8anks 8anks 8anks 8anks 8anks 8anks Package & Power, Temp. & Speed K41G0446G CF8/H9/K0/M 256M x 4 K41G0846G CF8/H9/K0/M 128M x 8 K41G0446G YF8/H9/K0 256M x 4 K41G0846G YF8/H9/K0 128M x 8 K42G0446C HCF8/H9/K0 512M x 4 K42G0846C HCF8/H9/K0 256M x 8 K42G0446C HYF8/H9 512M x 4 K42G0846C HYF8/H9 256M x 8 K42G0446D HCF8/H9/K0/M 512M x 4 K42G0846D HCF8/H9/K0/M 256M x 8 K42G0446D HYF8/H9/K0 512M x 4 K42G0846D HYF8/H9/K0 256M x 8 K42G0446E CH9/K0/M 512M x 4 K42G0846E CH9/K0/M 256M x 8 K42G0446E YH9/K0 512M x 4 K42G0846E YH9/K0 256M x 8 K44G0446 HCF8/H9/K0/M 1G x 4 K44G0846 HCF8/H9/K0/M 512M x 8 K44G1646 HCH9/K0 256M x 16 K44G0446 HYF8/H9/K0 1G x 4 K44G0846 HYF8/H9/K0 512M x 8 K44G1646 HYH9/K0 256M x 16 K44G0446C CH9/K0/M 1G x 4 K44G0846C CH9/K0/M 512M x 8 K44G0446C YH9/K0 1G x 4 K44G0846C YH9/K0 512M x 8 K44G0446D CH9/K0/M 1G x 4 K44G0846D CH9/K0/M 512M x 8 K44G0446D YH9/K0 1G x 4 K44G0846D YH9/K0 512M x 8 Org. VDD Voltage 1 PKG vail. NOTE 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1Q 13 8G -die 8anks K48G1646 K48G1646 MCK0 MYH9/K0 DDP 512M x 16 DDP 512M x 16 1.5V 1.35V 96 ball K48G3346 MCH9/K0 DDP 256M x 32 1.5V 136 ball K48G3346 MYH9/K0 DDP 256M x 32 1.35V K4G0446 K4G0446 ECH9/K0 EYH9/K0 QDP 4G x 4 QDP 4G x 4 1.5V 1.35V 16G -die 8anks K4G0446 OCK0 QDP 4G x4 1.5V K4G0446 OYF8/H9/K0 QDP 4G x4 1.35V * NOTE 1. 1.35V product is 1.5V operatable. - 3 -
3. DDR3 SDRM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 M X X X X X X X X X X - X X X X 1 Memory Module DIMM Type Data bits DRM Component Type Depth # of anks in Comp. & Interface it Organization 1. Memory Module : M 2. DIMM Type 3 : DIMM 4 : SODIMM 3~4. Data its 71 : x64 204pin Unbuffered SODIMM 74 : x72 204pin ECC Unbuffered SODIMM 78 : x64 240pin Unbuffered DIMM 86 : x72 240pin LR DIMM 90 : x72 240pin VLP Unbuffered DIMM 91 : x72 240pin ECC Unbuffered DIMM 92 : x72 240pin VLP Registered DIMM 93 : x72 240pin Registered DIMM 5. DRM Component Type : DDR3 SDRM 6~7. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G: 1G 2G: 2G 4G: 4G 8G: 8G 8. # of anks in comp. & Interface 7 : 8anks & SSTL-1.5V 9. it Organization 0 : x 4 3 : x 8 4 : x16 33 : 32M (for 128Mb/512Mb) 65 : 64M (for 128Mb/512Mb) 29 : 128M (for 128Mb/512Mb) 57 : 256M (for 512Mb/2Gb) 52 : 512M (for 512Mb/2Gb) 1K: 1G (for 2Gb) 2K: 2G (for 2Gb) 10. Component Revision M : 1st Gen. : 2nd Gen. : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. 11. Package Z : (Lead-free) H : (Lead-free & Halogen-free) J : (Lead-free, DDP) M : : (Lead-free & Halogen-free, DDP) (Halogen-free & Lead-free, Flip Chip) E O : : (Lead-free & Halogen-free, QDP) (Lead-free & Halogen-free, QDP for 64G LRDIMM) 12. PC Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev. 13. "_" 15~16. Speed 2 1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer 14. Temp & Power C : Commercial Temp.( 0 C ~ 85 C) & Normal Power(1.5V) Y : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) NOTE: 1. Only used for LRDIMM 2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) PC3-14900(DDR3-1866) Memory uffer Speed Temp & Power PC Revision Package Component Revision F7 : DDR3-800 (400MHz @ CL=6, trcd=6, trp=6) F8 : DDR3-1066 (533MHz @ CL=7, trcd=7, trp=7) H9 : DDR3-1333 (667MHz @ CL=9, trcd=9, trp=9) K0 : DDR3-1600 (800MHz @ CL=11, trcd=11, trp=11) M: DDR3-1866 (933MHz @ CL=13, trcd=13, trp=13) 17. Memory uffer 0 : Inphi im02-gs02 1 : IDT 2 (Greendale) 2 : Montage M C0 3 : Inphi im02-gs02 4 : Montage M CI - 4 -
4. DDR3 SDRM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3912873G0 CF8/H9/K0/M D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 64 256Mx 72 512Mx 64 512Mx 72 1Gx 64 2G 2G 4G 4G 8G Rank PKG Height vail. NOTE M3785773CH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die M3785773DH0 CF8/H9/K0/M (1Rx8) 256M x 8 * 8 pcs 2Gb D-die 8 1 M3785773E0 CH9/K0/M 256M x 8 * 8 pcs 2Gb E-die M3915673G0 CF8/H9/K0/M E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 M3915773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die M3915773DH0 CF8/H9/K0/M D(1Rx8) 256M x 8 * 9 pcs 2Gb D-die 8 1 M3915773E0 CH9/K0/M 256M x 8 * 9 pcs 2Gb E-die M3785273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die M3785273DH0 CF8/H9/K0 (2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M3785273E0 CH9/K0/M 256M x 8 * 16 pcs 2Gb E-die M3785173C0 CK0 512M x 8 * 8 pcs 4Gb C-die D(1Rx8) 8 1 M3785173D0 CK0/M 512M x 8 * 8 pcs 4Gb D-die 1Q 13 M3915273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die M3915273DH0 CF8/H9/K0/M E(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M3915273E0 CH9/K0/M 256M x 8 * 18 pcs 2Gb E-die M3781G73H0 CF8/H9/K0 512M x 8 * 16 pcs 4Gb -die M3781G73C0 CK0 (2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M3785173D0 CK0/M 1G x 8 * 8 pcs 4Gb D-die 1Q 13 1Gx 72 8G M3911G73H0 CF8/H9/K0/M E(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3912873G0 YF8/H9/K0 D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 72 512Mx 72 2G 4G Rank PKG Height vail. NOTE M3915673G0 YF8/H9/K0 E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 M3915773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die D(1Rx8) 8 1 M3915773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die M3915273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die E(2Rx8) 8 2 M3915273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die 1Gx 72 8G M3911G73H0 YF8/H9/K0 E(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 * NOTE : 1.35V product is 1.5V operatable. - 5 -
4.3 240Pin DDR3 VLP Unbuffered DIMM (1.35V Product) 240Pin DDR3 VLP Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 256Mx 72 2G M3905773DH0 YH9 J(1Rx8) 256M x 8 * 9pcs 2Gb D-die 8 1 512Mx 72 4G Rank PKG Height vail. NOTE 18.75mm M3905273DH0 YH9 K(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 18.75mm M3905173H0 YH9 J(1Rx8) 256M x 8 * 18 pcs 4Gb -die 8 1 1Gx 72 8G M3901G73H0 YH9 K(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 * NOTE : 1.35V product is 1.5V operatable. 18.75mm 4.4 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition 256Mx 64 512Mx 64 1Gx 64 2G 4G 8G Comp. Version Internal anks Rank PKG Height vail. NOTE M4715773CHS CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die (1Rx8) 8 1 M4715773DH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die M4715273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die M4715273DH0 CF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M4715273E0 CH9/K0 256M x 8 * 16 pcs 2Gb E-die M4715173C0 CK0 512M x 8 * 8 pcs 4Gb C-die (1Rx8) 8 1 M4715173D0 CH9/K0 512M x 8 * 8 pcs 4Gb D-die 1Q 13 M4711G73H0 CH9/K0 512M x 8 * 16 pcs 4Gb -die M4711G73C0 CK0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M4711G73D0 CH9/K0 512M x 8 * 16 pcs 4Gb D-die 1Q 13 4.5 204Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition 256Mx 64 512Mx 64 1Gx 64 2G 4G 8G Comp. Version Internal anks Rank PKG Height vail. NOTE M4715773CHS YF8/H9 256M x 8 * 8 pcs 2Gb C-die (1Rx8) 8 1 M4715773DH0 YF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die M4715273CH0 * NOTE : 1.35V product is 1.5V operatable. YF8/H9 256M x 8 * 16 pcs 2Gb C-die M4715273DH0 YF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M4715273E0 YK0 256M x 8 * 16 pcs 2Gb E-die M4715173C0 YH9/K0 512M x 8 * 8 pcs 4Gb C-die (1Rx8) 8 1 M4715173D0 YH9/K0 512M x 8 * 8 pcs 4Gb D-die 4Q 12 M4711G73H0 YF8/H9/K0 512M x 8 * 16 pcs 4Gb -die M4711G73C0 YH9/K0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M4711G73D0 YH9/K0 512M x 8 * 16 pcs 4Gb D-die 4Q 12-6 -
4.6 204Pin DDR3 ECC SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 256Mx 72 2G M4745773DH0 YF8/H9 C(1Rx8) 256M x 8 * 9 pcs 2Gb D-die 8 1 512Mx 72 4G M4745273DH0 YF8/H9 D(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M4745173H0 YF8/H9/K0 C(1Rx8) 256M x 8 * 18 pcs 2Gb -die 8 1 1Gx 72 8G M4741G73H0 YF8/H9/K0 D(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 NOTE : 1.35V product is 1.5V operatable. Rank PKG Height vail. NOTE 4.7 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3932873G0 CH9/K0/M (1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 72 512Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M3935673G0 CH9/K0/M (2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE M3935670G0 CH9/K0/M C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 M3935773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die (1Rx8) 8 1 M3935773DH0 CH9/K0/M 256M x 8 * 9 pcs 2Gb D-die M3935173G0 CH9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 M3935170G0 CH9/K0/M E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 M3935273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die M3935273DH0 CH9/K0/M (2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M3935273E0 CM 256M x 8 * 18 pcs 2Gb E-die M3935270CH0 CH9/K0 512M x 4 * 18 pcs 2Gb C-die M3935270DH0 CH9/K0/M C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 M3935270E0 CH9/M 512M x 4 * 18 pcs 2Gb E-die M3931K73CH0 CF8/H9 256M x 8 * 36 pcs 2Gb C-die M3931K73DH0 CH9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 M3931K73E0 CH9 256M x 8 * 36 pcs 2Gb E-die M3931K70CH0 CF8/H9/K0 512M x 4 * 36 pcs 2Gb C-die M3931K70DH0 CH9/K0/M E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die 8 2 M3931K70E0 CH9/M 512M x 4 * 36 pcs 2Gb E-die M3931G73H0 CH9/K0/M (2Rx8) 512M x 8 * 18 pcs 4Gb -die M3931G70H0 CH9/K0/M C(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3932K70DM0 CF8/H9 (4Rx4) 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 M3932G70H0 CF8/H9 1G x 4 * 36 pcs 4Gb -die E(2Rx4) 8 2 M3932G70C0 CK0/M 1G x 4 * 36 pcs 4Gb C-die M3932G73H0 CF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb -die 8 4 M3932G70D0 CK0/M E(2Rx4) 1G x 4 * 36 pcs 4Gb D-die 8 2 1Q 13-7 -
4.8 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3932873G0 YF8/H9/K0 (1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 72 512Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M3935673G0 YF8/H9/K0 (2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE M3935670G0 YF8/H9/K0 C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 M3935773CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die (1Rx8) 8 1 M3935773DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die M3935173G0 YF8/H9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 M3935170G0 YF8/H9/K0 E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 M3935273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M3935273DH0 YF8/H9/K0 (2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M3935273E0 YH9/K0 256M x 8 * 18 pcs 2Gb E-die M3935270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die M3935270DH0 YF8/H9/K0 C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 M3935270E0 YH9/K0 512M x 4 * 18 pcs 2Gb E-die M3931K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die M3931K73DH0 YF8/H9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 M3931K73E0 YH9 256M x 8 * 36 pcs 2Gb E-die M3931K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die M3931K70DH0 YF8/H9/K0 E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die 8 2 M3931K70E0 YH9/K0 512M x 4 * 36 pcs 2Gb E-die M3931G73H0 YF8/H9/K0 (2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 M3931G70H0 YF8/H9/K0 C(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3932K70DM0 YF8/H9 (4Rx4) 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 M3932G70H0 YF8/H9/K0 1G x 4 * 36 pcs 4Gb -die M3932G70C0 YH9/K0 E(2Rx4) 1G x 4 * 36 pcs 4Gb C-die 8 2 M3932G70D0 YH9/K0 1G x 4 * 36 pcs 4Gb D-die 1Q 13 M3932G73H0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb -die 8 4 4Gx 72 32G M3934G70M0 YF8/H9 (4Rx4) * NOTE : 1.35V product is 1.5V operatable. 2G DDP x 4 * 36 pcs 4Gb -die 8 4-8 -
4.9 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3922873G0 CF8/H9/K0/M K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 72 512Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M3925673G0 CF8/H9/K0/M L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE 18.75mm M3925670G0 CF8/H9/K0/M M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 18.75mm M3925773CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die K(1Rx8) M3925773DH0 CF8/H9/K0/M 256M x 8 * 9 pcs 2Gb D-die M3925273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die L(2Rx8) 8 2 M3925273DH0 CF8/H9/K0/M 256M x 8 * 18 pcs 2Gb D-die 18.75mm M3925270CH0 CF8/H9/K0 512M x 4 * 18 pcs 2Gb C-die M(1Rx4) 8 1 M3925270DH0 CF8/H9/K0/M 512M x 4 * 18 pcs 2Gb D-die M3921K73CM0 M3921K73DM0 M3921K70CM0 M3921K70DM0 CF8/H9 CF8/H9 CF8/H9/K0 CF8/H9/K0/M V(4Rx8) N(2Rx4) 512M DDP x 8 * 18 pcs 2Gb C-die 8 4 512M DDP x 8 * 18 pcs 2Gb D-die 1G DDP x 4 * 18 pcs 2Gb C-die 18.75mm 1G 8 2 x 4 * 18 pcs 2Gb D-die DDP M3921G73H0 CF8/H9/K0/M L(2Rx8) 512M x8 * 18 pcs 4Gb -die M3921G70H0 CF8/H9/K0/M M(1Rx4) 1G x4 * 18 pcs 4Gb -die 8 1 M3922G70M0 CF8/H9/K0/M N(2Rx4) M3922G73M0 CF8/H9 V(4Rx8) 4Gx 72 32G M3924G70E0 CF8/H9 U(4Rx4) 2G DDP x4 * 18 pcs 4Gb -die 8 2 1G 18.75mm x8 * 18 pcs 4Gb -die 8 4 DDP 4G QDP x4 * 18 pcs 4Gb -die 8 4 18.75mm - 9 -
4.10 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M3922873G0 YF8/H9/K0 K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die 8 1 256Mx 72 512Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M3925673G0 YF8/H9/K0 L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE 18.75mm M3925670G0 YF8/H9/K0 M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 18.75mm M3925773CH0 YF8/H9 512M x 4 * 9 pcs 2Gb C-die K(1Rx8) 8 1 M3925773DH0 YF8/H9/K0 512M x 4 * 9 pcs 2Gb D-die M3925273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die L(2Rx8) 8 2 M3925273DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die 18.75mm M3925270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die M(1Rx4) 8 1 M3925270DH0 YF8/H9/K0 512M x 4 * 18 pcs 2Gb D-die M3921K73CM0 M3921K73DM0 M3921K70CM0 M3921K70DM0 YF8/H9 YF8/H9 YF8/H9 YF8/H9/K0 V(4Rx8) N(2Rx4) 512M DDP x 8 * 18 pcs 2Gb C-die 8 4 512M DDP 18.75mm x 8 * 18 pcs 2Gb D-die 1G DDP x 4 * 18 pcs 2Gb C-die 8 2 1G DDP x 4 * 18 pcs 2Gb D-die M3921G73H0 YF8/H9/K0 L(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 M3921G70H0 YF8/H9/K0 M(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3922G70M0 YF8/H9/K0 N(2Rx4) M3922G73M0 YF8/H9 V(4Rx8) 4Gx 72 32G M3924G70E0 YF8/H9 U(4Rx4) * NOTE : 1.35V product is 1.5V operatable. 2G DDP x4 * 18 pcs 4Gb -die 8 2 1G 18.75mm x8 * 18 pcs 4Gb -die 8 4 DDP 4G QDP x4 * 18 pcs 4Gb -die 8 4 18.75mm - 10 -
4.11 240Pin DDR3 LRDIMM (1.5V Product) 240Pin DDR3 LDIMM Org. Density Part Number Speed Raw Card Composition 4G x 72 32G M3864G70M0 M3864G70DM0 CM CM C(4Rx4) 8G x 72 64G M3868G70O0 CK0 E(8Rx4) Comp. Version Internal anks Rank PKG Height vail. NOTE 2G DDP x 4 * 36 pcs 4Gb -die 8 4 2G 30.35mm x 4 * 36 pcs 4Gb D-die 2Q 13 DDP 4G QDP x 4 * 36 pcs 4Gb -die 8 8 * NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page. 30.35mm 1) 4.12 240Pin DDR3 LRDIMM (1.35V Product) 240Pin DDR3 LDIMM Org. Density Part Number Speed Raw Card Composition 2G x 72 16G M3862G70DM0 YH9/K0 4G x 72 32G M3864G70M0 M3864G70DM0 YH9/K0 YH9/K0 C(4Rx4) 8G x 72 64G M3868G70O0 YF8/H9 E(8Rx4) Comp. Version Internal anks 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 Rank PKG Height vail. NOTE 30.35mm 2G DDP x 4 * 36 pcs 4Gb -die 8 4 2G 30.35mm x 4 * 36 pcs 4Gb D-die 2Q 13 DDP 4G QDP x 4 * 36 pcs 4Gb -die 8 8 * NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page. 30.35mm 1) - 11 -
5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 4G 2Rx8 PC3-12800R - 11-11 - 1 - P2 Made in Korea M3935270DH0-CK0 1102 5.3 RCD Information - Example PKG RCD Vendor RCD Version(Rev.) JEDEC Description (Example - 4G 2Rx8 PC3(L) 1-12800R - 11-11 - 1 - XX) 1Gb F-die 2Gb C-die 4Gb -die 1Gb G-die 2Gb D-die 4Gb -die 2Gb E-die 2Gb E-die 4Gb C-die 4Gb D-die IDT HL(0) D2 Inphi GS04(1.5V)/LV-GS02(1.35V) P1 IDT 1(evergreen) D3 Inphi UV-GS02 P2 IDT 1 D4 Inphi XV-GS02 P3 * NOTE 1) PC3L is used for 1.35V 2) RCD information is subject to change. - 12 -
6. LRDIMM Memory uffer Information 6.1 Label Example 32G 4Rx4 PC3L - 10600L - 09-11 - C0 Made in Korea M3864G70M0-YH90 1102 6.2 Memory uffer Information - Example Voltage Vendor Revision Module P/N JEDEC Description On Label 1.35V Inphi im02-gs02 M3864G70M0-YH90 1 32G 4Rx4 PC3L-10600L-09-11-C0 Montage M C0 M3864G70M0-YH92 1 32G 4Rx4 PC3L-10600L-09-11-C0 Inphi im02-gs02 M3864G70M0-CM3 1 32G 4Rx4 PC3-14900L-13-11-C0 1.5V IDT 2 M3864G70M0-CM1 1 32G 4Rx4 PC3-14900L-13-11-C0 Montage M C1 M3864G70M0-CM4 1 32G 4Rx4 PC3-14900L-13-11-C0 * NOTE 1) The 16th digit refers memory buffer vendor and revision. 0: Inphi im02-gs02 1: IDT 2 2: Montage M C0 3: Inphi im02-gs02 4: Montage M C1 2) Memory buffer information is subject to change. - 13 -
7. Package Dimension 78all for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8) 7.50 0.10 0.80 x 8 = 6.40 (Datum ) 0.80 1.60 3.20 9 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 7.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 78-0.45 Solder ball (Post Reflow 0.05 0.05) 0.2 M (1.90) (0.95) 0.80 0.80 4.80 0.80 x 12 = 9.60 MOLDING RE 11.00 0.10 11.00 0.10 0.50 0.05 0.35 0.05 1.10 0.10 OTTOM VIEW TOP VIEW 78all Flip chip for 2Gb E-die (x4/x8) 7.50 0.10 0.80 x 8 6.40 (Datum ) 0.80 1.60 3.20 9 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 7.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 78-0.48 Solder ball (Post Reflow 0.50 0.05) 0.2 M (0.30) (0.60) 0.80 0.80 4.80 0.80 x 12 = 9.60 MOLDING RE 11.00 0.10 11.00 0.10 0.37 0.05 1.10 0.10 OTTOM VIEW TOP VIEW - 14 -
78all DDP for 2Gb C-die (x4/x8) (Datum ) 8.00 0.10 0.80 x 8 = 6.40 0.80 1.60 3.20 9 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 8.00 0.10 0.10MX (Datum ) C D E F G H J K L M N 78-0.45 Solder ball (Post Reflow 0.50 0.05) 0.2 M OTTOM VIEW 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 TOP VIEW 11.00 0.10 0.35 0.05 1.40 0.10 78all DDP for 2Gb D-die (x4/x8) 7.50 0.10 0.80 x 8 6.40 (Datum ) 0.80 1.60 3.20 9 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 7.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 78-0.45 Solder ball (Post Reflow 0.50 0.05) 0.2 M 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 11.00 0.10 0.35 0.05 1.10 0.10 OTTOM VIEW TOP VIEW - 15 -
78all DDP for 4Gb -die (x4/x8) (Datum ) 9 10.50 0.10 0.80 x 8 = 6.40 3.20 0.80 1.60 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 10.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 0.80 0.80 4.80 0.80 x 12 = 9.60 12.00 0.10 12.00 0.10 78-0.45 0.05 Solder ball (Post Reflow 0.50 0.05) 0.2 M 0.35 0.05 1.10 0.10 OTTOM VIEW TOP VIEW 78all DDP for 4Gb -die (x4/x8) (Datum ) 9 11.00 0.10 0.80 x 8 = 6.40 3.20 0.80 1.60 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 11.00 0.10 0.10MX (Datum ) C D E F G H J K L M N 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 11.00 0.10 78-0.45 0.05 Solder ball (Post Reflow 0.50 0.05) 0.2 M 0.35 0.05 1.10 0.10 OTTOM VIEW TOP VIEW - 16 -
78all for 4Gb -die (x4/x8) (Datum ) 9 10.00 0.10 0.80 x 8 = 6.40 3.20 0.80 1.60 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 10.00 0.10 0.10MX (Datum ) C D E F G H J K L M N 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 11.00 0.10 78-0.45 Solder ball (Post Reflow 0.50 0.05) 0.2 M (1.90) (0.95) MOLDING RE 0.35 0.05 1.10 0.10 OTTOM VIEW TOP VIEW 78all for 4Gb C-die (x4/x8) (Datum ) 9 8.50 0.10 0.80 x 8 = 6.40 3.20 0.80 1.60 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 8.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 11.00 0.10 78-0.48 Solder ball (Post Reflow 0.50 0.05) 0.20 M (0.30) (0.60) MOLDING RE 0.37 0.05 1.10 0.10 OTTOM VIEW TOP VIEW - 17 -
78all for 4Gb D-die (x4/x8) (Datum ) 9 7.50 0.10 0.80 x 8 = 6.40 3.20 0.80 1.60 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 7.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 0.80 0.80 4.80 0.80 x 12 = 9.60 11.00 0.10 11.00 0.10 78-0.48 Solder ball (Post Reflow 0.50 0.05) 0.20 M (0.30) (0.60) MOLDING RE 0.37 0.05 1.10 0.10 OTTOM VIEW TOP VIEW 78all Flip chip for 1Gb G-die (x4/x8) 7.50 0.10 0.80 x 8 = 6.40 (Datum ) 0.80 1.60 3.20 9 8 7 6 5 4 3 2 1 #1 INDEX MRK #1 7.50 0.10 0.10MX (Datum ) C D E F G H J K L M N 78-0.48 Solder ball (Post Reflow 0.05 0.05) 0.2 M (0.60) (0.30) 0.80 0.80 4.80 0.80 x 12 = 9.60 MOLDING RE 11.00 0.10 11.00 0.10 0.50 0.05 0.35 0.05 1.10 0.10 ottom Top - 18 -
8. Module Dimension x64/x72 240pin DDR3 SDRM Unbuffered DIMM Units : Millimeters 133.35 ± 0.15 128.95 (4X)3.00 ± 0.1 9.50 N/ (for x64) SPD ECC (for x72) 17.30 30.00 ± 0.15 (2) 2.50 2.30 54.675 47.00 71.00 Max 4.0 N/ (for x64) ECC (for x72) 1.270 ± 0.10 5.00 2.50 ± 0.20 0.80 ± 0.05 2x 2.10 ± 0.15 3.80 0.2 ± 0.15 2.50 1.50±0.10 Detail 1.00 Detail - 19 -
x72 240pin DDR3 SDRM ECC VLP UDIMM Units : Millimeters 133.35 ± 0.15 128.95 Max 4.0 18.75 ± 0.15 SPD/TS 54.675 47.00 71.00 D 1.0 max 1.27 ± 0.10 C 5.00 2.50 ± 0.20 0.80 ± 0.05 2x 2.10 ± 0.15 3.80 0.2 ± 0.15 2.50 1.50±0.10 1.00 (2)xR0.8 Detail Detail Detail C & D - 20 -
x64 204pin DDR3 SDRM Unbuffered SODIMM Units : Millimeters 67.60 ± 0.13 63.60 Max 3.8 20.00 SPD 6 30.00 ± 0.13 1.00 ± 0.10 24.80 2X 1.80 0.10 M C (OPTIONL HOLES) 21.00 39.00 2X 4.00 ± 0.10 0.10 M C 0.60 1.65 0.45 ± 0.03 4.00 ± 0.10 2.55 1.00 ± 0.10 0.25 MX Detail Detail - 21 -
x72 204 pin DDR3 SDRM ECC Unbuffered SODIMM Units : Millimeters 67.60 ± 0.13 63.60 Max 3.8 1.00 ± 0.10 24.80 20.00 6 30.00 ± 0.13 2X 1.80 0.10 M C (OPTIONL HOLES) 21.00 SPD 39.00 2X 4.00 ± 0.10 0.10 M C 0.60 1.65 0.45 ± 0.03 4.00 ± 0.10 2.55 1.00 ± 0.10 0.25 MX Detail Detail - 22 -
x72 240pin DDR3 SDRM Registered DIMM 133.35 ± 0.15 128.95 9.76 10.9 18.92 32.40 18.93 9.74 C (2X)3.00 Max 4.0 Units : Millimeters 2.50 54.675 47.00 71.00 Register 9.50 2.30 17.30 Register 30.00 ± 0.15 1.0 max 1.27 ± 0.10 5.00 2.50 ± 0.20 0.80 ± 0.05 3.80 0.2 ± 0.15 10.9 0.4 2.50 1.50±0.10 1.00 R 0.50 Detail Detail Detail C 2x 2.10 ± 0.15 ddress, Command and Control lines - 23 -
Registered DIMM Heat Spreader Design 1. FRONT PRT Outside 133.15 ± 0.2 9.26 11.9 130.45 ± 0.15 31.4 29.77 0.65 ± 0.2 R0.2 1+0/ -0.3 4.65± 0.12 23.6 ± 0.15 25.6 ± 0.15 0.15 1.3 R0.1 1 25.6 ± 0.15 2 127 ± 0.12 2 Green Line : TIM ttatch Line 7.45 2.6 ± 0.2 2 ± 0.1 1.3 Inside 0.4 Reg. pedestal line 80.78 119.29 128.5 2. CK PRT Outside Inside Green Line : TIM ttatch Line - 24 -
3. CLIP PRT 39.3 ± 0.2 29.77 Upper ending Tilting Gap 0.1 ~ 0.3 4. DDR3 RDIMM SS Y View Reference thickness total (Maximum) : 7.55mm (With Clip thickness) 133.15 1.27 3.77 44.4 7.3 ± 0.1 R1.5 6.3± 0.12 0.5 39.3 ± 0.2 7.3 ± 0.1 19 ± 0.12 D 19 ± 0.12 text mark D punch press_stamp Clip open size 2.6~3.8-25 -
x72 240pin DDR3 SDRM VLP Registered DIMM Units : Millimeters 133.35 ± 0.15 128.95 9.76 20.92 32.40 20.93 9.74 C Max 4.0 12.60 Register 54.675 47.00 71.00 SPD/TS 18.10 5.00 2.50 ± 0.20 0.80 ± 0.05 9.9 3.80 0.2 ± 0.15 1.00 VTT Register VTT 18.75 ± 0.15 1.0 max 1.27 ± 0.10 0.6 2.50 1.50±0.10 R 0.50 Detail Detail Detail C VTT SPD/TS VTT ddress, Command and Control lines - 26 -
VLP Registered DIMM Heat Spreader Design (DDP) 1. FRONT PRT Outside 130.45 67 8.69 20.82 35.98 20.82 8.69 0.4 Driver IC(DP:0.18mm) 14.3 Inside Driver IC(DP:0.18mm) 2. CK PRT Outside Driver IC(DP:0.18mm) Inside Driver IC(DP:0.18mm) - 27 -
3. CLIP PRT 7.2 ± 0.1 35.82 7.2 ± 0.1 9.16 ± 0.12 Clip open size 3.0~4.3 9.16 9.16 ± 0.12 0.1 SIDE-L FRONT SIDE-R 4. SS Y VIEW Reference thickness total (Maximum) : 7.55 (With Clip thickness) TIM Thickness 0.25 7.55-28 -
VLP Registered DIMM Heat Spreader Design (QDP) 1. FRONT PRT Outside 127 ± 0.12 51.97 36.56 21.15 9 9.07 9.07 Caution "Hot surfoce" 9.07 9.07 11.6 51.95 13.6±0.15 Inside 2. CK PRT Outside Inside - 29 -
3. CLIP PRT 7.40 ± 0.1 36.82 ± 0.12 7.40 ± 0.1 9.16 Clip open size 3.85 ± 0.65 9.16 ± 0.12 QU 9.16 0.40 ± 0.05 SIDE-L FRONT SIDE-R 4. SS Y VIEW Reference thickness total (Maximum) : 8 (With Clip thickness) TIM Thickness 0.25 8-30 -
x72 240pin DDR3 SDRM LRDIMM Units : Millimeters 133.35 ± 0.15 C (2X)3.00 Max 4.8 9.50 30.35 ± 0.15 2.50 54.675 2.30 17.30 1.27 47.00 71.00 5.00 2.50 ± 0.20 0.80 ± 0.05 9.9 3.80 0.2 ± 0.15 0.6 2.50 1.50±0.10 1.00 R 0.50 Detail Detail Detail C VTT VTT VTT VTT VTT VTT VTT VTT M ddress, Command and Control lines - 31 -
x72 244pin DDR3 SDRM Mini DIMM Units : Millimeters 82.00 ± 0.15 78.00 ± 0.1 6.00 SPD 17.90 ± 0.15 1.80 ± 0.075 33.60 75.60 38.40 3.20 2.55± 0.20 Max 4.0 1.270 ± 0.10 2.30 3.60 1.30 2.55 ± 0.20 0.45 ± 0.03 2x 2.00 ± 0.15 3.80±0.10 0.25 ± 0.15 1.00±0.10 0.60 Detail Detail - 32 -