System Design, Verification and Optimization of Modern Memory Interfaces (DDR3) Greg Pitner

Similar documents
Power Delivery Network (PDN) Analysis

ANSYS for Tablet Computer Design

Realize Your Product Promise. DesignerSI

Sentinel-SSO: Full DDR-Bank Power and Signal Integrity. Design Automation Conference 2014

IBIS for SSO Analysis

Streamlining the creation of high-speed interconnect on digital PCBs

Electromagnetic and Circuit Co-Simulation and the Future of IC and Package Design. Zoltan Cendes

Addressing the DDR3 design challenges using Cadence DDR3 Design-In Kit

3D modeling in PCI Express Gen1 and Gen2 high speed SI simulation

Trace Layer Import for Printed Circuit Boards Under Icepak

Application Note: PCB Design By: Wei-Lung Ho

Temperature-Aware Design of Printed Circuit Boards

Dual DIMM DDR2 and DDR3 SDRAM Interface Design Guidelines

Points Position Indicator (PPI1) for Points Motors with Common Ground

IC-EMC Simulation of Electromagnetic Compatibility of Integrated Circuits

11. High-Speed Differential Interfaces in Cyclone II Devices

LEDs offer a more energy efficient and no radiated heat, no Ultra Violet light solution to replace some halogen lamp applications.

Figure 1 FPGA Growth and Usage Trends

Jitter in PCIe application on embedded boards with PLL Zero delay Clock buffer

POINTS POSITION INDICATOR PPI4

White Paper Utilizing Leveling Techniques in DDR3 SDRAM Memory Interfaces

Figure 1. Core Voltage Reduction Due to Process Scaling

Agilent EEsof EDA.

Using Thermocouple Sensors Connecting Grounded and Floating Thermocouples

Simulation Techniques for Tablet and Mobile Phone Design Bill McGinn; Ansys Senior Application Engineer

Hardware and Layout Design Considerations for DDR4 SDRAM Memory Interfaces

1.55V DDR2 SDRAM FBDIMM

EE 242 EXPERIMENT 5: COMPUTER SIMULATION OF THREE-PHASE CIRCUITS USING PSPICE SCHEMATICS 1

Titelmasterformat durch Klicken bearbeiten

Application Note. PCIEC-85 PCI Express Jumper. High Speed Designs in PCI Express Applications Generation GT/s

Hands On ECG. Sean Hubber and Crystal Lu

" PCB Layout for Switching Regulators "

CFD SIMULATION OF SDHW STORAGE TANK WITH AND WITHOUT HEATER

CHIP-PKG-PCB Co-Design Methodology

Module 22: Signal Integrity

DDR subsystem: Enhancing System Reliability and Yield

Application Note AN1

Output Ripple and Noise Measurement Methods for Ericsson Power Modules

ECEN 1400, Introduction to Analog and Digital Electronics

Forum R.F.& Wireless, Roma il 21 Ottobre 2008 Dr. Emmanuel Leroux Country Manager for Italy

Application Note AN:005. FPA Printed Circuit Board Layout Guidelines. Introduction Contents. The Importance of Board Layout

CCTech TM. ICEM-CFD & FLUENT Software Training. Course Brochure. Simulation is The Future

Selecting and Implementing H-Bridges in DC Motor Control. Daniel Phan A

HP 8970B Option 020. Service Manual Supplement

Virtuoso Analog Design Environment Family Advanced design simulation for fast and accurate verification

EMIT. RF Cosite and Coexistence RFI Modeling and Mitigation

LEVERAGING FPGA AND CPLD DIGITAL LOGIC TO IMPLEMENT ANALOG TO DIGITAL CONVERTERS

POWER FORUM, BOLOGNA

Document Contents Introduction Layout Extraction with Parasitic Capacitances Timing Analysis DC Analysis

Welcome to this presentation on LED System Design, part of OSRAM Opto Semiconductors LED 101 series.

QUICK START GUIDE FOR DEMONSTRATION CIRCUIT 994 THREE CHANNEL LED BALLASTER WITH PWM LT3003 DESCRIPTION

Lab E1: Introduction to Circuits

LDO03C/LDO06C/LDO10C

Forum R.F.& Wireless, Milano il 14 Febbraio 2008 Dr. Emmanuel Leroux Technical Sales Manager for Italy

Thermal Modeling Methodology for Fast and Accurate System-Level Analysis: Application to a Memory-on-Logic 3D Circuit

.OPERATING SUPPLY VOLTAGE UP TO 46 V

DDR SDRAM Memory Termination USING THE LX1672 AND LX1673 FOR DDR SDRAM MEMORY TERMINATION INTEGRATED PRODUCTS. Microsemi

TYPICAL APPLICATION CIRCUIT. ORDER INFORMATION SOP-EP 8 pin A703EFT (Lead Free) A703EGT (Green)

Design Guide for the Control of ESD in the esata Interface

Multipurpose Analog PID Controller

Designing an Induction Cooker Using the S08PT Family

CAT4109, CAV Channel Constant-Current RGB LED Driver with Individual PWM Dimming

PowerAmp Design. PowerAmp Design PAD135 COMPACT HIGH VOLATGE OP AMP

DDR2 SDRAM FBDIMM MT9HTF6472F 512MB MT9HTF12872F 1GB. Features. 512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM. Features

Mobile Device Power Monitor Battery Connection Quick Start Guide

Learning Module 4 - Thermal Fluid Analysis Note: LM4 is still in progress. This version contains only 3 tutorials.

ADQYF1A08. DDR2-1066G(CL6) 240-Pin O.C. U-DIMM 1GB (128M x 64-bits)

Optimizing VCO PLL Evaluations & PLL Synthesizer Designs

Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material

One LED Driver Is All You Need for Automotive LED Headlight Clusters

Quick Start Guide for High Voltage Solar Inverter DC-AC Board EVM. Version 1.3

Technical Note. Initialization Sequence for DDR SDRAM. Introduction. Initializing DDR SDRAM

IIB. Complete PCB Design Using OrCAD Capture and PCB Editor. Kraig Mitzner. ~»* ' AMSTERDAM BOSTON HEIDELBERG LONDON ^ i H

isim ACTIVE FILTER DESIGNER NEW, VERY CAPABLE, MULTI-STAGE ACTIVE FILTER DESIGN TOOL

VICOR WHITE PAPER. The Sine Amplitude Converter Topology Provides Superior Efficiency and Power Density in Intermediate Bus Architecture Applications

FEATURES DESCRIPTION APPLICATIONS BLOCK DIAGRAM. PT2272 Remote Control Decoder

Fox-2 MPPT Unit Testing

SPREAD SPECTRUM CLOCK GENERATOR. Features

Calibration Techniques for High- Bandwidth Source-Synchronous Interfaces

LC05-6. Dual Low Capacitance TVS Array for Telecom Line-Card Applications. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

An Advanced Behavioral Buffer Model With Over-Clocking Solution. Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan.

SL Series AC and DC Electronic Loads

Shrinking a power supply and the challenge to maintain high reliability.

TIMING-DRIVEN PHYSICAL DESIGN FOR DIGITAL SYNCHRONOUS VLSI CIRCUITS USING RESONANT CLOCKING

Table 1 SDR to DDR Quick Reference

IEC ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays

ICS514 LOCO PLL CLOCK GENERATOR. Description. Features. Block Diagram DATASHEET

MAS.836 HOW TO BIAS AN OP-AMP

Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package

Application Note AN-1135

Features. Modulation Frequency (khz) VDD. PLL Clock Synthesizer with Spread Spectrum Circuitry GND

Best Practises for LabVIEW FPGA Design Flow. uk.ni.com ireland.ni.com

Welcome to this presentation on Driving LEDs AC-DC Power Supplies, part of OSRAM Opto Semiconductors LED Fundamentals series. In this presentation we

Technical Note Design Guide for Two DDR UDIMM Systems

Pololu DRV8835 Dual Motor Driver Shield for Arduino

Using CFD for optimal thermal management and cooling design in data centers

SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

Transcription:

System Design, Verification and Optimization of Modern Memory Interfaces (DDR3) Greg Pitner 1 ANSYS, Inc. September 14,

Agenda DDR3 Requirements Xilinx PCB translation DC and AC model extraction Building a system model User-defined outputs 2 ANSYS, Inc. September 14,

DDR2/3 Overview DDR3 speed is 800-1600MBps which is 2x DDR2 Tighter noise margins Lower voltage (1.5V vs 1.8V) 4 ANSYS, Inc. September 14, Information source: JEDEC 2007 DDR Workshop and HP DDR3 Application Note

DDR2/3 Timing Specifications Setup Margin & Hold Margin DQ Jitter DQS V REF V IH(AC) Setup Time Hold Time V IH(DC) V IL(AC) V IL(DC) Setup Margin Hold Margin 5 ANSYS, Inc. September 14,

Also DDR2/3 Timing Specifications 6 ANSYS, Inc. September 14, Information source: JEDEC specification JESD79-3

ANSYS Solution Electrical DesignerSI, SIwave, HFSS Mechanical Fluid Dynamic 7 ANSYS, Inc. September 14, Images and models courtesy of the Xilinx, Micron Technology, TE Connectivity.

Xilinx ML605 Board 10 ANSYS, Inc. September 14, Courtesy of:

Layout Translation from Cadence Allegro 11 ANSYS, Inc. September 14, Courtesy of:

Complex Multiple PCB Power Domains Power Sources and Sinks 1.5V Memory and FPGA 1V8 2V5 2V5 FPGA 3V3 5V 12_P 12_P_IN 14 ANSYS, Inc. September 14, Courtesy of:

Bidirectional Thermal Link SIwave DC IR solver SIwave has the ability to examine the full current path as well as each individual segment. Hot spots/bottlenecks that may cause reliability and excessive heating can be detected via current density and DC simulation results can be coupled to a thermal / airflow simulation using ANSYS IcePak TM. SIwave Bi-directional Coupling Power and Thermal Mapping Icepak 15 ANSYS, Inc. September 14,

SIwave DC Simulation Adaptive meshing of PCB geometry 16 ANSYS, Inc. September 14,

SIwave Icepak Link SIwave Icepak Although most temperature increase is driven by IC s, IR loss in high-current nets can be a non-trivial source of heating SIwave can export spatiallydependent ohmic loss data to Icepak Icepak Siwave Metal conductivity is significantly affected by temperature SIwave can read temperature data from Icepak and alter DC conductivity accordingly 17 ANSYS, Inc. September 14,

SYZ Parameter extraction Main board and SODIMM modeled with SIwave Power Rail and Signal Nets, DC and AC DDR3 204PIN SODIMM Connector modeled with HFSS 19 ANSYS, Inc. September 14,

Designer Models Main board with connector Main board with connector and SODIMM board Main board only 20 ANSYS, Inc. September 14,

VRM(PTD08A010W) model from TI Fusion Digital Power designer from TI Generate real VRM model 22 ANSYS, Inc. September 14, Information source: http://focus.ti.com/docs/toolsw/folders/print/fusion_digital_power_designer.html

VRM DDR3 PDN model DDR3 1.5V Power Delivery Network with real VRM model Multiple probing points displayed Top and bottom DDR3 package, FPGA and VRM U8 U18 23 ANSYS, Inc. September 14, Courtesy of:

VRM Current Signature Profile Probe Point : VRM Output(Blue), FPGA Power(Brown) and DDR3 (Red). 1. VRM Output 2. DDR3 package 24 ANSYS, Inc. September 14,

Automatic Schematic Creation: SIWizard Step 1: Select Signal Nets Step 2: Assign IBIS TX/RX Buffers Step 3: Identify Component Pwr/Gnd Nets Step 4: Set VRM Parameters Step 5: Set Transient Simulation 28 ANSYS, Inc. September 14,

SSN analysis Full Schematic and Analysis DQS Zero Crossing and Eye Margins 29 ANSYS, Inc. September 14,

DDR3 Channel Eye Diagrams Connector Effects on DQS line Zero Crossing Without Connector With Connector 30 ANSYS, Inc. September 14,

DDR3 SSN and Channel Eye Diagrams 31 ANSYS, Inc. September 14,

User-Defined Outputs UDO s are a way of calling Python scripts from within the Designer GUI Python is an intuitive and powerful scripting language with a large scientific and engineering user base Perform custom analyses on simulation waveforms A Python script can be written to arbitrarily postprocess waveforms 32 ANSYS, Inc. September 14,

Setting Up a UDO Point Designer to a Python script and map variables to waveform trace names 33 ANSYS, Inc. September 14,

Creating a UDO-based Report Once a UDO is set up, its results can be accessed like an ordinary output 34 ANSYS, Inc. September 14,

DDR3 Calculations With UDO Voltage and timing margins can be printed in Data Table format within the Designer GUI 35 ANSYS, Inc. September 14,

DDR3 Channel Derating tables, slew rate 36 ANSYS, Inc. September 14,

SODIMM board, Connector and Main Board HFSS SIwave, DesignerSI SIwave, DesignerSI and HFSS 37 ANSYS, Inc. September 14,

ANSYS Tools Overview DDR3 Solution for Electrical Simulations ECAD Geometry Translation ECAD Translators and AnsoftLinks SI/PI DDR3 Channel Extraction HFSS, SIwave Design Automation and Schematic Creation DesignerSI and SIwave DDR3 Transient Simulation Results DesignerSI, UDO s 38 ANSYS, Inc. September 14,

Thank You 39 ANSYS, Inc. September 14,