MODERN VACUUM TECHNOLOGY; COMPARING PLA TO OTHER BARRIER SUBSTRATES
OUTLINE High Barrier Metallizing The Metallizing Process Barrier Properties In Chamber Top Coating The top coating process Barrier properties SiOx Coating The EB coating process in chamber Barrier Properties Summary
HIGH BARRIER METALLIZING
The Metallization Process
The Winding System
The Metallizing Zone
Barrier Ranges of Films Standard Basic tea and coffee packaging BASIC High Barrier liquid packaging HIGH Ultra High Barrier Bag-in-box, dried soup mix HIGHER!
HIGH BARRIER MET PET Standard vs. High Barrier Oxygen Transmission Rates OTR (cc/100 in2/day 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 Standard Conditions 2.3 OD Standard Conditions 2.8 OD Barrier Conditions 2.3 OD Barrier Conditions 2.8 OD WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
HIGH BARRIER MET PET Standard vs. High Barrier Water Vapor Transmission Rates 0.09 0.08 WVTR (g/100 in2/day 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 Standard Conditions 2.3 OD Barrier Conditions Standard Conditions 2.8 OD 2.3 OD Barrier Conditions 2.8 OD WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
BARRIER VALUES Product MVTR Values g/100in²/24 hr. OTR Values cc/100in²/24 hr. Metallizing Condition PET Standard 0.06 0.07 PET High Barrier <0.02 <0.02 OPP Standard <0.03 <4 OPP High Barrier 0.01 <3.0 PLA Standard 0.84 1.5 PLA High Barrier 0.2 0.4 WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
IN CHAMBER TOP COATING
The In Chamber Coating Process
THE COATING ASSEMBLY
Metal layer PINHOLE THEORY Gas transmission rate through a metallized film is controlled by the number of defects in the metal layer Defects Substrate Gas flow
PINHOLE THEORY What causes the defects? Roller debris Metal layer Substrate Scratches in the metal layer from debris on rollers Impurities in the surface flaking off Antiblock particles Oligomers & waxes
PINHOLE THEORY How does a coating prevent the defects? Roller debris Coating Metal layer Substrate Impressions in the coating instead of scratches in the metal layer Impurities in the surface are trapped
PINHOLE THEORY Uncoated Coated
BARRIER VALUES Material Metallizing Condition MVTR Values g/100in²/24 hr. Improvement Percentage OTR Values cc/100in²/24 hr. Improvement Percentage PET UNCOATED 0.011 0.060 PET COATED 0.003 72.7 0.010 83.3 OPP UNCOATED 0.011 2.600 COATED 0.003 72.7 0.310 88.1 PLA UNCOATED 0.240 0.510 COATED 0.086 64.2 0.193 62.2 COATED 0.032 86.2 0.037 95.0 WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
SiOx COATING
The SiOx Coating Process Rewinder Unwinder Plasma pretreatment Electron beam evaporation
The SiOx Winding Zone
The SiOx Coating Zone
SiOx-PLA Barrier Development MVTR Values g/100in²/24 hr. OTR Values cc/100in²/24 hr. Product SiOx PET 0.100 0.150 SiOx PET laminated to 80g CPP 0.060 0.100 SiOx OPP 0.050 2.910 SiOx OPP laminated to 80g CPP 0.040 0.330 SiOx PLA 1.290 1.290 SiOx PLA laminated to 80g PLA 0.322 0.322 WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
SUMMARY
SUMMARY PLA films can be effectively run through various barrier processes. Improved barrier values can be achieved, for PLA to be used for flexible packaging applications. In chamber coating significantly improves the barrier values of metallized PLA.
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