PCI Express 3.0 Testing Approaches for PHY and Protocol Layers name title
Agenda Introduction to PCI Express 3.0 Trends and Challenges Physical Layer Testing Overview Transmitter Design & Validation Transmitter Compliance Receiver & Summary of Tools for PCIe PHY Testing Protocol Planning probe access Time to confidence Information density Applications Summary 2 2010-4-26
PCI Express 3.0 Technology Timeline Today 2009 2010 2011 2112 Base Spec CEM Spec Test Spec 0.5 Release 0.7 Release 0.71 Release 0.5 Release 0.7 Draft 0.3 Release Integration Phase Deployment Phase Silicon Phase CEM Spec Development Product Development PCI-SIG Tool Development Presentation Content based on.9 Base Specification Draft and.7 CEM Specification Draft Tektronix Involved in PCIe EWG, CEM, and Serial Enabling Working Groups 3 2010-4-26
PCI Express 3.0 Trends and Implications Industry/Technology Trends Data transfer rates continue to increase: 2.5 5 8 GT/s 128b/130b encoding Backwards interoperability Energy efficiency (Lower mw/gb/s) Implications Greater system complexity increases the engineering challenge Higher data rate signals have less margin requires de-embedding Crosstalk, skew, noise and attenuation more significant Link training and power management continue to be the most difficult challenges 4 2010-4-26
High Speed Serial Test Challenges Design Verification Compliance Test System Integration Digital Validation & Debug Data Link Analysis Digital validation & Debug Transaction Layer Data Link Layer Complete Validation, Debug, Compliance Solutions!! Logical Sub-block Simulation Signal Integrity Eye and Jitter Analysis Characterization & Validation Receiver Test Direct Synthesis Compliance Testing Physical Layer Electrical Sub-block Serial Data Network & Link Analysis Tx + + path + + Rx - - - - 5 2010-4-26
Agenda Introduction to PCI Express 3.0 Trends and Challenges Physical Layer Testing Overview Transmitter Design & Validation Transmitter Compliance Receiver & Summary of Tools for PCIe PHY Testing Protocol Planning probe access Time to confidence Information density Applications Summary 6 2010-4-26
What s New for PCI Express Gen 3.0 Double bandwidth (8GT/s with 128b/130b) while using traditional circuit board (FR-4) Requires de-embedding measurements to Tx pins, specifies breakout and replica channels. Large channel losses require Tx and Rx equalization Tx equalization- Defined pre-shoot and deemphasis Presets Rx equalization behavioral CTLE & DFE New jitter separation algorithms 7 2010-4-26
Transmitter Design & Validation PCI Express
PCIe 3.0 Base Spec Transmitter Voltage and Jitter Measurements Base Spec Measurements defined at the pins of the transmitter New Jitter Measurements are defined for PCIe 3.0 9 2010-4-26
New PCIe 3.0 Jitter Measurements Uncorrelated Total Jitter and Uncorrelated Deterministic Jitter Uncorrelated jitter is not mitigated by Tx or Rx equalization and represents timing margin that cannot be recovered with equalization. Data Dependent Jitter is determined by averaging from a repeated compliance pattern Uncorrelated Jitter derived after removing Data Dependent Jitter Construct the bathtub curve in Q scale Estimate Total Jitter with Q Scale extrapolation 10 2010-4-26
New PCIe 3.0 Jitter Measurements (cont d) Uncorrelated Total and Deterministic PWJ Long lossy channels cause single pulses to be attenuated ISI contributions need to be removed to determine PWJ Calculate the edge to edge Jitter Construct the bathtub curve in Q scale Estimate Total Jitter with Q Scale extrapolation 11 2010-4-26
Transmitter Characterization Tx measurements referenced to pins but can only access TP1 Extract replica channel transfer function (S-Parameter) Acquire signals at TP1 then mathematically remove channel effects Test Channel.s4p 12 2010-4-26
De-embedding Removal of signal impairment caused by selected known part of the circuit. Measurement setup often known i.e., a fixture. When impacts does the test fixture add? What does the signal look like at the Tx, without the fixture? + + - - True Fixture Measured De-embedded (calculated in oscilloscope from Measure and from network parameters of fixture) close to the True Measure the Fixture (with TDR, VNA, etc) and and capture the network s parameters (e.g. as a S parameter touchstone file) In the oscilloscope Import the S parameter file, view the waveform as it was at the source. 13 13 2010-4-26
Probing and Signal Access Typically used when a signal needs to be measured and no SMA or RF connector is available Debug Require a quick way to check that signals are present Solder tips can be used for a more permanent connection for troubleshooting Validation and Compliance Testing Chip to chip buses 14 2010-4-26
Tektronix Solutions for PCIe 3.0 Base Spec Testing Available Today Channel Embedding / Deembedding support with (Serial Data Link Analysis) Software TX Voltage V TX-FS-NO-EQ and V TX- RS-NO-EQ Measurements available today in DPOJET 20Ghz Real-Time Oscilloscope and Probes for Fifth Harmonic Capture Tektronix DPOJET PCIe 3.0 SW 15 2010-4-26
Transmitter Compliance PCI Express
CEM Specification Add-In Card Transmitter Testing TX measurements based on one preset value (assumption is the best preset will be used for compliance) Measurements taken after RX Equalization using the Compliance Base Board Preset Number P4 P1 P0 P9 P8 P7 P5 P6 P3 P2 P10 preshoot (db) 0.0 0.0 0.0 3.5 ±1 db 3.5 ±1 db 3.5 ±1 db 1.9 ±1 db 2.5 ±1 db 0.0 0.0 0.0 de-emph (db) 0.0-3.5 ±1 db -6.0 ±1.5 db 0.0-3.5 ±1 db -6.0 ±1.5 db 0.0 0.0-2.5 ±1 db -4.4 ±1.5 db -9.5 ± 1.5 db c -1 0.000 0.000 0.000-0.166-0.125-0.100-0.100-0.125 0.000 0.000 0.000 c +1 0.000-0.167-0.250 0.000-0.125-0.200 0.000 0.000-0.125-0.200-0.333 Va 1.000 1.000 1.000 0.668 0.750 0.800 0.800 0.750 1.000 1.000 1.000 Vb 1.000 0.668 0.500 0.668 0.500 0.400 0.800 0.750 0.750 0.600 0.333 Vc 1.000 0.668 0.500 1.000 0.750 0.600 1.000 1.000 0.750 0.600 0.333 Voltage Measurements on Both Transition and Non-Transition Bits at a BER of 10-6 Eye Width Measurements taken with a sample of at least 10 6 UI and Eye opening is computed at 10-6 17 2010-4-26
CEM Specification System Transmitter Testing Same methodology as Add-In Card Testing, but uses the dual port method (clock and data) Measurements taken after RX Equalization using the Compliance Load Board Voltage Measurements on Both Transition and Non-Transition Bits at a BER of 10-6 Eye Width Measurements taken with a sample of at least 10 6 UI and Eye opening is computed at 10-6 18 2010-4-26
Receiver Equalization PCIe Gen 3.0 uses Transmitter De-emphasis plus RX CTLE and Dfe What would the signal look like inside the receiver after equalization? + + result after emulated channel result after Equalization - - Measured Eye out of Tx 19 19 Link analysis with Continuous Time Linear Equalizer (CTLE) or Decision Feedback (DFE) Equalizers Three DFE modes Coefficients values adapted based on measured data- Auto adapt taps Coefficient values adapted based on existing taps- Adapt from current taps Do not adapt Slicer controls and training sequence support 2010-4-26
Tektronix Solutions for PCIe 3.0 CEM Testing Available Today Receiver Equalization support for CTLE and DFE with SDLA (Serial Data Link Analysis) Software Measurements available today in DPOJET Tektronix DPOJET SW PCI-SIG SigTest SW 20 2010-4-26
Summary of Tektronix Tools for PCIe Testing TDR/TDT/IConnect for Serial Data Network Analysis 50 GHz TDR/TDT system and S-Parameter measurements, highly accurate impedance and loss measurements Up to 1M record length Real-Time Oscilloscope and Analysis Tools Transmitter Validation, Debug, Compliance, and Receiver Calibration Complete Link channel embedding/de-embedding, equalization (CTLE/DFE) with SDLA CEM and Base Spec Measurements with DPOJET and TekExpress TriMode Differential probes 20GHz to the probe tip Receiver Stress Generation Flexibility to support all signal impairments required for jitter tolerance testing Model real-world complexities of SSC profiles to avoid system interoperability issues 21 21 2010-4-26 2010 年 4 月 26 日 星 期 一 Tektronix Confidential V0.98
Digital Validation And Debug Logic layer validation Design Verification Compliance Test Digital Validation And Debug System Integration Digital Validation & Debug Data Link Analysis Digital validation & Debug Transaction Layer Data Link Layer Logical Sub-block Simulation Signal Integrity Eye and Jitter Analysis Characterization & Validation Receiver Test Direct Synthesis Compliance Testing Physical Layer Electrical Sub-block Serial Data Network & Link Analysis Tx + + path + + Rx - - - - 22 2010-4-26
Agenda Introduction to PCI Express 3.0 Trends and Challenges Physical Layer Testing Overview Transmitter Design & Validation Transmitter Compliance Receiver & Summary of Tools for PCIe PHY Testing Protocol Planning probe access Time to confidence Information density Applications Summary 23 2010-4-26
Testing Challenges with PCI Express 3.0 Transaction Layer Creates Request/Completion Transactions Messaging TLP Flow Control Data Link Layer Flow control information Data Integrity, Error Checking/Correction Calculates/Check TLP Sequence Number Calculate/Check CR Physical Layer Logical Sub Block Link Initialization and Training Distribution of packet information over multiple lanes Power management and link power state transitions Physical Layer Electrical Sub Block Transmitter Signal Quality and Ref Clock Testing Receiver Testing Interconnect Testing PLL Loop BW 24 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Planning probe access Accessing PCIe3 signals Assessing probing impact Probing flexibility Time to confidence Automating setup Recovery options Powerful triggering Wide acquisition window Information density Four (4) different data visualizations that provide views dedicated to different types of investigations: Summary statistics window Transaction window Listing window Waveform window Applications Transaction Window Intro Transaction Window Normal Traffic Transaction Window Transaction Error Transaction Window Physical Layer Summary Profile Window 25 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Planning probe access How access PCIe3 signals? Is there a probe design guide available showing a variety of probing access? Does it include mechanical KOV (Keep Out Volume) info? Are PCB CAD symbols available for their midbus footprints? Is probing available for legacy PCIe2 midbus footprints? Is there a probe available that I can solder-down as a last resort? How assess the probing impact? How is the PCIe3 signal recovered without breaking the link? What is the maximum PCIe3 channel length supported? Are electrical load models of all probes available for computer simulation? How flexible is the probing? How long are the probe cables? Can I reconfigure my PCIe3 probe channels if there are layout errors? 26 2010-4-26
Primary Debug Challenges When Implementing PCIe 3.0 Device A Tx Rx Rx Tx Device B Probing Points Probing Access Midbus vs interposer vs solder-down Need to compensate for Tx de-emphasis Need to compensate for channel loss Need to compensate for reflections Link training Multi-lane systems x1, x4, x8, x16 Dynamic speed negotiations 2.5 GTs 5 GTs 8 GTs 2.5 GTs 8 GTs Dynamic link width changes x16 x8 x4 x1 Active State Power Management (ASPM) Power Management: Electrical Idle Entry and Exit for power savings (L0 L0s L0) Dynamic link width and link speed changes depending on data bandwidth requirements Total System Visibility Critical cross bus dependencies increase with speed Flow Control Time-correlated visibility across multiple buses Signal access across the entire system Link training and power management continue to be the most difficult challenges! 27 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Planning probe access Accessing PCIe3 signals Assessing probing impact Probing flexibility Time to confidence Automating setup Recovery options Powerful triggering Wide acquisition window Information density Four (4) different data visualizations that provide views dedicated to different types of investigations: Summary statistics window Transaction window Listing window Waveform window Applications Transaction Window Intro Transaction Window Normal Traffic Transaction Window Transaction Error Transaction Window Physical Layer Summary Profile Window 28 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Time to confidence Does the analyzer automatically configure? Are there real-time statistics that show bus utilization, link width, etc. so that I can get an overall indication of the link health? Does the GUI show the health of each lane? Are there front-panel LEDs that show me the status of the link? What options do I have if I can t get the analyzer to automatically configure? Is there an option to use my oscilloscope so that I can see whether my signal meets the input requirements or whether the probe is inoperable? 29 2010-4-26
PCIe3 Setup Window Additional key hardware settings (filtering, triggering) easily accessed Auto-training, auto-tracking as well as manual modes Configuration screen reflects front-panel LED lane status Module wires itself automatically based on observing signals yet allows user to adjust wiring 30 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Planning probe access Accessing PCIe3 signals Assessing probing impact Probing flexibility Time to confidence Automating setup Recovery options Powerful triggering Wide acquisition window Information density Four (4) different data visualizations that provide views dedicated to different types of investigations: Summary statistics window Transaction window Listing window Waveform window Applications Transaction Window Intro Transaction Window Normal Traffic Transaction Window Transaction Error Transaction Window Physical Layer Summary Profile Window 31 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Information density How powerful is the triggering? Can I trigger on ordered sets or packet types? Can I trigger on errors, e.g., loss of framing, illegal sync characters? How wide is the acquisition time window? Can I control what gets stored? How fast can I access and move around within the acquisition record? What information do each of the data windows provide? Summary Profile (Statistics) - Acquisition summary statistics based view of protocol elements (distribution of protocol elements across acquisition) Transaction - Link based behavior of protocol elements (transactions, packets, fields, ordered sets) Listing - Lane based behavior of protocol elements (symbols, tokens, ordered sets, DLLPs, TLPs) Waveform - Time based view of the data on each lane Can I correlate data from my PCIe3 bus with other buses (e.g., DDR3) and see it all on a single display? 32 2010-4-26
PCIe3 Trigger Window Packet level triggering 8 states 8 packet recognizers 4 symbol sequence recognizers 4 counter/timers 4 event flags Real-time filtering Pre-defined trigger templates (trigger on any field within packet) 33 2010-4-26
Summary Profile Window (1/2) 1 or more Links At a glance review of sparklines (divides acqmem into 100 slices or centiles) provides key information such as health and behavior of bus LTSSM view Summary statistics Trace elements view Each protocol element represented with its statistics Real-time statistics view (utilizes module acquisition HW) 1 st occurrence hyperlink 34 2010-4-26 Region markers
Summary Profile Window (2/2) Visually see training occur by recognizing patterns. For example, can see electrical idle (gap in SKP) followed by training (TS1 & TS2). 35 2010-4-26
Transaction Window (1/3) Toolbar (Search, filter, display management) Transaction stitching shows packets participating in transaction or incomplete transactions as errors mouse over shows time arrowheads/squares filled or not based upon completion Config Links Status bar & access to Summary Profile Window BEV (Bird s Eye View) Each row of the Packet View pane represents a single packet Flow control credit tracking PHY layer info (shows subpacket info such as ordered sets view in more detail in Listing Window) Packet pane to view fields (can simultaneously open multiple packets TEKTRONIX CONFIDENTIAL 36 2010-4-26
Transaction Window (2/3) Transaction stitching shows packets participating in transaction Toolbar (Search, filter, display management) Config Links Status bar & access to Summary Profile Window PHY layer info (shows subpacket info such as ordered sets view in more detail in Listing Window)) BEV (Bird s Eye View) Color-coding to distinguish normal traffic from error conditions Flow control credit tracking Packet pane to view fields (can simultaneously open multiple packets 37 2010-4-26
Listing Window Packet & Symbol View (disassembly of lane data on each link including TLPs, DLLPs, ordered sets and symbols 07-APR-2010 38 2010-4-26
Waveform Window Waveform symbolic decode (lane alignment disabled for accurate time correlation) 39 2010-4-26
Challenges Selecting Tools for PCI Express 3.0 Planning probe access Accessing PCIe3 signals Assessing probing impact Probing flexibility Time to confidence Automating setup Recovery options Powerful triggering Wide acquisition window Information density Four (4) different data visualizations that provide views dedicated to different types of investigations: Summary statistics window Transaction window Listing window Waveform window Applications Transaction Window Intro Transaction Window Normal Traffic Transaction Window Transaction Error Transaction Window Physical Layer Summary Profile Window 40 2010-4-26
PCI Express 3.0 Acquisition Solutions 8.0 GTs, 5GTs, and 2.5GTs acquisition rates for PCIe3/2/1 Sync to L0s within 4 FTS PCIe3 packets or 12 FTS PCIe2 packets Automatic configuration of link training speed changes and link width Track 2.5 GTs to 5.0 GTs to 8.0 GTs data rate changes without dropping parts of transactions or critical packets Dynamically track changes in link width Front-panel LEDs that show link rate and link status for both Upstream/Downstream links Powerful trigger state machine spans all layers of the protocol 8 states 8 packet recognizers 4 symbol sequence recognizers 4 counter/timers 4 event flags Conditional storage 8 GB memory/module (16 GB memory, x16 link) with 160 Msymbols/lane record length Two acquisition modules available: 16 differential inputs, x8 (2 required for x16) 8 differential inputs, x4 41 2010-4-26
Tektronix PCIe3 Probes With Active Equalization Slot Interposer Probes Midbus Probes Solder-down Probes Available in x16, x8, x4, x1 link widths Probe cover Bracket for SUT end point card provides mechanical stabilization and reliable connection 6 probe cable Ships in antistatic, foam-lined, plastic case Available in x8 or x4 link widths (2 for x16) Rugged probe head with contacts contained in retention module Retention module securely attaches to PCB (0.031 to 0.250 ) using back mounting plate with screws Midbus probe also available for legacy PCIe2 x16 midbus footprint 6 probe cable Ships in antistatic, foam-lined, plastic case High-performance solder-down probing of one (1) PCIe3 differential pair Supports 8 GT/s Compatible with P7500 Series TriMode probing leadsets that can be shared with oscilloscope 6 probe cable Ships in antistatic, foam-lined, plastic case 42 2010-4-26
Midbus footprint (PCB land pattern) support P67SA16 x8 midbus probe P67SA08 x4 midbus probe 8 GT/s P67SA16G2 x8 midbus probe TLA7SAxx PCIe3 Module 5 GT/s P67SA16G2 5 GT/s P6716 x8 midbus probe P6708 x4 midbus probe TLA7Sxx PCIe2 Module P6716G3 PCIe Gen2 midbus probe head P67SAxx Series PCIe Gen3 midbus probe with 16 diff inputs PCIe Gen3 midbus probe head 43 2010-4-26 P67xx Tektronix Series Innovation PCIe Forum Gen2 midbus 2010 probe with 16 diff inputs
TLA Mainframe Solutions TLA7012 2-module mainframe Shown with 2 TLA7SA16 modules for x16 PCIe3 link Mainframe with integrated 15 display and PC controller Connects to PC via GbE for running TLA Application Software TLA7016 6-module mainframe Shown with 2 TLA7SA16 modules for x16 PCIe3 link Mainframe with GbE controller TLA7016 6-module mainframe Shown with 2 TLA7SA16 modules for x16 PCIe3 link & 4 TLA7BB4 modules for 2 channels DDR3-1600 Connects to PC via GbE for running TLA Application Software Up to 8 frames interconnected via TekLink 44 2010-4-26
PCI Express Test Summary Tektronix is heavily involved in PCI Express Standards Development Electrical Working Group (EWG) for Base Specification Development Card Electromechanical Group (CEM) for CEM Specification Development Serial Enabling Group (SEG) for Compliance Program PCI Express 3.0 specification is at 0.7 (.9 draft) Expect Rev 0.9 spec. in Q2 2010 Physical layer testing De-embedding important for accurate measurements Minimum 12 GHz bandwidth scope for validation DPOJET for measurement automation and test reporting SDLA for measurement-based link analysis Protocol validation and debug TLA7000 series mainframes and TLA7SAxx serial acquisition modules Flexible probing and triggering Data visualization Cross-bus analysis 45 2010-4-26
Proven Expertise in High Speed Serial Data Design & Test High-Speed Serial Data Test Solutions Design Verification Compliance Test PCIe 3.0 & 2.0 Digital Validation & Debug Tektronix Logic Analyzers System Integration Digital Validation & Debug Tektronix TLA PCI-e Serial Analyzers Data Link Analysis Digital validation & Debug Transaction Layer Data Link Layer Simulation Tektronix Real-time Oscilloscopes Tektronix Real-Time and Sampling Oscilloscopes with Signal DPOJET Integrity Software Eye and Jitter Analysis Characterization & Validation Tektronix Arbitrary Waveform Generators Receiver Test Margin Testing Application Specific Compliance Test Software e.g., HDMI, SATA, PCIe. etc Physical Layer Logical Sub-block Electrical Sub-block Tektronix Serial Data 80SJNB Network and IConnect & Link Analysis Software PCIe 3.0 & 2.0 Physical Layer Testing Tx + + path Most Complete Serial Data Test Coverage + + Rx - - - - 46 2010-4-26