This test consists of twenty multiple-choice questions. All questions are from the video: Soldering Terminals (DVD-18C). Each question has only one most correct answer. Use the Answer Sheet and circle the letter corresponding to your selection for each test item. If you wish to change an answer, erase your choice completely. You should read through the questions and answer those you are sure of first. After your first pass through the test, then go back and answer the questions that you were not sure of. If two answers appear to be correct, pick the answer that seems to be the most correct response. When you are finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (14 correct answers or better). Good luck! 1
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1. Which of the following terminals is not commonly used? a. turret b. henway c. cup d. pierced 2. Tinning the tip of the soldering iron will not a. reduce the formation of oxides on the tip b. enable the heat to transfer from the tip to the connection faster c. guarantee the elimination of dendrites d. protect the tip 3. Chisel tips are typically used for soldering terminals because a. the flat edge transfers heat faster than a conical tip b. they are made to be used in small, tight areas c. the pointed tip provides greater mechanical contact d. some of the metal needs to be chiseled off 4. The purpose of tinning a stranded wire is to a. avoid damage to the individual strands when the wire is bent and to improve solderability b. increase birdcaging c. minimize the need for splicing d. increase oxidation 5. To properly tin a wire a. move it across a solder coated iron tip b. move a tinned tip over a stationary wire c. dip it in a solder pot 6. The correct method of forming the wire involves a. twisting it with a third hand tool b. bending the wire into a series of angles c. having the wire curve like a semi-circle 3
7. Mounting the terminal securely and using a 3 rd hand tool to hold the wire will reduce a. multiple solder fractures b. the risk of disturbed solder c. wire tinning d. successful splice formation 8. Placing the soldering iron tip on the contact point will help to a. increase oxidation b. increase the risk of disturbed solder c. transfer the heat to the wire and the terminal simultaneously d. decrease the thermal transfer rate 9. The soldering iron tip is applied to the contact point, along with a small amount of solder, to form a a. solder fillet b. solder heat bridge c. flux reservoir d. cold solder joint 10. On an ideal solder joint, the solder fillet should be a. a mound of solder that fully buries the wire b. slightly convex c. perfectly straight d. slightly concave 11. IPC-A-610, IPC/WHMA-A-620 and J-STD-001 provide acceptance criteria for a. designing PCBs b. monitoring reflow ovens c. soldering terminals d. protecting moisture sensitive devices 12. For cup terminals, it is acceptable to a. place several wires into a cup as long as the overall diameter is the same diameter as the original single wire b. twist two wires together before inserting them into the cup c. modify the wire or cup so that the wire perfectly fits 13. To place the properly prepared wire into the cup, the conductor should a. be fully inserted into the cup, touching the back wall for its full length b. not be fully inserted into the cup, touching the back wall for its full length c. be inserted into the cup at 75% depth, touching the back wall for its full length d. should not be higher than the ½ point of the cup 4
14. On cup terminals, moving the wire during the solidification process will cause a. bridging b. a void c. a disturbed solder connection 15. A resistance soldering tool can be useful a. for creating a solder heat bridge b. any time you need to solder a cup terminal c. for soldering highly resistant cup terminals d. if cup terminals are close together inside a connector 16. When installing two wires on a bifurcated terminal a. mount the wires on alternating posts b. make sure some insulation enters the hole on a bottom entry c. make sure side entry wires end up higher than the post d. wrap the wire around both posts for maximum strength 17. For top entry to bifurcated terminals a. use the exact same procedure as side entry b. the wire wrap needs to be at least 180 degrees c. the wire is bent 90 degrees from where it comes up through the hole d. the wire is bent to double thickness and inserted between the forks 18. For bottom entry to bifurcated terminals, the wire a. must reside completely inside the hole b. is bent a minimum of 90 degrees after it comes up through the hole c. should extend more than two wire diameters above the top of the terminal d. insulation should enter the hollow terminal 19. Hook terminals a. are found mainly on hermetically sealed relays b. must have a wire wrap of at least 180 degrees c. are soldered using a solder heat bridge 20. Pierced terminals a. have edges that pierce the wire insulation where required b. have a hole in the middle c. have two very sharp forks 5