SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS CLASS 3 TRAINING CERTIFICATION TEST (DVD-SMT-E) v.3
|
|
- Isaac Summers
- 7 years ago
- Views:
Transcription
1 This test consists of thirty multiple-choice questions. All questions are from the video: Surface Mount Solder Joint Workmanship Standards (DVD-SMT-E). Use the supplied Answer Sheet and circle the letter corresponding to your selection for each test item. If more than one answer appears to be correct, pick the answer that seems to be the most complete response. Should you wish to change an answer, erase your choice completely. When finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (21 correct answers), or better. Good luck! 1
2 ANSWER SHEET Name: Dat e: 1 True False 2 Yes No 3 True False 4 Yes No 5 True False 6 Yes No 7 True False 8 Yes No 9 Yes No 10 Yes No 11 A B C D 12 A B C D 13 True False 14 True False 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 21 A B C D 22 A B C D 23 A B C D 24 A B C D 25 A B C D 26 A B C D 27 A B C D 28 A B C D 29 A B C D 30 A B C D 2
3 1. The maximum side overhang for chip, J-lead and gull wing components is 50%. 2. If dimension A is 25% of lead width (W), then this component is at the maximum acceptable limit for side overhang. Yes or No 3. The maximum distance that the end of the J-lead may extend over the edge of the land is not specified for class 3 components. 4. Even though this component does not violate minimum electrical clearance, it exceeds the maximum requirement for end / toe overhang, or dimension B. Yes or No 3
4 5. End joint width needs to be a minimum of 50% of the lead width for J-lead and gull wing components. 6. Does this solder joint meet the minimum requirements for end joint width, or dimension C? Yes or No 7. The solder fillet is allowed to touch the body of any component, as long as it does not cover it. 8. Does the following solder joint exceed the maximum requirements for fillet height, or dimension E? Yes or No 4
5 9. This solder joint fails to meet the minimum requirements for heel fillet height, or Dimension F. 10. Must Dimension J be 100% of the component s termination (R) in order to meet minimum requirements for end overlap? Yes or No 11. A process indicator a. is not a defect b. means that the material, equipment or process may require a change c. is an indication the process is causing detectable variations in quality d. all of the above 12. Blowholes and pinholes are examples of a. component misalignment b. process indicators c. solder that has not adhered to the termination d. a gross soldering defect 5
6 13. A void is an allowable condition as long as minimum solder joint requirements have been met. 14. Any adhesive on the land is considered a process indicator for Class 3 products. 15. Nonwetting is when a. there is an open area caused by trapped air within the solder joint b. there is a connection of solder across lands that should not be joined c. solder has not adhered to the land or termination d. solder extends onto the component body 16. Dewetting is when a. a thin film of solder covers the land in some areas and there are irregular mounds in others b. the solder joint is moved while cooling c. stress lines appear on the solder joint d. the component is misaligned 17. The following is an example of a. solder balls b. excess solder c. solder projections d. solder bridging 6
7 18. The following is an example of a. non-coplanarity b. solder bridging c. excessive solder d. solder splashes 19. The following is an example of a. solder splashes b. solder balls c. excessive solder d. solder bridging 7
8 20. The following is an example of a. excessive solder b. solder fines c. disturbed solder d. cracked / fractured joint 21. The following is an example of a. chip out b. insufficient solder c. coplanarity d. tombstoning 8
9 22. The following is an example of a. cracked or fractured joint b. insufficient solder c. cold solder joint d. mounting adhesive on land 23. The following is an example of a. insufficient solder b. non-coplanarity (open connection) c. cracked or fractured joint d. incomplete reflow 9
10 24. The following is an example of a. cracked or fractured joint b. tombstoning c. non-coplanarity d. nicks or chip outs 25. The following is an example of a. solder bridging b. solder fines c. excessive solder d. solder splashes 10
11 26. The following is an example of a. cracked or fractured joint b. disturbed solder c. coplanarity d. insufficient solder 27. The following is an example of a. incomplete reflow b. insufficient solder c. solder fines d. mounting adhesive on land 11
12 28. The following is an example of a. incomplete reflow b. insufficient solder c. tombstoning d. mounting adhesive on land 29. The following is an example of a. incomplete reflow b. nicks or chip outs c. solder fines d. solder splashes 12
13 30. The following is an example of a. disturbed solder joint b. cracks / fractures on component body c. excessive fillet height d. tombstoning 13
IPC DRM-SMT-F. Area Array Components Chip Components J-Lead Components Gull Wing Components Class 1 Class 2 Class 3 Photos
1 IPC 2015 3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015-1219 +1 847.615.7100 (tel.) +1 847.615.7105 (fax) www.ipc.org email: orderipc@ipc.org Association Connecting Electronics Industries All
More informationBGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com
BGA - Ball Grid Array Inspection Workshop Bob Willis leadfreesoldering.com Mixed Technology Assembly Processes Adhesive Dispensing Component Placement Adhesive Curing Turn Boar Over Conventional Insertion
More informationDVD-PTH-E Through-Hole Solder Joint Workmanship Standards
DVD-PTH-E Through-Hole Solder Joint Workmanship Standards Below is a copy of the narration for the DVD-PTH-E video presentation. The contents for this script were developed by a review group of industry
More informationSOLDERING TERMINALS TRAINING CERTIFICATION TEST (DVD-18C)
This test consists of twenty multiple-choice questions. All questions are from the video: Soldering Terminals (DVD-18C). Each question has only one most correct answer. Use the Answer Sheet and circle
More informationThrough-Hole Solder Joint Evaluation
Demo Only Version This is a promotional sample of the IPC Training and Reference Guide DRM-PTH-E. Please do not use this SAMPLE for training or reference purposes. IPC is a not-for-profit association for
More informationDVD-71C IPC-A-610E Common Inspection Errors
DVD-71C IPC-A-610E Common Inspection Errors Below is a copy of the narration for DVD-71C. The contents for this script were developed by a review group of industry experts and were based on the best available
More informationPCB Quality Inspection. Student Manual
PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the
More informationTraining & Reference Guide
Version This is a promotional sample of the IPC Training and Reference Guide DRM-PTH-D. Please do not use this SAMPLE for training or reference purposes. IPC is a not-for-profit association for the electronics
More informationTHE 7 SINS OF WIRE HARNESS ASSEMBLY TRAINING CERTIFICATION TEST (DVD-60C)
This test consists of twenty multiple-choice questions. All questions are from the video: The 7 Sins of Wire Harness Assembly (DVD-60C). Each question has only one most correct answer. Circle the letter
More informationAOI and X-ray Inspection of PCB Assemblies
AOI and X-ray Inspection of PCB Assemblies Electronic Materials and Assembly Processes for Space (EMPS) Workshop HYTEK, Aalborg, Denmark 29th May 2013 Automatic Optical Inspection (AOI) and X-ray Inspection
More informationWave Soldering Problems
Wave Soldering Problems What is a good joint? The main function of the solder is to make electrical interconnection, but there is a mechanical aspect: even where parts have been clinched or glued in position,
More informationRoHS-Compliant Through-Hole VI Chip Soldering Recommendations
APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead
More informationAssembly of LPCC Packages AN-0001
Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)
More informationThe Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540
The Alphabet soup of IPC Specifications 340 Raleigh Street Holly Springs, NC 27540 http://www.circuittechnology.com (919) 552 3434 About the IPC IPC-the electronics industry standard Founded in 1957 as
More informationSelective Soldering Defects and How to Prevent Them
Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering
More informationLeaded Surface Mount Technology (SMT) 7
Leaded Surface Mount Technology (SMT) 7 7.1 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability
More informationPCB inspection is more important today than ever before!
PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit.
More informationApplication Note. Soldering Methods and Procedures for 1st and 2nd Generation Power Modules. Overview. Analysis of a Good Solder Joint
Soldering Methods and Procedures for 1st and 2nd Generation Power Modules Overview This document is intended to provide guidance in utilizing soldering practices to make high quality connections of Vicor
More informationDVD-111C Advanced Hand Soldering Techniques
DVD-111C Advanced Hand Soldering Techniques Below is a copy of the narration for DVD-111C. The contents for this script were developed by a review group of industry experts and were based on the best available
More informationReport. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D 86971 Peiting. Your Order-No.
Zentrum für Verbindungstechnik in der Elektronik Argelsrieder Feld 6 82234 Oberpfaffenhofen-Weßling Telefon: 081 53 / 403-0 Telefax: 081 53 / 403-15 Report Order: Soldering Tests at COM Express Connectors,
More informationAND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE
Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor APPLICATION NOTE Introduction ON Semiconductor has introduced an expanded
More informationFlexible Circuit Simple Design Guide
Flexible Circuit Simple Design Guide INDEX Flexible Circuit Board Types and Definitions Design Guides and Rules Process Flow Raw Material Single Side Flexible PCB Single Side Flexible PCB (Cover layer
More informationFlip Chip Package Qualification of RF-IC Packages
Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages
More informationGE Sensing & Inspection Technologies
GE Sensing & Inspection Technologies SOLDER JOINT INSPECTION AND ANALYSIS with phoenix x-ray microfocus and nanofocus X-ray systems FAQs about X-ray source small FOD large FOD object FDD detector high
More informationMOUNTING STRAIN GAGES TO THE LOAD CELL BODY
MOUNTING STRAIN GAGES TO THE LOAD CELL BODY Mounting strain gages to the load cell body is not a difficult task if the following suggested procedure is followed. It is important to recognize that the strain
More informationHow to avoid Layout and Assembly got chas with advanced packages
How to avoid Layout and Assembly got chas with advanced packages Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design
More informationUsing Stencils to Simplify the Printed Circuit Board Assembly Process
Using Stencils to Simplify the Printed Circuit Board Assembly Process Author: Nolan Johnson CAD/EDA Manager njohnson@sunstone.com The process of creating a prototype circuit board requires multiple phases
More informationTHE 7 SINS OF ESD CONTROL CERTIFICATION TEST (DVD-78C)
This test consists of twenty multiple-choice questions. All questions are from the video presentation: The Seven Sins of ESD Control (DVD-78C). Each question has only one most correct answer. Circle the
More informationSolder joint inspection and analysis
GE Inspection Technologies Solder joint inspection and analysis with GE s phoenix x-ray microfocus and nanofocus X-ray systems FAQs about X-ray source How X-ray inspection small FOD large FOD works object
More informationWCAP-CSGP Ceramic Capacitors
A Dimensions: [mm] B Recommended land pattern: [mm] D1 Electrical Properties: Properties Test conditions Value Unit Tol. Capacitance 1±0.2 Vrms, 1 khz ±10% C 15000 pf ± 10% Rated voltage Dissipation factor
More informationPIN IN PASTE APPLICATION NOTE. www.littelfuse.com
PIN IN PASTE APPLICATION NOTE 042106 technical expertise and application leadership, we proudly introduce the INTRODUCTION The Pin in Paste method, also called through-hole reflow technology, has become
More informationWhite Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?
Recommendations for Installing Flash LEDs on Circuits By Shereen Lim White Paper Abstract For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex
More informationCASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES
CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES By William E. Coleman Ph.D., Photo Stencil and Travis Tanner, Plexus Manufacturing Solutions When you have a gold Kovar
More informationLead-free Defects in Reflow Soldering
Lead-free Defects in Reflow Soldering Author: Peter Biocca, Senior Development Engineer, Kester, Des Plaines, Illinois. Telephone 972.390.1197; email pbiocca@kester.com February 15 th, 2005 Lead-free Defects
More information1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.
.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides
More informationENSURING ELECTROMAGNETIC COMPLIANCE IN PRINTED CIRCUIT BOARDS THROUGH DESIGN FOR ASSEMBLY GUIDELINES
ENSURING ELECTROMAGNETIC COMPLIANCE IN PRINTED CIRCUIT BOARDS THROUGH DESIGN FOR ASSEMBLY GUIDELINES Tom Page, *Paul Baguley and *Dirk Schaefer Department of Design & Technology, Loughborough University,
More informationPRODUCT PROFILE. ELECTROLOY in partnership with FCT Asia Pte Limited. in manufacturing. Nihon Superior Lead Free Solder Bar.
PRODUCT PROFILE ELECTROLOY in partnership with FCT Asia Pte Limited in manufacturing Nihon Superior Lead Free Solder Bar SN100C Product Name Product Code LEAD FREE BAR LEAD FREE BAR ( TOP UP ALLOY ) SN100C
More informationWATERPROOFING OF WET ROOMS
WATERPROOFING OF WET ROOMS Waterproofing under tiles For longterm enjoyment of a wetroom area a complete and resistant waterproofing system is an important precondition. Most tiles are by themselves waterproof
More informationBob Willis leadfreesoldering.com
Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed
More informationStair Parts Installation. Tricks
Stair Parts Installation Tips & Tricks Introduction Your DIY staircase guide Welcome to the Stairpart home installation guide. Your stairway is both a functional and focal point in your home, so keeping
More informationSMT Troubleshooting Guide
SMT Troubleshooting Guide Easy-to-use advice for common SMT assembly issues. Cookson Electronics Troubleshooting Guide Table of Contents With this easy-to-use Troubleshooting Guide, you can learn to troubleshoot
More informationThe application of image division method on automatic optical inspection of PCBA
1 1 1 1 0 The application of image division method on automatic optical inspection of PCBA Min-Chie Chiu Department of Automatic Control Engineering Chungchou Institute of Technology, Lane, Sec. 3, Shanchiao
More informationMIT 2.810 Manufacturing Processes and Systems. Homework 6 Solutions. Casting. October 15, 2015. Figure 1: Casting defects
MIT 2.810 Manufacturing Processes and Systems Casting October 15, 2015 Problem 1. Casting defects. (a) Figure 1 shows various defects and discontinuities in cast products. Review each one and offer solutions
More informationBearing Failure: Causes and Cures
Bearing Failure: Causes and Cures bearing.ppt Page 1 Excessive loads usually cause premature fatigue. Tight fits, brinelling and improper preloading can also bring about early fatigue failure. The solution
More informationSuggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages
APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern
More informationDesigning with High-Density BGA Packages for Altera Devices
2014.12.15 Designing with High-Density BGA Packages for Altera Devices AN-114 Subscribe As programmable logic devices (PLDs) increase in density and I/O pins, the demand for small packages and diverse
More informationMolded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.
Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct
More informationMuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC M. Simard-Normandin Inc. Ottawa, ON, Canada Abstract The recent need to develop lead-free electrical and electronic products
More informationTECHNICAL SPECIFICATION SERIES 8000 PRECAST CONCRETE
TECHNICAL SPECIFICATION SERIES 8000 PRECAST CONCRETE TECHNICAL SPECIFICATION PART 8000 - PRECAST CONCRETE TABLE OF CONTENTS Item Number Page 8100 PRECAST CONCRETE CONSTRUCTION - GENERAL 8-3 8101 General
More informationApplication Note AN-1080. DirectFET Technology Inspection Application Note
Application Note AN-1080 DirectFET Technology Inspection Application Note Table of Contents Page Inspection techniques... 3 Examples of good assembly... 3 Summary of rejection criteria... 4 Types of faults...
More informationTRAINING SERVICES. Training Courses Curriculum Development Highly Skilled Staff. Training Courses Curriculum Development Highly Skilled
TRAINING SERVICES Training Courses Curriculum Development Highly Skilled Staff Training Courses Curriculum Development Highly Skilled Staff 256-705-5528 www.stielectronicsinc.com Training Courses Hands-on
More informationSeptember 1, 2003 CONCRETE MANUAL 5-694.900 CONCRETE PAVEMENT REHABILITATION 5-694.900
September 1, 2003 CONCRETE MANUAL 5-694.900 5-694.901 GENERAL CONCRETE PAVEMENT REHABILITATION 5-694.900 Concrete Pavement Rehabilitation is an extremely valuable tool of the Minnesota Department of Transportation
More informationAZEK Rail Install Guide
TRIM MOULDING DECK PORCH RAIL PAVERS AZEK Rail Install Guide Installing AZEK Rail with Glass Infill... 2 Installing AZEk Rail Stairs with Glass Infill... 9 Notes...14 Please read all instructions completely
More informationDot matrix Label ID Products. C Vinyl cloth labels. Dot Matrix. Features and benefits. Part numbering system
Dot Matrix C Vinyl cloth labels Tyco Electronics C is a dot matrix printable vinyl coated cloth material with a permanent acrylic adhesive that is designed for application to irregular surfaces where conformability
More informationMATH 100 PRACTICE FINAL EXAM
MATH 100 PRACTICE FINAL EXAM Lecture Version Name: ID Number: Instructor: Section: Do not open this booklet until told to do so! On the separate answer sheet, fill in your name and identification number
More informationAnodes and Misc Equipment
Anodes and Misc Equipment Application: Platinised Titanium Anodes Platinised titanium anodes are recommended for use in the following electrolytic processes:- Precious metal electroplating - e.g. Au, Pt,
More informationMultiple Choice For questions 1-10, circle only one answer.
Test Bank - Chapter 1 The questions in the test bank cover the concepts from the lessons in Chapter 1. Select questions from any of the categories that match the content you covered with students. The
More informationWhat is surface mount?
A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface
More informationSolder Reflow Guide for Surface Mount Devices
June 2015 Introduction Technical Note TN1076 This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is
More informationThe Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007
The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 Successful designs are soon forgotten but failures are remembered for years. Steering clear of these twelve
More informationMounting Instructions for SP4 Power Modules
Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the
More informationMetropolitan Builders Association Masonry & Concrete Standard
Metropolitan Builders Association Masonry & Concrete Standard Background Masonry and concrete work in residential construction often provides the base structure upon which the house is built or as a veneer.
More informationUltra Reliable Embedded Computing
A VersaLogic Focus on Reliability White Paper Ultra Reliable Embedded Computing The Clash between IPC Class 3 Requirements and Shrinking Geometries Contents Introduction...1 Case in Point: IPC Class 3
More informationSurface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY
Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Abstract: The automotive technology is fast moving in integrating
More information30 GHz 5-Bit Phase Shifter TGP2100
August, 28 3 GHz -Bit Phase Shifter TGP2 Key Features and Performance Positive Control Voltage Single-Ended Logic CMOS Compatible Frequency Range: 28-32 GHz.2µm phemt 3MI Technology Chip dimensions:.88
More informationElectronic Board Assembly
Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -
More informationDVD-15C Soldering Iron Tip Care
DVD-15C Soldering Iron Tip Care Below is a copy of the narration for DVD-15C. The contents for this script were developed by a review group of industry experts and were based on the best available knowledge
More informationChapter 25. Trees. Part 1 Trees
Chapter 25 Trees Part 1 Trees 25-101. Placement of Trees along Streets 25-102. Penalty for Unlawful Placement of Trees along Streets 25-103. Planting of North Carolina Poplar Trees Unlawful 25-104. Removal
More informationRemoving chips is a method for producing plastic threads of small diameters and high batches, which cause frequent failures of thread punches.
Plastic Threads Technical University of Gabrovo Yordanka Atanasova Threads in plastic products can be produced in three ways: a) by direct moulding with thread punch or die; b) by placing a threaded metal
More informationHoles & Selective Laser Sintering
SLS is one of the most accurate 3D printing processes. The process has a layer thickness of 0.1mm. This is the thickness with which a new layer is added to each part. In any direction therefore the maximum
More informationSOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES
SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines 1, Kirk Peloza 2, Adam Stanczak 3, David Geiger 4 1 Molex Lisle, IL, USA 2 Molex Lisle, IL, USA 3 Molex Lisle, IL,
More informationDRAFTING MANUAL. Gears (Bevel and Hypoid) Drafting Practice
Page 1 1.0 General This section provides the basis for uniformity in engineering gears drawings and their technical data for gears with intersecting axes (bevel gears), and nonparallel, nonintersecting
More informationCHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN. page. Introduction 4-2. Axial and radial leaded devices 4-2. Surface-mount devices 4-3
CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 INTRODUCTION There are two basic forms of electronic component
More informationSoldering Methods and Procedures for Vicor Power Modules
APPLICATION NOTE Soldering Methods and Procedures for Vicor Power Modules LEAD-FREE PINS (ROHS); TIN / LEAD PINS see page 6 OVERVIEW The following pages contain soldering information for the following
More informationCrimp Tooling Where Form Meets Function
Crimp Tooling Where Form Meets Function Quality, cost, and throughput are key attributes for any production process. The crimp termination process is no exception. Many variables contribute to the results.
More informationGENERAL TRADING TERMS (GTT) RMC by EUROSURFACES
GENERAL TRADING TERMS (GTT) RMC by EUROSURFACES PART I GENERAL COMMERCIAL CONDITIONS FOR THE SALE OF AGGLOMERATED STONE RMC by EUROSURFACES Manufacturer: Product Brand: EUROSURFACES PORTUGAL S.A. RMC Rua
More informationSCENIC VIEW SV 10 SECTION 08 87 13 SOLAR CONTROL FILMS
PART 1 GENERAL SCENIC VIEW SV 10 SECTION 08 87 13 SOLAR CONTROL FILMS 1.1 SUMMARY A. Optically clear dual reflective, neutral sputtered and aluminum metallized polyester film for solar control. 1.2 RELATED
More informationChip NTC Thermistor for temperature sensor and temperature compensation 0201 size
P 1 / 8 Chip NTC Thermistor for temperature sensor and temperature compensation 0201 size 1. Part Numbering (ex.) NC P 03 XH 103 F 05 RL Product ID Series Dimensions Temperature Resistance Resistance Individual
More informationApplication Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies
Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Table of Contents Page Method...2 Thermal characteristics of SMDs...2 Adhesives...4 Solder pastes...4 Reflow profiles...4 Rework...6
More informationINSTALLATION INSTRUCTIONS for Vinyl Windows with Integral Nailing Fin (JII001)
Thank you for selecting JELD-WEN products. Attached are JELD-WEN s recommended installation instructions for Vinyl windows with an integral nailing fin. While the use of these installation instructions
More informationSafety Application Guide for Multilayer Ceramic Chip Capacitors
CK-E-1404-01 Date: TO: Safety Application Guide for Multilayer Ceramic Chip Capacitors Signature by receiver(s) Date * Please sign all copies of this document and return one copy for our records. Capacitor
More informationLessons 6 and 7 Foam Bridge Experiment- Forces and Stresses Lab
Lessons 6 and 7 Foam Bridge Experiment- Forces and Stresses Lab 1. Background All industrial and building materials undergo forces that they must withstand to function as designed. Concrete is strong under
More informationVT-44 Overview Of Component Preparation And Manual Insertion Leader s Guide
VT-44 Overview Of Component Preparation And Manual Insertion Leader s Guide ABOUT THIS IPC TRAINING VIDEO This videotape training package provides overview information on component preparation and manual
More informationRIGHT ANGLE CLINCH FASTENERS BULLETIN
BULLETIN R 215 R e v 515 PEM R NGLE fasteners provide strong right angle attachment points in sheet metal or PC boards. Types R and RS for metal are simply pressed into a rectangular mounting hole of the
More informationSPECIFICATIONS FOR PRECAST MODULAR BLOCK RETAINING WALL SYSTEM (revised 11/5/13)
Page 1 of 7 STONE STRONG SYSTEMS SPECIFICATIONS FOR PRECAST MODULAR BLOCK RETAINING WALL SYSTEM (revised ) PART 1: GENERAL 1.01 Description A. Work includes furnishing and installing precast modular blocks
More informationVT-WIN PRINTED CIRCUIT BOARD INSPECTION SYSTEM
VT-WIN PRINTED CIRCUIT BOARD INSPECTION SYSTEM Fully Automated And Integrated High-Speed, In-Line PCB Inspection and Verification System The increasing density and quality requirements of PCBs and intense
More informationJEDEC SOLID STATE TECHNOLOGY ASSOCIATION
JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113F (Revision of JESD22A113E, March 2006) OCTOBER 2008 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
More informationAutobody/Collision and Repair Technology/Technician CIP 47.0603 Task Grid
1 Secondary Task List 100 ORIENTATION 101 Identify opportunities in the auto body field. 102 Identify basic auto body construction. 103 Identify program rules and policies. 104 Identify government agencies
More informationGK Packing System Welding Instructions
GK Packing System Welding Instructions Roxtec GmbH Neuer Höltigbaum 1-3, 22143 Hamburg GERMANY Tel +49 (040) 657398-0, Fax +49 (040) 657398-50 EMAIL info@de.roxtec.com, www.roxtec.de Welding instructions
More informationFLEXIBLE CIRCUITS MANUFACTURING
IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available
More informationHARD SURFACE PAPERS INSTRUCTION GUIDE
HARD SURFACE PAPERS INSTRUCTION GUIDE I Contents Page Paropy...2 Paropy I...3 Paropy...4 Acrylic...5 Cardboard Puzzles...6 Ceramic Mugs...7 Ceramic Tiles...9 Crystal...10 Glass...10 Leather...11 Magnets...11
More informationAccelerometer and Gyroscope Design Guidelines
Application Note Accelerometer and Gyroscope Design Guidelines PURPOSE AND SCOPE This document provides high-level placement and layout guidelines for InvenSense MotionTracking devices. Every sensor has
More informationOptilia Instruments. Empowering Your Vision!
Optilia Instruments Empowering Your Vision! Product Review: Optilia BGA Inspection Systems Cutting edge technology in optical inspection of BGA, µbga, CSP and FlipChip soldering! RevA, Mrch-2013 Optical
More informationSOLDERING PROCEDURE SPECIFICATIONS PROCEDURE QUALIFICATION RECORDS. and SOLDERER PERFORMANCE QUALIFICATION RECORDS
SOLDERING PROCEDURE SPECIFICATIONS PROCEDURE QUALIFICATION RECORDS and SOLDERER PERFORMANCE QUALIFICATION RECORDS COPPER DEVELOPMENT ASSOCIATION INC. 260 Madison Avenue New York, NY 10016 (212) 251-7200
More informationDETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY
DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY Pavel Řihák Doctoral Degree Programme (2), FEEC BUT E-mail: xrihak02@stud.feec.vutbr.cz Supervised by: Ivan Szendiuch E-mail: szend@feec.vutbr.cz
More informationCity of Douglas Commercial Building Permit Site Application
City of Douglas Commercial Building Permit Site Application *Complete the following information including a complete site plan and floor plan. *Incomplete information may result in delay and/or rejection
More informationChapter 6 Machining Center Carbide Insert Fundamentals
This sample chapter is for review purposes only. Copyright The Goodheart-Willcox Co., Inc. All rights reserved. N10G20G99G40 N20G96S800M3 N30G50S4000 N40T0100M8 N50G00X3.35Z1.25T0101 N60G01X3.25F.002 N70G04X0.5
More informationField Welding Inspection Guide
Field Welding Inspection Guide Assistance in interpretation of any specification or questions concerning field welding issues can be obtained from the Office of Materials Management, Structural Welding
More informationSURFACE FINISHING FOR PRINTED CIRCUIT BOARDS
SURFACE FINISHING FOR PRINTED CIRCUIT BOARDS In a world of ever-increasing electronic component complexity and pin count requirements for component packaging, focus is once again on the age-old question
More informationLesson 13: The Formulas for Volume
Student Outcomes Students develop, understand, and apply formulas for finding the volume of right rectangular prisms and cubes. Lesson Notes This lesson is a continuation of Lessons 11, 12, and Module
More information