ASMT-M Moonstone TM 1 W Power LED Light Source Data Sheet Description The Moonstone TM 1W Power LED Light Source is a high performance energ efficient device which can handle high thermal and high driving current. The eposed pad design has ecellent heat transfer from the package to the motherboard. The Cool White Power LED is available in various color temperature ranging from 4K to 1K and Warm White Power LED ranging from 26K to 4K. The low profile package design is suitable for a wide variet of applications especiall where height is a constraint. The package is compatible with reflow soldering process. This will give more freedom and fleibilit to the light source designer. Applications Portable (flash light, biccle head light) Reading light Architectural lighting Garden lighting Decorative lighting Features Available in Red, Amber, Green, Blue, Cool White and Warm White color Energ efficient Eposed pad for ecellent heat transfer Suitable for reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation ESD Class HBM Class 3B (threshold > 8 kv) MSL 2A for InGaN products MSL 4 for AlInGaP products Specifications AlInGaP technolog for Red and Amber 2.4 V (tp) at 35 ma for AlInGaP InGaN technolog for Green, Blue, Cool White and Warm White 3.6 V (tp) at 35 ma for InGaN 12 viewing angle
Package Dimensions 1. 1 2 3 Anode Cathode Heat Sink 8.5 Metal Slug 3.3 1.27 3 Ø 5.26 8.5 1.6 LED + ZENER Ø 8. 2. 1.3 5.25 1 2 5.8.81 Device Selection Guide at Junction Temperature Tj = 25 C Color Part Number Luminous Flu, f V [1,2] (lm) Min. Tp. Ma. Test Current (ma) Dice Technolog Red ASMT-MR-AGH 25.5 35. 43. 35 AlInGaP Red ASMT-MR-AHJ 33. 4. 56. 35 AlInGaP Amber ASMT-MA-AGH 25.5 35. 43. 35 AlInGaP Green ASMT-MG 43. 6. 73. 35 InGaN Blue ASMT-MB 11.5 15. 25.5 35 InGaN Cool White ASMT-MW 43. 6. 73. 35 InGaN Warm White ASMT-M 43. 5. 73. 35 InGaN Notes 1. f V is the total luminous flu output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flu tolerance is ± 1 %. 2
Part Numbering Sstem ASMT-M N 1 2 3 Packaging Option Tube 1 Tape & Reel Color Bin Selection Ma Flu Bin Selection Min Flu Bin Selection Color R Red A Amber B - Blue G - Green W - Cool White - Warm White Absolute Maimum Ratings (T A = 25 C) Parameter ASMT-M Units DC Forward Current [1] 35 ma Peak Pulsing Current [2] 5 ma Power Dissipation for AlInGaP 15 mw Power Dissipation for InGaN 14 mw LED Junction Temperature for AlInGaP 125 C LED Junction Temperature for InGaN 11 C Operating Ambient Temperature Range -4 to +1 C Storage Temperature Range -4 to +12 C Notes: 1. DC forward current derate linearl based on Figure 5 for AlInGaP & Figure 11 for InGaN. 2. Pulse condition dut factor = 1%, Frequenc = 1kHz. 3
Optical Characteristics (T A = 25 C) Part Number Color Peak Wavelength l PEAK (nm) Tp. Dominant Wavelength l D [1] (nm) Tp. Viewing Angle 2q 1/2 [2] (Degrees) Tp. ASMT-MR-AGH Red 635 625 12 42 ASMT-MR-AHJ Red 635 625 12 48 ASMT-MA-AGH Amber 598 59 12 42 ASMT-MG Green 519 525 12 48 ASMT-MB Blue 46 467 12 12 Luminous Efficienc (lm/w) Tp. Part Number Color Correlated Color Temperature, CCT (Kelvin) Viewing Angle 2q ½ [2] (Degrees) Min. Ma. Tp. Tp. ASMT-MW Cool White 4 1 11 48 ASMT-M Warm White 26 4 11 4 Notes: 1. The dominant wavelength, λ D, is derived from the CIE Chromaticit Diagram and represents the color of the device. 2. θ 1/2 is the off-ais angle where the luminous intensit is 1/2 the peak intensit. Luminous Efficienc (lm/w) Electrical Characteristic (T A = 25 C) Dice Tpe Forward Voltage V F (Volts) @ I F = 35mA Reverse Voltage V R (Volts) Min Tp. Ma. Ma. Tp. AlInGaP 2. 2.4 3. 5 12 InGaN 3.2 3.6 4. 5 1 Notes: 1. R qj-ms is Thermal Resistance from LED junction to metal slug. Thermal Resistance Rq j-ms ( C/W) [1] 4
RELATIVE INTENSIT 1..9.8.7.6.5.4.3.2 Figure 1. Relative Intensit vs. Wavelength for AlInGaP RED AMBER.1. 38 43 48 53 58 63 68 73 78 WAVELENGTH - nm FORWARD CURRENT - ma 5 45 4 35 3 25 2 15 1 5..5 1. 1.5 2. 2.5 3. FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage for AlInGaP RELATIVE LUMINOUS FLU (-v) - lm 1.4 1.2 1..8.6.4.2. 5 1 15 2 25 3 35 4 45 5 MONO PULSE CURRENT - ma Figure 3. Relative Luminous Flu vs. Mono Pulse Current for AlInGaP RELATIVE INTENSIT 1.9.8.7.6.5.4.3.2.1-9 -7-5 -3-1 1 3 5 7 9 OFF-AIS ANGLE( ) Figure 4. Radiation Pattern for AlInGaP IF - MA FORWARD CURRENT - ma 4 35 3 25 2 15 1 5 R JA = 6 C/W R JA = 5 C/W R JA = 4 C/W 1 2 3 4 5 6 7 8 9 T A - AMBIENT TEMPERATURE - C Figure 5. Maimum forward current vs. ambient temperature for AlInGaP Derated based on T J MA = 125 C, Rθ JA = 4 C/W / 5 C/W and 6 C/W RELATIVE LOP (Normalized at 25 C) 2 1.5 1.5 RED AMBER -4-25 -1 5 2 35 5 65 8 95 11 125 JUNCTION TEMPERATURE - C Figure 6. Relative LOP (Normalized at 25 C) vs. junction temperature for AlInGaP 5
RELATIVE INTENSIT 1..9.8.7.6.5.4.3.2.1. 38 43 48 53 58 63 68 73 78 WAVELENGTH - nm Figure 7. Relative Intensit vs. Wavelength for InGaN GREEN BLUE COOL WHITE WARM WHITE FORWARD CURRENT - ma 5 45 4 35 3 25 2 15 1 5..5 1. 1.5 2. 2.5 3. 3.5 4. FORWARD VOLTAGE - V Figure 8. Forward Current vs. Forward Voltage for InGaN RELATIVE LUMINOUS FLU (φv) - lm 1.4 1.2 1..8.6.4.2. 5 1 15 2 25 3 35 4 45 5 MONO PULSE CURRENT - ma Figure 9. Relative Luminous Flu vs Mono Pulse Current for InGaN RELATIVE INTENSIT 1..9.8.7.6.5.4 GREEN.3 BLUE.2 COOL WHITE.1 WARM WHITE. -9-7 -5-3 -1 1 3 5 7 9 OFF-AIS ANGLE ( ) Figure 1. Radiation Pattern for InGaN I F MAIMUM FORWARD CURRENT ma 4 35 3 25 2 15 1 5 Rθ JA = 5 C/W Rθ JA = 4 C/W Rθ JA = 3 C/W 1 2 3 4 5 6 7 8 T A AMBIENT TEMPERATURE C 9 DOMINANT WAVELENGTH nm 54 53 52 51 5 49 48 47 46 45 1 15 GREEN BLUE 2 25 3 FORWARD CURRENT ma 35 4 Figure 11. Maimum Forward Current vs. Ambient Temperature for InGaN Derated based on T J MA = 11 C, Rθ JA = 3 C/W, 4 C/W and 5 C/W Figure 12. Dominant wavelength vs. forward current InGaN devices 6
-COORDINATES.16.14.12.1.8.6.4.2 3 ma 35 ma.1.2 1 ma 15 ma 25 ma.3.4.5.6.7 -COORDINATES.8 TEMPERATURE 217 C 2 C 15 C (Acc. to J-STD-2C) 255-26 C 3 C/SEC. MA. 3 C/SEC. MA. 6-12 SEC. TIME 1-3 SEC. -6 C/SEC. MA. 1 SEC. MA. Figure 13. Chromaticit shift vs. current *Note: (,) values @ 35 ma reference to (.) Figure 14. Recommended reflow soldering profile 17. ±.2 1.7 ±.1 1. ±.1 5.8 ±.1 3.1 ±.1 8.4 ±.1 RELATIVE FORWARD VOLTAGE SHIFT (mv) 3 25 2 15 1 5-5 -1-15 -2-25 -3-4 -15 1 35 6 85 TEMPERATURE - C Figure 15. Recommended soldering land pattern Figure 16. Temperature vs. relative forward voltage shift RELATIVE LOP (%) 1 9 8 7 6 5 4 3 2 1 GREEN BLUE COOL WHITE WARM WHITE 25 3 35 4 45 5 55 6 65 7 75 8 85 9 95 115 11 JUNCTION TEMPERATURE ( C) Figure 17. Relative LOP vs Junction Temperature for InGaN Devices 7
Flu Bin Limit (for reference onl) [ 1 2 ] Luminous Flu (lm) at I F = 35mA Bin Min Ma D 11.5 15. E 15. 19.5 F 19.5 25.5 G 25.5 33. H 33. 43. J 43. 56. K 56. 73. Tolerance for each bin limits is ±1 % Color Bin Selection [ 3 ] Individual reel will contain parts from one full bin onl. Cool White Full Distribution A A onl B B onl C C onl D D onl E E onl F F onl G G onl H H onl L A and G onl M B and H onl N A and C onl P B and D onl Q E and C onl R F and D onl S G and H onl U E and F onl W C and D onl Z A and B onl 1 A, B, C and D onl 2 G, H, A and B onl 4 C, D, E and F onl Color Bin Limits Amber Min. (nm) Ma. (nm) A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 Tolerance: ±1nm Blue Min. (nm) Ma. (nm) A 46. 465. B 465. 47. C 47. 475. D 475. 48. Tolerance: ±1nm Green Min. (nm) Ma. (nm) A 515. 52. B 52. 525. C 525. 53. D 53. 535. Tolerance: ±1nm Warm White Full Distribution A A onl B B onl C C onl D D onl E E onl F F onl N A and C onl P B and D onl Q E and C onl R F and D onl U E and F onl W C and D onl Z A and B onl 1 A, B, C and D onl 4 C, D, E and F onl 8
Color Bin Limit Cool White Bin A Bin B Bin C Bin D Bin E Bin F Bin G Color Limits (Chromaticit Coordinates).367.4.362.369.345.33.333.37.311.388.417.362.356.33.345.32.37.311.311.285.379.383.345.32.35.322.311.285.283.284.29.265.362.369.345.31.342.35.322.274.31.283.284.367.4 Warm White Bin A Bin B Bin C Bin D Bin E Bin F Color Limits (Chromaticit Coordinates) Tolerance: ±.1.452.434.438.43.47.393.395.362.381.377.373.349.488.447.47.414.418.422.47.393.387.44.381.377.47.414.452.384.452.434.438.43.418.422.47.393.438.43.424.376.438.43.424.376.47.393.395.362 Bin H.379.383.369.343.356.33.362 Tolerance: ±.1 - COORDINATE.44.42.4.38.36.34.32.3.28.26.24.24.26.28.3.32.34.36.38.4.42.44 - COORDINATE Figure 18. Color bins (Cool White). E 1k F C 7k D A B 5.6k G 4.5k H 4.k Black Bod Curve - COORDINATE.48.46.44.42.4.38.36.34 4.k F.32.34.36.38.4.42.44.46.48.5.52 - COORDINATE Figure 19. Color bins (Warm White). E 3.5k D C 3.k B A 2.6k Black Bod Curve 9
Sub-Color Binning (Onl Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits Cool White Bin A1 Bin A2 Bin A3 Bin A4 Bin B1 Bin B2 Bin B3 Bin B4 Bin B5 Bin B6 Bin C1 Bin C2 Bin C3 Bin C4 (Chromaticit Coordinates).364.367.383.4.364.383.357.345.362.36.357.358.343.331.331.343.331.369.357.314.355.315.362.369.357.36.357.358.343.356.33.345.341.314.357.345.315.316.333.348.385.346.359.348.385.347.343.331.341.314.346.359.343.331.32.315.316.333.33.333.35.322.347.347.347.346.359.346.359.343.331.32.32.314.355.315.31.342.33.333 Cool White Bin D1 Bin D2 Bin D3 Bin D4 Bin D5 Bin D6 Bin G1 Bin G2 Bin H1 Bin H2 Bin H3 Tolerances ±.1 (Chromaticit Coordinates).345.331.331.32.316.333.317.32.318.31.392.421.386.4.382.385.378.37.375.358.32.32.317.32.318.31.32.293.386.4.382.385.378.37.375.358.371.317.32.318.31.32.293.37.311.39.3.311.285.364.383.362.36.357.358.343.356.33.316.333.317.32.318.31.35.322.37.311.39.3.367.4.364.383.362.36.357.358.343.44.42.4 G1 - COORDINATE.38.36.34.32.3 C3 C4 D4 7k D5 D6 C1 C2 D1 D2 D3 A3 A4 B4 5.6k B5 B6 A1 A2 B1 B2 B3 G2 H1 4.5k H2 H3 4.k Black Bod Curve.28 1k.26.24.24.26.28.3.32.34.36.38.4.42.44 - COORDINATE 1
Packing Tube - Option 1. 5.8 4.65 37. 5.45 5.5 1.1 8.3 SIDE VIEW 535. TOP VIEW Tape & Reel - Option 1 Tape Dimension Dim Value A 8.8±.1 B 16.45±.1 K 3.6±.1 W 24.±.1 P 16.±.1 Qt/Reel 25EA Unit: mm
Tape & Reel - Option 1 (Cont.) Tape Dimension END START THERE SHALL BE A MINIMUM OF 16 mm OF EMPT COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 39 mm OF EMPT COMPONENT POCKETS SEALED WITH COVER TAPE. Reel Dimensions 24. +1.. 2.3 2.3 R1. 6.º 268. 33. ± 1. 99.5 ± 1. 2.5 ±.5 R1.5 ±.5 13.5 ±.5 12.º
Handling Precaution The encapsulation material of the product is made of silicone for better reliabilit of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembl or handling, the unit should be held on the bod onl. Please refer to Avago Application Note AN5288 for detail information. Moisture Sensitivit This product is qualified as Moisture Sensitive Level 2a for InGaN devices and MSL 4 for AlInGaP devices per Jedec J-STD-2. Precautions when handling this moisture sensitive product is important to ensure the reliabilit of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at <4 C/9%RH for 12 months. If the actual shelf life has eceeded 12 months and the humidit indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembl (e.g. for IQC). B. Control after opening the MBB The humidit indicator card (HIC) shall be read immediatel upon opening of MBB. The LEDs must be kept at <3 C/6%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours for MSL 2a and 72 hours for MSL 4. C. Control for unfinished reel For an unused LEDs, the need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembl boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have eceeded their floor life of 672 hours for MSL 2a and 72 hours for MSL 4. E. Baking is required if HIC 1% indicator is not blue and 5% indicator is pink. - The LEDs are eposed to condition of >3 C/6% RH at an time. The LEDs floor life eceeded 672 hours for MSL 2a and 72 hours for MSL 4. Recommended baking condition: 6±5ºC for 2hrs. DISCLAIMER AVAGO S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALL DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILIT OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLEL RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EPENSE OR LIABILIT IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copright 25-28 Avago Technologies. All rights reserved. Obsoletes AV1-668EN AV2-129EN - December 1, 28