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1 HSMx-A1x-xxxxx PLCC-2, Surface Mount LED Indicator Data Sheet Description This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 12 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. Features Industry standard PLCC-2 package High reliability LED package High brightness using AlInGaP and InGaN dice technologies Available in full selection of colors Super wide viewing angle at 12 Available in 8 mm carrier tape on 7 inch reel (2 pieces) Compatible with both IR and TTW soldering process Applications Interior automotive Instrument panel backlighting Central console backlighting Cabin backlighting Electronic signs and signals Interior full color sign Variable message sign Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting CAUTION: HSMN,M,K and E-A1x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
2 Package Dimensions 2.8 ± ± ±.2.1 TYP..8 ± ± ±.2.8 ±.3 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES).5 ±.1 TOP MOUNT 2.8 ± ± ± ± ±.2.1 TYP. CATHODE MARKING REVERSE MOUNT.5 ±.1 NOTE: ALL DIMENSIONS IN MILLIMETERS. 2
3 Table 1. Device Selection Guide Red HSMS-A1-JJ GaP HSMS-A1-LJ GaP HSMS-A1-J8J GaP HSMH-A1-LJ AlGaAs HSMH-A1-NJ AlGaAs HSMC-A1-QJ AlInGaP HSMC-A1-RJ AlInGaP HSMC-A11-SJ AlInGaP HSMZ-A1-TJ AlInGaP Red Orange HSMJ-A1-QJ AlInGaP HSMJ-A11-SJ AlInGaP HSMJ-A1-T4J AlInGaP HSMV-A1-TJ AlInGaP HSMJ-A1-R4J AlInGaP Orange HSMD-A1-JJ GaP HSMD-A1-LJ GaP HSMD-A1-K4PJ GaP HSML-A1-QJ AlInGaP HSML-A11-SJ AlInGaP Yellow / Amber HSMY-A1-JJ GaP HSMY-A1-LJ GaP HSMA-A1-QJ AlInGaP HSMA-A11-SJ AlInGaP HSMU-A1-SJ AlInGaP HSMA-A11-R8WJ AlInGaP 3
4 Table 1. Device Selection Guide (Cont.) Yellow Green HSMG-A1-J2J GaP HSMG-A1-K72J GaP HSME-A1-M2J AlInGaP HSME-A1-N82J AlInGaP Emerald Green HSMG-A1-H1J GaP HSME-A1-L1J AlInGaP HSME-A1-M3PJ AlInGaP Green HSMM-A11-RJ InGaN HSMM-A1-SJ InGaN HSMM-A1-U4PJ InGaN HSMM-A1-V7H InGaN Blue HSMN-A11-NJ InGaN HSMN-A1-PJ InGaN HSMN-A1-R4YJ InGaN HSMN-A1-S4YJ InGaN HSMN-A1-R8YJ InGaN 4
5 Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25 C) Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/N DC Forward Current [1] 3 ma 3 ma 3 ma [3,4] 2 ma [4] 3 ma [3,4] 3 ma Peak Forward Current [2] 1 ma 1 ma 1 ma 1 ma 1 ma 1 ma Power Dissipation 63 mw 6 mw 63 mw 48 mw 63 mw 114 mw Reverse Voltage Junction Temperature 11 C Operating Temperature Storage Temperature 5 V 55 C to +1 C 55 C to +1 C Notes: 1. Derate linearly as shown in Figure Duty factor = 1%, Frequency = 1 khz. 3. Drive current between 1 ma and 3 ma is recommended for best long term performance. 4. Operation at current below 5 ma is not recommended. 5
6 Optical Characteristics (T A = 25 C) Color Part Number Dice Technology Peak Wavelength λ PEAK (nm) Typ. Dominant Wavelength [1] λd (nm) Typ. Viewing Angle 2 θ1/2 [2] (Degrees) Typ. Luminous Efficacy ηv [3] (lm/w) Typ. Luminous Intensity/ Total Flux Iv(mcd)/Φv(mlm) Typ. Red HSMS-A1 GaP HSMH-A1 AlGaAs HSMC-A1x AlInGaP HSMZ-A1 AlInGaP Red HSMJ-A1x AlInGaP Orange HSMV-A1 AlInGaP Orange HSMD-A1 GaP HSML-A1x AlInGaP Amber HSMY-A1 GaP HSMA-A1x AlInGaP HSMU-A1 AlInGaP Yellow HSMG-A1 GaP Green HSME-A1 AlInGaP Emerald HSMG-A1 GaP Green HSME-A1 AlInGaP Green HSMM-A1x InGaN Blue HSMN-A1x InGaN Notes: 1. The dominant wavelength, λ D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /η v, where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt. Electrical Characteristics (T A = 25 C) Part Number Forward Voltage VF I F = 2 ma Typ. Max. Reverse Voltage V 1 μa Min. Reverse Voltage V 1 μa Min. Thermal Resistance Rθ JP ( C/W) HSMS/D/Y/G HSMH HSMC/J/L/A/E HSMZ/V/U HSMM/N
7 RELATIVE INTENSITY BLUE GREEN EMERALD GREEN YELLOW GREEN AMBER ORANGE RED ORANGE RED WAVELENGTH nm RELATIVE INTENSITY GaP EMERALD GREEN GaP YELLOW GREEN GaP YELLOW GaP ORANGE GaP RED WAVELENGTH nm Figure 1. Relative intensity vs. wavelength FORWARD CURRENT ma HSMS/D/Y/G HSMH HSMC/J/L/A/E/Z/V/U HSMM/N RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) AlInGaP AlGaAs Gap InGaN FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage DC FORWARD CURRENT ma Figure 3. Relative intensity vs. forward current CURRENT - ma HSME HSMS/D/G/ Y/H/Z/V/U HSMC/J/L/A HSMM/N CURRENT - ma HSME HSMS/D/G/Y/H HSMC/J/L/A HSMZ/V/U HSMM/N TEMPERATURE ( C) Figure 4. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 11 C, Rθ JA = 5 C/W TEMPERATURE ( C) Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on T J MAX = 11 C, Rθ JP = 18 C/W or 28 C/W. 7
8 DOMINANT WAVELENGTH nm GREEN CYAN BLUE CURRENT ma Figure 5. Dominant wavelength vs. forward current InGaN devices. DELTA VF (NORMALIZED AT 25 C) GaP/AlGaAs/ AlInGaP InGaN/GaN TEMPERATURE C Figure 6. Forward voltage shift vs. temperature NORMALIZED INTENSITY ANGULAR DISPLACEMENT DEGREES Figure 7. Radiation Pattern. 1 to 3 SEC. 25 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX SEC. 6 C/SEC. MAX. 1 SEC. MAX. TEMPERATURE C FLUXING PREHEAT BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD TIME Figure 8. Recommended Pb-free reflow soldering profile. (Acc. to J-STD-2C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 16 Surface Mounting SMT LED Indicator Components. Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section TIME SECONDS CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15C (1C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 39C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag,.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 9. Recommended wave soldering profile. 8
9 SOLDER RESIST Figure 1. Recommended soldering pad pattern TRAILER COMPONENT LEADER 2 mm MIN. FOR Ø18 REEL. 2 mm MIN. FOR Ø33 REEL. 48 mm MIN. FOR Ø18 REEL. 96 mm MIN. FOR Ø33 REEL. C A Figure 11. Tape leader and trailer dimensions USER FEED DIRECTION 4 ±.1 4 ±.1 2 ± ± ±.1 Ø C 3.5 ± ±.1 A 3.5 ±.1 Ø ±.1 Figure 12. Tape dimensions 9
10 2 +.5 Ø 2.5 ± Ø 13 ± (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (.25 mm) 7.9 (MIN.) 1.9 (MAX.) Figure 13. Reel dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 1
11 Intensity Bin Select (X 5 X 6 ) Individual reel will contain parts from one half bin only. X 5 X 6 Min I v Bin Full Distribution 2 2 half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X 5 2 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) G G H H J J K K L L M M N N P P Q Q R R S S T T U U V V W W X X Tolerance of each bin limit = ± 12% 11
12 Color Bin Select (X 7 ) Individual reel will contain parts from one full bin only. X 7 Full Distribution Z Y W V U T S Q P N M L K A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B, and C only B, C, and D only C, D, and E only D, E, and F only E, F, and G only F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Color Bin Limits Blue Min. (nm) Max. (nm) A B C D Cyan Min. (nm) Max. (nm) A B C D Green Min. (nm) Max. (nm) A B C D Emerald Green Min. (nm) Max. (nm) A B C D Color Bin Limits Amber Min. (nm) Max. (nm) A B C D E F Orange Min. (nm) Max. (nm) A B C D E Red Orange Min. (nm) Max. (nm) A B Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm. Yellow Green Min. (nm) Max. (nm) E F G H
13 Packaging Option (X 8 X 9 ) Option Test Current Package Type Reel Size J1 2 ma Top Mount 7 inch J4 2 ma Top Mount 13 inch H1 2 ma Reverse Mount 7 inch H4 2 ma Reverse Mount 13 inch J2 1 ma Top Mount 7 inch J5 1 ma Top Mount 13 inch H2 1 ma Reverse Mount 7 inch H5 1 ma Reverse Mount 13 inch L2 2 ma Top Mount 7 inch Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-2. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <4 C/9%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <3 C / 6%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - 1% is Not blue and 5% HIC indicator turns pink. - The LEDs are exposed to condition of >3 C / 6% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 6±5 C for 2 hours. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. Obsoletes AV1-4EN AV2-198EN - September 1, 215
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