Form A Solid State Relay VOAT, VOAABTR FEATURES 9 S S DC S' 3 S' High speed SSR - t on /t off < 8 μs Maximum R ON. Isolation test voltage 3 V RMS Load voltage V Load current A DC configuration DIP- package Clean bounce free switching TTL/CMOS compatible input Available on tape and reel Pure tin leads Compliant to RoHS Directive /9/EC and in accordance to WEEE /9/EC DESCRIPTION The VOAT are high speed SPST normally open ( form A) solid-state relay in a DIP- package. The relays are constructed as a multi-chip hybrid device. Actuation control is via an infrared LED. The output switch is a combination of a photodiode array with MOSFET switches. The relays can be configured for AC/DC or DC only operation. APPLICATIONS Instrumentation Industrial controls Security AGENCY APPROVALS UL77: file no. E7 system code H, double protection cul - UL77: file no. E7 system code H, double protection Notes IEC 77-- (VDE 88) capable, consult sales representative for details Agency approvals are valid only for ambient temperature range - C to 8 C ORDERING INFORMATION V O A x x T R DIP SMD PACKAGE SMD-, tape and reel DIP-, Tubes PART NUMBER ELECTR. VARIATION PACKAGE CONFIG. TAPE AND REEL UL, cul VOAABTR VOAT 7. mm >. mm Document Number: 8 For technical questions, contact: optocoupleranswers@vishay.com www.vishay.com Rev.., -Apr-
Form A Solid State Relay ABSOLUTE MAXIMUM RATINGS () (T amb = C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT LED continous forward current I F ma LED reverse voltage V R V LED power dissipation at C P diss 8 mw OUTPUT DC or peak AC load voltage V L V Load current (DC only) I L A Peak load current (AC/DC) t = ms I LPK 3. A Output power dissipation at C P diss mw SSR Total power dissipation P diss 33 mw Ambient temperature range T amb - to + 8 C Storage temperature range T stg - to + C Soldering temperature () t s max. T sld C Isolation test voltage for s V ISO 3 V RMS Notes () Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. () Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). ABSOLUTE MAXIMUM RATING CURVE.. I F = ma to ma Load Current (A).8... 99- - - - 8 Fig. - Load Current (AC/DC) vs. Temperature www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com Document Number: 8 Rev.., -Apr-
Form A Solid State Relay THERMAL CHARACTERISTICS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Maximum LED junction temperature at C T jmax. C Maximum output die junction temperature at C T jmax. C Thermal resistance, junction emitter to board at C EB 7 C/W Thermal resistance, junction emitter to case at C EC 8 C/W Thermal resistance, junction detector to board at C DB 7 C/W Thermal resistance, junction detector to case at C DC 3 C/W Thermal resistance, junction emitter to junction detector at C ED 3 C/W Thermal resistance, case to ambient at C CA 8 C/W Note The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal characteristics of optocouplers application note. T A θ CA T C Package θ DC θ EC T JD θ DE T JE θ DB θ EB T B θ BA 999 T A ELECTRICAL CHARACTERISTICS (T amb = C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT INPUT LED forward current, switch turn-on I L = A, V L. V, t = ms I Fon. ma LED forward current, switch turn-off V L = V, I L < μa I Foff μa LED reverse current V R = V I R μa LED forward voltage I F = ma V F.3. V OUTPUT On-resistance (AC/DC) I F = ma, I L = A R ON.8. On-resistance (DC only) I F = ma, I L = A R ON..7 Off-state leakage current I F = ma, V L = V I LEAK μa Note Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements. Document Number: 8 For technical questions, contact: optocoupleranswers@vishay.com www.vishay.com Rev.., -Apr- 3
Form A Solid State Relay PIN CONFIGURATION AC/DC configuration DC only configuration Anode Cathode Do not use 3 Load Load Anode Cathode Do not use 3 SWITCHING CHARACTERISTICS (AC/DC CONNECTION) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Turn-on time I F = ma, V L = 3 V, I L = ma t on 37 8 μs Turn-off time I F = ma, V L = 3 V, I L = ma t off 8 μs Turn-on time I F = ma, V L = V, I L = A t on μs Turn-off time I F = ma, V L = V, I L = A t off 8 μs. ms V L Input Output T ON T OFF Output 9 % % 99- www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com Document Number: 8 Rev.., -Apr-
Form A Solid State Relay SAFETY AND INSULATION RATINGS PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Climatic classification IEC 8 part /8/ Pollution degree DIN VDE 9 Tracking resistance (comparative tracking index) Insulation group IIIa CTI 7 Highest allowable overvoltage Transient overvoltage V IOTM 8 V peak Maximum working insulation voltage Recurring peak voltage V IORM 89 V peak Insulation resistance at C V IO = V R IS Insulation resistance at T S V IO = V R IS 9 Insulation resistance at C V IO = V R IS Partial discharge test voltage Method b, V pd = V IORM x.87 V pd 9 V peak Isolation test voltage s V ISO 3 V RMS Safety limiting values - Case temperature T SI C maximum values allowed in the Input current I SI ma event of a failure Output power P SO mw Minimum external air gap (clearance distance) Minimum external tracking (creepage distance) Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance path along body Note This SSR is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of protective circuits. 7 7 mm mm TYPICAL CHARACTERISTICS (T amb = C, unless otherwise specified) LED Forward Current (ma) 3 8 C C - C LED leakage current (na) 8 V R = V..8.. 39 LED Forward Voltage (V) Fig. - LED Forward Voltage vs. Current Fig. 3 - LED Leakage Current vs. Temperature 3 Document Number: 8 For technical questions, contact: optocoupleranswers@vishay.com www.vishay.com Rev.., -Apr-
Form A Solid State Relay Leakage (na) 9 3 V Load = V LED Forward Current for Switch Turn-on (%), normalized to C 8 - I L = A 3 Fig. - Output Leakage Current vs. Temperature - 3 Temparature ( C) Fig. 7 - LED Current for Switch Turn-on vs. Temperature LED Voltage (V). I F = 3 ma. I F = ma..3 I F = ma. I F = ma I F = ma.. 3 Fig. - LED Voltage vs. Temperature ON-Resistance, Normalized to C.8.....8 3 I F = ma I L = A. Fig. 8 - On-resistance vs. Temperature Diode Breakdown Voltage (V) 9. 8. 8. 7. 7. I L = μa Turn-off Time (μs) 7 3 9 I F = ma, I L = A, P W =. ms 33. Fig. - Diode Breakdown Voltage vs. Temperatur 3 Fig. 9 - Turn-off Time vs. Temperature www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com Document Number: 8 Rev.., -Apr-
Form A Solid State Relay Turn-off Time (μs) 7 3 I L = A, P W =. ms - C C 8 C Load Current (ma) 8 - - 8 I F = ma - C - C C 8 C 37 LED (ma) Fig. - Turn-off Time vs. LED - -. -. -.... 37 Load Voltage (V) Fig. 3 - Load Current vs. Load Voltage Turn-on Time (μs) 7 7 I F = ma, I L = A, P W =. ms Switch Capacitance (pf) 3 3 38 Fig. - Turn-on Time vs. Temperature 7 Applied Voltage (V) Fig. - Switch Capacitance vs. Applied Voltage 8 I L = A, P W =. ms Turn-on Time (μs) 8 - C C 8 C 39 LED (ma) Fig. - Turn-on Time vs. LED Document Number: 8 For technical questions, contact: optocoupleranswers@vishay.com www.vishay.com Rev.., -Apr- 7
Form A Solid State Relay PACKAGE DIMENSIONS in millimeters 3 pin one ID.7.3. ISO method A. 8 min.. R...78 8. 8.7 Option 7 min...3 7. typ. 7. typ. 3.3 3.8.7.. typ....8 typ..8 typ. 3 to 9 8 7. to 8.8..3 3.3 3.8 8 min. 8. min..3 max.. typ. i78_ PACKAGE MARKING VO V YWW H 8 Note Tape and reel suffix (TR) is not part of the package marking. www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com Document Number: 8 8 Rev.., -Apr-
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