Overview INVUE CR288 CONCENTRATION MONITOR APPLICATION NOTE FOR BEOL SEMICONDUCTOR PROCESSING. Authors: Christopher Wacinski and Wiley Wilkinson



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APPLICATION NOTE INVUE CR288 CONCENTRATION MONITOR APPLICATION NOTE FOR BEOL SEMICONDUCTOR PROCESSING Authors: Christopher Wacinski and Wiley Wilkinson Overview Semiconductor manufacturers and OEMs demand tighter process control solutions that increase wafer throughput, reduce chemical costs and prevent wafer scrap. Each requires a precise concentration monitor for BEOL (back-end-of-line) processing chemicals, such as oxide/metal etchants, post-cmp cleaners, photo-resist strippers and surface preparation solutions. The right concentration monitor must exceed current technology, yet be cost-effective to implement. Entegris offers InVue CR288, a highly accurate, in-line, real-time concentration monitor that meets these stringent requirements for improved BEOL process efficiency by allowing users to: Precisely monitor and control the chemical dilution and blending Increase chemical bath lifetime, which reduces chemical usage and disposal costs Detect chemical excursions, such as mechanical component failures Collect real-time data for optimizing a process or tool, such as the actual homogenization within a chemical blend The CR288 s IoR (index of refraction) technology uniquely measures concentration based on the fluid s IoR. These real-time, in-situ concentration measurements maintain a high degree of accuracy, precision and resolution. The ability to calibrate the CR288 in the field eliminates the need to have proprietary chemistry sent to the factory, and without consumable parts, little or no maintenance is necessary. The CR288 offers a wide dynamic range that is insensitive to bubbles and color, and guarantees an immediate return of investment. Figure 1. InVue CR288 liquid chemical concentration monitor shown with two flow cells ENTEGRIS, INC. 1

Typical Installation The illustration below shows a typical blending application. In general, the concentrated chemical is diluted using DI water (DIW) before it is either placed directly on the wafer, or it is diverted to a holding tank where the chemistry is being recirculated in process. DI water Recirculation loop Concentrated chemistry Process tool CR288 Figure 2. Typical blending application Case Studies HF Dilutions This graph compares the CR288's connectivity capability to measure concentration of HF dilutions from 1:100 to 1:1000. The conductivity signal saturates at approximately 5000 ppm. CR288 can measure the entire range (0 49 wt%), as well as the signal with more resolution, and has the potential for measuring dilutions lower than 1:1000. 6000 2500 ml/min; 1:100; 1:500; 1:750; 1:1000; HF:DI 5000 1:100 CR288 Conductivity sensor HF Concentration (ppm) 4000 3000 2000 1000 1:500 1:750 1:1000 0 13:16:19 13:17:02 13:17:46 13:18:29 13:19:12 13:19:55 Time (hour/min/sec) Figure 3. HF dilutions 2 APPLICATION NOTE ENTEGRIS, INC.

Photoresist Strip Dilutions The CR288 offers continuous precision while conductivity cannot correctly measure photoresist strip in solution because photoresist strip is often a non-conductive chemical. The plot in Figure 4 shows the CR288 IoR compared to a conductivity sensor output, both plotted as a function of time. The x-axis is the percentage of water added to the photoresist strip. NOTE: The CR288 measures photoresist strip correctly throughout the process range. In contrast, the conductivity sensor is completely insensitive to the changes in concentration. It is only once the water concentration reaches a sufficient level that the conductivity sensor can measure anything at all. The CR288 inherently outperforms conductivity in this critical metric. 1.458 4.00 lor @ 20 C 1.456 1.454 1.452 1.450 1.448 1.446 1.444 Index of refraction @ 20 C Conductivity 3.80 3.60 3.40 3.20 3.00 Conductivity (ms/cm) 1.442 2.80 0 2 4 6 8 10 12 14 16 18 Concentration of Added H 2O (%) Figure 4. CR288 index of refraction vs. conductivity ENTEGRIS, INC APPLICATION NOTE 3

IoR Precision of Measurement for Post-CMP Cleaner, ESC-784 In this study the CR288 kit2 was installed at the point-of-use (POU) on a post-cmp cleaning tool that dilutes the post-cmp cleaner at POU using two flowmeters. One sensor head was installed in each cleaning tank. The results show that the CR288 precisely monitored the POU dilution of the post-cmp cleaner in real time to at least the resolution of the flowmeters (0.1 wt%) with measurement resolution for even greater dilutions. NOTE: Incoming chemical is highly concentrated and diluted to the target concentration of 2.78 wt%. The CR288 monitors the POU blend to ensure that the target concentration of 2.78 wt% is met prior to wafer cleaning. 3.50 19.35 3.30 Fluid temperature 19.15 Concentration (wt%) 3.10 2.90 2.70 2.78% 2.88% New concentration 2.98% 3.08% 18.95 18.75 18.55 18.35 Temperature ( C) 2.50 18.15 2.30 17.95 0 1000 2000 3000 4000 5000 6000 Time (seconds) Figure 5. CR288 measurements of ESC- 784 post- CMP cleaning chemistry 4 APPLICATION NOTE ENTEGRIS, INC.

CR288 Millisecond Measurement in HF/SC1 in Single Wafer Tool While the OEM used the CR288 in an FEOL environment, the example applies equally to BEOL. The monitor shows three wafers being processed. A single flow cell was installed at the POU and measured premixed concentrations of distilled water, dilute HF, and SC1. The data demonstrate that: Using a single sensor, the CR288 can monitor the chemical that was dispensed at the POU as it switches between RCA cleaning chemistries. The CR288's nearly instantaneous measurement allows users to measure the chemistry on each wafer. The NIR measurement takes two minutes to achieve the required resolution while production continues. Conductivity could only be tuned for one of the chemicals, not all three. 1.3350 CR288 lor 1.3345 1.3340 Index of Refraction 1.3335 1.3330 1.3325 DIW 1:2:50 SC1 DIW 1.3320 1:50 HF 1.3315 0 30 60 90 120 150 180 210 240 270 300 330 360 390 420 450 480 510 540 Time (seconds) Note: Fluid Temperature Compensation (Tcc) optimized for both HF and SC1. Recommend for tool manufacturer to allow Tool PLC to swap individual Tcc values for the two blends. Figure 6. Three wafer cycles of HF, DIW and SC1 dispense: 30-second chemical dispense; 0.1 sec CR288 response time Entegris, the Entegris Rings Design, Creating a Material Advantage and InVue are trademarks of Entegris, Inc. ENTEGRIS, INC. Corporate Headquarters 129 Concord Road Billerica, MA 01821 USA Customer Service Tel. +1 952 556 4181 Customer Service Fax +1 952 556 8022 In North America 800 394 4083 www.entegris.com 2014-2015 Entegris, Inc. All rights reserved Printed in USA 3965-7601ENT-0415