Company Profile Dec. 2008 2009-2-3 1

Company Profile Dec. 2008 2009-2-3 1

Contents Company Vision, Mission & Objective Company Overview Organization Sales Performance Market Coverage Product Mix Major Customers Quality System & Certified Technology Road Map Equipment List 2009-2-3 2

Olympic Country Co., Ltd. Company Vision To be the one stop shop PCB supplier that offers the Best Value to its partners. Company Mission A leading PCB manufacturer that suppliers Quality PCB in mass volume at Competitive Price with Excellent Service. Page 3

Company Objective Expand HeShan factory production capacity up to 1,000,000sq.ft. per month by Mid. of 2009. Meet world class environmental protection standards. Page 4

Company Over view 1985 Founded in 1985, Hong Kong. 1991 Moved the Hong Kong factory to Shenzhen, China. 1996 Started double-side production at Shenzhen factory. 2002 Start Multi-Layer production. 2002 Start Silver-Through hole production at Shenzhen factory. 2006 Start to build Multi Layer HeShan Plant in April. 2007 He Shan Plant start mass production in July, the current capacity :300K sqft. Page 5

Company Overview Headquarter : Hong Kong Factory Locations/Area : -Shenzhen, China - 200,000sq.ft -HeShan, Guangdong Province, China - 300,000sq.ft Total Factory Area : 500,000sq.ft. Capital Investment : US$30M Products: -Single side, Carbon Ink, and Silver Through Hole PCB -2 to 8 layer PCB Page 6

Company Overview Page 7

Corp. Structure Olympic Country Company Limited (Headquarter) Hong Kong Olympic Circuit Technology Limited (Sales Office) Hong Kong Olympic (HeShan) PCB Co., Ltd. HeShan, Guangdong Province, PRC FuYong Olympic PCB Factory Shenzhen, Guangdong Province, PRC Double Side - Multilayer Plant Single Side & STH Plant Page 8

Organization Chart President Vice President Operation Director I & II Quality Director Technical Director Marketing Director Plant Manager I & II Quality Assurance Manufacture Technology Marketing Human Resource Manufacturing Quality Control Customer Service Sales Information Technology Korea MKT Procurement Finance Engineering Production Production Plan Control Japan MKT USA/Europe MKT China/others MKT Maintenance Page 9

Sales Performance 80 US$ (Million) Actual Forecast 60 40 20 0 2000 2001 2002 2003 2004 2005 2006 2007 2008 US$ (Million) 8 12 15 20 26 30 40 46 68 Page 10

Capacity Expansion Plan (Monthly Capacity) Ksq.ft/M 2,500 2,000 450 1,500 1,000 500 0 600 150 250 100 600 150 350 300 450 200 450 450 300 500 800 FY2006 FY2007 FY2008 FY2009 S/S 600 600 450 450 STH 150 150 200 300 D/S 250 350 450 500 MTL 100 300 450 800 Projected Page 11

Market Coverage Power Supply 10% Games/Toy 10% Others 5% Computer 35% Home Appliances 20% Automotive Telecommunic 5% ation 15% Page 12

Product Mix Single side 5% Silver Through 6% Multi-Layer 45% Double side 44% Page 13

Major Customers Epson BSH/Siemens Sharp Diehl/Ako Hitachi CTS Computime Flextronics Hana Panasonic Sanyo World Fair Celestica WKK Speedy-tech Synaptics VTech ZTE Staci Selcom Sagem Page 14

Capability & Technology Single Side Mass production Small scale production (In Metric measurement) Max Board Thickness Min Board Thickness Min. Finished Hole Size Line Width / Spacing, Max External Copper Wt. Outline Dimension Tolerance Surface finishing Others 1.6mm 1.6mm 0.8mm 0.8mm 0.5mm 0.5mm 0.25mm/0.2mm 0.25mm/0.2mm 2 oz 2 oz +/-0.15mm +/-0.15mm Lead & Lead-free HASL, OSP, Immersion Tin, Immersion Silver, Immersion Gold, Gold plating STH & Carbon Ink product available Page 15

Capability & Technology Single Side Mass production Small scale production (In US measurement) Max Board Thickness Min Board Thickness Min. Finished Hole Size Line Width / Spacing, Max External Copper Wt. Outline Dimension Tolerance Surface finishing Others 0.064 0.064 0.032 0.032 0.020 0.020 0.010 /0.008 0.010 /0.008 2 oz 2 oz +/-0.006 +/-0.006 Lead & Lead-free HASL, OSP, Immersion Tin, Immersion Silver, Immersion Gold, Gold plating STH & Carbon Ink product available Page 16

Capability & Technology D/S & Multi-layer Mass production Small scale production (In Metric measurement) Max Layer Count Max Board Thickness Min Board Thickness Drill to Metal Inner layer Registration Line Width / Spacing, Aspect Ratio Controlled Impedance Max Internal and External Copper Wt. 8 3.2mm 0.3mm 0.2mm +/- 0.1mm 0.075mm / 0.075mm </= 6:1 +/- 10%* 3 oz 10 3.5mm 0.3mm 0.175mm +/- 0.075mm 0.075mm / 0.075mm </= 8:1 +/- 8%* 3 oz * Less than 10% impedance tolerance capability is design dependent. Page 17

Capability & Technology D/S & Multi-layer (In US measurement) Mass production Small scale production Max Layer Count Max Board Thickness Min Board Thickness Drill to Metal Inner layer Registration Line Width / Spacing, Aspect Ratio Controlled Impedance Max Internal and External Copper Wt. 8 0.126 0.012 0.008 +/- 0.004 0.003 / 0.003 </= 6:1 +/- 10%* 3 oz 10 0.140 0.012 0.007 +/- 0.003 0.003 / 0.003 </= 8:1 +/- 8%* 3 oz * Less than 10% impedance tolerance capability is design dependent. Page 18

Capability & Technology Material CEM-1 CEM-3 FR-1 FR-2 FR-4 (Tg130) FR-4(Tg140) FR-4(Tg170) Supplier Kingboard, ShengYi Kingboard, Matsushita, ShengYi Kingboard, Matsushita Kingboard, Matsushita Kingboard Kingboard, ITEQ, Matsushita, Nanya, ShengYi, Sumitomo ITEQ, Shengyi Page 19

Technology Roadmap Task Name 2009 2010 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 1 High Frequency Material I. Rogers (RO4350) II. Getek/Megtron III. Teflon (Taconic RF35, Rogers 3003) 2 Metal PCB I. Aluminium/Copper heat sink with DS PCB II. Aluminium/Copper heat sink with Hybrid PCB 3 Heavy Copper weight Product 6oz I/L and 5 ozo/l 4 High Layer Count Technology I. 10L II. 12L III. 16L Page 20

Green Manufacturing Lead Free Manufacturing Alternatives MSP Immersion Silver, Immersion Gold, Electrolytic Gold OSP, Pre-flux Lead Free HAL Process need to subcontract out Lead HAL Gold Finger Immersion Tin Halogen Free Manufacturing Alternatives HF Laminate- Nanya "NPG-TL" and Hitachi "MCL-BE- 67G (Type H) Solder Mask- Taiyo "PSR-4000 GEC50" for solder-mask Page 21

Quality system & Certified Certified ISO9002 by 1998 Certified ISO9001 by Jan 2005 Certified by ISO/TS16949 by Aug.2007 He Shan Plant get ISO14000 in June 2008 UL No. E122808(S) Page 22

Manpower Distribution Others 15% Total Staff = 1,600 persons Engineering 5% Quality 10% Production 70% Note : SZ (900) persons, HeShan (700) persons Page 23

Major Equipments Inner Layer Exposure Machine - CBT Integrated Develop-Etch-Strip line - UCE Page 24

Major Equipments Automatic Layup station Automatic system on Press process

Major Equipments High Precision Drilling machine - Hitachi Outer layer Auto-exposure machine - Onosokki Page 26

Major Equipments AOI, Verification and Repair station for both Inner and Outer layer process -CamTek

Major Equipments Soldermask exposure machine /quick turn order - CBT Flying probe E-tester for sample /quick turn order -MicroCraft

Major Equipments Lead-free surface finishing OSP, Immersion Silver & Immersion Gold

HS Plant Major Equipment List Types Existing Setup Future Plan Manufacturer CNC Drilling Machine 20 sets 54 sets Hitachi Auto Roller Coating Machine 1 set 3 sets Asianeo Tech CCD Semi-Auto Exposure Machine 2 sets 6 sets CBT AOI Machine 5 sets 10 sets Camtek Press Reflow Line 1 set 2 sets Lan Teh X-Ray Target Drilling Machine 1 set 3 sets MURAKI Auto Dry Film Laminator 1 set 3 sets Asahi Auto Exposure Machine 2 sets 3 sets ONOSOKKI Auto Film Inspector 1 set 2 sets Camtek

HS Plant Major Equipment List Types Existing Setup Future Plan Manufacturer Flying Probe Testing System 1 set 2 sets MicroCraft Optical CNC Measure Machine 1 set 2 sets OPTEK Cold/Hot Press Machine 2sets 3 sets DAH TYAN Panel Plating Line 2 sets 3 sets Gainford/Commend Immersion Gold Line 2 sets 2 sets Gainford/Y.M.Co Routing Machine 6 sets 12 sets Takeuchi /Ta liang Auto E-Tester 1 set 2 sets Mason Page 31

Physics Lab Testing Equipment List Types Existing Setup Manufacturer Gel-Time tester 1set Vigor Press Machine X-ray Thickness tester Mobil copper thickness tester CMI 700 copper thickness tester Peel strength tester 1set 1set 1set 1set 1set Vigor Oxford Oxford Oxford ZhengYe Microscope 1set ZhengYe Polish machine 1set ZhengYe Page 32

Physics Lab Testing Equipment List Types Existing Setup Manufacturer UV tester 1set ShangHai precision &scientific Instrument High volt tester 1set Nanjing Changjiang Radio Micro-OHMS 1set APPLENT Humidity/Temperature tester 1set MENTEK EDX tester 1set JIANGSU SKYISY Ionic contamination 1set COOKSON AA spectrum measurement 1set ThermoFisher Page 33

Headquarter/Factory Locations Headquarter : Sales Office : Address : Olympic Country Company Ltd. Olympic Circuit Technology Ltd. Flat 804, 8/F Hewlett Centre, 54 Hoi Yuen Road, Kwun Tong, Kowloon, HK. TEL : (852) 2341-5313 Fax : (852) 2343-6011 E-mail : Website : Shenzhen Factory : Address : info@olympicpcb.com www.olympicpcb.com FuYong Olympic PCB Factory Bldg. 9,10,11,16 Cui Gang Industrial Area, South Zheng Feng Road, Huai De, Fu Yong, Bao An, Shenzhen, Guangdong Province, China TEL : (86) 755 2739-4669 Fax : (86) 755 2739-1312 HeShan Factory: Olympic (HeShan) PCB Co. Ltd. Address : Tie Gang Industrial Area, Gonghe Town, HeShan, Guangdong Province, China TEL : (86) 750 8411-888 Fax : (86) 750 8419-888 Page 34

Thank You! 2009-2-3 35