Electromouillage réversible sur nanofils de silicium superhydrophobes



Similar documents
Introduction to Microfluidics. Date: 2013/04/26. Dr. Yi-Chung Tung. Outline

FINAL DRAFT INTERNATIONAL STANDARD

Introduction au BIM. ESEB Seyssinet-Pariset Economie de la construction contact@eseb.fr

Photolithography. Class: Figure Various ways in which dust particles can interfere with photomask patterns.

Nanoparticle Deposition on Packaging Materials by the Liquid Flame Spray

MOS (metal-oxidesemiconductor) 李 2003/12/19

CS257 Introduction to Nanocomputing

Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator

Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography

Personnalisez votre intérieur avec les revêtements imprimés ALYOS design

Results Overview Wafer Edge Film Removal using Laser

Basic Principles in Microfluidics

Focused Ion beam nanopatterning: potential application in photovoltaics

Microstockage d énergie Les dernières avancées. S. Martin (CEA-LITEN / LCMS Grenoble)

Dr Marcin Adamiak marcin.adamiak.

Bending, Forming and Flexing Printed Circuits

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Graduate Student Presentations

Rapid Prototyping and Development of Microfluidic and BioMEMS Devices

Improving Printability of Functional Materials by. Laboratory of Paper Coating and Converting Martti Toivakka and Jouko Peltonen

Etching Etch Definitions Isotropic Etching: same in all direction Anisotropic Etching: direction sensitive Selectivity: etch rate difference between

Supporting Online Material for

"Internationalization vs. Localization: The Translation of Videogame Advertising"

Spectroscopic Ellipsometry:

Dependence of the thickness and composition of the HfO 2 /Si interface layer on annealing

ENS 07 Paris, France, 3-4 December 2007

Regulatory Compliance Statement

PLASMA TECHNOLOGY OVERVIEW

L304 LED PUSHBUTTON SWITCH / DISPLAY INDICATOR INDICATEUR LUMINEUX A LED / BOUTON POUSSOIR

Fabrication and Characterization of N- and P-Type a-si:h Thin Film Transistors

THE TRACKER FULLY AUTOMATED DROP TENSIOMETER FOR THE MEASUREMENT OF THE RHEOLOGICAL CHARACTERISTICS OF INTERFACES

CAPITOLO III MATERIALI ASSEMBLATI E AUTOASSEMBLATI. Photonics and Biophotonics Organics Synthesis - PhoBOS

SURFACE TENSION. Definition

Amorphous Silicon Backplane with Polymer MEMS Structures for Electrophoretic Displays

Machine de Soufflage defibre

Combustion chemical vapor deposition

Laboratorio Regionale LiCryL CNR-INFM

Light management for photovoltaics using surface nanostructures

for Low power Energy Harvesting Sun to fiber' Solar Devices

Case Study 2: Digital Micromirror Devices (DMD) Optical MEMS

Scanning Near Field Optical Microscopy: Principle, Instrumentation and Applications

Liste d'adresses URL

Coating Technology: Evaporation Vs Sputtering

Centre d expertise en analyse environnementale du Québec. Analytical Laboratory Accreditation Program INSTRUCTIONS APPLICATION FOR ACCREDITATION

1. PECVD in ORGANOSILICON FED PLASMAS

Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.

Why silicon MEMS? Silicon is a strong material... Photolithography. Micromachining. Dicing and packaging

SPACE CHARGE MEASUREMENTS IN XLPE INSULATED MID VOLTAGE CABLE: CORRELATION WITH CABLE PERFORMANCE

Formation à l ED STIC ED STIC Doctoral education. Hanna Klaudel

Numéro de projet CISPR Amd 2 Ed IEC/TC or SC: CISPR/A CEI/CE ou SC: Date of circulation Date de diffusion

AD511 Active Iridium Antenna User Manual Mar 12 V4.0

Silicon-On-Glass MEMS. Design. Handbook

Implementation Of High-k/Metal Gates In High-Volume Manufacturing

Semiconductor doping. Si solar Cell

Light management for photovoltaics. Ando Kuypers, TNO Program manager Solar

SELECTIVELY ABSORBING COATINGS

Micro-Power Generation

Nanometer-scale imaging and metrology, nano-fabrication with the Orion Helium Ion Microscope

Detection of water leakage using laser images from 3D laser scanning data

Design for Microfluidic Device Manufacture Guidelines

Thursday, February 7, DOM via PHP

MEMS mirror for low cost laser scanners. Ulrich Hofmann

ref. 6 Young 2G Accès d angle à 2 portes pivotantes / Corner entry enclosure, 2 hinged doors

Damage-free, All-dry Via Etch Resist and Residue Removal Processes

Fabrication Challenges for Point-ofcare Diagnostics and Organ-on-chip

Microstockage d énergie Les dernières avancées. S. Martin (CEA-LITEN / Grenoble)

SFxxx-S PID Test Report (Potential Induced Degradation) TUV Rheinland Japan. ARC Product Management Ver. 1

Performance of Carbon-PTFE Electrodes and PTFE Separators in Electrochemical Double Layer Capacitors (EDLCs)

Fluid Mechanics: Static s Kinematics Dynamics Fluid

Calcul parallèle avec R

Reflectance Characteristics of Accuflect Light Reflecting Ceramic

Supporting information

This paper describes Digital Equipment Corporation Semiconductor Division s

Formation of Oriented Fibers Using Injection of PEO Solutions inside Electric Fields Defined by Two Parallel Suspended Electrodes

DualBeam Solutions for Electrical Nanoprobing

Solar Photovoltaic (PV) Cells

NANO SILICON DOTS EMBEDDED SIO 2 /SIO 2 MULTILAYERS FOR PV HIGH EFFICIENCY APPLICATION

[ dessins, collages, illustrations, etcetera ]

Active Nanocomposite Materials

Hierarchical Classification of the Photovoltaic Materials by Data Analysis Method

Monitoring Displacement vs. Depth in Lateral Pile Load Tests with Shape Accelerometer Arrays

Advanced VLSI Design CMOS Processing Technology

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Presentation of Project NanoPlast. The Project is subsidize of

105 Adopted:

XI / PHYSICS FLUIDS IN MOTION 11/PA

TR "Coverup" Protective Covers for Evidence

Short Form Description / Sommaire: Carrying on a prescribed activity without or contrary to a licence

Good Boards = Results

Laser sintering of greens compacts of MoSi 2

Comprehensive Investigation of Sequential Plasma Activated Si/Si Bonded Interface for Nano-integration

CONSOLIDATION AND HIGH STRAIN RATE MECHANICAL BEHAVIOR OF NANOCRYSTALLINE TANTALUM POWDER

Transcription:

Electromouillage réversible sur nanofils de silicium superhydrophobes EWOD: Electro Wetting On Dielectrics Rabah Boukherroub 1,2 N. Verplanck, 2 G.Piret 1,2 Y. Coffinier, 1,2 E. Galopin, 2 V. Thomy, 2 I. Fournier, 3 M. Salzet, 3 J.-C. Camart 2 1 Institut de Recherche Interdisciplinaire (IRI) 2 Institut d Électronique, de Microélectronique et de Nanotechnologie (IEMN) 3 Laboratoire de Neuroimmunologie des Annélides Cité Scientifique 59652 Villeneuve D Ascq, France

Why use droplet based Microfluidics? La biologie n échappe pas à la tendance générale à la miniaturisation, notamment dans le domaine analytique de la biochimie. En quelques années, les concepts de laboratoires sur puces, labo puces ou Lab-on-a-chip sont devenus une réalité. Les avantages de la miniaturisation sont multiples: - amélioration de la sensibilité d analyse - rapidité d exécution - parallélisation des essais - réduction des volumes d échantillons - diminution des coûts des dispositifs - automatisation - standartisation des procédés, etc. La réalisation de microsystèmes pour l analyse biologique est un domaine de recherche interdisciplinaire faisant appel à des connaissances aussi diverses que: - la microfluidique, - la chimie des surfaces - la microélectronique, la mécanique, l optique

Why use droplet based Microfluidics (EWOD)? basic operations all on one chip - e.g. pumping, mixing achieved by simply programming signals fabrication is simple no moving parts like pumps, etc. flexible - changing of signals instead of adding new physical structures small amounts of fluids can be handled operations become digital Integration

Voltage Dependence of Contact Angle - for higher voltages saturation of the contact angle - contact angle saturation still largely not well understood -hydrophobic surface needed because of contact angle saturation Lippmann equation Ewod_120.wmv The main criteria required to ensure effective reversible electrowetting is that the hydrophobic layer hysteresis is as low as possible and the contact angle at zero voltage is as high as possible

Setups in EWOD (I) - Open Setup - insulator needed: as dielectric medium (for capacity) in order to prevent electrolysis (SiO 2, Si 3 N 4, organic polymers) - droplet sitting on hydrophobic surface (hydrophobicity induced through chemical modification or capping with a hydrophobic layer such as fluoropolymers) Droplet deformation and moving - ground electrode is sitting in the droplet - bottom electrode is structured in order to control droplet actuation (motion)

Setups in EWOD (II) - Closed Setup - structured electrodes on the bottom side - unstructured, electrically isolated electrodes on the top side -hydrophobizationon top and bottom side - electrolysis prevented by electrical insulator on the bottom/top layer

EWOD setup used in the laboratory Si counter electrode Liquid droplet Hydrophobic surfaces (Cytop, Teflon ) SiO 2 insulator Glass substrate +V 1 2 3 4 Control electrodes Distance between the plans: 300 µm, Applied voltage: 80 V Speed: environ 10 mm/s (5 plots/s)

It works and so what is next?!!! The main criteria required to ensure effective reversible electrowetting is that the Teflon is relatively an inert material hydrophobic layer hysteresis is as low as possible and the contact angle at zero voltage is as high as possible Si counter electrode Liquid droplet superhydrophobic surfaces (SiNWs) SiO 2 insulator Glass substrate +V 1 2 3 4 Control electrodes The main advantages associated with such a substrate are: (i) flow resistance of droplets is dramatically reduced (low voltage), (ii) simple realization of hydrophilic and functionalized pads in the superhydrophobic surface allowing analytes trapping and enhancement of the liquid / surface interaction, (iii) subsequent analysis by matrixfree desorption/ionization MS-DIOS on these pads.

Previous work on reversible electrowetting on superhydrophobic surfaces

- Herbertson et al.sens. Actuators, A 2006, 130-131, 189-193 Electrowetting on patterned layers of SU-8 photoresist with an amorphous Teflon-AF coating was examined by Newton et al.16 After a cycle from 0 to 130 V and back to 0 V, a decrease of the contact angle from its original value ( 152 ) to 114 was observed. The contact angle continued to fall down even when the voltage was reduced, which is a good indication of the non-reversibility of the system.

- Heikenfled et al. Langmuir 2006, 22, 9030-9034. - Krupenkin et al. Langmuir 2004, 20, 3824-3827. The nanostructured material exhibited a water contact angle of 160 in air for saline solution with an irreversible behavior. A method for dynamic electrical control over the wetting behavior of liquid droplets on superhydrophobic nanostructured surfaces prepared by etching microscopic array of cylindrical nanoposts into the surface of a silicon wafer was first demonstrated by Krupenkin et al. They found that the wetting properties of the surface can be tuned from superhydrophobic behavior to nearly complete wetting as a function of applied voltage and liquid surface tension, but with no reversible effect.

SiNWs Synthesis VLS growth technique

1. Preparation of Superhydrophobic Surfaces a) SEM image of silicon nanowires grown on Si/SiO 2 using the vapor-liquid-solid (VLS) mechanism (PSiH 4 = 0.4 T, T = 500 C, t = 60 min). diameter in the range of 20-150 nm and 30 µm in length b) SEM image of the same silicon nanowires coated with C4F8. C4F8 was deposited using a plasma technique to yield a conformal hydrophobic layer (60 nm thick) N. Verplanck et al. Nano Lett. 7 (2007) 813

1. Preparation of Superhydrophobic Surfaces CF 3 (CF 2 ) 7 (CH 2 ) 2 Si O O O SiONWs Y. Coffinier et al. Langmuir 23 (2007) 1608

It is well-established that the air trapped in the solid surface plays an important role on hydrophobicity. Cassie and Baxter have proposed the following equation to express the contact angle on a composite surface (θr): cos θ r = f 1 cosθ f 2 θ r and θ are the water contact angles of the chemically-modified a-sionws and Smooth Si/SiO 2 surfaces, respectively, and f 1 and f 2 are the fractions of solid surfaces and air in contact with water, respectively. It is assumed that f 1 + f 2 = 1. θ = 109 reported for Si/SiO 2 modified with perfluorodecyl trichlorosilane was used for the calculation. f 1 = 0.173 f 2 = 0.827 Y. Coffinier et al. Langmuir 23 (2007) 1608

EWOD actuation on SiNWs

2. Reversible EWOD on SiNWs Electrowetting on silicon nanowires coated with hydrophobic fluoropolymer C 4 F 8 displaying reversible electrowetting of a saline solution (100 mm KCl) in oil: (a) contact angle ) 164 at 0 V, (b) contact angle ) 106 at 150 VTRMS. Contact angle vs time for a saline solution droplet (100mM KCl) in air at 150 VTRMS proving the repeatable reversibility of the electrowetting. A zoom of this curve shows the speed of the droplet relaxation: each point is a contact angle of the droplet taken from a frame of a video (25 frames/s). Reversible electrowetting is demonstrated on modified SiNWs. Even though the decrease of the contact angle is limited to ~ 25, it is expected that such surfaces will allow liquid displacement according to the quasi null hysteresis due to a recessed contact angle near the advanced contact angle. In order to move a droplet, the contact angle under applied voltage has to be lower than the recessed contact angle.

2. Reversible EWOD on SiNWs Capot_SH1.wmv

Conclusions - Comprendre le phénomène électromouillage sur nanofils de silicium (modélisation + expérience) - Préparer des surfaces avec deux niveaux de rugosité (feuilles de Lotus) - Réaliser les fonctions principales d électromouillage sur surfaces superhydrophobes (scission, fusion, ) -Déplacer des liquides contenant des molécules biologiques - Optimiser le système pour réaliser une actuation à faibles tensions Control electrodes SiNWS for EWOD actuation Modified SiNWs for 2D chromatography