Meridian TM WS-DP Next Generation Wafer Based Electrical Fault Isolation System to Improve Yield Ramp

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1 Meridian TM WS-DP Next Generation Wafer Based Electrical Fault Isolation System to Improve Yield Ramp 曹君正 Chun-Cheng Tsao September 30, 2014 Find defects that matter

2 Outline Introduction to Meridian and Meridian WS Meridian WS-DP, new wafer-level electrical fault analysis system Features of WS-DP Conclusions Slide 2

3 Introduction to Meridian and Meridian WS Slide 3 08/26/2013 DCG Systems, Inc. Confidential

4 Meridian and Meridian WS Dynamic/Static electrical failure analysis (FA) and fault isolation (FI) platform Laser and camera based optical systems Overhead tester docking configuration Wafer-level analysis as well as packaged die capability on Meridian WS Meridian Meridian WS Slide 4 Fabless-Foundry Yield Handshake

tester docking configuration Wafer-level analysis as well as packaged die

5 Where Are Meridian & WS Applications IC Design Frontend Backend Design Layout Photomask Production CP Test Dice/ Package FT Test Final Product EFA DCG WS DCG Elite DCG Meridian DCG nprober r DCG nprober r Slide 5 LVx Scan chain debug PFA

Package FT Test Final Product EFA DCG WS DCG Elite DCG

most versatile EFA technique for defects that lead to photon emission such as leakage, saturation, latch up SLS (OBIRCH and TIVA)

6 FA/FI Technologies in Meridian and WS Slide 6 LVx (LVP and LVi) Dynamic Laser-based waveform probing and function mapping at transistor level DLS (SDL and LADA) Dynamic Laser-based soft defect localization and speed path analysis PEM Dynamic or Static The most versatile EFA technique for defects that lead to photon emission such as leakage, saturation, latch up SLS (OBIRCH and TIVA) Static Simple and powerful laser-based technique in localizing conductivity related defects Meridian Optics LVP Die-to-die FA/FI on Meridian WS LVI PEM

7 Solid Immersion Lens for Meridian WS 350x magnification Diffraction-limited resolution Si thickness tolerance +/- 80mm User-swappable tips ideal for various Si thickness applications Long effective working distance for easy access to packaged die in socket Auto landing and focus Tips available in Si and GaAs for broad wavelength range Changeable tip 50x50mm 0.5mm 12x12mm Slide 7 Reliable performance for wafer-level analysis

distance for easy access to packaged die in socket Auto landing and focus Tips available in Si and GaAs

image quality Control probe card load/unload and contact

8 Tester Interface on Meridian WS Flexible cable interface Isolate mechanical vibration from tester head ensure SIL image quality Control probe card load/unload and contact over drive Slide 8 Proven solution in foundries worldwide

9 Meridian WS-DP Evolution from Meridian WS Slide 9 08/26/2013 DCG Systems, Inc. Confidential

10 The Drive for Direct Probe in Test Highly integrated system-in-package requires known good die (KGD) before entering package step KGD testing requires increased at-speed functional test coverage at wafer probe to deliver similar performance at package test Direct probe reduces interface performance gap between wafer probing and package test Meridian WS-DP supports the trend of moving FT test to CP phase Slide 10

probe to deliver similar performance at package test Direct probe reduces interface performance gap

11 Advantages of Direct Probe Interface Meridian WS Test Head Custom PIB Board Pogo Tower Probe Card Meridian Long flex Interface with pogo tower Wafer Meridian WS-DP Test Head (Advantest or Teradyne) Modularized PCB Production Probe Card Meridian Short flex Interface Wafer Meridian WS-DP Same probe card as production Production test program High speed test 1 to 1 signal connection from test head to probe Larger probe card allows for flexibility of on-board signal conditioning Enables calibration all the way to probe needles Same platform as Meridian IV at Fabless share work flow and results Slide 11

card as production Production test program High speed test 1 to 1 signal connection from test head to probe Larger probe card allows for flexibility

12 Meridian WS vs. WS-DP: the Change Same optics, electronics, software, and FA/FI packages WS-DP has new platen to accommodate Direct-Probe probe card and other various conventional, round, non-dp probe cards WS WS-DP Slide 12

Large probe card (bridge beam mounted) New platen to allow for the

13 WS-DP Interface Stack Up Test head V93K Direct-Probe or Teradyne - UltraProbe Short cable flex interface Max cable length = 12 inches Large probe card (bridge beam mounted) New platen to allow for the larger probe card size Modified table-top with WS optics and electronics Slide 13

14 Features of Meridian WS-DP Slide 14 08/26/2013 DCG Systems, Inc. Confidential

15 WS-DP: Enabling Direct Probing of Wafer Verigy V93000 Direct-Probe DCG direct probe interface Prober head plate with bridge beam Probe card Cable interface inserted between tester head and probe card Upper frame houses configurable connector /cable & docks to tester head Lower frame is same part as inside V93k head & connects to direct-probe PC Curtesy of Advantest Slide 15

and probe card Upper frame houses configurable connector /cable & docks to tester head Lower

harness PCB & connectors are housed in cartridges.

16 WS-DP: Configurable Interface Face tester Face wafer Customized 93K stiffener PCB mounted on the cartridge can be independently configured w/o removing the cable harness PCB & connectors are housed in cartridges. Cartridge can be removed from stiffener for retrofit Independently mounted cable harness Slide 16 Universal to resource maps

0V swing Maximum clock rate: 800MHz With DP interface after TDR

17 WS-DP: Flexible Cable Interface to Tester Production test Signal rise time: 600ps/1.0V swing Maximum clock rate: 800MHz With DP interface after TDR High-speed interface plus production probe card enables use of production settings: same shmoo results & same pass/fail conditions Slide 17

well to WS same probe card mounting features as WS platen Existing WS flexible interfaces are

18 WS-DP: Accommodate to All Probe Cards Existing non-dp probe card Teradyne UltraProbe Adaptor ring to convert Verigy V93k Direct-Probe to Teradyne UFlex UltraProbe Slide 18 Adaptor ring to convert WS-DP well to WS same probe card mounting features as WS platen Existing WS flexible interfaces are backward compatible with WS-DP Quick changeover between DP and conventional interfaces Curtesy of Teradyne

19 Conclusions Direct probe is the trend of high-performance testing High-performance signal integrity Large PC space to support increased test coverage for KGD High correlation between package test to wafer probe Meridian WS-DP provides direct probe solution to tester interface for dynamic/static electrical FA/FI Share the same probe card with production test Use production test program Run high-speed test Direct data comparison with production test Configurable interface for flexible test resource change Universal compatibility to various types of probe cards Slide 19

dynamic/static electrical FA/FI Share the same probe card with production test Use production test program Run high-speed test Direct data

20 Thank You Slide 20 08/26/2013 DCG Systems, Inc. Confidential

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com