X A sensitive gate SCR. Features. Applications. Description. on-state rms current: 1.25 A. repetitive peak off-state voltage: 600 V and 800 V
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1 1.25 sensitive gate SCR Features on-state rms current: 1.25 repetitive peak off-state voltage: 600 V and 800 V G gate triggering current: 50 and 200 µ K pplications ground fault circuit interrupters overvoltage crowbar protection in power supplies capacitive ignition circuits K X02xxN G K TO-92 X02xx G Description The X02 SCR can be used as the on/off function in applications where topology does not offer high current for gate triggering. K G This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. SMBflat-3L X0202NUF Table 1. Device summary Order code Voltage 600 V 800 V Sensitivity µ Package X0202M Y 200 TO-92 X0202MN Y 200 X0202N Y 200 TO-92 X0202NN Y 200 X0205M Y 50 TO-92 X0205N Y 50 TO-92 X0202NUF Y 200 SMBflat-3L January 2011 Doc ID 7480 Rev 4 1/
2 Characteristics X02 1 Characteristics Table 2. bsolute ratings (limiting values, T J = 25 C unless otherwise specified) Symbol Parameter Value Unit I T(RMS) IT (V) I TSM On-state rms current (180 Conduction angle) verage on-state current (180 Conduction angle) Non repetitive surge peak on-state current TO-92 T L = 63 C T tab = 99 C SMBflat-3L T tab = 111 C TO-92 T L = 63 C T tab = 99 C SMBflat-3L T tab = 111 C t p = 8.3 ms 25 Tj = 25 C t p = 10 ms I ² t I ² t Value for fusing t p = 10 ms T j = 25 C s di/dt Critical rate of rise of on-state current I G = 2 x I GT, t r 100 ns F = 60 Hz T j = 125 C 50 /µs I GM Peak gate current t p = 20 µs T j = 125 C 1.2 P G(V) verage gate power dissipation T j = 125 C 0.2 W T stg T j Table 3. Storage junction temperature range Operating junction temperature range Electrical characteristics (T J = 25 C unless otherwise specified) - 40 to to Symbol Test conditions X0202 X0205 Unit I GT V D = 12 V, R L = 140 Ω Min. 20 Max V GT Max. 0.8 V V GD V D = V DRM, R L = 3.3 kω, R GK = 1 kω T j = 125 C Min. 0.1 V V RG I RG = 10 µ Min. 8 V I H I T = 50 m, R GK = 1 kω Max. 5 m I L I G = 1 m, R GK = 1 kω Max. 6 m dv/dt V D = 67% V DRM, R GK = 1 kω T j = 110 C Min V/µs Table 4. Static electrical characteristics Symbol Test conditions X0202 X0205 Unit V TM I TM = 2.5, t p = 380 µs T j = 25 C V TO Threshold voltage 0.9 V T j = 125 C R d Dynamic resistance Max. 200 mω I DRM I RRM V DRM = V RRM, R GK = 1 kω µ 1.45 V T j = 25 C 5 µ T j = 125 C 500 µ C 2/11 Doc ID 7480 Rev 4
3 Characteristics Table 5. Thermal resistances Symbol Parameter Value Unit R th(j-l) Junction to leads (DC) TO-92 R th(j-t) Junction to tab (DC) 25 R th(j-t) Junction to tab (DC) SMBflat-3L 14 Max. TO R th(j-a) Junction to ambient (DC) S = 5 cm 2 60 SMBflat-3L C/W Figure 1. Maximum average power dissipation versus average on-state current (full cycle) Figure 2. verage and DC on-state current versus tab (, SMBflat-3L) or lead (TO-92) temperature P(W) 360 α = 180 α I T(V) () I T(V) () D.C. (TO-92) Tlead or T tab ( C) α = 180 (TO-92) α = 180 () D.C. () α = 180 (SMBflat-3L) D.C. (SMBflat-3L) Figure I T(V) () verage and DC on-state current versus ambient temperature Figure 4. 0 Relative variation of thermal impedance junction to ambient versus pulse duration K=[Z th(j-a) /Rth(j-a)] TO D.C. () SMBflat-3L D.C. (SMBflat-3L) D.C. (TO-92) α = 180 (TO-92) α = 180 () T amb ( C) α = 180 (SMBflat-3L) t (s) p 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 Doc ID 7480 Rev 4 3/11
4 Characteristics X02 Figure 5. Relative variation of triggering, holding and latching current versus junction temperature I GT,I H,I L[T] j / I GT,I H,I L[T j=25 C] T ( C) j IGT IH & IL R GK = 1kΩ Figure 6. Typical values I H[R GK] / I H[ R GK =1k Ω] Relative variation of holding current versus gate-cathode resistance (typical values) 0.5 R GK(k Ω) E-02 1.E-01 1.E+00 1.E+01 Tj=25 Figure 7. Relative variation of dv/dt immunity versus gate-cathode resistance (typical values) Figure 8. Relative variation of dv/dt immunity versus gate-cathode capacitance (typical values) 10.0 dv/dt[r GK] / dv/dt[ R GK =1k Ω] 20 dv/dt[c GK] / dv/dt[ R GK =1k Ω] Tj = 125 C V D = 0.67 x VDRM V D = 0.67 x VDRM Tj = 125 C R GK = 1kΩ R GK(k Ω) C GK(nF) Figure 9. Surge peak on-state current versus number of cycles Figure 10. Non repetitive surge peak on state current for a sinusoidal pulse and corresponding value of I 2 T 25 I TSM() I TSM(), I t ( s) Tj initial = 25 C 20 t p=10ms One cycle 100 di/dt limitation ITSM 15 Non repetitive Tj initial=25 C Repetitive T amb=25 C 2 I t Number of cycles t (ms) p /11 Doc ID 7480 Rev 4
5 Ordering information scheme Figure 11. On-state characteristics (maximum values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (, SMBflat-3L) 3E+1 1E+1 1E+0 1E I TM() Tj max.: V t0=0.9v R d=200mω Tj=max 1.5 T j=25 C V TM(V) R th(j-a) ( C/W) Epoxy printed circuit board FR4, copper thickness 35 µm SMBF3L (typical) (maximum) 60 S(cm²) Ordering information scheme Figure 13. Ordering information scheme X M ZBlank 1B2 Sensitive SCR series Current 02 = 1.25 Sensitivity 02 = 200 µ 05 = 50 µ Voltage M = 600 V N = 800 V Package = TO-92 ("Blank") N = (N"No Blank ) UF = SMBF3L Packing mode 1B2 = Bulk 2BL2 = mmopack 5B4 = Tape and reel 7 () Blank = Tape and reel 13 (SMBflat-3L) Doc ID 7480 Rev 4 5/11
6 Package information X02 3 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPCK packages, depending on their level of environmental compliance. ECOPCK specifications, grade definitions and product status are available at: ECOPCK is an ST trademark. Table 6. TO-92 dimensions Ref Millimeters Dimensions Inches B C a Min. Typ. Max. Min. Typ. Max B C F D E D E F a /11 Doc ID 7480 Rev 4
7 Package information Table 7. dimensions Dimensions Ref. Millimeters Inches V c Min. Typ. Max. Min. Typ. Max. 1 B e D B1 B B c H E D (1) e e E (1) e H V 10 max 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) Figure 14. footprint Doc ID 7480 Rev 4 7/11
8 Package information X02 Table 8. SMBflat-3L dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. E E1 D L 2x L e b4 c b 2x L2 2x L1 L1 L b b c D E E L L L e Figure 15. SMBflat-3L footprint dimensions 0.51 (0.020) 5.84 (0.230) 2.07 (0.082) 2.07 (0.082) 0.51 (0.020) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) millimeters (inches) 8/11 Doc ID 7480 Rev 4
9 Package information Figure 16. Footprint and connectors for or SMBflat-3L (dimensions in mm) Solder resist SMBF3L Solder lands 2.07 SMBF3L SMBF3L Solder paste Connector line Doc ID 7480 Rev 4 9/11
10 Ordering information X02 4 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode X0202M 1B2 X0202 M TO g 2500 Bulk X0202M 2BL2 X0202 M TO g 2000 mmopack X0202MN5B4 X2M 0.12 g 1000 Tape and reel X0202N 1B2 X0202 N TO g 2500 Bulk X0202N 2BL2 X0202 N TO g 2000 mmopack X0202NN5B4 X2N 0.12 g 1000 Tape and reel X0205M 1B2 X0205 M TO g 2500 Bulk X0205M 2BL2 X0205 M TO g 2000 mmopack X0205N 1B2 X0205 N TO g 2500 Bulk X0202NUF X2N SMBflat-3L mg 5000 Tape and reel 5 Revision history Table 10. Document revision history Date Revision Changes Sep Previous issue 14-Jan dded SMBflat-3L package and ECOPCK statement. 10/11 Doc ID 7480 Rev 4
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