ROTARY CODED SWITCHES (SMD)

Transcription

1 COPL ELECTRONICS RoHS compliant INTERNL STRUCTURE ETURES soldering Low profile of. mm Wide variety (top or side setting,, or positions, J-hook, gull wing or throuhg hole pins) to choose from Compatible with flow (top setting only) / reflow soldering Washable Part name Cover O ring Rotor Spacer Moving contact ixed contact Housing Terminal pin PRT NUMBER DESIGNTION S - T Series name Shape of rotor Without knob Material Stainless steel (SUS ) Silicone rubber PPS Polyphenylenesulphide Stainless steel (SUS ) Sn-Pb u Copper alloy, Gold-plated Epoxy Copper alloy, Solder-plated Copper alloy, Gold-plated lammability UL-HB UL-V- UL-V- CCs (PBBOs, PBBs) CCs, Halon, Carbon tetrachloride and designated bromic flame retardant PBBOs and PBBs are not used in our products. Shape of terminal J- B C J-hook Gull wing Through hole pins Except for positions type Code format Setting position Top setting Side setting Except for positions type positions, real code positions, complementary code positions, real code positions, real code positions, complementary code orm of packaging T Taping (Reel) W Tray packaging (Through hole pins only) Bulk in plastic bag Blank Terminal pin BlankSn-Pb E u () Please refer to the LIST O PRT NUMBERS when placing orders.

2 COPL ELECTRONICS S- CODE ORMT Code positions No. of positions positions positions Position Real code Complementary code Contact closed LIST O PRT NUMBERS Setting position Top setting Side setting Shape of terminal J-hook B Gull wing C Tray packaging Through hole pin Plastic bag J-hook B Gull wing orm of packaging Taping Plastic bag Taping Plastic bag Taping Plastic bag Taping Plastic bag C Tray packaging Through hole pin Plastic bag Terminal pin Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Sn-Pb u () Binary coded hexal Real code Binary coded decimal Real code Binary coded hexadecimal Real code Pieces in package Complementary code Complementary code S-T S-T S-T S-T S-T pcs. / reel S-ET S-ET S-ET S-ET S-ET pcs. / reel S- S- S- S- S- pcs. / pack S-E S-E S-E S-E S-E pcs. / pack S-TB S-TB S-TB S-TB S-TB pcs. / reel S-ETB S-ETB S-ETB S-ETB S-ETB pcs. / reel S-B S-B S-B S-B S-B pcs. / pack S-EB S-EB S-EB S-EB S-EB pcs. / pack S-WC S-WC S-WC S-WC pcs. / tray S-EWC S-EWC S-EWC S-EWC pcs. / tray S-C S-C S-C S-C pcs. / pack S-EC S-EC S-EC S-EC pcs. / pack S-T S-T S-T S-T pcs. / reel S-ET S-ET S-ET S-ET pcs. / reel S- S- S- S- pcs. / pack S-E S-E S-E S-E pcs. / pack S-TB S-TB S-TB S-TB pcs. / reel S-ETB S-ETB S-ETB S-ETB pcs. / reel S-B S-B S-B S-B pcs. / pack S-EB S-EB S-EB S-EB pcs. / pack S-WC S-WC S-WC S-WC pcs. / tray S-EWC S-EWC S-EWC S-EWC pcs. / tray S-C S-C S-C S-C pcs. / pack S-EC S-EC S-EC S-EC pcs. / pack Not manufactured Verify the above part numbers when placing orders. Taping and tray version can be supplied only in reel or tray unit. The products indicated by mark are manufactured upon receipt of order basis.

3 COPL ELECTRONICS S- STNDRD SPECIICTIONS Circuit type Operating temperature range Storage temperature range Sealing Net weight No. of positions djustment torque Stepping angle Solderability Soldering heat Shear (adhesion) Substrate bending Pull-off strength Sn-Pb u Sn-Pb u BCD (Real code, complementary code) BCH (Real code, complementary code) ~ C Washable by O ring pprox.. g ( or B type in top setting) pprox.. g (C type in top setting) pprox.. g (Side setting type) MECHNICL CHRCTERISTICS,, mn m { gf cm} maximum ( positions) ( positions). ( positions) ± C, ±. s ± C, ~ s ± C, s Reflow C (Peak temperature) Please refer to the profile below low : ± C, ~ s, two times maximum Manual soldering : ± C, ~ s N {. kgf}, s Width mm, bend mm, s, time N {. kgf}, s { } : Reference only ELECTRICL CHRCTERISTICS Contact rating Non-switching Switching Minimum Contact resistance Insulation resistance Dielectric strength Vibration Shock Load life Humidity (Steady state) High temperature exposure Low temperature exposure Thermal shock DC V m DC V m DC mv μ mω maximum MΩ (DC V) minimum C V, s ENVIRONMENTL CHRCTERISTICS (mplitude). mmor (cceleration) m/s, -- Hz, directions for h each m/s, ms directions for times each steps minimum, DC V, m C, Relative humidity ~ %, h C, h C, h (. h) ~ C (. h ), cycles Reflow profile for soldering heat evaluation ( C) C C Peak : + C Over C Pre Heating Zone ± s ± s Heating time Soldering Zone Reflow : two times maximum

4 COPL ELECTRONICS S- OUTLINE DIMESIONS S-, S-E (Real code) S-, S-E (Complementary code) Unless otherwise specified, tolerance: ±. (Unit: mm) S-, S-E (Real code) S-, S-E (Complementary code) C. W. L. D. t =. C. W. L. D. t = C.... C.... S-B, S-EB (Real code) S-B, S-EB (Complementary code) S-B, S-EB (Real code) S-B, S-EB (Complementary code) C. W. L. D. min.. t =. C. W. L. D. min.. t =..... C. min..... C.. min.... S-C, S-EC (Real code) S-C, S-EC (Complementary code) S-C, S-EC (Real code) S-C, S-EC (Complementary code) C. t =. C. t =..... C... ±.. C... ±... W. L. D Projection.. W. L. D Projection.

5 COPL ELECTRONICS S- OUTLINE DIMESIONS S-, S-E (Real code) S-, S-E (Complementary code) Unless otherwise specified, tolerance: ±. (Unit: mm) S-, S-E (Real code) S-, S-E (Complementary code) C. W. L. D min... t =... C. W. L. D min... t =..... C min. C min. S-B, S-EB (Real code) S-B, S-EB (Complementary code) S-B, S-EB (Real code) S-B, S-EB (Complementary code)..... C. W. L. D. min... t =.... C. W. L. D. min... t =..... C. min. C. min. S-C, S-EC (Real code) S-C, S-EC (Complementary code) S-C, S-EC (Real code) S-C, S-EC (Complementary code) C. W. L. D... t =... C. W. L. D... t =... C C

6 COPL ELECTRONICS S- OUTLINE DIMESIONS S-, S-E (Real code) Unless otherwise specified, tolerance: ±. (Unit: mm) S-B, S-EB (Real code) C. t =. C. min.. t =..... RECOMMENDED P.C.B. PD OUTLINE DIMENSIONS <Top setting> type B type (Unit: mm)... <Side setting> type B type NO C. W. L. D.. NO C..... min.. W. L. D Note) The zero point is the center of mounting.

7 COPL ELECTRONICS S- Soldering iron Manual soldering Soldering shall be done at C (lead-free : C) for seconds (max.). SOLDERING CONDITIONS low soldering Tp Preheating Dip Cooling ~ min ~ C Infrared reflow soldering Tp Tm ~ min low soldering () Tp Preheating Dip Cooling ~ min ~ C ~ s Time ~ s Time Tp C (Peak temperature) tm Time Tp C (Peak temperature) Tm C (Melting point temperature) tm s (Melting time) Infrared reflow soldering () Tp C (Peak temperature) Reflow : two times maximum Recommended profile for soldering ( C) C C Peak : ~ C Over C Pre Heating Zone ± s Heating time ± s Soldering Zone PCKGING SPECIICTIONS <Taping packaging specifications> Taping version is packaged in pcs. per reel. Orders will be accepted for units of pcs., i.e.,,,, pcs., etc. Taping version is boxed with one reel ( pcs.). Maximum number of consecutive missing pieces= Leader length and reel dimension are shown in the diagrams below: Embossed tape dimensions Reel dimensions (Unit: mm) (JIS C - Conforms to JIS C -) (EIJ ET- In accordance with EIJ ET-) End Empty illed Empty Head φ±. ±..± ± φ mm min. pitches min. mm min. φ ±. φ ± (Top setting type) φ ± (Side setting type).±

8 B B COPL ELECTRONICS S- S-T, S-ET <Top setting> <Side setting> (JIS C - Conforms to JIS C -) (Unit: mm) ±. D E ±. ±. φ. +..±..±..±. ±. ±. ±. φ. +..±..±...±.. S-TB, S-ETB < Top setting > <Side setting> ±. D E ±. ±. φ. +..±..±..±. ±. ±. φ. +...±. C C ±..±..±.. <Tray packaging specifications> Tray version is packaged in pcs. per tray. Orders will be accepted for units of pcs., i. e.,,, pcs. etc. Tray version is boxed with trays. <Bulk pack specifications> The smallest unit of bulk pack in a plastic bag is pcs. per pack. Orders will be accepted for unit of minimum pcs., i.e.,,, pcs., etc. Boxing of bulk in a plastic bag (top setting type) is performed with pcs. (standard pcs.) per box. Only that side setting type is pcs. (standard pcs.) per box.