Klik for at redigere undertiteltypografien i masteren. ESA HDI Technologies workshop

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Martin Bridges
7 years ago
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1 Klik for at redigere undertiteltypografien i masteren ESA HDI Technologies workshop Printed Circuit Boards in non woven aramide for Space applications

2 Mission statement Printca aims to be the preferred and market leading PWB partner to the defence-, space- and aerospace industry Supplemented by particularly demanding industrial customers

3 CTE mismatch, will reduce reliability CTE mismatch will give risk of cracks in solder joints after thermal excursion

4 Why did Printca select the Thermount Low CTE need by key OEM s Main applications; Eurofighter Typhoon and Gripen fighters Seen possible to Space qualify Conventional fabrication methods with no risk of contamination of process areas with e.g. conductive fibers Availible with polyimide and high Tg epoxy resin systems Supported by existing supply partner for polyimide products (Arlon) Good dielectric parameters like low dielectric constant and low weight

5 Background Thermount Thermount is a non-woven aramid fabric produced by DuPont-Teijin Advanced Papers in Japan Thermount offers a unique combination of light-weight, high tensile strength material with low in-plane thermal expansion Primary uses include both commercial electronics as well as defense & aerospace electronics

6 Thermount supply chain DuPont-Toray JV aramid fiber/floc DuPont-Teijin JV Thermount Fabric Arlon Laminate & Prepreg PCB Fabricators DuPont-Toray is a joint venture between E.I. DuPont & Toray Industries Manufactures aramid fiber/floc materials in Japan DuPont-Teijin Advanced Papers is a joint venture between E.I. DuPont & Teijin Manufactures Thermount fabric in Japan

7 Thermount availibility Thermount has historically been available in several fabric styles differentiated by fiber type & fabric density E-Series: Includes E210, E220 & E230 grades Original U.S. Thermount style used in 85NT & 55NT currently dominates material in defense/aerospace applications N-Series: N710 series Includes 2N710, 3N710 & 4N710 2 nd generation U.S. Thermount, used in 85RT, 55RT, 55ST, 55LM & 65GT Predominantly commercial applications N-Series: N740 series Includes N740#40 & N740#80 Historically only available in Japan Printca has since year 1999 supported the E-series (epoxy and polyimide)

8 Density and permittivity

Thermount is proven Arlon 85NT Polyimide Thermount Key Benefits of Polyimide Thermount High Tg (250oC) /

CIC, Woven Kevlar Manufacturability PTH Reliability Thermount rigid/flex Applications for Arlon

Eurofighter DSMAC Digitally Mapped Guidance System for the Tomahawk Cruise Missile ESA approved for

9 Thermount is proven Arlon 85NT Polyimide Thermount Key Benefits of Polyimide Thermount High Tg (250oC) / Higher Layer-Count Low Cost CTE vs. CIC, Woven Kevlar Manufacturability PTH Reliability Thermount rigid/flex Applications for Arlon Polyimide Thermount Include: Commercial and Military Avionics (Boeing 777) 75% of the Avionics on the Eurofighter DSMAC Digitally Mapped Guidance System for the Tomahawk Cruise Missile ESA approved for sequential MLB since year 2000 with resin filled blind vias Thermount with resin filled blind vias THERMOUNT THERMOUNT AND THERMOUNT RT RT ARE TRADENAMES OF THE DUPONT COMPANY, WILMINGTON, DE

10 Limited resin filling properties Due to low resin content prepreg, filling properties are limited For 70µm innerlayer copper, a glass/polyimide prepreg sheet is needed Blind via fill in sequential boards, also needs glass/polyimide prepreg (or other filling material)

11 Low in-plane x-y CTE

12 Thermount 85NT, Material Avalibility Prepreg types (all on stock at Printca) 210, 46 µm 220, 76µm 230, 94 µm Most common laminate types on Printca stock 4 mil 35/35 5 mil 35/35 8 mil 35/35 14 mil 35/35

13 Low dielectric constant Dieletric constant depends on frequency and moisture level in dielectric Glass/FR4-85/85 Saturated 4.5 Glass/FR4 - Bone-dry 4 THERMOUNT - 85/85 Saturated 3.5 THERMOUNT - Bone Dry Frequency - MHz

14 Moisture absorbtion Like other polyimide dielectrics, moisture removal before assembly is nessesary

15 E-series fabric not in production anymore From January 2007 Dupont stopped the E-series fabric (reinforcement) production Last buy options were availible Sq. foot reservation made by Printca With current programs the need for fabric is expected covered until end of 2011 New low CTE product to replace the Thermount E-series is under development by Arlon 85XT is under trial production and evaluation in the PCB industry

16 Board Build-up rules Use symmetric build Limit copper thickness to 35microns (low resin content and poor resin flow) Limit copper plane amount to reduce CTE Blind vias are possible with filling prepreg (glass/polyimide style) Printca PID approval cover up to max. 16 layers Be aware of very smooth surface (low peel strength) Assembly process, has to be controlled concerning moisture level in boards (like all other bare boards)

17 Printca results with new 85XT Build of sequential, thick and high layer count boards Use of existing proces flow and parameters to compare similarity with E-series Thermount Dimensional stability same as today Drilling and plating results close to same results as seen today Some small spot discoloration seen Next step is further cooperation with Arlon concerning results and future release

Microwave Multi-layer Printed Circuit Boards

Microwave Multi-layer Printed Circuit Boards MicroAPS at IEEE MTT-S IMS in Fort Worth, TX Ed Sandor, Manager of Application Engineering, Taconic Advanced Dielectric Division June 9, 2004 Abstract Over