UM OM13257 temperature sensor daughter card. Document information
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1 Rev October 2013 User manual Document information Info Content Keywords Fm+ Development Kit, OM13320, Temperature Sensor, LM75, SE95, PCT2075 Abstract Installation guide and User Manual for the OM13257 Temperature Sensor Daughter Card that connects to OM13320 Fm+ Development Kit. This board permits easy and simple evaluation of most of the NXP temperature sensor portfolio of products.
2 Revision history Rev Date Description Initial release Contact information For more information, please Visit: For sales office addresses, please send an to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
3 1. Introduction The OM13257 Temperature Sensor Daughter Card connects directly to the OM13320 Fm+ Development kit and permits easy evaluation of most of NXP s Temperature Sensor portfolio of products. Table_1 lists the supported devices. The OM13257 Temperature Sensor Daughter Card is shipped with no temperature sensor device soldered to the board. The user must purchase the device he is interested in evaluating in a TSSOP8 package (the ordering part number suffix should be DP and the package designation should be SOT505-1). These leaded packages should be relatively easy to solder to the board with a low wattage, fine tipped soldering iron. Remark: The pin 1 orientation is down and to the right when the text on the board readable. Usually, you would expect pin 1 to be up and to the left. There are two additional package footprints for an XSON8U package (SOT996-2). This same footprint accepts an HWSON8 package (SOT1169-2) with the exposed center pad unconnected. This configuration is acceptable for the temperature sensor devices. There is also a WLCSP6 package footprint for the PCT2202 device. In all cases, the pin 1 orientation is down and to the left when the board text is readable. Table 1. Devices supported by OM13257 Temperature Sensor Daughter Card Part Number Package Number Package Description LM75ADP SOT505-1 TSSOP8 LM75BDP SOT505-1 TSSOP8 SE95DP SOT505-1 TSSOP8 PCT2075DP SOT505-1 TSSOP8 LM75BGD SOT996-2 XSON8 LM75BTP SOT HWSON8 PCT2075TP SOT HWSON8 PCT2202UK WLCSP6 2. Features of the OM13257 Temperature Sensor Daughter Card Direct connection to OM13320 Fm+ Development kit Footprint for a TSSOP8 package, user solderable Flexible power supply configuration: 3.3 V or 5 V Jumper configuration of device I 2 C address LED indicators for power and INT Scope ground connection loop All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
4 3. Board jumper setup 3.1 Power Supply The power supply selection for the OM13257 is very flexible and allows for detailed analysis and evaluation of all the NXP temperature sensor devices. JP1 labeled PWR selects between 5 V supplied from the tester connector CN4 (jumper between pin 2 and 3) and the Fm+ board connector CN5 (jumper between pin 1 and 2). If 3.3 V is desired, no jumper is required. JP2 (labeled VDD) selects between 5 V and 3.3 V for the main power supply on pin 8 of the device under test. Add a jumper between pins 2 & 3 for 3.3 V supplied by the Fm+ board or 1 & 2 for 5 V selected by JP1. See the schematic section at the end of this document for more details. 3.2 I 2 C Address The I 2 C address of the slave temperature sensor device is selected via JP10, JP11 and JP12 connected to pin 5, 6, and 7 of the device under test respectively. Pin 1 of the jumpers is connected to 0 V, while pin 3 is connected to VDD selected above. Consult the datasheet for the I 2 C addresses corresponding to the logic levels on each pin. See the schematic section at the end of this document for more details. 3.3 SCL and SDA source There are two I 2 C busses implemented on the Fm+ board and JP3 and JP4 select either Bus 1 or Bus 2 as a source to the device under test. Jumper between pins 1 and 2 to select Bus 2 as a source and jumper between pins 2 and 3 to select Bus 1. Remark: SCL and SDA from CN4 Tester Connector are always connected to the device under test. If two masters are used, there may be contention. Fig 1. OM13257 jumper location and configuration All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
5 4. Connector pinouts 4.1 CN5 Fm+ Development Board connector The OM13257 can connect directly to the OM13320 Fm+ Development kit via CN2. This connector provides power, I 2 C signals and other ancillary signals. Remark: The connector on the Fm+ board is a male, shrouded 14-pin type, while the connector on the GPIO board is female, 18-pin. The reason lies with the shroud around the 14-pin connector. To ensure correct mating of the female with the male, two pin positions on both of the female sides are unused. Table 2. CN5 Fm+ Board connector pinout CN2 Pin Number Function Board Connection 1 No connect 2 No connect 3 SCL SCL Bus 1 to JP4 pin 3 4 SDA2 SDA Bus 2 JP3 pin 1 5 INT Interrupt to INT LED and U1 pin 3 6 RESET 7 +5 V JP1 pin V JP2 pin 3 9 GND 10 GND V JP2 pin V JP1 pin 1 13 RESET 14 INT Interrupt to INT LED and U1 pin 3 15 SDA SDA Bus 1 JP3 pin 3 16 SCL2 SCL Bus 2 JP4 pin 1 17 No connect 18 No connect 4.2 CN4 Tester connector Generation, inspection and logging of I 2 C-bus data is easily achieved with third-party development tools from Total Phase ( There are two tools called Aardvark and Beagle that direct connect to this board through CN4. Remark: Since SDA and SCL are both connected to the device under test, the Aardvark and the Fm+ Development board cannot be used simultaneously. The Beagle, a bus sniffer, does not have any issues. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
6 Table 3. CN5 Tester connector pinout CN4 Pin Number Function Board Connection 1 SCL U1 pin 2 2 Ground 3 SDA U1 pin V JP1 pin V JP1 pin V JP1 pin Ground All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
7 User manual All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Rev October of 10
8 User manual All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Rev October of 10
9 5. Legal information 5.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 5.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 5.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. I 2 C-bus Logo is a trademark of NXP B.V. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. User manual Rev October of 10
10 6. Contents 1. Introduction Features of the OM13257 Temperature Sensor Daughter Card Board jumper setup Power Supply I 2 C Address SCL and SDA source Connector pinouts CN5 Fm+ Development Board connector CN4 Tester connector Legal information Definitions Disclaimers... 9 Trademarks Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. NXP B.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 31 October 2013 Document identifier:
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