STMicroelectronics Payment Solutions

Transcription

1 STMicroelectronics Payment Solutions December 3rd 2013 Marie-France Florentin

2 MMS Group Memories Secure Microcontrollers Serial EEPROM RF memories #1 WW Supplier Personal and Embedded Security Secure Hardware platforms and Turnkey solutions GP Microcontrollers General Purpose 8-bit and 32-bit MCUs Automotive 8-bit MCUs Key Enablers State-of-the-art embedded NVM technology Advanced 8 & 32-bit CPU platforms System & Security expertise Market leadership in key products Supporting our target markets SmartGrid / Industrial Healthcare Appliances Consumer Security 2

3 Our Growth Drivers MEMS and Sensors Smart Power Automotive Application Processors Microcontrollers and Digital Consumer Targeting areas where ST leads or will lead 3

4 Growth Driver: Microcontrollers MEMS and Sensors ST #4 Microcontrollers Smart Power Automotive Player in 2012* Application Processors Microcontrollers and Digital Consumer Targeting areas where ST leads or will lead *Excluding Automotive: IHS isuppli, March 2013; WSTS, February

5 2012 WW Ranking MCUs 1,800 1,600 1,400 1,200 1,000 US$M Secure #11 in 2007 #4 in 2012 Target # (*) without Automotive Source: IHS isuppli CLT August 14th 2013 General Purpose* ST Secure MCUs #3 in

6 32 bit MCUs > 500P/N Secure Microcontrollers Entry level 32-bit Cortex SC000 ST31 Low cost & low power Contactless market 32-bit High performance Cortex SC300 ST33 High security, high computing power Secure Element Based on M Family General Purpose Microcontrollers Entry level 32-bit Cortex - M0 STM32 F0 STM32 L0 32-bit Cortex - M3 STM32 F1, F2 STM32 L1 32-bit Cortex - M4 STM32 F3,F4 STM32 L4 32-bit Cortex M7 STM32 F5 Low cost, low power focus (L0) Address 8 & 16bit market Mainstream, broadest portfolio Address very large range of applications High computing power including DSP capabilities Sensor Hub, Smart watch Leading Edge computing power and Digital signal processing Industrial market High performance 6

7 Microcontrollers- ST key assets Advanced e-nvm technology road map e-flash 80nm (mass production) e-eeprom 90nm (mass production) CPU architecture 8 bit ST 32 bit ARM Cortex M Wireless connectivity Multi standard 2.4GHz RF solutions : Zigbee, BTLE, WiFi direct Multi standard 13.56MHz RF solutions : ISO (A,B,F), NFC Added Values Advanced analog and ultra low power capabilities for GP MCUs Advanced security and turn key solution capabilities (HW+SW) for Secure MCUs 7

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9 Secure MCUs Perimeter Banking Market Pay TV Personal Security Identity Transport Mobile NFC / SIM & M2M Embedded Security Computer Consumer Security Enablers envm Technology Advanced security Contactless performance Software & Turn-key solutions 9

10 Secure MCUs Growth Drivers Market growth driven by mobility, contactless convenience and an increasing need for security & authentication in the digital world (consumer, ) Personal Security Payment Solutions Embedded Security 10

11 ST Payment Solutions Card Payment Mobile Payment NFC Controller Contact cards Contactless Cards SWP SIM Embedded SE 11

12 NFC & Mobile Payment ST s Secure Elements and NFC solutions to enable secure applications in Mobile Devices With leadership position in NFC-SIM and e-se ST is the ideal partner For OEMs and Card Vendors 12

13 Mobile Payment Market Trend WW TAM Munits Embedded Secure Element (e-se) 1800 Strong Relation to OEM Handset manufacturers Large market segment over medium/long term Key driver for NFC Payment Applications 1600 SWP-SIM 1400 Massive migration started in 2012 Deployment started in all regions Key Driver for NFC Payment Applications Connectivity Combo 600 Controller integrating all short-range connectivity (WiFi, Bluetooth, NFC) It will gain significant share only in long/medium term Standalone NFC Controller ST estimation based on: - Eurosmart NFC Ctrl Connectivity Combo SWP-SIM Embedded SE 2017 Source: Eurosmart, ABI, Eurosmart, ST Internal 2013 Massive deployment started SPA -The Nilson report Will still represent majority of NFC controllers shipment the next 2 years 13

14 Mobile Payment NFC RF controllers Source : ABI Q313 NFC is now deployed in most of high-end smartphones 2013 shipments > 250Mu (mainly Android) 2014 shipments > 400Mu Secure Elements Source : Eurosmart 2013 Secure NFC devices include NFC enabled UICCs, embedded SE and other form factors of NFC enabled SE. Volume shipments: > 200Mu in 2013 > 400Mu expected in 2014 OEMs Mobile Network Operators OEMs & Google NFC controller deployment Secure SWPSIM deployment Embedded Secure Element NFC drives massive deployment of NFC controllers, Secure SIM and Embedded Secure Elements, all co-existing into a smartphone 14

15 ST in Mobile Payment NFC in Mobile Handsets Embedded Secure Element Host Controller Host NFC Middleware NFC usd NFC CTRL NFC Controller SWP SIM 15

16 ST Solutions for Mobile Payment NFC SIM ST33 family, in mass production MIFARE enabled Secure NFC usd ST33 family, in mass production usd and custom packaging Embedded Secure Element ST33 family, in mass production Secure Java OS, EMVco & GP2.2 certified MIFARE enabled NFC Controller ST21NFC, in mass production Android & WIN8 compatible Integrated SE/NFC ST21NFC + ST33 + Secure Java OS = ST54 Android & WIN8 compatible Stacked solution, Effective footprint optimization MIFARE is trademark of NXP Semiconductors 16

17 ST Solutions for Mobile Payment ST33: Most advanced SIM and Embedded Secure Element for mobile NFC applications ST54: Turnkey NFC Controller & Secure Element incl. the latest JAVA Card OS in a cost efficient SiP Global leadership on Secure Elements SWP SIMs Establish STMicroelectronics as a Leading Secure Element Vendor Both secure microcontroller categories are also benefiting from the acceleration in NFC deployments that we have detected, although the ramp up in NFC SIMs is greater, with it now expected to account for approximately 40% of secure elements in 2012 and STMicroelectronics, however, is the standout winner, with faster development of NFC SIMs occurring. ABI Research estimates that it will achieve SWP SIM secure element market share in the region of 2-3 times that of its nearest competitor. 17

18 ST IC s for Secure Element ST33 3rd Gen ST33 1st Gen FLASH 90nm ARM SC MBytes, 90nm EMVCo, CC EAL5+ ARM SC300 Ultra advanced lithography Larger Flash size ST33 2nd Gen FLASH 80nm ARM SC MB and 768KB Enhanced performances, security & footprint In development stage Fully qualified Mass production now MIFARE Massively deployed Leadership position MIFARE MIFARE is trademark of NXP Semiconductors

19 ST leader in Secure Elements Mobile Payment SWP SIM Embedded Secure Element ST leading position with SWP-SIM market share >> 50% in 2012 & 2013 Leadership position on SIM in all regions where NFC is deployed ST leading position on high-end e-se market, share >> 50% in Reference : LG Nexus 4, Samsung Nexus 10, Samsung Galaxy Note 3, Samsung Galaxy S4 19

20 Card Payment Secure ICs ST s Secure ICs enable convenient and secure card payment solutions With strong security know-how and 20-year experience in banking, ST offers a unique range of contact and contactless ICs 20

21 Card Payment IC s market trend Munits 3,000 2,500 Contact Contactless / Dual Contactless Payment 2,000 Massive migration in China : 250Mu in 2013 Europe progressive switch to contactless 1,500 1,000 EMV contact Continuous mag stripe to chip card migration SDA to DDA migration Source : ABI May

22 Major banking chip card migrations Massive migration from mag stripe to dual interface chip cards : 250Mu in 2013 ; 500Mu/y by 2015 PBOC specification (non EMV) Migration still limited to few million units in 2013 ; 300Mu/y planned by 2015 Technical specification not frozen : on-line vs. off-line, contact vs. dual interface Migration from mag stripe to EMV cards to take place in next 3 years Penjab National Bank tender (Dual Interface EMV cards) on hold Rupay local specification defined 22

23 ST IC s for Card Payment 2013 ST31G / H 2012 ST31Z 2012 EEPROM 90nm NVM : KB ISO 7816 ISO Type A/B EMVCo, CC EAL5+ ST23Y ST23Z EEPROM 90nm NVM : 4 48 KB ISO 7816 ISO Type A/B EMVCo, CC EAL5+/6+ Proven ST23 CPU FLASH 80nm NVM : KB ISO 7816 ISO Type A/B ISO passive EMVCo, CC EAL6+ MIFARE is trademark of NXP Semiconductors ST31- ARM SC000 CPU High speed contactless Multi-RF protocols MIFARE ST31- ARM SC000 CPU Flash flexibility High speed contactless Multi-RF protocols MIFARE 23

24 New ST31 Advanced Contactless platform ST23 platform ST31 platform 90nm ROM/EE 90nm ROM/EE 80nm FLASH ISO Type A & B ISO Type A & B VHBR up to 3.4Mb/sec ISO Type A & B VHBR up to 3.4Mb/sec ISO passive First ARM 32-bit SC000 based Secure MCU Transaction speed Multi-protocol ISO A & B, Interoperability passive MIFARE and Calypso enabled Multi-application Transport Flash 80nm technology Supply chain flexibility Highly secure CC EAL6+ architecture Security 24

25 ST leader in IC s for Card Payment Card Payment Contact cards Contactless cards ST banking market share 2012 > 15% (ST estimates in volume) Strong position in Latin America, Western Europe and Asia More than 1 B. units Smartcard ICs shipped for Banking cards 25

26 Summary ST solid leader in Secure Payment solutions Above 15% market share in IC s for Card Payment Above 50% market share in Secure Elements SWP-SIM ICs + ese Solid experience and broad range contactless offer RF multi-protocol ISO Type A, B and F NFC Controller for Smartphones MIFARE libraries for contactless Transport Leader in Security First to achieve Common Criteria EAL6+ Support certified cryptography library 26