SHOEI CHEMICAL INC. Fine Powders and Thick Film Materials

Transcription

1 SHOEI CHEMICAL INC. Fine Powders and Thick Film Materials

2 INDEX Fine Powders Precious Metal Fine Powders Base Metal Conductive Compositions Silver, Platinum, Ruthenium(IV) Oxide Palladium, Silver/Palladium (Coprecipitated and Alloy) Nickel, Copper Silver Compositions (Fired-on type) Silver Compositions (Heat curing type) Gold Compositions Silver/Platinum Compositions Silver/Palladium Compositions Palladium Compositions Platinum Compositions Copper Compositions (For Nitrogen firable) Copper Compositions (Heat curing type) Nickel Compositions (For H2-N2 firable) Dielectric Compositions Resistive Compositions 7,8

3 Materials 1. Fine Powders Precious Metal Product No. Content Shape Surface Area Tap Density 3.3 /g g/ ; Highly Crystalline ; Highly Crystalline ; Highly Crystalline ; Highly Crystalline Bi2O3-C Bi2O3 1.8 Pd-209 Pd Pd-21A Pd Pd-222 Pd 0.9. Pd-22 Pd Pd-10A Pd 3.9 Pd-1A Pd 3.9 Pd-20A Pd Pd-30A Pd Pd-70A Pd 2.0. Pd-710 Pd Pd-720 Pd Pd-730 Pd 3. Pd-770 Pd.0 SEM PHOTO Pd-21A Pd-22 Pt-01 Ru-109G Pt RuO Pd-730 2

4 2. Fine Powders Base Metal Product No. Content Shape Surface Area Tap Density Ni-83 Ni.7 /g 2. g/ Ni-70 Ni Ni-0 Ni Ni-0 Ni Cu-0 Glass-Cu 3.2 Cu-10 Cu Glass-coated Copper Powder SEM PHOTO TEM PHOTO 3

5 3. Conductive Compositions 3-1 Silver Compositions Fired-on type H-100 Varistors Brushing, Spraying 700 Good spray printability; good bondability with materials resistant to SnO2 H-210 For TC; good shape; good platability H-2109 Good platability & adhesion H-2117H -700 Good platability & adhesion H Advantage in cost; good adhesion H For low firable ceramics, good platability H-293 Overcoat Correction for -700 Use for overcoat; improved soldering, simultaneous firing possible H-29H -800 For HiK and TC; good platability; good bending strength H-29N For HiK and TC; good platability; good adhesion H-2997 For HiK F; good shape; good platability H-00A Display Devices, PZT, Ceramic Capacitors Applicable to large substrates; good line resolution H-207 CR 1st Conductors Compatible with resistors; good line resolution H-209 Resonators Good line resolution; good printability, Pd-free design H-21 Pb free; good adhesion; good line resolution H-10 PZT Buzzers, PZT Filters 700 For general PZT products; good adhesion strength H-3 PZT, Ceramic Capacitors For thin ceramic substrates H- CR 1st Conductors Compatible with resistors; good line resolution H-722 PZT Buzzers 700 Platability; good solderability H-77 Ceramic Capacitors 800 High-pressure; good solder leach resistance H-98 Ceramic Capacitors, PZT, Resonators General for various ceramics; suitable for thicker prints; good resistance to soldering heat H-993 Resonators Good solder leach resistance; excellent Q characteristics H-997 Good adhesion; good line resolution; applicable to enamel substrates ML-019 Inner Electrodes for Chip Inductors Low Rdc; good line resolution; dielectric system ML-019L Inner Electrodes for Chip Inductors Low Rdc; thin print; dielectric system ML-038L Inner Electrodes for Chip Inductors Low Rdc; good line resolution; dielectric system ML-02 Inner Electrodes for Chip Inductors Slow sintering; dielectric system 3-2 Silver Compositions Heat curing type Product No. Application Printing Method Curing Conditions Resistivity Ω Key Features N-207A Printed Wiring Boards 10, 30min < Low cost, low resistance, phenol N-71 Polarizer for PZT 100, 10min < Removable after polarization 3-3 Gold Compositions Au-0A Good die bondability; good semiconductivity Au-0 Good die bondability; good line resolution

6 3- Silver/Platinum Compositions D-022, Variable Resistors Good adhesion; good solderability 3- Silver/Palladium Compositions D Good adhesion; for solder reflow D-28 Termination for Chip Inductors 0 Good platability; good contact with inner electrodes D-302, Variable Resistors Good compatibility with various resistors D-3, Resistor Networks Good solder leach resistance and good silver migration moisture resistance D-397N Resistor Networks Good compatibility with various resistors; less stain phenomenon D-3 Excellent resistance to soldering heat, good printability, Pd-free design D-37 1st conductor for CR Good compatibility with various resistors; good platability; low cost D-38 1st conductor for CR Good solder leach resistance; lowcost; Pd-free design D-97 Chip Array Resistors Good through-hole coverage; low cost D-9K Chip Array Resistors Good through-hole, prevention of diffusion of for low cost D-70, Variable Resistors, Resistor Networks Good aged adhesion; good line resolution; fast firable; low cost ML-3901 MLCV Inner Electrode Little reaction with ceramics; high reliability; low cost ML-3907 MLCV Inner Electrode Little reaction with ceramics; high reliability; low cost ML-393N For HiK with PVB sheets; small oxidation expansion ML For TC and HiK with PVB sheets; small oxidation expansion ML For HiK with PVB sheets; small oxidation expansion ML Little reaction with ceramics; low cost ML-3srs MLCV Inner Electrode Designed to custom specifications 3- Palladium Compositions ML Applicable to PVA and PVB sheets ML-3700srs Designed to custom specifications 3-7 Platinum Compositions ML-3822 Varistors & PZT Transducers Inner Electrode Little reaction with ceramics; for PVB sheets; high reliability

7 3-8 Copper Compositions For Nitrogen firable SC-00 Anti-surge resistors Good solder leach resistance; good line resolution C-110H Good contact with nickel inner electrode; good bending strength C-118 Good contact with nickel inner electrodes C Good shape; Prevent solder spattering C Good shape; Prevent solder spattering C-000srs Designed to custom specification 3-9 Copper Compositions Dried-on type Product No. Application Printing Method Curing Conditions Key Features C-100srs Jumper Wire 180, 30min Designed to custom specifications 3-10 Nickel Compositions For H2-N2 firable ML For B characteristic; applicable for high stacking ML For B/F characteristic, applicable for high stacking ML For temperature compensation ML-0srs Design customized product with various Ni powders. Dielectric Compositions Product No. Application Printing Method Firing Temp. Color Key Features G-177 Overcoat 20 Green Easy to laser trim; good moisture protection G-20 Display Devices 0 Black For thicker print; good print resolution G-231L 2nd overcoat for CR Black Good resistance to plating solution; less resistivity change G-238 1st overcoat for CR Green Easy to laser trim; good line resolution G-28T 1st overcoat for CR Green Easy to laser trim G-270G 1st overcoat for CR Green Easy to laser trim G-27 2nd overcoat for CR Auburn Improved withstand voltage characteristics, various colors available

8 . Resistive Compositions Printing Method : Series R-2000 R-2000L R-0N Application CR R Networks CR R Networks R Networks Firing TCR ppm/ <±0 <±100 <±100 Key Feature High reliability, current noise Low TCR High reliability & Low TCR High reliability, fast firing, ESD 0.1 R-2001 R-2001L # R-2010 R-2010L # R-200 R-200L.0 10 R-2110 R-2110L R-9110NC Resistivity R-210 R-2210 R-9210NC Ω 00 1k R-2310 R-9310N k 10k R-210 R-910N 0k 100k R-210 R-910N 00k 1M R-210 R-910N 10M R-2710 R-9710N 0M R-270 Resistor W L mm # Remarks TCR <±30 <±10 <±200 <±100 D /0.Pd D-9K 98/2Pd D-3 73/27Pd Recommended Conductors H- D /0.Pd H- D /0.Pd D-70 8/1Pd D /1Pt 7

9 . Resistive Compositions Printing Method : Series R-0A R-000 Application Variable resistors, potentiometers Potentiometers Firing TCR ppm/ <±100 <±100 Key Feature High reliability for stainless wipers Palladium-silver multi-wiper R-9010A R-900A R-9110AC R-9210A R-010 # R-00 ## R-110 R-210 Resistivity 1k 10k 100k R-9310A R-910A R-910A R-310 R-10 R-10 Ω 300k 1M R-910A 3M 10M Resistor W L mm 1 2 TCR: Remarks TCR Recommended Conductors D /30Pd D-70 8/1Pd D-91 98/2Pd D /1Pt D-70 8/1Pd # Ω ## 7Ω Product No. Application Resistivity Firing Temp. Key Features SR-700 Anti-surge resistors 0-0mΩ/ Nitrogen firable; TCR<±100ppm/ 8