DATA SHEET CHIP RESISTORS Mounting. Product Specification Nov 26, 2004 V.4

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1 \ DATA SHEET CHIP RESISTORS Product Specification

2 MOUNTING Due to their rectangular shape and small dimensional tolerances, Surface Mounted Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printedcircuit boards (PCBs). Electrical connection to the circuit is by wave, vapour phase or infrared soldering. The end terminations guarantee a reliable contact and the protective coating enables face down mounting. The laws of heat conduction, convection and radiation determine the temperature rise in a resistor owing to power dissipation. The maximum body temperature usually occurs in the middle of the resistor and is called the hot-spot temperature. The hot-spot temperature depends on the ambient temperature and the dissipated power. This is described in the data sheets under the chapter heading Functional description. The hot-spot temperature is important for mounting because the connections to the chip resistors will reach a temperature close to the hot-spot temperature. Heat conducted by the connections must not reach the melting point of the solder at the The laws of heat conduction, convection and radiation determine the temperature rise in a resistor due to power dissipation. joints. Therefore a maximum solder joint temperature of 11 C is advised. The ambient temperature on large or very dense printed-circuit boards (PCBs) is influenced by the dissipated power. The ambient temperature will again influence the hot-spot temperature. Therefore, the packing density that is allowed on the PCB is influenced by the dissipated power. EXAMPLE OF MOUNTING EFFECTS Assume that the maximum temperature of a PCB is 95 C and the ambient temperature is C. In this case the maximum temperature rise that may be allowed is 45 C. In the graph (see Fig.1), this point is found by drawing the line from point A (PCB = 95 C) to point B (T amb = C) and from here to the left axis. To find the maximum packing density, this horizontal line is extended until it intersects with the curve,.125 W (point C). The maximum packing density, 19 units/ mm2 (point D), is found on the horizontal axis 2 handbook, full pagewidth.25 W.125 W MBC739 T (K).625 W ( o C) 1 C D mounting density (units/x mm 2 ) B A ( o C) PCB temperature (normally around oc) ambient temperature Fig. 1 PCB temperature as a function of applied power, mounting density and ambient temperature

3 3 THERMAL RESISTANCE (R th ) Thermal resistance prohibits the release of heat generated within the resistor to the surrounding environment. It is expressed in K/W and defines the surface temperature (T HS ) of the resistor in relation to the ambient temperature (T amb ) and the load (P) of the resistor, as follows: handbook, halfpage phenolic paper R th (K/W) 2 MGA25 T HS = T amb + P R th Due to their direct contact with the solder spot, chip resistors dissipate over 5% of their heat via conduction to the solder spot and hence to the PCB. Thus the PCB on which the chip resistor is mounted functions as a heat sink. Different PCBs have different heat conductance. Figure 2 shows the different values of heat resistance per material type. Substrates with a higher heat conductance give lower thermal resistance figures; substrates with a lower heat conductance give higher thermal resistance figures. It should be noted that the temperature of the terminations of the chip resistor is virtually the same as the hotspot temperature. Therefore the power that may be dissipated by the resistor is dependent on: T amb (which is also dependent on the packing density) R th of the PCB maximum solder spot temperature (generally 11 C). Fig. 2 T (K) epoxy DIN44 96% alumina 1 5 resistor 5 1 d (mm) Heat resistance for 126 sized resistors as a function of distance and material (1) (2) (3) (4) SCR P (W) (1) For size 42: Rth = K/W; (2) For size 63: Rth = 4 K/W (3) For size 5: Rth = 2 K/W; (4) For size 126: Rth = 2 K/W (5) For size 121: Rth = 125 K/W; (6) For size 121: Rth = K/W (7) For size 21: Rth = K/W; () For size 2512: Rth = K/W (5) (7) (6) & () Fig. 3 Hot-spot temperature rise ( T) as a function of dissipated power

4 4 FOOTPRINT DIMENSIONS SINGLE RESISTOR CHIPS C B A D preferred direction during wave soldering solder land / solder paste pattern SCR22 Fig. 4 Single resistor chips recommended dimensions of footprints Table 1 Reflow soldering footprint dimensions for relevant chip resistors size; see Fig. 4 PRODUCT SIZE FOOTPRINT DIMENSIONS Unit: mm CODE A B C D Placement accuracy To be decided ± ± ± ± ± ± ± ±.25 Table 2 Wave soldering footprint dimensions for relevant chip resistors size; see Fig. 4 PRODUCT SIZE FOOTPRINT DIMENSIONS Unit: mm CODE A B C D Placement accuracy ± ± ± ± ± ± ±.25

5 5 RESISTOR ARRAYS, NETWORK AND RF ATTENUATORS B P F A SCR23 solder land / solder paste pattern Fig. 5 Resistor arrays and network recommended dimensions of footprints Table 3 Reflow soldering footprint dimensions for relevant chip resistors size; see Fig. 5 PRODUCT SIZE CODE TYPE FOOTPRINT DIMENSIONS Unit: mm A B F P 44 ATV321. ±.1.42 ±.5 1. ±.2.65 ± (4P2R) YC122. ±.1.3 ±.5 1. ±.2.67 ± (P4R) YC124. ±.1.3 ±.5 1. ±.2. ± (P4R) YC/TC164. ±.1.45 ± ±.2. ± (P4R) YC ±.1.71 ± ± ± (16PR) YC24. ±.1.3 ±.5 1. ±.2. ± (1PR) YC15. ±.1.35 ± ±.2.64 ± (1PR) YC ±.1.9 ± ± ±.5

6 6 SOLDERING CONDITIONS The lead free Surface Mount Resistors are able to stand the reflow soldering conditions as below: Temperature: above 22 C Endurance: 95 to 12 seconds Cycles: 3 times The test of "soldering heat resistance" is carried out in accordance with the schedule of MIL-STD-22G-method 21F, "The robust construction of chip resistors allows them to be completely immersed in a solder bath of 26 C for 1 seconds". Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 245 C during 2 seconds. The test condition for no leaching is 26 C for 3 seconds. Typical examples of soldering processes that provide reliable joints without any damage, the recommended soldering profiles referring to "IEC " are given in Figs 6, 7 and. Typical values (solid line) Process limits (dotted lines) 2 T ( C) 2 24 C 23 C 215 C SCR24 16 C C 13 C 1 C 6 s ramp up rate < 3 K/s ramp down rate < 6 K/s ramp up rate < 3 K/s typical Preheating 2 2 t (s) Fig. 6 Infrared soldering, forced air convection reflow soldering-temperature/time profile for SnPb solders

7 7 Typical values (solid line) Process limits (dotted lines) 3 SCR25 T ( C) C 245 C 2 19 C 235 C 217 C 1 C 6 s ramp up rate < 3 K/s ramp down rate < 6 K/s typical ramp up rate < 3 K/s Preheating 2 2 t (s) Fig. 7 Infrared soldering, forced air convection reflow soldering-temperature/time profile for SnAgCu solders Typical values (solid line) Process limits (dotted lines) The resistors may be soldered twice in accordance with this method if desired 3 1 s SCR26 T ( C) 2 2 SnAgCu: 2 C to 26 C SnPb: 235 C to 26 C first wave second wave T < K ramp down rate 5 K/s 13 C 12 C C ramp down rate ramp down rate 3.5 K/s 2 K/s ramp up rate < 2 K/s typical Preheating Cooling 2 t (s) 2 Fig. Double wave soldering for SnPb and leadfree SnAgCu solder temperature/time profile (terminal temperature)

8 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 4 Nov 26, Converted to Yageo / Phycomp brand - Expanded sizes from 21 to 2512 on the profile of Hot-spot temperature rise ( T) as a function of dissipated power - Footprint dimensions updated - Profiles of infrared and double wave soldering amended Version 3 Jul 25, Updated company logo Version 2 May 3, Converted to Phycomp brand