3216 Ceramic Chip Antenna for Bluetooth/WLAN Application
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1 ANTENNA PRODUCTS Mars Liu C.T.Lee Page 1 sheet A4
2 for Bluetooth/WLAN Application Preliminary Product Specification Quick Reference Data Centre Frequency Bandwidth VSWR Polarization Azimuth Beamwidth Peak Gain Impedance Operating Temperature Termination Resistance to soldering heats Maximum Power 2.45 GHz*¹ at least 100 MHz*² 2.5 (Max.)*² Linear Omni-directional 3.1 dbi*² 50Ω -25~85 o C Ni / Sn (Environmentally-Friendly Leadless) 260, 10sec. 1W 1 All the technical data and information contained herein are subject to change without prior notice 2 Testing under evaluation board of page2 Mars Liu C.T.Lee Page 2 sheet A4
3 1. Mechanical Data (3.2 x 1.6 x 1.2 mm³) Unit: mm 2. Evaluation Board Dimension and Outlook Unit: mm Mars Liu C.T.Lee Page 3 sheet A4
4 3. Soldering Pads Dimension Unit: mm 4. Return Loss Mars Liu C.T.Lee Page 4 sheet A4
5 5. VSWR Mars Liu C.T.Lee Page 5 sheet A4
6 6. The Definition of X-Y-Z Plane and Angle Mars Liu C.T.Lee Page 6 sheet A4
7 7. The Environment of Antenna Radiation Pattern Anechoic Chamber Dimension=8(m) 4(m) 4(m) Mars Liu C.T.Lee Page 7 sheet A4
8 8. Radiation Pattern 2450 MHz Mars Liu C.T.Lee Page 8 sheet A4
9 IEC / CECC CLAUSE IEC TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 Mounting The antenna can be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 Visual inspection and dimension check Any applicable method using 10 magnification Antenna Central Frequency at 20 o C 4.8 Adhesion A force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate 4.9 Bond strength of Mounted in accordance with plating on end face CECC , paragraph 4.4 No visible damage In accordance with specification (chip off 4mm) Standard test board in page 4 No visible damage No visible damage Conditions: bending 0.5 mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length No visible damage (Tb) Resistance to soldering heat Resistance to leaching 260 ± 5 C for 10 ± 0.5 s in a static solder bath 260 ± 5 C for 30 ± 1 s in a static solder bath The terminations shall be well tinned after recovery and Central Freq. Change ± 6% Using visual enlargement of 10, dissolution of the termination shall not exceed 10% Mars Liu C.T.Lee Page 9 sheet A4
10 IEC / CECC CLAUSE IEC TEST METHOD TEST PROCEDURE REQUIREMENTS (Ta) Solderability Zero hour test, and test after storage (20 to 24 months) in original atmosphere; unmounted chips completely immersed for 2 ± 0.5 s in 235 ± 5 C (Na) Rapid change of temperature -25 C (30 minutes) to +85 C (30 minutes); 100 cycles (Ca) Damp heat 500 ± 12 hours at 60 C; 90 to 95 % RH The termination must be well tinned, at least 75% is well tinned at termination No visible damage Central Freq. Change ± 6% No visible damage 2 hours recovery Central Freq. Change ± 6% 4.15 Endurance 500 ± 12 hours at 85 C; No visible damage 2 hours recovery Central Freq. Change ± 6% Mars Liu C.T.Lee Page 10 sheet A4
11 Ordering Information The antennas may be ordered by using the Yageo ordering code. These code numbers can be determined by the following rules: CAN K CAN = Yageo Part No. for Antenna Family Code 43 = Antenna Packing Type Code 11 = 180 mm/ 7" reel, blister taping Materials Code 7 = High Frequency Material Size Code 11 = 3.2 * = 3.2 * = 2.5 * = 2.0 * = 1.6 * 0.8 Tolerance 00 = at least 200 MHz Impedance Bandwidth Working Frequency 245 = 2.45 GHz Packing Type Code 3K = 3000 pcs for tape (Clear Text Code Example) CAN K Product Pacing tape Material Code Size Tolerance Working Packing code frequency CAN= Ceramic Antenna 11 = 180 mm/ 7" blister 7= High frequency material 3.2*1.6 mm 245 = 2.45GHz 3= 3 Kpcs At least 200MHz Impendence Bandwidth K=7" plastic F =13" plastic B = Bulk Mars Liu C.T.Lee Page 11 sheet A4
12 Taping Blister Tape DIMENSION: Serial no Checking note Index Spec(mm) 1 Sprocket hole Do 1.50± Pocket hole D1 1.0± Distance sprocket hole/sprocket hole Po 4.0± Distance pocket/pocket P1 4.0± Distance sprocket hole/pocket P2 2.0± Tape width W 12.0± Distance sprocket hole/outside E 1.75± Distance sprocket hole/pocket F 5.50± Pocket length Ao 1.47± Pocket length Bo 3.4± Pocket depth Ko 1.8± Thickness of tape T 0.279± x sprocket hole pitch 10Po 40.0±0.20 Mars Liu C.T.Lee Page 12 sheet A4
13 7 (180mm) Reel Specifications TAPE WEITH A N C W 1 W 2 MAX. (mm) (mm) (mm) (mm) (mm) (mm) ± / / Revision Control: Revision Date Content Remark 4 th, April, 2005 New Issued Mars Liu C.T.Lee Page 13 sheet A4
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