NAN YA PCB PRINTING INK

Transcription

1 United States Patent NO ISO 9001 BSMI Registered by Standars Metrology and Inspection, Ministry of Economic Affairs, Taiwan, R.O.C. NAN YA PCB PRINTING INK Liquid Photoimageable Solder Mask LP-4G NAN YA PLASTICS CORPORATION ELECTRO MATERIALS DIV. 201, TUN HWA N. ROAD, TAIPEI, TAIWAN R.O.C TEL: ext FAX:

2 Catologue Item Color Index Page 1 LP-4G Y-10 Golden Yellow Y-1 1~2 2 LP-4G B-50 Blue B-1 3~4 3 LP-4G N-90 Colorless Transparency N-1 5~6 4 LP-4G R-36 Red R-1 7~8 5 LP-4G G-20 Light Green G-1 9~10 6 LP-4G G-25 Green G-3 11~12 7 LP-4G K-60 Black K-1 13~14 8 LP-4G K-65 Deep Black K-2 15~16 9 LP-4G P-70 Pink P-1 17~18 10 LP-4G G-22 Light Green G-8 19~20 11 LP-4G W-80 White W-1 21~22 12 LP-4G G-28 Deep Green G-4 23~24 13 LP-4G P-72 Orange P-2 25~26 14 LP-4G P-75 Purple P-3 27~28 1.Introduction: As the patern of printing circuit boards has been coming finer, conventional solder mask cannot satisfy the customer demands any long. On the other hand solvent developable solder mask also has an enviromental polution problem due to developing solvents. Alkaline developable solder mask has been longed for its appearance by customers. To meet the market demands,nan Ya Plastic Co. has developed a high performance alkaline developable liquid photoimaginable solder mask LP-4G. 2.Characteristics: A. Wider working window for pre-bake. B. Excellent handling properties due to sufficient tack-free after pre-bake. C. High developing resolution, suit for fine solder dam. D. Special solvent selected, meet low odor, low toxicity requirement.

3 Description Using method Liquid Photoimageable Solder Mask Item LP-4G Y-10 Color Golden Yellow Y-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (1) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (2) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 1

4 Item LP-4G Y Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 2

5 Description Using method Liquid Photoimageable Solder Mask Item LP-4G B-50 Color Blue B-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (3) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (4) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 3

6 Item LP-4G B Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 4

7 Description Using method Liquid Photoimageable Solder Mask Item LP-4G N-90 Color Colorless Transparency N-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (5) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (6) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 5

8 Item LP-4G N Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 6

9 Description Using method Liquid Photoimageable Solder Mask Item LP-4G R-36 Color Red R-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (7) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (8) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 7

10 Item LP-4G R Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 8

11 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-20 Color Light Green G-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (9) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (10) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 9

12 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 10

13 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-25 Color Green G-3 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (11) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (12) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 11

14 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 12

15 Description Using method Liquid Photoimageable Solder Mask Item LP-4G K-60 Color Black K-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (13) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (14) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 13

16 Item LP-4G K Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 14

17 Description Using method Liquid Photoimageable Solder Mask Item LP-4G K-65 Color Deep Black K-2 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (15) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (16) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 15

18 Item LP-4G K Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade could be gained more great undercut on normal process condition because of dark color, no suggestion using for PCB of SMD higher required. 2.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 3.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 4. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 16

19 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-70 Color Pink P-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (17) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (18) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 17

20 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 18

21 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-22 Color Light Green G-8 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (19) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (20) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature. Exposure Holding Developing Post-cure mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Others: 155 /60 80 minutes 19

22 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 5H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times Physical & Electrical Properties 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade is not suitable using for PCB of hole-plugging required. 2.This grade is suitable using specially for Ni/Au plating boards. 3.In assembly stage, could be resist flux of powreful attacking. 4.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 5.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 6. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 20

23 Description Using method Liquid Photoimageable Solder Mask Item LP-4G W-80 Color White W-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (21) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (22) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature. Exposure Holding Developing Post-cure mj/cm 2 (on solder mask) 21 step sensitivity: step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Others: 155 /60 80 minutes 21

24 Item LP-4G W Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 5H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade could be gained more great undercut on normal process condition because of good cover, no suggestion using for PCB of SMD higher required (solder Dam 6mil min.). 2.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 3.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 4. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 22

25 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-28 Color Deep Green G-4 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (23) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (24) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 23

26 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 24

27 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-72 Color Orange P-2 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (25) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (26) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 25

28 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 26

29 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-75 Color Purple P-3 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (27) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (28) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 27

30 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 28