NAN YA PCB PRINTING INK

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "NAN YA PCB PRINTING INK"

Transcription

1 United States Patent NO ISO 9001 BSMI Registered by Standars Metrology and Inspection, Ministry of Economic Affairs, Taiwan, R.O.C. NAN YA PCB PRINTING INK Liquid Photoimageable Solder Mask LP-4G NAN YA PLASTICS CORPORATION ELECTRO MATERIALS DIV. 201, TUN HWA N. ROAD, TAIPEI, TAIWAN R.O.C TEL: ext FAX:

2 Catologue Item Color Index Page 1 LP-4G Y-10 Golden Yellow Y-1 1~2 2 LP-4G B-50 Blue B-1 3~4 3 LP-4G N-90 Colorless Transparency N-1 5~6 4 LP-4G R-36 Red R-1 7~8 5 LP-4G G-20 Light Green G-1 9~10 6 LP-4G G-25 Green G-3 11~12 7 LP-4G K-60 Black K-1 13~14 8 LP-4G K-65 Deep Black K-2 15~16 9 LP-4G P-70 Pink P-1 17~18 10 LP-4G G-22 Light Green G-8 19~20 11 LP-4G W-80 White W-1 21~22 12 LP-4G G-28 Deep Green G-4 23~24 13 LP-4G P-72 Orange P-2 25~26 14 LP-4G P-75 Purple P-3 27~28 1.Introduction: As the patern of printing circuit boards has been coming finer, conventional solder mask cannot satisfy the customer demands any long. On the other hand solvent developable solder mask also has an enviromental polution problem due to developing solvents. Alkaline developable solder mask has been longed for its appearance by customers. To meet the market demands,nan Ya Plastic Co. has developed a high performance alkaline developable liquid photoimaginable solder mask LP-4G. 2.Characteristics: A. Wider working window for pre-bake. B. Excellent handling properties due to sufficient tack-free after pre-bake. C. High developing resolution, suit for fine solder dam. D. Special solvent selected, meet low odor, low toxicity requirement.

3 Description Using method Liquid Photoimageable Solder Mask Item LP-4G Y-10 Color Golden Yellow Y-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (1) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (2) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 1

4 Item LP-4G Y Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 2

5 Description Using method Liquid Photoimageable Solder Mask Item LP-4G B-50 Color Blue B-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (3) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (4) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 3

6 Item LP-4G B Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 4

7 Description Using method Liquid Photoimageable Solder Mask Item LP-4G N-90 Color Colorless Transparency N-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (5) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (6) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 5

8 Item LP-4G N Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 6

9 Description Using method Liquid Photoimageable Solder Mask Item LP-4G R-36 Color Red R-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (7) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (8) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 7

10 Item LP-4G R Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 8

11 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-20 Color Light Green G-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (9) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (10) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 9

12 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 10

13 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-25 Color Green G-3 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (11) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (12) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 11

14 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 12

15 Description Using method Liquid Photoimageable Solder Mask Item LP-4G K-60 Color Black K-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (13) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (14) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 13

16 Item LP-4G K Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 14

17 Description Using method Liquid Photoimageable Solder Mask Item LP-4G K-65 Color Deep Black K-2 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (15) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (16) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 15

18 Item LP-4G K Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade could be gained more great undercut on normal process condition because of dark color, no suggestion using for PCB of SMD higher required. 2.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 3.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 4. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 16

19 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-70 Color Pink P-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (17) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (18) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 17

20 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 18

21 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-22 Color Light Green G-8 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (19) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (20) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature. Exposure Holding Developing Post-cure mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Others: 155 /60 80 minutes 19

22 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 5H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times Physical & Electrical Properties 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade is not suitable using for PCB of hole-plugging required. 2.This grade is suitable using specially for Ni/Au plating boards. 3.In assembly stage, could be resist flux of powreful attacking. 4.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 5.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 6. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 20

23 Description Using method Liquid Photoimageable Solder Mask Item LP-4G W-80 Color White W-1 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (21) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (22) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature. Exposure Holding Developing Post-cure mj/cm 2 (on solder mask) 21 step sensitivity: step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Others: 155 /60 80 minutes 21

24 Item LP-4G W Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 5H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.This grade could be gained more great undercut on normal process condition because of good cover, no suggestion using for PCB of SMD higher required (solder Dam 6mil min.). 2.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 3.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 4. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 22

25 Description Using method Liquid Photoimageable Solder Mask Item LP-4G G-28 Color Deep Green G-4 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (23) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (24) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 23

26 Item LP-4G G Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 24

27 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-72 Color Orange P-2 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (25) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (26) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 25

28 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 26

29 Description Using method Liquid Photoimageable Solder Mask Item LP-4G P-75 Color Purple P-3 Hardener HP-25D Mixing ratio 75/25 (Main agent/hardener) Solid content 74± 3% Viscosity (Main agent) ps (25±0.1,VT-04 viscometer) Pot life (after mixing) 24 hours (below 25 ) Shelf life (before mixing) 6 months (below 25 ) Pretreatment of circuit boards Diluting Printing Pre-heating Cooling Exposure Holding Developing Post-cure 1.Clean the boards with chemical or mechanical treatment, to avoid oil and oxide on boards. 2.Bake the copper surface of the boards after rinse with water. 1.Ensure ink thickness above 15µm after cured, no suggestion diluting. 2.If a low viscosity is required, ensure ink thickness after cured. Diluted with solvent BCS or DPM is possible, but should not exceed 3%. 3.Suitable viscosity for printing is 150~250 ps 1.A polyester filament fabricated screen at mesh is recommendable. 2.It is necessary to keep ink thickness above 15µm after cured, for ensure soldering resistibility. 3.The PC board is required by hole-plugging, suggestion of process like following: (27) 1st side (Co side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 40 50%. (28) Reverse side (So side): printing and hole-plugging are operated same time, hole-plugging filled ratio about 10 20%. 1st side: 70 /25 分 75 /20 minutes Reverse side: 70 /30 分 75 /25 minutes Both sides: 70 /50 分 75 /45 minutes Natural cooling to room temperature mj/cm 2 (on solder mask) 21 step sensitivity: 9 12 step Hold for above 10 minutes after exposure, and finish development in 24 hours. Developer: 1.0~1.2% Na 2 CO 3 (aq) Temperature of developer: 31~35 Pressure of sprayer: 2.0~3.0 kg/cm 2 Development time: 60~120 seconds Electroless Ni/Au plating board: 150 /50 70 minutes Hole-plugging solder board: (80 /30 minutes) + (115 /30 minutes) + (155 /60 80 minutes) Others: 155 /60 80 minutes 27

30 Item LP-4G P Adhesion 100/100 (JIS D-0202) 2. Pencil hardness 6H min. (JIS D-0202) 3. Hot air solder leveling resistance 260 / 10 seconds 3 times 4. Solder heat resistance 260 / 10 seconds 3 times 5. Acid resistance 30 minutes (10% H 2 SO 4(aq.), 20 ) Physical & Electrical Properties 6. Alkali resistance (before solder) 30 minutes (10% NaOH (aq.), 20 ) 7. Solvent resistance 30 minutes (Trichloroethane, 20 ) 8. Pressure cooker test 121 2atm, 5Hr 9. Boiling test 100, 5Hr 10. Dielectric strength 1000V DC/mil 11. Volume resistance Ω. cm 12. Surface resistance Ω 13. Dielectric loss factor (tanδ ) 14. Dielectric constant (ε ) (1MHz) 3.4 (1MHz) 15. Flammability UL 94V-0 (File No. E123174) Note 1.Solder mask product should be stored in a dark, well ventilated, temperature at 20~25. 2.Soldering have finished in 10 minutes after coated flux, to avoid flux attack copper foil exceedingly. 3. In assembly stage, the following facts will cause the solder mask fail, precious evaluation is necessary. (1) Ink thickness not enough (below 15µm). (2) Ink cured deficient. (3) To mask, different flux has different corrosion. (4)Flux concentration too high (solvent evaporate too much) or flux coated too much. Above process condition just for reference purpose is not for guarantee. 28

TAIYO PSR-4000 AUS703

TAIYO PSR-4000 AUS703 TAIYO PSR-4000 AUS703 LIQUID PHOTOIMAGEABLE SOLDER MASK Designed for Flip Chip Packaging Applications Halogen-Free (300ppm) Excellent Thermal and Crack Resistance Low Water Absorption RoHS Compliant Excellent

More information

TAIYO PSR-4000MP LIQUID PHOTOIMAGEABLE SOLDER MASK

TAIYO PSR-4000MP LIQUID PHOTOIMAGEABLE SOLDER MASK TAIYO PSR-4000MP LIQUID PHOTOIMAGEABLE SOLDER MASK Screen or Spray Application Dark Green, Matte Finish Excellent Solder Ball Resistance Resistance to No-Clean Flux Residue Wide Processing Window Fine

More information

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

江 苏 广 信 感 光 新 材 料 股 份 有 限 公 司. T: 86-20-22935367 F: 86-20-84559389 E: kuangshunexport2000@gmail.com. Catalogue

江 苏 广 信 感 光 新 材 料 股 份 有 限 公 司. T: 86-20-22935367 F: 86-20-84559389 E: kuangshunexport2000@gmail.com. Catalogue 江 苏 广 信 感 光 新 材 料 股 份 有 限 公 司 Jiangsu Kuangshun Photosensitivity New-Material Stock Co., Ltd T: 86-20-22935367 F: 86-20-84559389 E: kuangshunexport2000@gmail.com Catalogue Liquid photoimageable solder

More information

SCREEN PRINTING INSTRUCTIONS

SCREEN PRINTING INSTRUCTIONS SCREEN PRINTING INSTRUCTIONS For Photo-Imageable Solder Masks and Idents Type 5600 Two Part Solder Masks and Idents Mega Electronics Ltd., Mega House, Grip Industrial Estate, Linton, Cambridge, ENGLAND

More information

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004 How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production

More information

Technical Information

Technical Information Technical Information UK and Corporate Headquarters Norton Hill, Midsomer Norton, Bath, BA3 4RT, England Telephone: (44) 1761 414471 Fax: (44) 1761 416609. www.coates.com imagecuresmart XV501T-4 LDI SCREEN

More information

TECHNICAL DATASHEET. Ronascreen TM SPSR 5900 SP / HL-3

TECHNICAL DATASHEET. Ronascreen TM SPSR 5900 SP / HL-3 TECHNICAL DATASHEET Ronascreen TM SPSR 5900 SP / HL-3 Aqueous Developable PHOTOIMAGEABLE SOLDERMASK PRODUCT DESCRIPTION SPSR 5900 SP / HL-3 is a negative-working, photoimageable soldermask for the production

More information

ELPEMER SD 2463 FLEX-HF (adjustment VSD)

ELPEMER SD 2463 FLEX-HF (adjustment VSD) Lackwerke Peters GmbH + Co KG Hooghe Weg 13, D-47906 Kempen Internet: www.peters.de E-Mail: peters@peters.de Telefon (0 21 52) 20 09-0 Telefax (0 21 52) 20 09-70 Ein Unternehmen der PETERS-Gruppe LP 082310

More information

Polyimide labels for Printed Circuit Boards

Polyimide labels for Printed Circuit Boards Polyimide labels for Printed Circuit Boards The right match for any PCB labelling application Labels on Printed Circuit Boards Matching product performance with application needs Printed Circuit Boards

More information

CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS

CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using

More information

CHAMELEON THERMOCHROMIC UV FLEXO INK

CHAMELEON THERMOCHROMIC UV FLEXO INK LCR Hallcrest Ltd. Riverside Buildings, Dock Road, Connah s Quay, Flintshire, CH5 4DS U.K. Tel: +44 (0)1244 817107 Fax: +44 (0)1244 818502 Email: sales@lcrhallcrest.com Web: www.lcrhallcrest.com Advanced

More information

Dot matrix Label ID Products. C Vinyl cloth labels. Dot Matrix. Features and benefits. Part numbering system

Dot matrix Label ID Products. C Vinyl cloth labels. Dot Matrix. Features and benefits. Part numbering system Dot Matrix C Vinyl cloth labels Tyco Electronics C is a dot matrix printable vinyl coated cloth material with a permanent acrylic adhesive that is designed for application to irregular surfaces where conformability

More information

Surface Finishes for High-Speed PCBs

Surface Finishes for High-Speed PCBs column BEYOND DESIGN Surface Finishes for High-Speed PCBs by Barry Olney The Nickel Doesn t Make Cents! PCB surface finishes vary in type, price, availability, shelf life, assembly process and reliability.

More information

Technical Information DF30

Technical Information DF30 Technical Information DF30 Performance Pigments and Colors Lead Free Onglaze Colours for Porcelain, Bone China, Vitreous China, Earthenware, and Enamel In this leaflet, Ferro presents SAMBA100, the next

More information

Printed Circuit Design Tutorial

Printed Circuit Design Tutorial Printed Circuit Design Tutorial By Gold Phoenix Technology Tech Center, sales@goldphoenixpcb.biz Gold Phoenix has been sale PCB board in North America since 2003, during these years we received a lot of

More information

Multi-Flex Circuits Aust.

Multi-Flex Circuits Aust. Contents: Base Materials Laminate Prepreg Panel Size (Utilization) Multilayer Layup N.C. Drilling Pattern design Impedance control Solder mask type Legend PCB Finishing Gold Plating Profiling Final testing

More information

FLEXIBLE CIRCUITS MANUFACTURING

FLEXIBLE CIRCUITS MANUFACTURING IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available

More information

Flexible PCB Plating Through Hole Considerations, Experiences and Solutions

Flexible PCB Plating Through Hole Considerations, Experiences and Solutions Flexible PCB Plating Through Hole Considerations, Experiences and Solutions Neil Patton Atotech Deutschland GmbH Berlin, Germany Abstract Due to the worldwide increase in demand for flex and flex-rigid

More information

SC2000 CEMENT BONDING PROCEDURES

SC2000 CEMENT BONDING PROCEDURES Pg.1 SC2000 CEMENT BONDING PROCEDURES Widely recognized as the world s finest cold vulcanizing cement REMA SC2000 is the solution to your industrial bonding problems. By using REMA UTR20 hardener with

More information

PRODUCT DATA SHEET DESCRIPTION:

PRODUCT DATA SHEET DESCRIPTION: DESCRIPTION: SP-9888 Pipe Lining is based on the latest Zero VOC Novolac Technology. The product cures to a highly cross-linked coating with excellent chemical, solvent and water immersion resistance.

More information

3 Scotch-Seal TM. Tamper Proof Sealant 1252. Technical Data Issue No. 5

3 Scotch-Seal TM. Tamper Proof Sealant 1252. Technical Data Issue No. 5 3 Scotch-Seal TM Technical Data Issue No. 5 Advantages 3M Scotch-Seal is a one-part, fast drying, antitamper sealer. Self-extinguishing. It can be applied over adjustable or removable parts to indicate

More information

Cobalt, indigo, royal, sapphire, ocean, electric, true... whatever you call it, we ve got your blue.

Cobalt, indigo, royal, sapphire, ocean, electric, true... whatever you call it, we ve got your blue. A L K A L I Cobalt, indigo, royal, sapphire, ocean, electric, true... whatever you call it, we ve got your blue. UNTONED TONED Pantone is a registered trademark of Pantone, Inc. With unparalleled strength,

More information

Structural Plastic Adhesives DP8010 Blue. Preliminary Product Data Sheet Date: February 2015 Supersedes: New. room temperature cure

Structural Plastic Adhesives DP8010 Blue. Preliminary Product Data Sheet Date: February 2015 Supersedes: New. room temperature cure Scotch-Weld TM Structural Plastic Adhesives DP8010 Blue Preliminary Product Data Sheet Date: Supersedes: New Product Description 3M Scotch-Weld Structural Plastic Adhesives DP8010 Blue is a two-part, acrylic-based

More information

PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES

PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES By Al Wright, PCB Field Applications Engineer Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry

More information

Innovative, Thermally Conductive Silicone Solutions for LED Lighting

Innovative, Thermally Conductive Silicone Solutions for LED Lighting Innovative, Silicone Solutions for LED Lighting Better Performance and Reliability for Your Lighting Designs With Dow Corning, You Have a Powerful Ally for Thermal Management Heat remains the enemy of

More information

Flex Circuit Design and Manufacture.

Flex Circuit Design and Manufacture. Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit

More information

SC4000 CEMENT BONDING PROCEDURES

SC4000 CEMENT BONDING PROCEDURES Pg.1 SC4000 CEMENT BONDING PROCEDURES The REMA TIP TOP SC4000 Bonding System is free of chlorinated hydrocarbons (CFC), and consists of the following products: REMA TIP TOP Cement SC4000 + E40 Hardener

More information

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Gerd Linka, (Neil Patton) Atotech Deutschland GmbH Berlin, Germany Abstract With the latest legislations from RoHS

More information

Use of Carbon Nanoparticles for the Flexible Circuits Industry

Use of Carbon Nanoparticles for the Flexible Circuits Industry Use of Carbon Nanoparticles for the Flexible Circuits Industry Ying (Judy) Ding, Rich Retallick MacDermid, Inc. Waterbury, Connecticut Abstract FPC (Flexible Printed Circuit) has been growing tremendously

More information

Austin Peay State University Department of Chemistry CHEM 1111. Copper Cycle

Austin Peay State University Department of Chemistry CHEM 1111. Copper Cycle Cautions Nitric acid and sulfuric acid are toxic and oxidizers and may burn your skin. Nitrogen dioxide gas produced is hazardous if inhaled. Sodium hydroxide is toxic and corrosive and will cause burns

More information

Application Note #006 Wrapped Chip Device Mounting Instructions

Application Note #006 Wrapped Chip Device Mounting Instructions Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound

More information

Low Odour Acrylic Adhesives DP8805NS Green. Product Data Sheet Date: March 2014 Supersedes: August Property. Colour. Viscosity 1.

Low Odour Acrylic Adhesives DP8805NS Green. Product Data Sheet Date: March 2014 Supersedes: August Property. Colour. Viscosity 1. Scotch-Weld TM Low Odour Acrylic Adhesives Product Data Sheet Date: Supersedes: August 2013 Product Description 3M Scotch-Weld Low Odour Acrylic Adhesives are high performance, two-part acrylic adhesives

More information

ABSTRACT. STEEL SURFACE OXIDATION AFTER PICKLING By Yume Gerenrot and David Leychkis Ferrotech, Applied Research Center, Pittsburg, PA, U.S.A.

ABSTRACT. STEEL SURFACE OXIDATION AFTER PICKLING By Yume Gerenrot and David Leychkis Ferrotech, Applied Research Center, Pittsburg, PA, U.S.A. ABSTRACT STEEL SURFACE OXIDATION AFTER PICKLING By Yume Gerenrot and David Leychkis Ferrotech, Applied Research Center, Pittsburg, PA, U.S.A. Oxidation of coiled rolled steels panels after pickling in

More information

Basic Properties and Application of Auto Enamels

Basic Properties and Application of Auto Enamels Basic Properties and Application of Auto Enamels Composition of Ceramic Automotive Glass Enamels Ceramic automotive glass colours are glass enamels that fire on to the glass during the bending process

More information

UL Recognition in the view of a PCB manufacturer

UL Recognition in the view of a PCB manufacturer UL Recognition in the view of a PCB manufacturer J.Deutschmann, 11.02.2016 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse 13 A-8700 Leoben Tel +43 (0) 3842 200-0 E-mail info@ats.net

More information

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road

More information

IPC-SM-840C. Qualification and Performance of Permanent Solder Mask IPC-SM-840C. The Institute for. Interconnecting. and Packaging Electronic Circuits

IPC-SM-840C. Qualification and Performance of Permanent Solder Mask IPC-SM-840C. The Institute for. Interconnecting. and Packaging Electronic Circuits The Institute for Interconnecting and Packaging Electronic Circuits Qualification and Performance of Permanent Solder Mask January 1996 A standard developed by the Institute for Interconnecting and Packaging

More information

Electronics and Soldering Notes

Electronics and Soldering Notes Electronics and Soldering Notes The Tools You ll Need While there are literally one hundred tools for soldering, testing, and fixing electronic circuits, you only need a few to make robot. These tools

More information

Technical Data Sheet February 2014

Technical Data Sheet February 2014 Scotch-Weld Technical Data Sheet February 2014 Product Description s are high performance, two-part acrylic adhesives that offer excellent shear, peel, and impact performance. These toughened products

More information

Technical Data March, 2015

Technical Data March, 2015 3 Scotch-Weld TM Technical Data March, 2015 Product Description 3M TM Scotch-Weld TM DP270 (or 3M Scotch- Weld 270 B/A) is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing,

More information

WCAP-CSGP Ceramic Capacitors

WCAP-CSGP Ceramic Capacitors A Dimensions: [mm] B Recommended land pattern: [mm] D1 Electrical Properties: Properties Test conditions Value Unit Tol. Capacitance 1±0.2 Vrms, 1 khz ±10% C 15000 pf ± 10% Rated voltage Dissipation factor

More information

Nickel Free Room Temperature Seal: an innovative and ecological process

Nickel Free Room Temperature Seal: an innovative and ecological process Nickel Free Room Temperature Seal: an innovative and ecological process 2015 ANODIZING CONFERENCE San Diego, California Prepared by: Marcello Rossi Italtecno Srl Italy NICKEL FREE ROOM TEMPERATURE SEAL:

More information

Low Pressure Molding Solutions

Low Pressure Molding Solutions Low Pressure Molding Solutions PROCESS TRADITIONAL POTTING PROCESS FLOW MOLD CASE PALLETIZE INSERT ELECTRONICS PRE-HEAT ENCAPSULATE SETTLING OR VACUUM CURE TEST LOW PRESSURE PROCESS FLOW INSERT ELECTRONICS

More information

Dynamic & Proto Circuits Inc. Corporate Presentation

Dynamic & Proto Circuits Inc. Corporate Presentation Dynamic & Proto Circuits Inc. Corporate Presentation 1 DAPC Facility 54,000 Sq.ft./6,000 Sq.M 2 Multilayer Process 3 Solder Mask Options BLUE BLACK RED GREEN DRY FILM CLEAR 4 Investing in Technology New

More information

Make up Epoxy adhesive

Make up Epoxy adhesive Epoflex Base Materials series of MSC Polymer AG offers flexible base materials from simple single side flexible boards, flex-rigid applications up to highly complex multilayer boards. The dielectric is

More information

NAN YA NYLON 66 Engineering Plastics. Flame Retardant.High Toughness.Heat Resistant. Impact Resistant.Moldability.Low Warpage

NAN YA NYLON 66 Engineering Plastics. Flame Retardant.High Toughness.Heat Resistant. Impact Resistant.Moldability.Low Warpage NAN YA NYLON 66 Engineering Plastics Flame Retardant.High Toughness.Heat Resistant. Impact Resistant.Moldability.Low Warpage Introduction NAN YA FR-NYLON 66 has water absorption propertieslike other nylons.

More information

The Anatomy of a Label

The Anatomy of a Label The Anatomy of a Label Three key elements make up a label: face stock, release liner, and adhesive. Face Stock: Face stock is the material of the label that carries the imprint. The print can be applied

More information

Scotch-Weld TM. Acrylic Adhesives. DP8405NS Green. Product Data Sheet. Date: March 2014 Supersedes: August 2013

Scotch-Weld TM. Acrylic Adhesives. DP8405NS Green. Product Data Sheet. Date: March 2014 Supersedes: August 2013 Scotch-Weld TM Product Data Sheet Acrylic Adhesives Date: Supersedes: August 2013 Product Description 3M TM Scotch-Weld Acrylic Adhesives are high performance, twopart acrylic adhesives that offer good

More information

PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP.

PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP. PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP. Corporate Information Established in 2004 Headquarter office in San Jose, CA Production factory located in Binh Duong, Vietnam - Center of hi-tech industrial

More information

Surface Engineering Solutions Rebuild, Repair and Protect Industrial Equipment

Surface Engineering Solutions Rebuild, Repair and Protect Industrial Equipment Surface Engineering Solutions Rebuild, Repair and Protect Industrial Equipment Whatever You Rebuild, Repair and Protect...... Find the Right Solution! Henkel's Solutions for all Surface Engineering Needs

More information

SLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant

SLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant PRODUCT DATASHEET SLLP-5630-150-G Table of Contents Features... 1 Applications 1 Characteristics.. 1 Typical Electro optical Characteristics Curves... 3 Mechanical Dimensions... 4 Carrier Tape Dimensions.....

More information

Anodizing Reference Guide

Anodizing Reference Guide Anodizing Reference Guide Type Thickness Type II Conventional coatings produced 1.8µ-25.4µ from sulfuric acid bath Type I A Conventional coatings produced 0.5µ-7.6µ (microns) from chromic acid bath Type

More information

Auditing a Printed Circuit Board Fabrication Facility Greg Caswell

Auditing a Printed Circuit Board Fabrication Facility Greg Caswell Auditing a Printed Circuit Board Fabrication Facility Greg Caswell Introduction DfR is often requested to audit the PCB fabrication process of a customer s supplier. Understanding the process variations

More information

Safety Certification for Lead Free Flexible and Rigid-Flex PCBs

Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Crystal Vanderpan Underwriters Laboratories Inc. March 27, 2007 Crystal Vanderpan Principal Engineer for Printed Circuit Technologies Joined

More information

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production

More information

Scotch-Weld TM. Epoxy Adhesive 1838 B/A Green 1838 B/A Tan 1838-L B/A Translucent. Technical Data February, 2016. Product Description

Scotch-Weld TM. Epoxy Adhesive 1838 B/A Green 1838 B/A Tan 1838-L B/A Translucent. Technical Data February, 2016. Product Description 3 Scotch-Weld TM 1838 1838 1838-L Technical Data February, 2016 Description 3M TM Scotch-Weld TM s 1838 and are controlled flow products; Scotch-Weld 1838-L is flowable. These epoxy adhesives are two-part,

More information

POWER ROCKER SWITCH UL, CSA, VDE, TÜV, ÖVE, KEMA, SEMKO, NEMKO, DEMKO, FIMKO, SEV UL, CSA, VDE, TÜV, SEMKO, NEMKO, DEMKO, FIMKO, SEV, KEMA, ÖVE

POWER ROCKER SWITCH UL, CSA, VDE, TÜV, ÖVE, KEMA, SEMKO, NEMKO, DEMKO, FIMKO, SEV UL, CSA, VDE, TÜV, SEMKO, NEMKO, DEMKO, FIMKO, SEV, KEMA, ÖVE POWER ROCKER SWITCH SWITCHES AJ8 switch standard actuator AJ8 switch Wide actuator RoHS Directive compatibility information http://www.nais-e.com/ FEATURES 1. Power rocker switches for safety requirements.

More information

MAKING A BETTER MARK WITH INK JET As substrates, industry regulations and customer demands change, fluids are also evolving

MAKING A BETTER MARK WITH INK JET As substrates, industry regulations and customer demands change, fluids are also evolving MAKING A BETTER MARK WITH INK JET As substrates, industry regulations and customer demands change, fluids are also evolving By Dan Laird, technical support chemist, Videojet Technologies Inc. On the surface,

More information

Assembly of LPCC Packages AN-0001

Assembly of LPCC Packages AN-0001 Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)

More information

RAPTOR TRUCK BED LINER - BLACK

RAPTOR TRUCK BED LINER - BLACK 4 x 750ml RAPTOR base coating x L RAPTOR hardener TECHNICAL DATA SHEET & U-POL s RAPTOR Truck Bed Liner is a durable K polyurethane coating that provides surfaces with a protective barrier. RAPTOR Tintable

More information

RTV162. Electronic Grade Silicone Adhesive Sealant

RTV162. Electronic Grade Silicone Adhesive Sealant RTV162 Product Description Electronic Grade Silicone Adhesive Sealant RTV162 adhesive sealant from GE Silicones is one-component, readyto-use electronic grade silicone sealant. It cures to a tough, resilient

More information

Epoxy Powder-Coated Bus Bar Insulation

Epoxy Powder-Coated Bus Bar Insulation PROCESS GUIDE Epoxy Powder-Coated Bus Bar Insulation Everything you need to know. 1 Ready, Right, Sure. Storm Copper has the experience, capabilities, and equipment to manufacture high-dielectric epoxy

More information

Temperature range for use between 40 and C (dependent on material and construction; higher temperatures may also be possible see chart page 3)

Temperature range for use between 40 and C (dependent on material and construction; higher temperatures may also be possible see chart page 3) is a solvent-free two-component adhesive based on epoxy resin that allows extremely firm assemblies using a wide range of materials. has a UL admission. Specification of Chemical basis epoxy resin Adhesive

More information

CONFORMAL COATINGS. Acrylic (AR) Conformal Coating NEW!

CONFORMAL COATINGS. Acrylic (AR) Conformal Coating NEW! Acrylic (AR) Conformal Coating CONFORMAL COATINGS Acrylic coatings offer good moisture protection and some of the best dielectric properties available. They are not chemically resistant, so can be partially

More information

TECHNICAL DATA RS-6100. European Clear EZ. 5751 N. Webster Street Dayton, OH 45414-0802 Phone 937-890-6547 Toll Free 800-257-6547 Fax 937-890-6320

TECHNICAL DATA RS-6100. European Clear EZ. 5751 N. Webster Street Dayton, OH 45414-0802 Phone 937-890-6547 Toll Free 800-257-6547 Fax 937-890-6320 RS-6100 TECHNICAL DATA European Clear EZ DESCRIPTION: RS-6100 European Clear EZ is formulated with premium European resins. It is ideal for excellent color matching on white, light colors and metallics

More information

C4246 120W COB Series

C4246 120W COB Series High Performance LED Module SemiLEDs C4246 120W COB is a high performance LED module with high thermal conductivity and reliability for demanding lighting applications. It is an easy to assemble light

More information

Electroplating with Photoresist Masks

Electroplating with Photoresist Masks Electroplating with Photoresist Masks Revised: 2014-01-17 Source: www.microchemicals.com/downloads/application_notes.html Electroplating - Basic Requirements on the Photoresist Electroplating with photoresist

More information

Thermal Adhesives Ther-O-Bond 1500

Thermal Adhesives Ther-O-Bond 1500 Products / Interface Materials / Adhesives Adhesives Bond 1500 Epoxy casting system for potting and encapsulation Bond 1600 Two part epoxy for bonding Bond 2000 Rapid cure acrylic adhesive bond High strength

More information

SIGMASHIELD 460. PRODUCT DATA SHEET December 15, 2014 (Revision of June 1, 2013) DESCRIPTION

SIGMASHIELD 460. PRODUCT DATA SHEET December 15, 2014 (Revision of June 1, 2013) DESCRIPTION DESCRIPTION Two-component, high solids glass flake reinforced polyamine adduct epoxy coating PRINCIPAL CHARACTERISTICS Excellent abrasion and impact resistance Suitable for use on ice-going vessels Excellent

More information

OP REBEL STAR. Opulent. Opulent OP REBEL STAR_v4_30Sept09. Features

OP REBEL STAR. Opulent. Opulent OP REBEL STAR_v4_30Sept09. Features Features Excellent thermal conductivity Excellent insulating ability Excellent Dimensional Stability Excellent Mechanical Strength Lower heat expansibility Lower operating temperature Increase power density

More information

Etching using chemicals

Etching using chemicals Etching using chemicals Free tutorial Artsandtechniques.com Arts and Techniques School RJDS inc. Etching using chemicals There are several ways to etch metal, this technique uses a chemical. The etching

More information

Technical Info Sheet. Ionic contamination testing in a no-clean soldering process. Scope

Technical Info Sheet. Ionic contamination testing in a no-clean soldering process. Scope Scope This document provides information about ionic contamination testing and its relevance in a no-clean. Also so-called C3 testing and ROSE (Resistivity of Solvent Extract) testing are forms of ionic

More information

Via Hole Filling Technology for High Density, High Aspect Ratio Printed Wiring Boards Using a High Tg, low CTE Plugging Paste

Via Hole Filling Technology for High Density, High Aspect Ratio Printed Wiring Boards Using a High Tg, low CTE Plugging Paste Via Hole Filling Technology for High Density, High Aspect Ratio Printed Wiring Boards Using a High Tg, low CTE Plugging Paste Michael Carano Electrochemicals, Inc. Maple Plain, Minnesota Abstract The continued

More information

Epoxy/Urethane Concrete Coating System

Epoxy/Urethane Concrete Coating System Epoxy/Urethane Concrete Coating System Application Guide Endura offers a coating system for concrete floors consisting of an epoxy primer and a urethane topcoat. It can be used on garage, warehouse and

More information

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region Solutions without Boundaries PCB Surface Finishes Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region 1 Notice Notification of Proprietary Information: This document contains proprietary

More information

C1919 15W COB Series

C1919 15W COB Series High Performance LED Module SemiLEDs C1919 15W COB is a high performance LED module with high thermal conductivity and reliability for demanding lighting applications. It is an easy to assemble light source

More information

https://www.aavid.com/product-group/interface/adhesive

https://www.aavid.com/product-group/interface/adhesive Page 1 of 5 Tel (toll-free): +1-855-32-AAVID Search Register Log in Home Products Solutions Aavid Design Tools & Docs Contact Company Online Store Interface Materials Adhesives 1500 1600 Thermalbond Thermal

More information

Return to Lab Menu. Acids and Bases in Your House

Return to Lab Menu. Acids and Bases in Your House Return to Lab Menu Acids and Bases in Your House OBJECTIVES Isolate a natural acid-base indicator. Determine the acid-base properties of common household solutions. INTRODUCTION Acids and bases are among

More information

Heat-Shrinkable Tubing

Heat-Shrinkable Tubing CPO 2:1 Shrink Ratio Thin-Wall Tubing, Non-Lined Flame-retardant, cross-linked polyolefin Continuous operating temperature: -55 C to 135 C Shrink temperature of 120 C Meets UL and CSA standards; MIL-DTL-23053/5

More information

Dispose of all materials in the proper waste containers which are provided in the laboratory.

Dispose of all materials in the proper waste containers which are provided in the laboratory. THE EXTRACTION AND IDENTIFICATION OF ARTIFICIAL FOOD COLORS 2009, 2003, 2000, 1997, 1975 by David A. Katz. All Rights reserved. Reproduction permitted for education use provided original copyright is included.

More information

CAMP U S RAC K. Orderly Bike Parking

CAMP U S RAC K. Orderly Bike Parking CAMP U S RAC K Orderly Bike Parking The design of this bike rack supports the frame of the bike while keeping the fork from twisting. The result is convenient, orderly bike parking. The Campus Rack is

More information

TECHNICAL DATA SHEET

TECHNICAL DATA SHEET Nightingale Supply 12a Hungerford Street, Northgate Qld 4013 Phone: 3260.6544 Fax: 3260.6646 TECHNICAL DATA SHEET Resorcinol: Resorcinol: R15 Resin RP51H Hardener ADHESIVE DESCRIPTION: RESORCINOL R15 RESIN

More information

TO INCREASE PROCESSING EFFICIENCY, TO SAVE ENERGY AND PRODUCTION COSTS, AND TO INCREASE PRODUCT YIELD

TO INCREASE PROCESSING EFFICIENCY, TO SAVE ENERGY AND PRODUCTION COSTS, AND TO INCREASE PRODUCT YIELD TO INCREASE PROCESSING EFFICIENCY, TO SAVE ENERGY AND PRODUCTION COSTS, AND TO INCREASE PRODUCT YIELD LIMS (Liquid Injection Molding System) is a newly designed system, which includes a series of highly

More information

Material Product Data Sheet Sealers for Thermal Spray Coatings

Material Product Data Sheet Sealers for Thermal Spray Coatings Material Product Data Sheet Sealers for Thermal Spray Coatings Thermal Spray Products: AP, APT Thinner, ERS, SA, URS, Metco 185 Sealer 1 Introduction Sealers are materials that penetrate the pores of thermal

More information

Digital PCB production usingindustrialinkjetprinting. Roel De Mondt, PhD Productronica Munich 2015

Digital PCB production usingindustrialinkjetprinting. Roel De Mondt, PhD Productronica Munich 2015 Digital PCB production usingindustrialinkjetprinting Roel De Mondt, PhD Productronica Munich 2015 The whole world becomes digital, well, almost Photo film digital camera Letters emails Books e-readers

More information

Printed Circuit Board - PCB presentation

Printed Circuit Board - PCB presentation Printed Circuit Board - PCB presentation PCB application P&A supplies customer with Quick Turn Prototype, Small and Medium-volume PCBs. The PCBs can be widely used in communication product, eg. Bluetooth,

More information

Screw Plug Immersion Heaters

Screw Plug Immersion Heaters Immersion Heaters Overview Immersion Heaters consist of hairpin bent tubular elements brazed or welded into a screw plug and provided with terminal enclosures for electrical connections. Immersion Heaters

More information

Technical Data February, 2015

Technical Data February, 2015 TM Scotch-Weld Technical Data February, 2015 Product Description is a two-part, 2:1 mix ratio, toughened epoxy structural adhesive which has a 5 minute work life and accelerated cure. It exhibits excellent

More information

Neutral type Auto-Catalytic Electroless Gold Plating Process Abstract 1. Introduction 2. Experiment and Results

Neutral type Auto-Catalytic Electroless Gold Plating Process Abstract 1. Introduction 2. Experiment and Results Neutral type Auto-Catalytic Electroless Gold Plating Process Don Gudeczauskas, Uyemura International Corporation Seiji Nakatani, Masayuki Kiso, Shigeo Hashimoto, C.Uyemura & Co., Ltd Abstract In order

More information

AUSTENITIC STAINLESS DAMASCENE STEEL

AUSTENITIC STAINLESS DAMASCENE STEEL AUSTENITIC STAINLESS DAMASCENE STEEL Damasteel s austenitic stainless Damascene Steel is a mix between types 304L and 316L stainless steels which are variations of the 18 percent chromium 8 percent nickel

More information

Araldite CY 220-1 100 - pbw Araldite CY 223-100 pbw Hardener HY 5052 30 35 pbw

Araldite CY 220-1 100 - pbw Araldite CY 223-100 pbw Hardener HY 5052 30 35 pbw Ciba Specialty Chemicals Performance Polymers Electro & Electronic Encapsulating Araldite Casting Resin System Araldite CY 220-1 100 - pbw Araldite CY 223-100 pbw Hardener HY 5052 30 35 pbw Casting systems

More information

Soldering Process Considerations for Land Grid Array Modules

Soldering Process Considerations for Land Grid Array Modules Soldering Process Considerations for Land Grid Array Modules The reflow process is dependant on many parameters; this application note is presented as a guide to soldering LGA modules. Manufacturers are

More information

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages Atmel AVR211: Wafer Level Chip Scale Packages Features Allows integration using the smallest possible form factor Packaged devices are practically the same size as the die Small footprint and package height

More information

Product Data Sheet Updated : February 2009 Supersedes: June 2001

Product Data Sheet Updated : February 2009 Supersedes: June 2001 Scotch-Weld DP760 Product Data Sheet Updated : February 2009 Supersedes: June 2001 Product Description DP760 epoxy adhesive is a non-sag, two-part room temperature curing adhesive designed for use when

More information

PANTONE Solid to Process

PANTONE Solid to Process PANTONE Solid to Process PANTONE C:0 M:0 Y:100 K:0 Proc. Yellow PC PANTONE C:0 M:0 Y:51 K:0 100 PC PANTONE C:0 M:2 Y:69 K:0 106 PC PANTONE C:0 M:100 Y:0 K:0 Proc. Magen. PC PANTONE C:0 M:0 Y:79 K:0 101

More information

ENIG with Ductile Electroless Nickel for Flex Circuit Applications

ENIG with Ductile Electroless Nickel for Flex Circuit Applications ENIG with Ductile Electroless Nickel for Flex Circuit Applications Yukinori Oda, Tsuyoshi Maeda, Chika Kawai, Masayuki Kiso, Shigeo Hashimoto C.Uyemura & Co., Ltd. George Milad and Donald Gudeczauskas

More information

SIGMACOVER 456. PRODUCT DATA SHEET December 12, 2014 (Revision of November 1, 2013) DESCRIPTION

SIGMACOVER 456. PRODUCT DATA SHEET December 12, 2014 (Revision of November 1, 2013) DESCRIPTION DESCRIPTION Two-component, high-build, polyamide-cured recoatable epoxy coating PRINCIPAL CHARACTERISTICS General-purpose epoxy buildcoat or finish in protective coating systems, for steel and concrete

More information

STYCAST 2651 MM Two Component, Low Viscosity, General Purpose Epoxy Encapsulant

STYCAST 2651 MM Two Component, Low Viscosity, General Purpose Epoxy Encapsulant Key Feature General purpose Machinability Low viscosity Product Description : Benefit Used in a wide variety of applications Casting can be cut, drilled and tapped easily Ease of use STYCAST 2651 MM is

More information

Title: Making your own acid-base indicator

Title: Making your own acid-base indicator Lo Fong Him(19) Chan Lik Sang(2) Title: Making your own acid-base indicator Date: 26 th April, 2010 Objective: To determine what substances can be used as acid-base indicator Theory: Acid-base indicators

More information