Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F = 100 ma

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1 Rev September 2008 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package. 1.2 Features Non-repetitive peak reverse power dissipation: P ZSM 40 W Total power dissipation: P tot 320 mw Tolerance series: B: approximately ±5 %; B1, B2, B3: approximately ±2 % Wide working voltage range: nominal 2.4 V to 36 V (E24 range) Low reverse current I R range Small plastic package suitable for surface-mounted design AEC-Q1 qualified 1.3 Applications General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F = 0 ma [1] V P ZSM non-repetitive peak reverse [2] W power dissipation P tot total power dissipation T amb 25 C [3] mw [1] Pulse test: t p 300 µs; δ [2] t p = 0 µs; square wave; T j =25 C prior to surge [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

2 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode aaa Ordering information [1] The marking bar indicates the cathode. Table 3. Type number Ordering information Package Name Description Version PZU2.4BA to SC-76 plastic surface-mounted package; 2 leads SOD323 PZU36BA [1] PZU2.4BA/DG to PZU36BA/DG [1][2] [1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V. [2] /DG: halogen-free Product data sheet Rev September of 14

3 4. Marking Table 4. Marking codes Type number [1] Marking code Type number [1] Marking code B B1 B2 B3 B B1 B2 B3 PZU2.4*A X PZU2.4*A/DG Y PZU2.7*A X9 XA XB - PZU2.7*A/DG Y9 YA YB - PZU3.0*A XT XU XV - PZU3.0*A/DG YT YU YV - PZU3.3*A XW XX XY - PZU3.3*A/DG YW YX YY - PZU3.6*A XZ MC MD - PZU3.6*A/DG YZ NC ND - PZU3.9*A ME MF MG - PZU3.9*A/DG NE NF NG - PZU4.3*A MM MN MP MR PZU4.3*A/DG NM NN NP NR PZU4.7*A MS MT MU MV PZU4.7*A/DG NS NT NU NV PZU5.1*A MW MX MY MZ PZU5.1*A/DG NW NX NY NZ PZU5.6*A LF LG LH LK PZU5.6*A/DG RF RG RH RK PZU6.2*A LL LM LN LP PZU6.2*A/DG RL RM RN RP PZU6.8*A LR LS LT LU PZU6.8*A/DG RR RS RT RU PZU7.5*A LV LW LX LY PZU7.5*A/DG RV RW RX RY PZU8.2*A LZ CR CS CT PZU8.2*A/DG RZ ER ES ET PZU9.1*A CU CV CW CX PZU9.1*A/DG EU EV EW EX PZU*A VA VB VC VD PZU*A/DG WA WB WC WD PZU11*A VE VF VG VH PZU11*A/DG WE WF WG WH PZU12*A VK VL VM VN PZU12*A/DG WK WL WM WN PZU13*A VP VR VS VT PZU13*A/DG WP WR WS WT PZU14*A - - VU - PZU14*A/DG - - WU - PZU15*A VV VW VX VY PZU15*A/DG WV WW WX WY PZU16*A VZ X1 X2 X3 PZU16*A/DG WZ Y1 Y2 Y3 PZU18*A X4 X5 X6 X7 PZU18*A/DG Y4 Y5 Y6 Y7 PZU20*A XC XD XE XF PZU20*A/DG YC YD YE YF PZU22*A XG XH XK XL PZU22*A/DG YG YH YK YL PZU24*A XM XN XP XR PZU24*A/DG YM YN YP YR PZU27*A XS PZU27*A/DG YS PZU30*A MH PZU30*A/DG NH PZU33*A MK PZU33*A/DG NK PZU36*A ML PZU36*A/DG NL [1] * = B: tolerance series B, approximately ±5 % * = B1, B2, B3: tolerance series B1, B2, B3: approximately ±2 % Product data sheet Rev September of 14

4 5. Limiting values 6. Thermal characteristics Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit I F forward current ma I ZSM P ZSM non-repetitive peak reverse current non-repetitive peak reverse power dissipation [1] - see Table 8 and 9 [1] - 40 W P tot total power dissipation T amb 25 C [2] mw [3] mw T j junction temperature C T amb ambient temperature C T stg storage temperature C [1] t p = 0 µs; square wave; T j =25 C prior to surge [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-a) thermal resistance from in free air [1] K/W junction to ambient [2] K/W R th(j-sp) thermal resistance from junction to solder point [3] K/W 7. Characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2. [3] Soldering point of cathode tab. Table 7. Characteristics T j =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V F forward voltage [1] I F = ma V I F = 0 ma V [1] Pulse test: t p 300 µs; δ Product data sheet Rev September of 14

5 Table 8. Characteristics per type; PZU2.4BA to PZU5.6B3A and PZU2.4BA/DG to PZU5.6B3A/DG T j =25 C unless otherwise specified. PZUxBA Sel Working voltage V Z (V) Differential resistance r dif (Ω) Reverse current I R (µa) Temperature coefficient S Z (mv/k) Diode capacitance C d (pf) [1] Non-repetitive peak reverse current I ZSM (A) [2] I Z =5mA I Z = 0.5 ma I Z =5mA I Z =5mA Min Max Max Max Max V R (V) Typ Max Max 2.4 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B [1] f = 1 MHz; V R =0V [2] t p = 0 µs; square wave; T j =25 C prior to surge Product data sheet Rev September of 14

6 Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG T j =25 C unless otherwise specified. PZUxBA Sel Working voltage V Z (V) Differential resistance r dif (Ω) Reverse current I R (na) Temperature coefficient S Z (mv/k) Diode capacitance C d (pf) [1] Non-repetitive peak reverse current I ZSM (A) [2] I Z =5mA I Z = 0.5 ma I Z =5mA I Z =5mA Min Max Max Max Max V R (V) Typ Max Max 6.2 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B Product data sheet Rev September of 14

7 Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG continued T j =25 C unless otherwise specified. PZUxBA Sel Working voltage V Z (V) Differential resistance r dif (Ω) 14 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B [1] f = 1 MHz; V R =0V [2] t p = 0 µs; square wave; T j =25 C prior to surge Reverse current I R (na) Temperature coefficient S Z (mv/k) Diode capacitance C d (pf) [1] I Z =5mA I Z = 0.5 ma I Z =5mA I Z =5mA Min Max Max Max Max V R (V) Typ Max Max Non-repetitive peak reverse current I ZSM (A) [2] Product data sheet Rev September of 14

8 3 006aab mbg781 P ZSM (W) I F (ma) t p (s) V F (V) T j =25 C (prior to surge) T j =25 C Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values Fig 2. Forward current as a function of forward voltage; typical values 0 S Z (mv/k) mgl S Z (mv/k) mgl I Z (ma) I Z (ma) T j =25 C to 150 C V Z = 2.4 V to 4.3 V T j =25 C to 150 C V Z = 4.7 V to 12 V Fig 3. Temperature coefficient as a function of working current; typical values Fig 4. Temperature coefficient as a function of working current; typical values Product data sheet Rev September of 14

9 2 I Z (ma) 1 V Z(nom) (V) = aab I Z (ma) 1 V Z(nom) (V) = aab V Z (V) V Z (V) T j =25 C V Z = 2.4 V to 4.3 V T j =25 C V Z = 4.7 V to 12 V Fig 5. Working current as a function of working voltage; typical values Fig 6. Working current as a function of working voltage; typical values 2 006aab248 I Z (ma) V Z(nom) (V) = V Z (V) Fig 7. T j =25 C V Z = 13 V to 36 V Working current as a function of working voltage; typical values Product data sheet Rev September of 14

10 8. Test information 9. Package outline 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q1 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications Dimensions in mm Fig 8. Package outline SOD323 (SC-76). Packing information Table. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity PZU2.4BA to PZU36BA PZU2.4BA/DG to PZU36BA/DG [1] For further information and the availability of packing methods, see Section SOD323 4 mm pitch, 8 mm tape and reel Product data sheet Rev September 2008 of 14

11 11. Soldering solder lands solder resist (2 ) 0.6 (2 ) solder paste occupied area 0.5 (2 ) 0.6 (2 ) 2.2 Dimensions in mm sod323_fr Fig 9. Reflow soldering footprint SOD323 (SC-76) (2 ) solder lands solder resist occupied area (2 ) Dimensions in mm preferred transport direction during soldering sod323_fw Fig. Wave soldering footprint SOD323 (SC-76) Product data sheet Rev September of 14

12 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes Product data sheet - - Product data sheet Rev September of 14

13 13. Legal information 13.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail Disclaimers General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: For sales office addresses, please send an to: Product data sheet Rev September of 14

14 15. Contents 1 Product profile General description Features Applications Quick reference data Pinning information Ordering information Marking Limiting values Thermal characteristics Characteristics Test information Quality information Package outline Packing information Soldering Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: For sales office addresses, please send an to: Date of release: 19 September 2008 Document identifier:

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