Micron Product Guide. The memory. Experts

Transcription

1 Micron Product Guide The memory Experts 2014

2 Contents 4 Segment Directory DRAM 6 MT40 DDR4 SDRAM MT41 DDR3 SDRAM MT47 DDR2 SDRAM MT46 DDR SDRAM MT48 SDRAM 7 MT44 RLDRAM 3 Memory MT49 RLDRAM 2 Memory MT42 Mobile LPDDR2 MT46 Mobile LPDDR MT48 Mobile LPSDR 8 MT45 PSRAM CellularRAM Memory Modules 8 DDR3 SDRAM 240-pin UDIMM DDR3 SDRAM 240-pin ECC UDIMM DDR3 SDRAM 240-pin VLP ECC UDIMM DDR3 SDRAM 204-pin SODIMM DDR3 SDRAM 204-pin ECC SODIMM DDR3 SDRAM 200-pin SORDIMM 9 DDR3 SDRAM 240-pin RDIMM DDR3 SDRAM 240-pin VLP RDIMM DDR3 SDRAM 240-pin LRDIMM DDR3 SDRAM 244-pin Mini-UDIMM DDR3 SDRAM 244-pin Mini-RDIMM DDR3 SDRAM 244-pin Mini-UDIMM DDR3 SDRAM 244-pin VLP Mini-UDIMM DDR3 SDRAM 244-pin VLP Mini-RDIMM DDR2 SDRAM 240-pin UDIMM DDR2 SDRAM 240-pin ECC UDIMM 10 DDR2 SDRAM 200-pin SODIMM DDR2 SDRAM 200-pin SORDIMM DDR2 SDRAM 240-pin RDIMM DDR2 SDRAM 240-pin VLP RDIMM DDR2 SDRAM 240-pin FBDIMM DDR2 SDRAM 244-pin Mini-RDIMM 10 DDR2 SDRAM 244-pin VLP Mini-RDIMM DDR SDRAM 184-pin UDIMM 11 DDR SDRAM 184-pin ECC UDIMM DDR SDRAM 200-pin SODIMM DDR SDRAM 200-pin ECC SODIMM DDR SDRAM 184-pin RDIMM DDR SDRAM 184-pin VLP RDIMM SDRAM 168-pin UDIMM SDRAM 168-pin ECC UDIMM SDRAM 144-pin SODIMM SDRAM 168-pin RDIMM NAND Flash 12 MT29 SLC NAND Flash NAND Small Page (SP) Flash MT29 MLC NAND Flash 13 MT29 Serial NAND Flash Managed NAND 13 MTFC and N2M4 e MMC Memory for Embedded MTED and MTFD Embedded USBs MT29 Enhanced ClearNAND Flash Memory NOR Flash 14 M29AW Parallel NOR Flash Automotive M29DW Parallel NOR Flash Automotive M29F Parallel NOR Flash Automotive M29W Parallel NOR Flash Automotive 15 M58BW Parallel NOR Flash Automotive M58WR Parallel NOR Flash Automotive G18 Parallel NOR Flash Embedded J3 Parallel NOR Flash Embedded M28W Parallel NOR Flash Embedded 16 M29DW Parallel NOR Flash Embedded M29EW Parallel NOR Flash Embedded M29W Parallel NOR Flash Embedded

3 17 P30 Parallel NOR Flash Embedded P33 Parallel NOR Flash Embedded M58, PF48F, PC28F Parallel NOR Flash Mobile 18 M25P Serial NOR Flash Automotive M25PE Serial NOR Flash Automotive N25Q Serial NOR Flash Automotive M25PX Serial NOR Flash Automotive 19 M25P Serial NOR Flash Embedded M25PE Serial NOR Flash Embedded M25PX Serial NOR Flash Embedded 20 M45PE Serial NOR Flash Embedded N25Q Serial NOR Flash Embedded N25W Serial NOR Flash Mobile Solid State Drives (SSDs) 21 M500 Self-Encrypting Drive (SED) P400e SSD P400m SSD P300 SSD P410m SSD 22 P320h PCIe SSD P410m PCIe SSD Multichip Packages (MCPs) 23 MT29 NAND Flash-Based MCPs 23 Bare Die and Wafer-Level Products Hybrid Memory Cube (HMC) Part Numbering 25 DRAM Components 27 HMC Memory 28 MCP/PoP Memory 29 NOR MCP 30 e MMC Memory 31 e MMC 100-ball Stand-Alone 32 DDR4 Module 33 DDR3 Module 34 DDR2 Module 35 DDR and SDRAM Module 36 PSRAM CellularRAM Memory 37 NAND Flash 38 NAND Small Page Flash 39 N25Q Serial NOR Flash 40 M25/M45 Serial NOR Flash 41 M29W Parallel NOR Flash M29AW Automotive Uniform Block MLC Flash 42 M29DW Parallel NOR Flash M29EW Parallel NOR Flash 43 M29F Automotive Single-Bank 5V Flash 44 P30/P33 Parallel NOR Flash and P30/P33 Stacked 45 G18 Parallel NOR Flash J3 Parallel NOR Flash 46 M28W Parallel NOR Flash M58BW Parallel NOR Flash 47 M58WR Parallel NOR Flash 48 3xx and 4xx SSDs 49 4xx and 5xx SSDs Resources 50 Product Lifecycle Solutions 51 Web Tools 24 Hybrid Memory Cube

4 We have the right device for your design. Micron has one of the most comprehensive, cost-competitive memory product portfolios in the industry. We re committed to meeting our customers needs with a broad continuum of memory solutions, from legacy designs to long-term stability for current designs, new innovations, and emerging technologies. Automotive Solutions for the Road Building on our decades of experience in the memory business, we ve established a broad portfolio of products and technologies that maximize the functionality of today s sophisticated automotive electronics. Our engineers have the technical background to help you choose the best of our high-quality, rigorously tested automotive memory solutions to optimize your design. DRAM Components 6 PSRAM CellularRAM Memory 8 NAND Flash 12 NOR Flash 14 Mobile LPDRAM 7 e MMC Memory 13 IMM One Source for Industrial/Multi-Market Applications Our exacting quality standards, broad product portfolio, individualized category support, and commitment to supply stability set us apart as the memory provider that IMM customers can rely on to serve mission-critical application needs. Our memory solutions are the top choice for PC, network infrastructure, and communications equipment used in extreme environments empowering the newest technology developments in the fields of science, medicine, and manufacturing. DRAM Components 6 Mobile LPDRAM 7 NOR Flash 14 e MMC Memory 13 PSRAM CellularRAM 8 NAND Flash 12 Mobile Staying Connected in a Wireless World We ve developed some of the industry s highest-performance mobile memory solutions, but we deliver more than just great products. We strive to solve design challenges through better engineering raising the bar on features, functionality, and performance. We work with chipset vendors, OS designers, and other enablers to ensure our parts are optimized for your design. You get a comprehensive product portfolio of mobile memory solutions that maximize performance along with the technical experts to help you make it work for your applications. Mobile LPDRAM 7 NAND Flash 12 PSRAM CellularRAM Memory 8 NAND and NOR Flash-Based Multichip Packages (MCPs) 23 e MMC Memory 13

5 Computing Power and Efficiency From workstations to netbooks, from tablets to ultrathins, computing designs require a multitude of packages, densities, and speeds. Our products enable you to optimize performance in key areas like signaling speeds and bandwidth and to find the right combination of power, efficiency, and cost. From components to modules to SSDs, we manufacture our products from start to finish. We invest time up front, rigorously testing and validating that our products are right the first time. Plus, our experienced technical support will help you get your design to market faster, easier, and better. DRAM Modules 8 Solid State Drives (SSDs) 21 DDR3/DDR4 SDRAM Components 6 Hybrid Memory Cube (HMC) 24 Graphics and Consumer Balancing Cost and Performance The convergence of applications in the graphics and consumer segment is bringing TV, social media, home entertainment, and gaming to end consumers through one piece of equipment. Micron offers one of the industry s broadest portfolios of market-leading DRAM and nonvolatile memory devices to meet this very competitive segment s demands for highperformance, cost-efficient memory solutions. We ve got the memory you need for a broad range of designs, including digital TVs, Blu-ray Disc players, video game consoles, portable game systems, personal media players, PC graphics cards, media tablets, cameras, or printers. DRAM Components 6 NOR Flash 14 NAND Flash 12 Managed NAND 13 Multichip Packages (MCPs) 23 Hybrid Memory Cube (HMC) 24 Networking Enabling Applications Now and Into the Future The unique requirements of communications and networking applications demand high-performance, specialty memory with low latency, rigorous thermal specifications, pristine signal integrity, and ECC data protection. Choosing the right memory technology for your design is a critical decision you make on the initial board layout; so is choosing a memory supplier to provide it. Micron engineers and manufactures a broad portfolio of specific solutions to meet the needs of your mission-critical networking applications. DRAM and RLDRAM Components 6 DRAM Modules 8 NAND Flash 12 eusb, e MMC Memory 13 Solid State Drives (SSDs) 21 NOR Flash 14 Hybrid Memory Cube (HMC) 24 Server Rigorously Tested for Reliability Server designs demand reliability, performance, and low power consumption. We ve developed a host of solutions from professional-grade SSDs to the industry s lowest-voltage modules that can help you address these challenges and overcome power and space constraints in data centers. We design and build our memory solutions from start to finish beginning with memory component design rigorously testing at each stage of the manufacturing process. We also work with board makers and industry organizations to define and develop the leading technologies that will enable your next server design. LRDIMMs 8 FBDIMMs 10 RDIMMs 8 NAND Flash 12 SATA and PCIe Solid State Drives (SSDs) 22 Hybrid Memory Cube (HMC) 24

6 DRAM Density Bus Width Voltage Clock Rate Package Temp Range MT40 DDR4 SDRAM 4Gb x4, x8, x16 1.2V MHz 78-, 96-ball FBGA 0 C to +95 C 8Gb x4 1.2V 1067 MHz 78-ball FBGA 0 C to +95 C Note: Products meet RoHS standards. MT41 DDR3 SDRAM 1Gb x4, x8, x V1.5V MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 2Gb x4, x8, x V1.5V MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 4Gb x4, x8, x V1.5V MHz 78-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C, 40 C to +105 C 8Gb x4, x8, x V1.5V MHz 78-, 86-, 96-ball FBGA 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS standards. MT47 DDR2 SDRAM 512Mb x4, x8, x16 1.8V MHz 60-, 84-ball FBGA, Wafer 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 1Gb x4, x8, x V1.8V MHz 60-, 84-ball FBGA 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 2Gb x4, x8, x16 1.8V MHz 60-, 63-, 84-ball FBGA 0 C to +85 C, 40 C to +95 C, 40 C to +105 C 4Gb x4, x8 1.8V MHz 0 C to +85 C Note: Products meet RoHS standards. MT46 DDR SDRAM 256Mb x4, x8, x V MHz 512Mb x4, x8, x V MHz 64Mb x4, x8, x16, x32 3.3V MHz 128Mb x4, x8, x16, x32 3.3V MHz 256Mb x4, x8, x16 3.3V MHz 54-, 86-pin TSOP, 54-, 90-ball VFBGA 54-, 86-pin TSOP, 54-, 90-ball VFBGA, 54-, 60-, 86-ball FBGA 54-pin TSOP, 54-ball VFBGA, 60-ball FBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 512Mb x4, x8, x16 3.3V 133 MHz 54-pin TSOP 0 C to +70 C, Note: Products meet RoHS 5/6 standards. 60-ball FBGA, 66-pin TSOP 60-ball FBGA, 66-pin TSOP 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 1Gb x4, x8, x16 2.5V MHz 66-pin TSOP 0 C to +70 C, Note: Products meet RoHS 5/6 standards. MT48 SDRAM 6

7 Density Bus Width Voltage Clock Rate Package Temp Range MT44 RLDRAM 3 Memory 576Mb x18, x V MHz 168-ball FBGA 0 C to +95 C, 40 C to +95 C 1.15Gb x18, x V 800 MHz 168-ball FBGA 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS 5/6 standards. MT49 RLDRAM 2 Memory 288Mb x9, x18, x36 1.8V MHz 144-ball ubga 0 C to +95 C, 40 C to +95 C 576Mb x9, x18, x36 1.8V MHz 144-ball ubga 0 C to +95 C, 40 C to +95 C Note: Products meet RoHS 5/6 standards. DRAM Density Bus Width Voltage Clock Rate Package Temp Range MT42 Mobile LPDDR2 1Gb x32 1.2V 400 MHz 134-ball VFBGA 25 C to +85 C, 40 C to +105 C 2Gb x16, x32 1.2V MHz 168-ball PoP 25 C to +85 C 4Gb x32, x64 1.2V MHz 168-, 216-ball PoP, 134-, 168-, 240-ball WFBGA, 216-ball UFBGA 25 C to +85 C 6Gb x32 1.2V MHz 168-ball VFBGA 25 C to +85 C 8Gb x32, x64 1.2V MHz 168-, 216-, 240-ball PoP, 168-, 216-, 272-ball WFBGA 25 C to +85 C 16Gb x64 1.2V MHz 216-, 220-, 253-ball VFBGA 25 C to +85 C Note: Products meet RoHS standards. MT46 Mobile LPDDR 128Mb x16 1.8V MHz 60-ball VFBGA 256Mb x16, x32 1.8V MHz 60-, 90-ball VFBGA 512Mb x16, x32 1.8V MHz 1Gb x16, x32 1.8V MHz 2Gb x16, x32 1.8V MHz 60-, 90-ball VFBGA, WFBGA, 152-ball PoP 60-, 90-ball VFBGA, 168-ball PoP 60-, 90-ball VFBGA, 168-ball PoP, 60-ball WFBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C, 40 C to +105 C 25 C to +85 C, 4Gb x32 1.8V MHz 168-, 240-ball PoP 25 C to +85 C, 8Gb x32 1.8V MHz 168-ball PoP 25 C to +85 C, Note: Products meet RoHS standards. MT48 Mobile LPSDR 64Mb x16 1.8V MHz 54-ball VFBGA 0 C to +70 C, 128Mb x16, x32 1.8V MHz 54-, 90-ball VFBGA 256Mb x16, x32 1.8V MHz 54-, 90-ball VFBGA 0 C to +70 C,, 40 C to +105 C 0 C to +70 C,, 40 C to +105 C 512Mb x16, x32 1.8V MHz 54-, 90-ball VFBGA Note: Products meet RoHS standards. 128Mb meets RoHS 5/6 standards. 7

8 Density Bus Width RoHS I/O Voltage Access Time Package Temp Range MT45 PSRAM CellularRAM Memory 16Mb x16 Yes, Green 1.8V 70ns 48-, 54-ball VFBGA, 40 C to +105 C 32Mb x16 Green 1.8V 70ns 48-, 54-ball VFBGA, 40 C to +105 C 64Mb x16 Green 1.8V 70ns 48-, 54-ball VFBGA, 30 C to +85 C 128Mb x16 Green 1.8V 70ns, 85ns 54-ball VFBGA, 40 C to +105 C Modules Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR3 SDRAM 240-pin UDIMM 1GB x64 8 Green V 1333 MT/s Single 0 C to +95 C 2GB x64 4, 8 Green V MT/s Single 0 C to +95 C 4GB x64 8, 16 Green V MT/s Single, Dual 0 C to +95 C 8GB x64 16 Green V MT/s Dual 0 C to +95 C DDR3 SDRAM 240-pin ECC UDIMM 1GB x72 9 Green V MT/s Single 0 C to +95 C 2GB x72 9 Green V MT/s Single 0 C to +95 C 4GB x72 9, 18 Green V MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green V MT/s Dual 0 C to +95 C DDR3 SDRAM 240-pin VLP ECC UDIMM 2GB x72 9 Green 1.35V 1333 MT/s Single 0 C to +95 C 4GB x72 9, 18 Green V MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green V 1600 MT/s Dual 0 C to +95 C DDR3 SDRAM 204-pin SODIMM 1GB x64 4, 8 Green V MT/s Single 0 C to +95 C 2GB x64 4, 8 Green V MT/s Single, Dual 0 C to +95 C 4GB x64 8, 16 Green V MT/s Single, Dual 0 C to +95 C 8GB x64 16 Green V MT/s Dual 0 C to +95 C DDR3 SDRAM 204-pin ECC SODIMM 2GB x72 18 Green 1.35V 1333 MT/s Dual 0 C to +95 C 4GB x72 9, 18 Green 1.35V MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green 1.35V MT/s Dual 0 C to +95 C DDR3 SDRAM 200-pin SORDIMM 16GB x72 36 Green 1.35V 1600 MT/s Quad 0 C to +95 C 8

9 Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR3 SDRAM 240-pin RDIMM 1GB x72 9 Green 1.5V MT/s Single 0 C to +95 C 2GB x72 9, 18 Green V MT/s Single, Dual 0 C to +95 C 4GB x72 9, 18 Green V MT/s Single, Dual 0 C to +95 C 8GB x72 18, 36 Green V MT/s Single, Dual, Quad 0 C to +95 C 16GB x72 36 Green V MT/s Dual 0 C to +95 C 32GB x72 72 Green V MT/s Quad 0 C to +95 C DDR3 SDRAM 240-pin VLP RDIMM 2GB x72 9 Green MT/s Single 0 C to +95 C 4GB x72 9, 18 Green V MT/s Single, Dual 0 C to +95 C 8GB x72 18 Green V MT/s Single, Dual 0 C to +95 C 16GB x72 36 Green V MT/s Dual, Quad 0 C to +95 C 32GB x72 72 Green 1.35V 1333 MT/s Quad 0 C to +95 C DDR3 SDRAM 240-pin LRDIMM 16GB x72 36 Green 1.35V 1600 MT/s Quad 0 C to +95 C 32GB x72 72 Green 1.35V1.5V MT/s Quad 0 C to +95 C 64GB x Green, Yes 1.35V1.5V MT/s Octal 0 C to +95 C DRAM Modules DDR3 SDRAM 244-pin Mini-UDIMM 2GB x72 9 Green 1.35V1.5V MT/s Single 0 C to +95 C 4GB x72 9, 18 Green 1.35V1.5V 1333 MT/s Single, Dual 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR3 SDRAM 244-pin Mini-RDIMM 4GB x72 18 Green 1.5V 1333 MT/s Dual 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR3 SDRAM 244-pin VLP Mini-UDIMM 2GB x72 9 Green 1.5V 1333 MT/s Single 0 C to +95 C, 40 C to +95 C 4GB x72 9 Green 1.35V 1333 MT/s Single 0 C to +95 C, 40 C to +95 C 8GB x72 18 Green 1.35V 1600 MT/s Dual 0 C to +95 C DDR3 SDRAM 244-pin VLP Mini-RDIMM 4GB x72 9 Green 1.35V 1333 MT/s Single 40 C to +95 C 8GB x72 18 Green 1.35V 1333 MT/s Dual 40 C to +95 C DDR2 SDRAM 240-pin UDIMM 512MB x64 4 Yes 1.8V 800 MT/s Single 0 C to +85 C 1GB x64 8 Green 1.8V 800 MT/s Single 0 C to +85 C 2GB x64 16 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin ECC UDIMM 1GB x72 9 Yes 1.8V MT/s Single 0 C to +85 C 2GB x72 9, 18 Yes 1.8V MT/s Single, Dual 0 C to +85 C 4GB x72 18 Yes 1.8V MT/s Dual 0 C to +85 C 9

10 Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR2 SDRAM 200-pin SODIMM 256MB x64 4 Yes 1.8V 800 MT/s Single 0 C to +85 C 512MB x64 4 Yes, Green 1.8V 800 MT/s Single 0 C to +85 C 1GB x64 8 Yes, Green 1.8V MT/s Single, Dual 0 C to +85 C 2GB x64 16 Yes 1.8V MT/s Dual 0 C to +85 C 4GB x64 16 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 200-pin SORDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 9, 18 Yes, Green 1.8V 800 MT/s Single, Dual 0 C to +85 C 4GB x72 18, 36 Yes 1.8V MT/s Single, Dual 0 C to +85 C 8GB x72 36 Yes 1.8V MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin VLP RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Single, Dual 0 C to +85 C 4GB x72 18, 36 Yes 1.8V 800 MT/s Dual 0 C to +85 C 8GB x72 36 Yes 1.8V MT/s Dual 0 C to +85 C DDR2 SDRAM 240-pin FBDIMM 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +95 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +95 C 4GB x72 36 Yes 1.8V 800 MT/s Dual 0 C to +95 C 8GB x72 36, 72 Yes 1.8V MT/s Dual, Quad 0 C to +95 C DDR2 SDRAM 244-pin Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C DDR2 SDRAM 244-pin VLP Mini-RDIMM 512MB x72 9 Yes 1.8V 667 MT/s Single 0 C to +85 C 1GB x72 9 Yes 1.8V 800 MT/s Single 0 C to +85 C 2GB x72 18 Yes 1.8V 800 MT/s Dual 0 C to +85 C 4GB x72 18 Yes 1.8V MT/s Dual 0 C to +85 C DDR SDRAM 184-pin UDIMM 256MB x64 4 Yes 2.5V 400 MT/s Single 0 C to +70 C 512MB x64 8 Yes 2.5V 400 MT/s Single 0 C to +70 C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0 C to +70 C 10

11 Density Bus Width Component Count RoHS Voltage Data Rate Module Ranks Temp Range DDR SDRAM 184-pin ECC UDIMM 256MB x64 9 Yes 2.5V 333 MT/s Single 0 C to +70 C 512MB x64 9, 18 Yes, 5/6 2.5V MT/s Single, Dual 0 C to +70 C 1GB x64 18 Yes 2.5V 400 MT/s Dual 0 C to +70 C DDR SDRAM 200-pin SODIMM 128MB x64 4 Yes 2.5V 333 MT/s Single 0 C to +70 C 256MB x64 4, 8 Yes 2.5V MT/s Single, Dual 0 C to +70 C, 40 C to +95 C 512MB x64 8 Yes 2.5V MT/s Single, Dual 0 C to +70 C 1GB x64 16 Yes 2.5V 400 MT/s Dual 0 C to +70 C DDR SDRAM 200-pin ECC SODIMM 256MB x72 9 Yes, 5/6 2.5V 333 MT/s Single 0 C to +70 C, 40 C to +95 C 512MB x72 9 Yes, 5/6 2.5V MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V MT/s Dual 0 C to +70 C DDR SDRAM 184-pin RDIMM 256MB x72 9 Yes 2.5V 400 MT/s Single 0 C to +70 C 512MB x72 9 Yes 2.5V MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V MT/s Single, Dual 0 C to +70 C 2GB x72 36 Yes 2.5V MT/s Dual 0 C to +70 C 4GB x72 36 Yes 2.5V 333 MT/s Dual 0 C to +70 C Modules DDR SDRAM 184-pin VLP RDIMM 512MB x72 9 Yes 2.5V 400 MT/s Single 0 C to +70 C 1GB x72 18 Yes 2.5V 333 MT/s Dual 0 C to +70 C Density Bus Width Component Count RoHS Voltage Clock Rate Module Ranks Temp Range SDRAM 168-pin UDIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0 C to +70 C 128MB x64 4 Yes, 5/6 3.3V 133 MHz Single 0 C to +70 C 256MB x64 8, 16 Yes 3.3V 133 MHz Single, Dual 0 C to +70 C SDRAM 168-pin ECC UDIMM 128MB x72 9 Yes 3.3V 133 MHz Single 0 C to +70 C 256MB x72 18 Yes 3.3V 133 MHz Dual 0 C to +70 C SDRAM 144-pin SODIMM 64MB x64 4 Yes 3.3V 133 MHz Single 0 C to +70 C 128MB x64 4, 8 Yes 3.3V 133 MHz Single, Dual 0 C to +70 C 256MB x64 8 Yes, 5/6 3.3V 133 MHz Dual 0 C to +70 C 512MB x64 16 Yes 3.3V 133 MHz Dual 0 C to +70 C SDRAM 168-pin RDIMM 128MB x72 9 Yes, 5/6 3.3V 133 MHz Single 0 C to +70 C 256MB x72 9 Yes 3.3V 133 MHz Single 0 C to +70 C 512MB x72 18 Yes 3.3V 133 MHz Single 0 C to +70 C 11

12 NAND Flash Density Bus Width Voltage Interface Package Temp Range MT29 SLC NAND Flash* 1Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 2Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 4Gb x8, x16 1.8, 3.3V Async (ONFI 1.0) 48-pin TSOP, 63-ball VFBGA, Wafer 0 C to +70 C, 8Gb x8, x16 1.8, 3.3V 16Gb x8, x16 1.8, 3.3V 32Gb x8 3.3V 64Gb x8 3.3V 128Gb x8 3.3V Async (ONFI 1.0)/ Sync (ONFI 2.1) Async/Sync (ONFI 2.1/2.2) Async/Sync (ONFI 2.1/2.2/3.0) Async/Sync (ONFI 2.1/2.2/3.0) Async/Sync (ONFI 2.1/2.2/3.0) 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 48-pin TSOP, 63-ball VFBGA, 100-ball VBGA, Wafer 48-pin TSOP, 100-ball VBGA, 132-ball VBGA 48-pin TSOP, 100-ball VBGA, 100-ball TBGA, 132-ball VBGA, 152-ball VBGA 48-pin TSOP, 100-ball TBGA, 100-ball LBGA, 132-ball TBGA, 152-ball VBGA 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 0 C to +70 C, 256Gb x8 3.3V Async/Sync (ONFI 2.2/3.0) 100-, 132-ball LBGA, 152-ball TBGA 0 C to +70 C, 512Gb x8 3.3V Async/Sync (ONFI 3.0) 152-ball LBGA 0 C to +70 C, Density Bus Width Voltage Interface Package Temp Range NAND Small Page (SP) Flash* 128Mb x8 3.3V Async 48-pin TSOP 256Mb x8 3.3V Async 48-pin TSOP, 55-ball VFBGA 512Mb x V Async 48-pin TSOP, 63-ball VFBGA Density Bus Width Voltage Interface Package Temp Range MT29 MLC NAND Flash* 16Gb x8 3.3V Async/Sync (ONFI 2.2) 48-pin TSOP, Wafer 0 C to +70 C, 32Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0 C to +70 C, 64Gb x8 3.3V Async/Sync (ONFI 2.2/2.3) 48-pin TSOP, 100-ball VBGA, Wafer 0 C to +70 C, 128Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA, Wafer 0 C to +70 C, 196Gb x8 3.3V Async/Sync (ONFI 3.2) 272-ball VFBGA 0 C to +70 C 256Gb x8 3.3V Async/Sync (ONFI 2.2/2.3/3.0) 48-pin TSOP, 100-ball LBGA, 100-ball TBGA, 132-ball TBGA, 152-ball VBGA 0 C to +70 C, 512Gb x8 3.3V Async/Sync (ONFI 2.2/3.2) 132-ball LBGA, 152-ball TBGA, 272-ball TFBGA 0 C to +70 C, 1Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball TFBGA/LFBGA 0 C to +70 C, 2Tb x8 3.3V Async/Sync (ONFI 3.2) 152-ball LBGA, 272-ball LFBGA 0 C to +70 C *Products meet RoHS standards. 12

13 Density Bus Width Voltage Technology Package Temp Range MT29 Serial NAND Flash* 1Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, 2Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, 4Gb x1 3.3V SLC 63-ball VFBGA 0 C to +70 C, *Products meet RoHS standards. Managed NAND Density Bus Width Voltage Technology JEDEC Package Temp Range Applications MTFC and N2M4 e MMC Memory for Embedded 2GB 4GB 4GB 8GB 8GB 16GB 32GB 64GB x8 x8 x8 x8 x8 x8 x8 x8 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) 3.3V CC (3.3V/1.8V V CCQ ) Density Package RoHS Voltage Interface Temp Range MTED and MTFD Embedded USBs 25nm MLC ball WFBGA 25 C to +85 C Consumer 25nm MLC ball LBGA, 153-ball TFBGA, 153-ball WFBGA 25nm MLC ball WFBGA 25nm MLC ball LBGA, 153-ball TFBGA, 153-ball WFBGA 25nm MLC ball WFBGA 25nm MLC nm MLC ball LBGA, 169-ball TFBGA, 169-ball WFBGA 100-ball LBGA, 169-ball TFBGA, 169-ball VFBGA 25nm MLC ball LBGA/LFBGA Note: Products meet RoHS standards. Enhanced SLC partition 100% of the user area. 2GB eusb Yes 5V, 3.3V USB C to +70 C, 4GB eusb Yes 5V, 3.3V USB C to +70 C, 8GB eusb Yes 5V, 3.3V USB C to +70 C, 16GB eusb Yes 5V, 3.3V USB C to +70 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, 25 C to +85 C, Consumer, Industrial, Automotive Consumer Consumer, Industrial, Automotive Consumer Consumer, Industrial, Automotive Consumer, Industrial, Automotive Consumer, Industrial, Automotive NAND Flash Managed NAND Density Bus Width RoHS Voltage Bits/Cell Package Temp Range MT29 Enhanced ClearNAND Flash Memory 32GB x8 Yes 3.3V MLC 100-ball LBGA 0 C to +70 C 64GB x8 Yes 3.3V MLC 100-ball LBGA 0 C to +70 C 13

14 NOR Flash Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M29AW Parallel NOR Flash Automotive 512Mb x16 Yes V 100ns 1Gb x16 Yes V 100ns Note: Available in tape and reel. M29DW Parallel NOR Flash Automotive 56-pin TSOP, 56-ball BGA 56-pin TSOP, 56-ball BGA High/Low Lock High/Low Lock 32Mb x8/x16 Yes V 70ns 48-pin TSOP Multibank 256Mb x16 Yes V 70ns 56-pin TSOP Multibank Note: Available in tray or tape and reel. M29F Parallel NOR Flash Automotive 2Mb x8/x16 Yes V 55ns 4Mb x8/x16 Yes, No V 55ns 8Mb x8/x16 Yes V 55ns 16Mb x8/x16 Yes V 55ns Note: Available in tray or tape and reel. M29W Parallel NOR Flash Automotive 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP 44-pin SOIC, 48-pin TSOP Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 4Mb x8/x16 Yes V 55ns 8Mb x8/x16 Yes V 70ns 16Mb x8/x16 Yes V 70ns, 80ns 32Mb x8/x16 Yes V 70ns, 80ns 64Mb x8/x16 Yes V 60ns, 70ns 128Mb x8/x16 Yes V 70ns 256Mb x8/x16 Yes V 70ns 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-pin TSOP, 48-ball TFBGA 48-, 56-pin TSOP, 48-ball TFBGA, 64-ball TBGA 56-pin TSOP, 64-ball FBGA, 64-ball TBGA 56-pin TSOP, 64-ball FBGA, 64-ball TBGA Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot, High/Low Lock High/Low Lock High/Low Lock, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 512Mb x8/x16 Yes V 70ns 56-pin TSOP Low Lock Note: Available in tray or tape and reel. 14

15 Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M58BW Parallel NOR Flash Automotive 16Mb x32 Yes, No V M58WR Parallel NOR Flash Automotive 45ns, 55ns, 70ns 32Mb x32 Yes, No V 45ns, 55ns Note: Available in tape and reel. 80-ball LBGA, 80-pin PQFP 80-ball LBGA, 80-pin PQFP Bottom Boot Bottom Boot 40 C to +125 C 40 C to +125 C 32Mb x16 Yes V 70ns 56-ball VFBGA Bottom Boot 64Mb x16 Yes V 70ns 56-ball VFBGA Bottom/Top Boot Note: Available in tray or tape and reel. Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range G18 Parallel NOR Flash Embedded 256Mb x16 Yes V 512Mb x16 Yes V 1Gb x16 Yes V 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync 96ns, 133 MHz/Sync 64-ball Easy BGA 64-ball Easy BGA 64-ball Easy BGA Uniform, AD, AA/D MUX Uniform, AD, AA/D MUX Uniform, AD, AA/D MUX Note: Available in tray or tape and reel. Also available in AD and AA/D MUX configurations for 50%-reduced active ball count. J3 Parallel NOR Flash Embedded 32Mb x8/x16 Yes, No V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 64Mb x8/x16 Yes, No V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 128Mb x8/x16 Yes, No V 75ns 56-pin TSOP, 64-ball Easy BGA Uniform, In-Sys Pgm 256Mb x8/x16 Yes, No V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Uniform M28W Parallel NOR Flash Embedded 16Mb x16 Yes V 70ns 32Mb x16 Yes V 70ns 64Mb x16 Yes V 70ns 48-pin TSOP, 46-ball TFBGA 48-pin TSOP, 47-ball TFBGA 48-pin TSOP, 48-ball TFBGA Bottom/Top Boot Bottom/Top Boot Bottom/Top Boot Notes: Available in tray or tape and reel. Features: Hardware write protection, OTP space, OTP SD, Krypto Flex Lock, Krypto Encrypted Access SD. NOR Flash 15

16 Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range M29DW Parallel NOR Flash Embedded 32Mb x8/x16 Yes V 70ns 48-pin TSOP, 48-ball-TFBGA Multibank 128Mb x8/x16, x16 Yes V 60ns, 70ns 64-ball TBGA, 56-pin TSOP Multibank 256Mb x16 Yes V 70ns 56-pin TSOP, 64-ball TBGA Multibank M29EW Parallel NOR Flash Embedded 32Mb x8/x16 Yes V 60ns, 70ns 64Mb x8/x16 Yes V 60ns, 70ns 128Mb x8/x16 Yes, No V 60ns, 70ns 256Mb x8/x16 Yes, No V 512Mb x8/x16 Yes, No V 1Gb x8/x16 Yes, No V M29W Parallel NOR Flash Embedded 100ns, 110ns 100ns, 110ns 100ns, 110ns 48-pin TSOP, 48-ball BGA 48-, 56-pin TSOP, 64-ball FBGA, 48-ball BGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA 56-pin TSOP, 64-ball FBGA Bottom/Top Boot, High/Low Lock Bottom/Top Boot, High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure High/Low Lock, Secure 2Gb x8/x16 Yes, No V 100ns 64-ball FBGA High/Low Lock 4Mb x8/x16 Yes V 45ns, 55ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 8Mb x8/x16 Yes V 45ns, 70ns 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 16Mb x8/x16 Yes V 70ns 64-ball FBGA, 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 32Mb x8/x16 Yes V 70ns 64-ball FBGA, 48-ball TFBGA, 48-pin TSOP Bottom/Top Boot 64Mb x8/x16 Yes V 60ns, 70ns, 90ns 64-ball FBGA, 48-ball TFBGA, 48-, 56-pin TSOP, 64-ball TBGA Bottom/Top Boot, High/Low Lock, Secure 128Mb x8/x16 Yes V 60ns, 70ns, 90ns 64-ball FBGA, 64-pin LBGA 64-ball TBGA, 56-pin TSOP High/Low Lock, Secure 256Mb x8/x16 Yes V 70ns 64-ball FBGA, 64-ball TBGA, 56-pin TSOP High/Low Lock, Secure 16

17 Density Bus Width RoHS Voltage Speed Package Boot Block Temp Range P30 Parallel NOR Flash Embedded 64Mb x16 Yes, No V 65ns, 75ns 128Mb x16 Yes, No V 65ns, 75ns 256Mb x16 Yes, No V 100ns, 110ns 512Mb x16 Yes, No V 100ns, 110ns 1Gb x16 Yes, No V 100ns, 110ns 56-pin TSOP, 64-ball Easy BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA, 88-ball Quad+ BGA 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP Bottom/Top Boot, OTP Bottom/Top Boot, OTP Bottom/Top Boot, Uniform Bottom/Top Boot, Uniform 2Gb x16 Yes V 105ns 64-ball Easy BGA Uniform P33 Parallel NOR Flash Embedded 64Mb x16 Yes, No V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 128Mb x16 Yes, No V 60ns, 70ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 256Mb x16 Yes, No V 85ns, 95ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, OTP 512Mb x16 Yes, No V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA Bottom/Top Boot, Uniform, OTP 1Gb x16 Yes V 95ns, 105ns 56-pin TSOP, 64-ball Easy BGA 2Gb x16 Yes V 100ns 64-ball Easy BGA Bottom/Top Boot, Uniform Bottom/Top Boot, Uniform NOR Flash 17

18 Density Bus Width RoHS Voltage Speed Package Type Temp Range M25P Serial NOR Flash Automotive 1Mb x1 Yes V 50 MHz 8-pin SO8 Narrow, 8-pin U-PDFN Data Storage 2Mb x1 Yes V 75 MHz 8-pin SO8 Narrow Data Storage 4Mb x1 Yes V 75 MHz 8Mb x1 Yes V 75 MHz 16Mb x1 Yes V 75 MHz 32Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin U-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide 8-pin SO8 Narrow, 8-pin SO8 Wide 8-pin SO8 Narrow, 8-pin SO8 Wide Data Storage Data Storage Data Storage Data Storage 64Mb x1 Yes V 75 MHz 16-pin SO16 Wide Data Storage Note: Available in tray, tube, or tape and reel. M25PE Serial NOR Flash Automotive, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C, 40 C to +125 C 1Mb x1 Yes V 75 MHz 8-pin SO8 Narrow Page Erase, 40 C to +125 C 2Mb x1 Yes V 75 MHz 8-pin SO8 Narrow Page Erase 4Mb x1 Yes V 75 MHz 8-pin SO8 Narrow Page Erase 8Mb x1 Yes V 75 MHz 8-pin SO8 Narrow Page Erase Note: Available in tape and reel. N25Q Serial NOR Flash Automotive 32Mb x1/x2/x4 Yes V 108 MHz 8-pin SO8 Narrow, 16-pin SO16 Wide Multi I/O, 40 C to +125 C 32Mb x1/x2/x4 Yes V 108 MHz 8-pin SO8 Wide Multi I/O 40 C to +125 C 64Mb x1/x2/x4 Yes V, V 108 MHz 128Mb x1/x2/x4 Yes V 108 MHz 256Mb x1/x2/x4 Yes V 108 MHz 8-pin V-PDFN-8, 8-pin SO8 Wide, 16-pin SO16 Wide, 24-ball TBGA 8-pin V-PDFN-8, 16-pin SO16 Wide, 24-ball TBGA 8-pin V-PDFN-8, 16-pin SO16 Wide, 24-ball TBGA Multi I/O Multi I/O Multi I/O, 40 C to +125 C, 40 C to +105 C, 40 C to +125 C, 40 C to +125 C 512Mb x1/x2/x4 Yes V 108 MHz 16-pin SO16 Wide Multi I/O 40 C to +125 C Note: Available in tape and reel. M25PX Serial NOR Flash Automotive 8Mb x1/x2 Yes V 75 MHz 8-pin SO8 Narrow Dual I/O, 40 C to +125 C 16Mb x1/x2 Yes V 75 MHz 8-pin SO8 Narrow Dual I/O 32Mb x1/x2 Yes V 75 MHz 64Mb x1/x2 Yes V 75 MHz Note: Available in tube or tape and reel. 8-pin V-PDFN-8, 24-ball TBGA 16-pin SO16 Wide, 24-ball TBGA Dual I/O Dual I/O 18

19 Density Bus Width RoHS Voltage Speed Package Type Temp Range M25P Serial NOR Flash Embedded 512K x1 Yes V 50 MHz 1Mb x1 Yes V 50 MHz 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN Data Storage Data Storage 2Mb x1 Yes V 75 MHz 8-pin V-PDFN, 8-pin SO8 Narrow Data Storage 4Mb x1 Yes V 75 MHz 8Mb x1 Yes V 75 MHz 16Mb x1 Yes V 75 MHz 32Mb x1 Yes V 75 MHz 8-pin U-PDFN, 8-pin SO8 Narrow, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN 16-pin SO16 Wide, 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN, KGD 16-pin SO16 Wide, 8-pin SO8 Wide, 8-pin V-PDFN Data Storage Data Storage Data Storage Data Storage 64Mb x1 Yes V 75 MHz 16-pin SO16 Wide, 8-pin V-PDFN Data Storage 128Mb x1 Yes V 75 MHz 8-pin V-PDFN, 16-pin SO16 Wide Data Storage Note: Available in tray, tube, or tape and reel. M25PE Serial NOR Flash Embedded 1Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, KGD Page Erase 2Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, KGD Page Erase 4Mb x1 Yes V 75 MHz 8Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN Page Erase Page Erase 16Mb x1 Yes V 75 MHz 8-pin SO8 Wide, 8-pin V-PDFN Page Erase Note: Available in tray, tube, or tape and reel. M25PX Serial NOR Flash Embedded 8Mb x1/x2 Yes V 75 MHz 16Mb x1/x2 Yes V 75 MHz 32Mb x1/x2 Yes V 75 MHz 64Mb x1/x2 Yes V 75 MHz Note: Available in tray, tube, or tape and reel. 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin V-PDFN, 24-ball T-PBGA, KGD 8-pin SO8 Wide, 8-pin V-PDFN, 24-ball TBGA 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball TBGA, 24-ball T-PBGA Dual I/O Dual I/O Dual I/O Dual I/O NOR Flash 19

20 Density Bus Width RoHS Voltage Speed Package Type Temp Range M45PE Serial NOR Flash Embedded 1Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN Page Erase 2Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN Page Erase 4Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, 8-pin SO8 Wide Page Erase 8Mb x1 Yes V 75 MHz 8-pin SO8 Narrow, 8-pin V-PDFN, 8-pin SO8 Wide Page Erase 16Mb x1 Yes V 75 MHz 8-pin V-PDFN, 8-pin SO8 Wide Page Erase Note: Available in tray, tube, or tape and reel. N25Q Serial NOR Flash Embedded 16Mb x1/x2/x4 Yes V 108 MHz 8-pin XF-SCSP, 8-pin SO8 Wide, 8-pin SO8 Narrow Multi I/O 32Mb x1/x2/x4 Yes V, V 108 MHz 8-pin SO8 Narrow, 8-pin SO8 Wide, 8-pin U-PDFN, 8-pin V-PDFN Multi I/O 64Mb x1/x2/x4 Yes V, V 108 MHz 8-pin SO8 Wide, 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA, KGD, SOP Multi I/O 128Mb x1/x2/x4 Yes V, V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA, 8-pin V-PDFN, 8-pin SO8 Wide Multi I/O 256Mb x1/x2/x4 Yes V, V 108 MHz 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O 512Mb x1/x2/x4 Yes V, V 108 MHz 8-pin V-PDFN, 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O 1Gb x1/x2/x4 Yes V 108 MHz 16-pin SO16 Wide, 24-ball T-PBGA Multi I/O Note: Available in tray, tube, or tape and reel. Density Bus Width RoHS Voltage Speed Package Type Temp Range N25W Serial NOR Flash Mobile 32Mb x4 Yes V 108 MHz 64Mb x4 Yes V 108 MHz 8-pin V-PDFN, 8-pin SO8 Wide 8-pin V-PDFN, 8-pin SO8 Wide Multi I/O Multi I/O 25 C to +85 C 25 C to +85 C 128Mb x4 Yes V 108 MHz 8-pin V-PDFN Multi I/O 25 C to +85 C 256Mb x4 Yes V 108 MHz 8-pin V-PDFN Multi I/O Note: Available in tray or tape and reel. 20

21 Solid State Drives SSDs Capacity Package Height MT/s READ Performance WRITE Performance Voltage Interface Operating Temp M500 Self-Encrypting Drive (SED) 120GB 2.5in 7mm 6.0 Gb/s 500 MB/s 130 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 240GB 2.5in 7mm 6.0 Gb/s 500 MB/s 250 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 480GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 960GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 120GB msata 3.75mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 240GB msata 3.75mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 480GB msata 3.75mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 120GB M.2 3.5mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 240GB M.2 3.5mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C 480GB M.2 3.5mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s 0 C to +70 C Capacity Package Height Random READ Random WRITE Sequential READ Sequential WRITE Voltage Interface Operating Temp P400e SSD 50GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 100 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 100GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 50K IOPS 7K IOPS 350 MB/s 140 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C P400m SSD 100GB 2.5in 7mm 50K IOPS 14K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 55K IOPS 16K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 55K IOPS 17K IOPS 350 MB/s 300 MB/s 5V±10% SATA 6.0 Gb/s 0 C to +70 C P300 SSD 50GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 100GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 9.5mm 60K IOPS 45K IOPS 360 MB/s 275 MB/s 5V SATA 6.0 Gb/s 0 C to +70 C P410m SSD 100GB 2.5in 7mm 50K IOPS 20K IOPS 410 MB/s 235 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 200GB 2.5in 7mm 50K IOPS 30K IOPS 410 MB/s 345 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 400GB 2.5in 7mm 50K IOPS 30K IOPS 410 MB/s 345 MB/s 12V SATA 6.0 Gb/s 0 C to +70 C 21

22 Capacity Package Height Random READ Random WRITE Sequential READ Sequential WRITE Voltage Interface Operating Temp P320h PCIe SSD 175GB 2.5in 9.5mm 415K IOPS (MAX4KB) 145K IOPS 1.75 GB/s 1.1 GB/s 12V x4 PCIe Gen2 0 C to +70 C 350GB 2.5in 9.5mm 415K IOPS (MAX4KB) 145K IOPS 1.75 GB/s 1.1 GB/s 12V x4 PCIe Gen2 0 C to +70 C 350GB HHHL 9.5mm 785K IOPS 205K IOPS 3.2 GB/s 1.9 GB/s 12V x8 PCIe Gen2 0 C to +50 C 700GB HHHL 9.5mm 785K IOPS 205K IOPS 3.2 GB/s 1.9 GB/s 12V x8 PCIe Gen2 0 C to +50 C P420m PCIe SSD 350GB 2.5in 9.5mm 430K IOPS (MAX 4KB) TBD 1.8 GB/s 325 MB/s 12V x4 PCIe Gen2 0 C to +70 C 700GB 2.5in 9.5mm 430K IOPS (MAX 4KB) TBD 1.8 GB/s 325 MB/s 12V x4 PCIe Gen2 0 C to +70 C 700GB HHHL 9.5mm 750K IOPS 95K IOPS 3.3 GB/s 630 MB/s 12V x8 PCIe Gen2 0 C to +50 C 1.4TB HHHL 9.5mm 750K IOPS 95K IOPS 3.3 GB/s 630 MB/s 12V x8 PCIe Gen2 0 C to +50 C 22

23 Multichip Packages NAND Density MT29 NAND Flash-Based MCPs 1Gb Bus Width x8, x16 LPDDR Density 256Mb, 512Mb 256Mb, 512Mb x16, x V 166 MHz, 200 MHz 2Gb x8, x16 1Gb x16, x V 200 MHz 4Gb x8, x16 2Gb, 4Gb x V 200 MHz 107-ball TFBGA/VFBGA, 130-ball VFBGA, 137-ball TFBGA, 153-ball VFBGA 107-ball TFBGA, 130-ball VFBGA, 137-ball TFBGA, 153-ball VFBGA 137-ball TFBGA/VFBGA, 168-ball VFBGA 25 C to +85 C 8Gb x8, x16 4Gb x V 200 MHz 137-ball TFBGA, 168-ball VFBGA 25 C to +85 C Note: Products meet RoHS standards. LPSDR Density Secondary Bus Width Voltage Clock Rate Package Temp Range SSDs MCPs Bare Die and Wafer-Level Products Requirements for increasingly smaller form factors and higher memory densities are fueling the need for an array of bare die memory solutions. Our bare die offerings are designed to enable you to choose the wafer-level products that best meet your project s needs. And we re committed to delivering bare die products that maintain reliability and quality levels similar to our fully tested and burned-in packaged devices. Find out more at micron.com/baredie. 23

24 Hybrid Memory Cube Hybrid Memory Cube (HMC) is a revolutionary innovation in DRAM memory architecture that sets a new standard for memory performance, power consumption, and cost. Combining high-speed logic process technology with a stack of through-silicon via (TSV) bonded memory die, HMC delivers dramatic improvements in performance and enables ultra-high bandwidth for applications ranging from networking, communications, and computing, to consumer technologies like tablets and graphics cards. Engineering samples of this high-bandwidth, low-energy, high-density memory system are now available. Work with your sales representative or visit micron.com/products/hmc for more information. Increased Bandwidth Provides 15X the performance of a DDR3 module Power Reductions Uses 70% less energy per bit than DDR Smaller Physical Systems Uses nearly 90% less space than today s RDIMMs due to HMC s stacked architecture Scalable Includes logic layer flexibility, which enables HMC to be tailored to multiple platforms and applications Reduced Latency Enables significantly lower system latency as a result of HMC s massive parallelism Ultra Reliability Delivers greater resilience and field reparability with a new paradigm of system-level, advanced RAS features that include embedded error checking and correction capabilities Abstracted Memory Enables designers to leverage HMC s revolutionary features and performance without having to interface with complex memory parameters; manages error correction, resiliency, refresh, and other parameters exacerbated by memory process variation Low TCO Lowers TCO thanks to HMC s high performance, low energy, and RAS capabilities Density Link Description (Gb/s) Links MAX Effective BW (GB/s) Package Description Hybrid Memory Cube (HMC) 2GB 15G SR x ball BGA, 21mm x 31mm x 4mm 2GB 15G SR x ball FBGA, 16mm x19.5mm x 3.9mm 24

25 Part Numbering DDR4, DDR3, DDR2, DDR, SDRAM, Mobile LPDDR2/LPDDR/LPSDR, and RLDRAM Memory Micron Technology Product Family 40 = DDR4 SDRAM 41 = DDR3 SDRAM 42 = Mobile LPDDR2 44 = RLDRAM 3 Memory 46 = DDR SDRAM/ Mobile LPDDR Process Technology A = 1.2V V DD CMOS C = 5.0V V CC CMOS G = 3.0V V DD CMOS H = 1.8V V DD CMOS HC = 1.8V V DD CMOS, 1.2V I/O J = 1.5V V DD CMOS Device Number (depth, width) Blank = Bits M = Megabits K = Kilobits G = Gigabits Device Versions Alphanumeric character(s) specified by individual data sheet. L2, S2, and S4 devices are made with dual die in package. Mobile devices C1 = Single die, 2n prefetch C2 = 2-die stack, 2n prefetch D1 = Single die, 4n prefetch D2 = 2-die stack, 4n prefetch D4 = 4-die stack, 4n prefetch LA = 2-die stack, reduced-page-size addressing LF = Single die, standard addressing LG = Single die, reduced-page-size addressing L2 = 2-die stack, standard addressing L4 = 4-die stack, standard addressing R4 = 4-die stack, reduced-page-size addressing RLDRAM only Blank = Common I/O C = Separate I/O Package Codes Lead Plating DDR4 SDRAM Pb-Free/RoHS- Compliant Plating HA HX TRF 47 = DDR2 SDRAM 48 = SDRAM/ Mobile LPSDR 49 = RLDRAM 1 & 2 Memory 52 = Mobile LPDDR3 MT 48 A 128M16 D1 KL - 25 IT ES :A K = 1.35V V DD CMOS L = 1.2V V DD CMOS LC = 3.3V V DD CMOS N = 1.0V V DD CMOS R = 1.55V V DD CMOS V = 2.5V V DD CMOS Package Description 2, 3 FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (Twindie, 78-ball, 9 x 11.5) Package codes and descriptions continued on page 26. Die Revision Designator Special Processing Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperatures Special Options (Multiple processing codes are separated by a space and are listed in hierarchical order.) A = Automotive L = Low Power G = Graphics Blank = Commercial Temperature IT 1 = Industrial Temperature AT = Automotive Temperature WT = Wireless Temperature 1 The number one (1) and the capital letter I utilize the same laser mark I DRAM Technology Speed Grade Mark All DRAM -0 -A Speed Grade Mark DDR4 SDRAM -107E -107H -093E -093H -083E DDR3 SDRAM E E E -15F E M = Reduced Standby X = Premium Lifecycle Product (PLP) Access/Cycle Time MAX Clock Frequency 933 MHz 933 MHz 1067 MHz 1067 MHz 1200 MHz 400 MHz 400 MHz 533 MHz 533 MHz 667 MHz 667 MHz 667 MHz 800 MHz 800 MHz 933 MHz 1067 MHz t RAC Access Time Untested Untested PC Targets CL- t RCD- t RP Access/cycle time continued on page 26. HMC Part Numbering 25

26 DRAM Component Part Numbering (Continued) Package Codes Lead Plating DDR3 SDRAM DDR2 SDRAM FP FG JN HW F6 FN HV HW PK DDR SDRAM CV FG FN TG SDRAM FB FG F4 F5 TG xtg Pb-Free/ RoHS- Plating DA HA HX JP JT RA RE RH SHM STA SMA SLD THD THE THG THV THA TNA THW TRF BP BG CF HR B6 BN HQ HR RT HG EB WTR THM THN THN WTR THT CY BG BN P BB BG B4 B5 P xp RLDRAM 1 and 2 FM HU RLDRAM 3 PA PKM BM HT RB RCT Package Description 2, 3 FBGA (78-ball, 8 x 10.5) FBGA (96-ball, 9 x 14) FBGA (78-ball, 9 x 11.5) FBGA (78-ball, 8 x 11.5) FBGA (96-ball, 8 x 14) FBGA (78-ball, 10.5 x 12) FBGA (96-ball, 10.5 x 12) FBGA (78-ball, 9 x 10.5) FBGA (QuadDie, 78-ball, 10.5 x 12) FBGA (QuadDie, 3DS, 78-ball, 10.5 x 12) FBGA (QuadDie, 78-ball, 9.5 x 11.5) FBGA (TwinDie, 136-ball, 10 x 14) FBGA (TwinDie, 78-ball, 9 x 11.5 x 1.2) FBGA (TwinDie, 78-ball, 10.5 x 12) FBGA (TwinDie, 3DS, 78-ball, 10.5 x 12) FBGA (TwinDie, 78-ball, 8 x 11.5) FBGA (QuadDie, 78-ball, 10 x 11.5) FBGA (TwinDie, 96-ball, 10x14, x8 + x8) FBGA (QuadDie, 78-ball, 8 x 11.5) FBGA (TwinDie, 78-ball, 9.5 x 11.5) FBGA (60-ball, 8 x 12) FBGA (84-ball, 8 x 14) FBGA (60-ball, 8 x 10) FBGA (84-ball, 8 x 12.5) FBGA (60-ball, 10 x 10) FBGA (84-ball, 10 x 12.5) FBGA (60-ball, 8 x 11.5) FBGA (84-ball, 8 x 12.5) FBGA (84-ball, 9 x 12.5) FBGA (60-ball, 84-ball, 11.5 x 14) FBGA (60-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 12 x 14) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (TwinDie, 63-ball, 8 x 10 [1Gb, 50nm only]) FBGA (TwinDie, 63-ball, 9 x 11.5) FBGA (Quad die, 65-ball, 9 x 11.5) FBGA (84-ball, 60-ball, 8 x 12.5) FBGA (84-ball, 60-ball, 8 x 14) FBGA (54-ball, 60-ball, 84-ball, 10 x 12.5) TSOP (Type II) FBGA (60-ball, 8 x 16) VFBGA (54-ball); FBGA (84-ball, 60-ball, 8 x 14) VFBGA (54-ball, 8 x 8) VFBGA (90-ball, 8 x 13) TSOP (Type II) Stacked TSOP, x = internal stacking code µbga (144-ball, 11 x 18.5) FBGA (144-ball, 11 x 18.5) FBGA (168-, 169-ball, 13.5 x 13.5 x 1.2) SDP FBGA (168-, 169-ball, 13.5 x 13.5 x 1.45) DDP Pb-Free/ RoHS- Plating Mobile LPDDR3 2 Due to space limitations, FBGA- and µbga-packaged components and flip chips in packages have an abbreviated part mark that is different from the part number. See our Web site for more information on abbreviated component marks. 3 Dimensions in millimeters. Note: Some device offerings are available in a VFBGA rather than an FBGA package; this is noted on the data sheet. EL EM EN ET Mobile LPDDR2 AB AC EU EV GU GV KH KJ KL KP KQ KU KV LC LD LE LF LG LH LK LL LM MA MC MG MH MP Mobile LPDDR BF B5 B7 CK CM CX JV KQ MA Mobile LPSDR B4 B5 BF Package Description 2, 3 WFBGA (178-ball SDP, 11 x 11.5 x 0.8) VFBGA (178-ball DDP, 11 x 11.5 x 0.9) VFBGA (253-ball DDP, 11.5 x 11.5 x 0.9) TFBGA (178-ball QDP, 11 x 11.5 x 1.2) PoP (121-ball SDP, 6.5 x 8 x 0.8) PoP (134-ball DDP ICE, 10 x 11.5 x.65) PoP (253-ball DDP, 11 x 11 x 0.9) PoP (253-ball DDP, 11 x 11 x 1.2) PoP (134-ball SDP, 10 x 11 x 0.7) PoP (134-ball DDP, 10 x 11 x.85) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP & DDP, 12 x 12 x 0.8) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball JD32, 12 x 12 x 0.75) PoP (216-ball 3DP, 12 x 12 x 0.9) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (240-ball QDP, 14 x 14 x 1) PoP (220-ball QDP, 14 x 14 x 1) PoP (168-ball 3DP, 12 x 12 x 1, 0.35mm ball) PoP (168-ball SDP, 12 x 12 x 0.75) PoP (168-ball DDP, 12 x 12 x 0.8) PoP (216-ball SDP, 12 x 12 x 0.65) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball DDP, 12 x 12 x 0.8) PoP (216-ball QDP, 12 x 12 x 1) PoP (168-ball SDP, 12 x 12 x 0.7) PoP (240-ball DDP, 14 x 14 x 0.8) PoP (134-ball QPD, 11.5 x 11.5 x 1.2) PoP (134-ball QPD, 11 x 11.5 x 1) PoP (220-ball DDP, 14 x 14 x 0.8) VFBGA (60-ball SDP, 8 x 9 x 1) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 10 x 10 x 1) VFBGA (60-ball SDP, 10 x 11.5 x 1) VFBGA (90-ball SDP, 10 x 13 x 1) VFBGA (90-ball SDP, 9 x 13 x 1) PoP (168-ball QDP, 12 x 12 x 1) PoP (168-ball DDP, 12 x 12 x 0.75) PoP (168-ball SDP, 12 x 12 x 0.7) VFBGA (54-ball SDP, 8 x 8) VFBGA (90-ball SDP, 8 x 13 x 1) VFBGA (60-ball SDP, 8 x 9 x 1) Speed Grade Mark DDR2 SDRAM -5E -37E -3-3E E -187E DDR SDRAM -75-6T -6-5B SDRAM -75-7E A Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPSDR MAX Clock Frequency 200 MHz 267 MHz 333 MHz 333 MHz 400 MHz 400 MHz 533 MHz Access/Cycle Time 133 MHz 167 MHz 167 MHz 200 MHz 133 MHz 133 MHz 143 MHz 167 MHz 167 MHz 183 MHz 200 MHz 667 MHz 800 MHz 533 MHz 400 MHz 333 MHz 266 MHz 200 MHz 133 MHz 167 MHz 185 MHz 200 MHz 208 MHz 125 MHz 133 MHz 167 MHz RLDRAM 1 and E -18 RLDRAM E E E 200 MHz 300 MHz 400 MHz MHz MHz 800 MHz MHz MHz MHz MHz MHz 8 4 Available with t RC 20ns. 5 Available with t RC 15ns. 6 Available with t RC (MIN) 12ns. 7 Available with t RC (MIN) 10ns. 8 Available with t RC (MIN) 8ns. PC Targets CL- t RCD- t RP

27 Hybrid Memory Cube Part Numbering MT 43 A 04G NGF - S15 ES :A Micron Technology Product Family 43 = HMC DRAM Voltage A = 1.2V V DD CMOS DRAM Die Density per Layer G = Gigabits Number of DRAM Die in Package Logic Design Designator Sequential Number for Product Variations Package Codes Die Revision Designator Special Processing Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperatures Blank = Standard Temperature Electrical & Physical Link Specification U10 Special Options Blank = No Special Options Link Description SerDes I/O Interface 15 Gb/s 10 Gb/s Codes NFA NFH NGF NGK Package Description (mm) BBGA (896-ball, 4 DRAM high, 31 x 31 x 4) BBGA (896-ball, 8 DRAM high, 31 x 31 x 4) BFBGA (666-ball, 4 DRAM high, 16 x 19.5 x 3.9) BFBGA (666-ball, 8 DRAM high, 16 x 19.5 x 3.9) Part Numbering 27

28 MCP/PoP Part Numbering MT 29C 1G 12M A C A A xx - x IT ES Micron Technology Product Family 28C = NOR + LPDRAM MCP/PoP 27C = OneNAND + LPDRAM MCP/PoP 29C = NAND + LPDRAM MCP/PoP NAND Density 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb LPDRAM Density 56M = 256Mb 12M = 512Mb 40M = 640Mb 24M = 1Gb 52M = 1,152Mb AG = 16Gb BG = 32Gb CG = 64Gb DG = 128Gb 48M = 2Gb 72M = 3Gb 96M = 4Gb 92M = 8Gb Operating Voltage Range A = V B = V C = V D = V F = V NAND Flash Configuration Production Status Blank = Production ES = Engineering Sample DC = Daisy Chain QS = Qualification Sample MS = Mechanical Sample Operating Temperature Range IT = Industrial Temp () W = Wireless (25 C to +85 C) Special Options Blank = Standard E = On-die ECC enabled LPDRAM Access Time -5 = 200 MHz CL3-54 = 185 MHz CL3-6 = 166 MHz CL3-75 = 135 MHz CL3-8 = 125 MHz CL3 Package Code Contact factory Chip Count Type CE# Chip Count Type Width Density Generation C D J K N P U V Y Z x8 x16 x8 x16 x8 x16 x8 x16 x8 x16 1Gb 1Gb 2Gb 2Gb 4Gb 4Gb 1Gb 1Gb 4Gb 4Gb First First Second Second First First Second Second Second Second Type Width Density Generation AA AB AC AD AE AF AG AH AI AJ AL KH x8 x16 x8 x16 x8 x16 x8 x16 x8 x16 x16 x16 2Gb 2Gb 1Gb 1Gb 8Gb 8Gb 4Gb 4Gb 1Gb 1Gb 8Gb 128Gb Third Third Third Third First First Fourth Fourth Fourth Fourth First First A B C D E F G H 1, 1 2, 1 1, 2 2, 2 1, 2 1, 2 1, 2 1, 3 1 NAND, 1 LPDRAM 2 NAND, 1 LPDRAM 1 NAND, 2 LPDRAM 2 NAND, 2 LPDRAM 1 NAND, 3 LPDRAM 2 NAND, 3 LPDRAM 1 NAND, 4 LPDRAM 1 NAND, 3 LPDRAM LPDRAM Configuration 28 A C J L N P R T V Y Z Type Width Density Generation DDR DDR DDR DDR DDR SDR DDR SDR DDR DDR SDR x16 x32 x16 x32 x16 x16 x32 x32 x16 x32 x16 512Mb 512Mb 1Gb 1Gb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 256Mb First First First First Second Second Second Second Third Third First AA AE AF AG AH AJ AK AL AM AN AP AR AS AT AU AV AY AZ BA Type Width Density Generation DDR SDR SDR SDR DDR SDR DDR SDR DDR SDR DDR SDR SDR DDR DDR SDR DDR DDR DDR x16 x16 x32 x16 + x16 x16 x16 x32 x32 x16 x16 x32 x32 x16 (2) + x16 x16 (2) + x32 x32 x32 x32 (x2) x16 x32 256Mb 512Mb 512Mb 512Mb + 128Mb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 1Gb + 128Mb 2Gb + 1Gb 256Mb 256Mb 4Gb + 1Gb 2Gb 2Gb First Third Third First Second First Second First First First First First First First First First First/Second Second Second

29 NOR MCP Part Numbering MT 38W A ZQx * Z W XQ5 - ES Micron Technology Product Family 38L = NOR L-Series + xnand + xdram 38M = NOR M-Series + xnand + xdram 38W = NOR W-Series + xnand + xdram Density Mark NOR xnand xdram A B C D Voltage Range (Core I/O) Die Count 32Mb = 4MB 64Mb = 8MB 128Mb = 16MB 256Mb = 32MB 512Mb = 64MB 768Mb = 96MB 1Gb = 128MB 1.25Gb = 160MB 1.5Gb = 192MB 1.75Gb = 224MB 2Gb = 256MB 3Gb = 384MB 4Gb = 512MB Mark NOR xdram V 3.0V V 3.0V Mark NOR xdram A B NOR Configuration 1.8V 3.0V V 3.0V N/A 16Mb = 2MB 32Mb = 4MB 64Mb = 8MB 128Mb = 16MB 256Mb = 32MB 384Mb = 48MB 512Mb = 64MB 768Mb = 96MB 1Gb = 128MB 1.5Gb = 192MB 2Gb = 256MB 3Gb = 384MB 4Gb = 512MB Production Status Blank = Production ES = Engineering Sample MS = Mechanical Sample Die Revision Code Contact factory Operating Temperature Range I = Industrial () W = Wireless (25 C to +85 C) Special Options Contact factory Package Code ZA = 44-ball VBGA (7.5 x 5 x 1), F10x4+4, Z = 64-ball VBGA (7.7 x 9 x 1), F10x6+4, P.5, B.3 ZQ = 88-ball TFBGA (8 x 10 x 1.2), F8x10+8, 0.8 ZS = 56-ball VFBGA (8 x 6 x 1), 10x6-8+4,.5, B.3 3RZ = 133-ball VFBGA (8 x 8 x 1), 3R14x14+1, 0.5 * x = a null character used as a placeholder xdram Description 0 = N/A 1 = Async PSRAM 2 = Sync PSRAM, No MUX 3 = Sync PSRAM, A/D MUX 4 = Sync PSRAM, AA/D MUX 5 = x16 DDR, 1KB Page 6 = x16 DDR, 2KB Page 7 = x16 DDR, 4KB Page 8 = x32 DDR, 4KB Page NAND Description 0 = N/A Mark Boot MUX A B C Uniform Uniform Uniform Uniform Bottom Bottom Bottom Bottom Top Top Top Top NO AD A/D, AA/D** AA/D NO A/D A/D, AA/D** AA/D NO A/D A/D, AA/D** AA/D ** AA/D interface configurable through register. Part Numbering 29

30 e MMC Memory Part Numbering MT FC xx x x xx - xx xx x x Micron Technology Flash + Controller = FC NAND Density BA = BGA adapter BG = BGA IC guide 2G = 2GB 4G = 4GB 8G = 8GB NAND Component J = MLC, 25nm, 64Gb x 8, 3.3V L = MLC, 25nm, 32Gb x 8, 3.3V M = MLC, 25nm, 16Gb x 8, 3.3V Controller ID U = 4.41 for automotive G = 4.41 for automotive W = 4.51 for automotive 16G = 16GB 32G = 32GB 64G = 64GB V = 4.41 for broad market D = 4.41 for broad market C = 4.51 for broad market Package Codes DM = 153-ball TFBGA (11.5 x 13 x 1.2), Pb-free package DN = 169-ball LFBGA (14 x 18 x 1.4), Pb-free package DQ = 100-ball LBGA (14 x 18 x 1.4), Pb-free package EA = 153-ball WFBGA (11.5 x 13 x 0.8), Pb-free package EC = 169-ball WFBGA (14 x 18 x 0.8), Pb-free package ED = 169-ball VFBGA (14 x 18 x 1), Pb-free package Design Revision Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Wafer Process Applied Blank = Not specified Z = Special processing Operating Temperature Range Blank = 0 C to +70 C WT = Standard: 25 C to +85 C IT = Industrial: AIT = Automotive: + HR-certified test flow Special Options Blank = No special options xx = For broad market: enhanced area/max boot size 30

31 e MMC 100-Ball Stand-Alone Part Numbering N2M 4 00F D B 3 1 1A3 C E Managed NAND e MMC Version 4 = Version 4.41 Density 00F = 4GB 00G = 8GB 00H = 16GB 00J = 32GB Lithography D = 25nm Operating Temperature Range A = Automotive: + HR-certified test flow B = Industrial: Packaging E = Standard tray packaging F = Tape and reel packaging Firmware ID B = Automotive C = Industrial Package 1A3 = 100-ball (14 x 18 x 1.4mm) Configuration 1 = 1 die 2 = 2 die 4 = 4 die Voltage 3 = 3.0V Part Numbering 31

32 DDR4 Module Part Numbering MT 36 A SF 2G 72 P Z - 2G1 A 1 Micron Technology Number of Memory Components Process Technology A = 1.2V Product Family TF = FBGA without temp sensor TS = DDP (dual die in package) without temp sensor TQ = QDP (quad die in package) without temp sensor SF = FBGA with temp sensor SS = DDP with temp sensor SQ = QDP with temp sensor DF = VLP (very low profile) with temp sensor DS = VLP DDP with temp sensor DQ = VLP QDP with temp sensor SZF = FBGA with temp sensor and heat spreader SZS = DDP with temp sensor and heat spreader SZQ = QDP with temp sensor and heat spreader DZF = VLP with temp sensor and heat spreader DZS = VLP DDP with temp sensor and heat spreader DZQ = VLP QDP with temp sensor and heat spreader Module Speed Grade -1G9-1S9-2G1-2S1-2G4 Component Speed Grade/ Part Mark -107E -107H -093E -093H -083E JEDEC Component Speed Grade DDR DDR DDR DDR DDR MB Vendor/Revision (LRDIMM only) Clock Frequency (MHz) Data Rate (MT/s) Printed Circuit Board Revision Designator Die Revision Module Speed Module Bandwidth PC PC PC PC PC Module Configuration SPD (CL- t RCD- t RP) SPD = serial presence-detect pin (module only) CL = CAS latency; t RCD = active-to-command time; t RP = precharge time Device Number (depth, width) Blank = Megabits G = Gigabits Module Version A = 284-pin Unbuffered DIMM H = 256-pin SODIMM L = 284-pin LRDIMM LS = 284-pin 3DS LRDIMM P = 284-pin RDIMM PS = 284-pin 3DS RDIMM Pb-Free Devices Z DZ DZM IZ ZM Package Descriptions Package Codes Commercial temp; halogen-free; single-, dual-, quad-, or octal-rank DIMM Commercial temp; halogen-free; select single-, dual-, quad-, or octal-rank DIMM Commercial temp; reduced standby; halogen-free; select single-, dual-, quad-, or octal-rank DIMM Industrial temp, halogen-free; single-, dual-, or quad-rank DIMM Commercial temp; reduced standby; halogen-free; select single-, dual-, quad-, or octal-rank DIMM 32

33 DDR3 Module Part Numbering MT 36 K SF 2G 72 P Z - 1G6 E 1 Micron Technology Number of Memory Components Process Technology J = 1.5V K = 1.35V M = 1.35V Reduced Standby Product Family TF = FBGA TS = DDP (dual die in package) SF = FBGA with temp sensor SS = DDP with temp sensor SQ = QDP with temp sensor BF = VLP (very low profile) (17.9mm) with temp sensor BS = VLP (17.9mm) DDP with temp sensor DF = VLP (18.75mm) with temp sensor DS = VLP (18.75mm) DDP with temp sensor GF = 1.5U height with temp sensor HF = 2U height with temp sensor LF = 4U height with temp sensor SZF = FBGA with temp sensor and heat spreader SZS = DDP with temp sensor and heat spreader SZQ = QDP with temp sensor and heat spreader BZF = VLP (17.9mm) with temp sensor and heat spreader BZS = VLP (17.9mm) DDP with temp sensor and heat spreader DYS = VLP (18.75mm) with temp sensor and alternate heat spreader DZF = VLP (18.75mm) with temp sensor and heat spreader DZS = VLP (18.75mm) DDP with temp sensor and heat spreader DZQ = VLP (18.75mm) QDP with temp sensor and heat spreader Device Number (depth, width) Blank = Megabits G = Gigabits Module Version Blank = 240-pin Registered DIMM A = 240-pin Unbuffered DIMM AK = 244-pin Unbuffered Mini-DIMM H = 204-pin SODIMM L = 240-pin LRDIMM LS = 240-pin 3DS LRDIMM P = 240-pin Parity RDIMM PK = 244-pin Parity Mini-DIMM Module Speed Grade -80B -80C -1G0-1G1-1G2-1G3-1G4-1G5-1GA 9-1G6-1G7-1G8-1G9-1GB -1GC -2G1-2G2-2G3 Pb-Free Devices Y Z IZ DY DZ Component Speed Grade/ Part Mark E E -187F E -15F E -125F E -107F E -093F MB Vendor/Revision (LRDIMM only) JEDEC Component Speed Grade DDR3-800 DDR3-800 DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR DDR Clock Frequency (MHz) Printed Circuit Board Revision Designator Data Rate (MT/s) Die Revision Module Speed Module Bandwidth PC PC PC PC PC PC PC PC PC PC PC PC PC PC PC PC PC PC G1A = SPD with -125 tested DRAM SPD = serial presence-detect pin (module only) CL = CAS latency; t RCD = active-to-command time; t RP = precharge time Package Descriptions Package Codes Commercial temp; single- or dual-rank DIMM Halogen-free; commercial temp; single- or dual-rank DIMM Industrial temp, halogen-free; commercial temp; single- or dual-rank DIMM Commercial temp; select dual- or quad-rank DIMM Halogen-free; commercial temp; select dual- or quad-rank DIMM Module Configuration SPD (CL- t RCD- t RP) Part Numbering 33

34 DDR2 Module Part Numbering MT 36 H TF 1G 72 P Z - 80E C 1 Micron Technology AMB Vendor Rev (FBDIMM only) Number of Memory Components Process Technology H = 1.8V G = 1.5V R = 1.55V Product Family TF = FBGA TS = DDP (dual die in package) TZS = DDP with heat spreader VF = VLP (very low profile) VS = VLP DDP VZS = VLP DDP with heat spreader Device Number (depth, width) Blank = Megabits G = Gigabits Module Speed Grade Component Speed Grade/ Part Mark JEDEC Component Speed Grade Clock Frequency (MHz) Data Rate (MT/s) AMB Vendor E = Intel (FBDIMM) D = IDT (FBDIMM) N = NEC (FBDIMM) Printed Circuit Board Revision Designator Die Revision Module Speed Module Bandwidth Module Configuration SPD (CL- t RCD- t RP) Module Version Blank = 240-pin Registered DIMM A = 240-pin Unbuffered DIMM F = 240-pin FBDIMM H = 200-pin SODIMM P = Parity PK = 244-pin Parity Mini-RDIMM RH = 200-pin SORDIMM -40E -53E E GA -5E -37E -3-25E E DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR PC PC PC PC PC PC SPD = serial presence-detect pin (module only) CL = CAS latency; t RCD = active-to-command time; t RP = precharge time Package Codes Pb-Free Devices Y Z DY DZ IY TY IZ TZ Package Descriptions Commercial temp; single- or dual-rank DIMM Halogen-free; commercial temp; single- or dual-rank DIMM Commercial temp; select dual-rank DIMM Halogen-free; commercial temp; select dualor quad-rank DIMM Industrial temp; select dual-rank DIMM Industrial temp; select dual-rank DIMM Halogen-free; industrial temp; select singleand dual-rank DIMM Halogen-free; industrial temp; select dualand quad-rank DIMM 34

35 DDR and SDRAM Module Part Numbering MT 36 V DDF Y - 40B J 2 Micron Technology Number of Memory Components Process Technology L = 3.3V (SDRAM) V = 2.5V (DDR SDRAM) Product Family DDF = FBGA (DDR SDRAM) DDT = TSOP (DDR SDRAM) DVF = FBGA VLP (DDR SDRAM) SDF = FBGA (SDRAM) SDT = TSOP (SDRAM) Device Number (depth, width) Blank = Megabits G = Gigabits Module Version 10 Blank = 168-pin/184-pin/240-pin Registered DIMM A = 168-pin/184-pin/240-pin Unbuffered DIMM H = 144-pin/200-pin SODIMM PH = 144-pin/200-pin Unbuffered SODIMM with PLLs U = 100-pin Unbuffered DIMM 10 All SDRAM and DDR SDRAM DIMMs have serial-presence detect. SDRAM Modules Module Speed Grade B Component Speed Grade/ Part Mark -6T -6-5B JEDEC Component Speed Grade DDR333 TSOP DDR333 FBGA DDR Clock Frequency (MHz) Die Revision Designator Data Rate (MT/s) Module Speed Module Bandwidth PC2700 PC2700 PC3200 Module Configuration SPD (CL- t RCD- t RP) SPD = serial presence-detect pin (module only) CL = CAS latency; t RCD = active-to-command time; t RP = precharge time 11 Data valid window is 150ps greater than -6T. 12 DDR400 nominal voltage is 2.6V. Lead-Plated Devices G DG I T Pb-Free Devices Y DY IY TY Package Descriptions Printed Circuit Board Revision Designator Package Codes Commercial temp; single- or dual-rank DIMM Commercial temp; select dual-rank DIMM Industrial-temp DIMM Industrial temp; select dual-rank DIMM Module Speed E Allowable Component Speed -6A, -75, -7E -7E CL- t RCD- t RP DDR SDRAM Modules Module Speed B Allowable Component Speed -6, -6T, -5B -5B Part Numbering 35

36 PSRAM CellularRAM Memory Part Numbering MT 45 W 1M W 16 P A FA WT ES Micron Technology Product Family 45 = PSRAM CellularRAM Memory Operating Core Voltage W = V V = V Address Locations M = Megabits K = Kilobits I/O Voltage W = V V = V Bus Configuration 16 = x16 Read/Write Mode Operation P = Async/Page B = Async/Page/Burst DB = AA/D MUX MB = MUX Burst MP = Asynchronous MUX Die Rev Code Blank = P25A, P26Z, and P24Z Design A = P24A Design C = P25Z Design D = P23Z Design E = P22Z Design Production Status Blank = Production ES = Engineering Sample MS = Mechanical Sample Operating Temperature Range WT = 30 C to +85 C IT = AT = 40 C to +105 C Options Blank = Standard device L = Low power Frequency Blank = No burst mode 8 = 80 MHz 1 = 104 MHz 13 = 133 MHz Access/Cycle Time 55 = 55ns 70 = 70ns 85 = 85ns Package Code FA = 48-ball VFBGA (6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) FB = 54-ball VFBGA (6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) BA = 48-ball VFBGA (Pb-free 13 ; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) BB = 54-ball VFBGA (Pb-free 13 ; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) GX = 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 8 x 10 x 1mm) GA = 48-ball VFBGA (Green; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm) GB = 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm) 13 Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. 36

37 NAND Flash Part Numbering MT 29F 2G 08 A A A A A WP - xx xx x ES: A Micron Technology Product Family 29F = NAND Flash 29E = Enterprise NAND Flash Density 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb 16G = 16Gb 32G = 32Gb Device Width 01 = 1 bit 08 = 8 bits 16 = 16 bits Level 64G = 64Gb 128G = 128Gb 256G = 256Gb 512G = 512Gb 1Tb = 1024Gb (1Tb) 2Tb = 2048Gb (2Tb) E = Internal ECC enabled M = Media R = MLC+ features S = Security features Design Revision A = 1st Design Revision Production Status Blank = Production ES = Engineering Sample QS = Qualification Sample MS = Mechanical Sample Features X = Premium Lifecycle Product (PLP) Z = Polyimide (if applicable) Operating Temperature Range Blank = Commercial (0 C to +70 C) IT = Extended () (AKA ET) WT = Wireless Temp (25 C to +85 C) AAT = Automotive Grade (40 C to +105 C) AIT = Automotive Grade () Mark A C E Classification Mark Die nce RnB I/O Channels B D E F J K L M Q T U V Level SLC MLC TLC Operating Voltage Range A = 3.3V ( V) B = 1.8V ( V) C = 3.3V ( V), V CCQ 1.8V ( V) D = 1.8V ( V) SIM E = 3.3V ( V), V CCQ 3.3V or 1.8V ( V) Blank = Async only 6 = 333 MT/s Speed Grade 12 = 166 MT/s 10 = 200 MT/s Package Code 14 WP = 48-pin TSOP I (CPL version) J1 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm J2 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm J3 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm J4 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm J5 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm J6 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm J7 = 152-ball LBGA (16DP), 14 x 18 x 1.5mm J9 = 132-ball LBGA (16DP), 12 x 18 x 1.5mm G1 = 272-ball VFBGA (SDP, DDP, 3DP, QDP), 14 x 18 x 1.0mm G2 = 272-ball TFBGA (8DP), 14 x 18 x 1.3mm G6 = 272-ball LFBGA (16DP), 14 x 18 x 1.5mm H1 = 100-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm H2 = 100-ball TBGA (QDP), 12 x 18 x 1.2mm H3 = 100-ball LBGA (8DP), 12 x 18 x 1.4mm H4 = 63-ball VFBGA (SDP, DDP), 9 x 11 x 1.0mm H6 = 152-ball VBGA (SDP, DDP), 14 x 18 x 1.0mm H7 = 152-ball TBGA (QDP), 14 x 18 x 1.2mm H8 = 152-ball LBGA (8DP), 14 x 18 x 1.4mm HC = 63-ball VFBGA (SDP, DDP), 10.5 x 13 x 1.0mm 14 Products are Pb-free and RoHS-compliant. Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Interface A = Async only B = Sync/Async D = SPI Die Revision A = 1st set of device features B = 2nd set of device features (rev only if different from 1st set) C = 3rd set of device features (rev only if different) D = 4th set of device features (rev only if different) Etc.... Part Numbering 37

38 NAND Small Page Flash Memory Part Numbering NAND 512 R 3 A 2 A ZA 6 E Density 128 = 128Mb 256 = 256Mb 512 = 512Mb Operating Voltage Range R = 1.8V W = 3.0V Configuration 3 = x8 4 = x16 NAND Product Family Identifier A = 512B Page NAND SLC Device Options 0 = No options (CE care; sequential raw read enabled) 2 = CE don t care A = CE don t care; automotive Packaging E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging Operating Temperature Range 6 = 40 C to +85 C X = 40 C to +85 C; Premium Lifecycle Product (PLP) Package Code N = 48-pin TSOP ZA/ZD = 55-, 63-ball VFBGA E0 = Bare die DI = Known good die Product Version A, B, C, D 38

39 N25Q Serial NOR Flash Memory Part Numbering N25Q 128 A 1 3 E G SPI NOR Family Identifier N25Q = Multi I/O SPI NOR Flash Density 008 = 8Mb 016 = 16Mb 032 = 32Mb 064 = 64Mb Litho A = 65nm 128 = 128Mb 256 = 256Mb 512 = 512Mb 00A = 1Gb Feature Set 1 = Byte addressability, hold pin, Micron XiP 2 = Byte addressability, hold pin, basic XiP 3 = Byte addressability, reset pin, Micron XiP 4 = Byte addressability, reset pin, basic XiP Operating Voltage Range 1 = V V CC 3 = V V CC Array Configuration T = Top B = Bottom E = Uniform G = Easy transparent stack Packaging E = Tray F = Tape and reel G = Tube Security 0, 1, 2, 3, 4, 5, 6 Contact Micron Sales for more information Operating Temperature Range 4 = Industrial-tested with standard test flow () A = Automotive: 40 C to +125 C + HR-certified test flow H = Automotive: + HR-certified test flow Package Code F3 = DFN/3 x 2 (MLP) F4 = DFN/3 x 4 (MLP) F6 = DFN/6 x 5 (MLP) F7 = DFN/6 x 5 (MLP), sawn F8 = DFN/8 x 6 (MLP) SC = SOP2-8/150 mil (SO8N) SE = SOP2-8/208 mil (SO8W) SF = SOP2-16/300 mil (SO16W) 12 = T-PBGA-24b05/6 x 8 (TBGA 24) 51 = XF-SCSP (CSP) Part Numbering 39

40 M25/M45 Serial NOR Flash Memory Part Numbering M25P 10 x V MN 6 T P x SPI NOR Family Identifier M25P = Data storage family 512K/1Mb Uniform block erase 32KB 2Mb to 64Mb Uniform block erase 64KB 128Mb Uniform block erase 256KB M25PE = Page erase family Uniform block erase 256 byte + 4KB + 64KB M45PE = Page erase family Uniform block erase 256 byte + 64KB M25PX = Dual I/O family Uniform block erase 4KB + 64KB Density 05 = 512Kb 10 = 1Mb 20 = 2Mb 40 = 4Mb 80 = 8Mb 16 = 16Mb 32 = 32Mb 64 = 64Mb 128 = 128Mb Security Blank = No security S = UID preprogrammed SO = UID + Permanent block lock ST = UID + Permanent block lock + reverse power-up block lock status Operating Voltage Range V = V V CC V V CC (M25P available in 512Kb4Mb; M25PX available in 8Mb16Mb) Test Flow Blank = Standard parts A = Automotive: + HR-certified test flow (designated only for operating temp range 6) RoHS P = RoHS-compliant G = RoHS-compliant Packaging Blank = SO Tube (MLP and BGA tray) T = Tape and reel Operating Temperature Range 6 = 3 = Automotive: 40 C to +125 C + HR-certified test flow Package Code BA = PDIP8, 300 mils MB = DFN, 3 x 2 (MLP) MC = DFN, 3 x 4 (MLP) ME = DFN, 8 x 6 (MLP) MF = SOP2-16, 300 mils (SO16W) MN = SOP2-8, 150 mils (SO8N) MP = DFN, 6 x 5, (MLP) MS = DFN, 6 x 5, sawn (MLP) MW = SOP2-8, 208 mils (SO8W) ZM = T-PBGA-24b05, 6 x 8 (TBGA 24) 40

41 M29W Parallel NOR Flash Memory Part Numbering M29 W 320 E T 70 N 6 E NOR Family Identifier M29 = Standard Parallel NOR Operating Voltage Range W = V V CC Density 400 = 4Mb 800 = 8Mb 160 = 16Mb 320 = 32Mb 640 = 64Mb 128 = 128Mb 256 = 256Mb Silicon Version or Architecture Option D, E, F, G Functionality/Security H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) Packaging E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging Operating Temperature Range 3 = 40 C to +125 C (automotive) 6 = Package Code N/NB = 56-pin TSOP, 14 x 20mm N/NA = 48-pin TSOP, 12 x 20mm ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch (4Mb64Mb) 64-ball TBGA, 10 x 13mm, 1mm pitch (128Mb/256Mb) ZS = 64-ball FBGA, 11 x 13mm, 1mm pitch ZF = 64-ball TBGA, 10 x 13mm, 1mm pitch ZE = 48-ball TFBGA, 6 x 8mm, 0.8mm pitch Speed 45 = 45ns 5A = 55ns (automotive, temp range 6) 55 = 55ns 6A = 60ns (automotive, temp range 6) 60 = 60ns 7A = 70ns (automotive, temp range 6) 70 = 70ns M29AW Automotive Uniform Block MLC Flash Memory Part Numbering JS 28F 512 M29AW H x Package Code JS = 56-pin TSOP, 14 x 20mm, RoHS PC = 64-ball FBGA, 11x13mm, RoHS Product Line Designator 28F = NOR parallel interface Density 512 = 512Mb 00A = 1Gb Device Features (Optional) Assigned to cover packing media and/or features or other specific configurations. Packaging B = Tape and reel Functionality/Security H = Uniform block (highest block protected by V PP /WP#) L = Uniform block (lowest block protected by V PP /WP#) Parallel NOR Family Identifier M29AW = Automotive: Parallel Flash memory, uniform block, 3V core Part Numbering 41

42 M29DW Parallel NOR Flash Memory Part Numbering M29 DW 323 D T 70 N 6 E NOR Family Identifier M29 = Standard Parallel NOR Operating Voltage Range DW = V V CC, multibank Density 323 = 32Mb, x8/x = 128Mb, x8/x = 128Mb, x = 256Mb, x16 Silicon Version or Architecture Option D, E, F, G Functionality/Security H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) Packaging E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging Operating Temperature Range 3 = 40 C to +125 C (automotive) 6 = Package Code NF = 56-pin TSOP N = 48-pin TSOP ZA = 64-ball TBGA ZE = 48-ball TFBGA Speed 5A = 55ns (automotive, temp range 6) 60 = 60ns 7A = 70ns (automotive, temp range 6) 70 = 70ns M29EW Parallel NOR Flash Memory Part Numbering PC 28F 256 M29EW x H x Package Code JR = 48-pin TSOP, RoHS, HF JS = 56-pin TSOP, RoHS, HF PC = Fortified 64-ball BGA, RoHS, HF PZ = 48-pin BGA (RoHS, HF) RC = Fortified 64-ball BGA Product Line Designator 28F = NOR parallel interface Device Features (Optional) Assigned to cover packing media and/or features or other specific configurations. Functionality/Security H = Uniform block (highest block protected) L = Uniform block (lowest block protected) B = Bottom boot (bottom two blocks protected) T = Top boot (top two blocks protected) Density 032 = 32Mb, x8/x = 64Mb, x8/x = 128Mb, x8/x = 256Mb, x8/x = 512Mb, x8/x16 00A = 1Gb, x8/x16 00B = 2Gb (1Gb/1Gb), x8/x16 Lithography Blank = 65nm Parallel NOR Family Identifier M29EW = Parallel Flash memory, 3V core, V I/O 42

43 M29F Automotive Single-Bank 5V Flash Memory Part Numbering M29F 160 F T 55 M 6 NOR Family Identifier M29F = Parallel NOR, single bank, top/bottom boot block, 5V supply voltage Density 200 = 16Mb 400 = 32Mb 800 = 64Mb 160 = 128Mb Litho F = 110nm Functionality/Security B = Bottom boot (bottom blocks protected) T = Top boot (top blocks protected) Packaging Blank = Standard tray packaging E = Standard tray packaging, RoHS F = Tape and reel packaging, RoHS, 24mm T = Tape and reel packaging, 24mm Operating Temperature Range 3 = Automotive: 40 C to +125 C 6 = Automotive: Package Code M = SO44, 0.525in cu N = 48-pin TSOP-1, 12 x 20mm, AL 4 ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch (only 8Mb, bottom boot) Speed 55 = 55ns (temp range 3: 40 C to +125 C) 5A = 55ns (temp range 6: ) Part Numbering 43

44 P30/P33 Parallel NOR Flash Memory Part Numbering PC 28F 128 P 33 T F 60 x Package Code JS = 56-pin TSOP, RoHS PC = 64-ball Easy BGA, RoHS RC = 64-ball Easy BGA Product Line Designator 28F = NOR parallel interface Density 640 = 64Mb, x = 128Mb, x = 256Mb, x16 NOR Family Identifier P = P30/P33 Parallel NOR Operating Voltage Range 30 = V, V 33 = V 512 = 512Mb, x16 00A = 1Gb, x16 00B = 2Gb (1Gb/1Gb), x16 Device Features (Optional) Assigned to cover packing media and/or features or other specific configurations. Speed 60 = 60ns 65 = 65ns 70 = 70ns 75 = 75ns 85 = 85ns 95 = 95ns Blank = Various speeds Lithography F = 65nm Functionality B = Bottom boot T = Top boot P30/P33 Stacked PC 48F 3000 P0 Z T Q E x Package Code PC = 64-ball Easy BGA, RoHS PF = 88-ball Quad+ BGA, RoHS RC = 64-ball Easy BGA RD = 88-ball Quad+ BGA Product Line Designator 48F = NOR parallel interface for stacked configurations Density 3000 = 128Mb, x = 256Mb, x = 512Mb (256Mb/256Mb), x16 NOR Family Identifier P0 = P30/P33 Parallel NOR Operating Voltage Range Z = Individual chip enable(s), V V CC, V V CCQ V = Virtual chip enable(s), V V CC, V V CCQ X = Individual chip enable(s), V V CC, V V CCQ T = Virtual chip enable(s), V V CC, V V CCQ Device Features (Optional) Assigned to cover packing media and/or features or other specific configurations. Speed 60 = 60ns 65 = 65ns 70 = 70ns 75 = 75ns 85 = 85ns 95 = 95ns Blank = Various speeds Ballout Designator Q = Quad+ 0 = Discrete Functionality B = Bottom boot, top/bottom boot T = Top boot 44

45 G18 Parallel NOR Flash Memory Part Numbering PC 28F 512 G 18 F F x Package Code PC = 64-ball Easy BGA, RoHS Product Line Designator 28F = NOR parallel interface Density 128 = 128Mb, x8/x = 256Mb, x8/x = 512Mb, x8/x16 00A = 1Gb, x8/x16 Test Flow Blank = Standard parts A = Automotive: + HR-certified test flow Packaging E = Standard tray packaging F = Tape and reel packaging Interface F = Non-MUX A = A/D MUX Operating Voltage Range 18 = V core and I/O Parallel NOR Family Identifier G = StrataFlash embedded memory J3 Parallel NOR Flash Memory Part Numbering PC 28F 320 J 3 F 75 Package Code JS = 56-pin TSOP, RoHS PC = 64-ball Easy BGA, RoHS RC = 64-ball Easy BGA TE = 56-pin TSOP Product Line Designator 28F = NOR parallel interface Density 320 = 32Mb, x8/x = 64Mb, x8/x = 128Mb, x8/x = 256Mb, x8/x16 Speed 75 = 75ns 95 = 95ns 105 = 105ns Lithography F = 65nm with HR-certified test flow D = 130nm Operating Voltage Range 3 = 3V V CC, 3V V PEN NOR Family Identifier J = J3 Parallel NOR Part Numbering 45

46 M28W Parallel NOR Flash Memory Part Numbering M28 W 160C T 70 N 6 T NOR Family Identifier M28 = Parallel NOR Operating Voltage Range W = V V DD, V V DDQ Density/Functionality 160C = 16Mb, x16, boot block 320FC = 32Mb, x16, boot block 640HC = 64Mb, x16, boot block Functionality B = Bottom boot T = Top boot Packaging Blank = Standard tray packaging E = ECOPACK package, standard tray packaging F = ECOPACK package, tape and reel packaging U = ECOPACK package, tray packaging Operating Temperature Range 6 = Package Code N = 48-pin TSOP ZB = 46-ball TFBGA Speed 70 = 70ns M58BW Parallel NOR Flash Memory Part Numbering M58 B W 32F T 4 T 3 T NOR Family Identifier M58 = Parallel NOR Flash Identifier B = Burst mode Operating Voltage Range W = V V DD range for 45ns speed class V V DD range for 55ns speed class 2.4VV DD V DDQ range for 45ns and 55ns speed classes Density/Functionality 16F = 16Mb, x32, boot block, burst, 0.11µm process 32F = 32Mb, x32, boot block, burst, 0.11µm process Packaging F = ECOPACK package, tape and reel packaging T = Standard tray packaging Operating Temperature Range 3 = 40 C to +125 C (automotive) Package Code T = 80-pin PQFP ZA = 80-ball LBGA Speed 4 = 45ns 5 = 55ns Functionality B = Bottom boot T = Top boot 46

47 M58WR Parallel NOR Flash Memory Part Numbering M58 W R 016 K T 7A ZB 6 E NOR Family Identifier M58 = Parallel NOR Flash Identifier W = Multiple bank, burst mode Operating Voltage Range R = V VDD Density/Functionality 016 = 16Mb, x = 32Mb, x = 64Mb, x16 Technology K = 65nm process Packaging E = Standard tray packaging F = Tape and reel packaging Operating Temperature Range 6 = Package Code ZB = 56-ball VFBGA Automotive Temp Range 7A = Automotive-grade certified Functionality B = Bottom boot T = Top boot Part Numbering 47

48 3xx and 4xx SSD Part Numbering MT FD D AC 128 M x x - 1 G 1 2 xx xx ES Micron Technology Flash Drive (SSD) Drive Interface A = SATA 1.5 Gb/s B = SATA 3.0 Gb/s D = SATA 6.0 Gb/s G = PCIe Gen2 Drive Form Factor AA = 1.8in, 5mm, Micro SATA connector AC = 2.5in, 9.5mm AG = Full-height, full-length x8 AH = Full-height, half-length x8 AK = 2.5in, 7mm AR = Half-height, half-length x8 AT = msata Drive Density 001 = 1GB 002 = 2GB 004 = 4GB 008 = 8GB 014 = 14GB 016 = 16GB 025 = 25GB 030 = 30GB 032 = 32GB 050 = 50GB 060 = 60GB NAND Type S = SLC M = MLC 064 = 64GB 120 = 120GB 128 = 128GB 175 = 175GB 200 = 200GB 256 = 256GB 350 = 350GB 400 = 400GB 512 = 512GB 700 = 700GB Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Operating Temperature Range Blank = Commercial (0 C to +70 C) Hardware Feature Set Blank = Blank AA = Contact factory AB = Contact factory AC = Contact factory Security Feature Set Blank = Blank 1 = Contact factory 2 = SED (self-encrypting drive) 4 = Oprom 1 (Bootable) P320h only 5 = UEFI P320h only Production: 1 = 1st generation 2 = 2nd generation 3 = 3rd generation Etc.... BOM Revision ES: A = 1st generation B = 2nd generation C = 3rd generation Etc.... NAND Component A = 4Gb, SLC, x8, 3.3V, 72nm B = 8Gb, SLC, x8, 3.3V, 50nm C = 16Gb, MLC, x8, 3.3V, 50nm D = 4Gb, SLC, x8, 3.3V, 50nm E = 16Gb, MLC, x8, 3.3V, 34nm F = 32Gb, MLC, x8, 3.3V, 34nm G = 32Gb, MLC, x8, 3.3V, 34nm H = 8Gb, SLC, x8, 3.3V, 50nm J = 32Gb, MLC, x8, 3.3V, 25nm K = 64Gb, MLC, x8, 3.3V, 25nm L = 4Gb, SLC, x8, 3.3V, 34nm M = 8Gb, SLC, x8, 3.3V, 34nm N = 16Gb, SLC, x8, 3.3V, 34nm Sector Size 1 = 512 byte Product Family AE = C200/P200 AF = eusb AG = C300 AH = P320 AJ = e230 AL = P300 AM = C400 AN = P400m AR = P400e 48

49 4xx and 5xx SSD Part Numbering MT FD D AK 120 M AV - 1 AE 1 2 AB YY ES Micron Technology Flash Drive (SSD) Drive Interface B = SATA 3.0 Gb/s D = SATA 6.0 Gb/s E = SAS 6.0 Gb/s F = PCIe Gen1 G = PCIe Gen2 Drive Form Factor AA = 1.8in, 5mm, micro SATA connector AC = 2.5in, 9.5mm AG = Full-height, full-length x8 AH = Full-height, half-length x8 AK = 2.5in, 7mm AR = Half-height, half-length x8 AT = msata AV = M.2, 80mm x 22mm x 3.5mm AW = 2.5in, 5mm Drive Density 050 = 50GB 060 = 60GB 064 = 64GB 100 = 100GB 120 = 120GB 128 = 128GB 175 = 175GB 200 = 200GB 240 = 240GB 256 = 256GB 350 = 350GB 400 = 400GB 480 = 480GB 500 = 500GB 512 = 512GB 700 = 700GB 800 = 800GB 960 = 960GB 1T0 = 1024GB 1T4 = 1.4TB Production Status Blank = Production ES = Engineering sample MS = Mechanical sample Customer Designator YY = Standard Additional Features AB = Standard AF = Contact factory Extended Firmware Features Z = Blank 1 = Contact factory 2 = SED (self-encrypting drive) 3 = Oprom 1 (Bootable) P420h only 4 = UEFI P420h only Sector Size 1 = 512 byte NAND Component AA = 32Gb, SLC, x8, 3.3V, 25nm AB = 64Gb, MLC, x8, 3.3V, 25nm AC = 64Gb, MLC, x8, 3.3V, 20nm AD = 64Gb, MLC, x8, 3.3V, 20nm AE = 128Gb, MLC, x8, 3.3V, 20nm AF = 32Gb, MLC, x8, 3.3V, 34nm AG = 32Gb, MLC, x8, 3.3V, 25nm AH = 64Gb, MLC, x8, 3.3V, 20nm AJ = 64Gb, SLC, x8, 3.3V, 20nm NAND Type S = SLC M = MLC Operating Temperature Range Commercial (0 C to +70 C) for all SSDs Production: 1 = 1st generation 2 = 2nd generation 3 = 3rd generation Etc.... BOM Revision ES: A = 1st generation (P420m only) B = 2nd generation C = 3rd generation Etc.... Product Family AV = M500 AY = M550 AX = P420m AZ = M510 Part Numbering 49

50 Product Lifecycle Solutions Memory Choices for Mass Market Distribution Customers Micron s Product Lifecycle Solutions bring the stability of our memory support into alignment with the lifecycle of your design. Two levels of support standard and premium provide a framework for choosing a solution that best meets your specific requirements. Standard Lifecycle Products For customers with application lifecycles of 7+ years DRAM, LPDRAM, NOR, SLC/ MLC NAND, e MMC, MCPs, SSDs, and other products One-stop supplier for a broad range of applications Optimum performance/feature combinations, multiple densities, cost-effective products Strong record of long-term support for legacy products Up to 5-year roadmap visibility for standard products Standard JEDEC conversion and discontinuance timelines apply Premium Lifecycle Products (PLP) For customers with application lifecycles of 710+ years Select DRAM, NAND, and NOR products Stability and longevity for mission-critical applications with extensive design-in or requalification requirements Minimum 10-year form, fit, function compatibility from the date of introduction Extended 2-year conversion timeline in case of part number change or discontinuance Premium Lifecycle Products (PLP) Product Family Density Temp Range DRAM PLP Products MT41 DDR3 14Gb IT, AT MT47 DDR2 12Gb IT, AT MT46 DDR Mb IT, AT MT48 SDRAM Mb IT, AT Parallel NOR Flash PLP Products M29EW Parallel NOR Flash 64Mb1Gb IT M29W Parallel NOR Flash 8256Mb IT, AT M58BW Parallel NOR Flash 16Mb AT P30 Parallel NOR Flash 64Mb1Gb IT P33 Parallel NOR Flash 64Mb1Gb IT J3 Parallel NOR Flash 64256Mb IT SPI NOR Flash PLP Products N25Q Serial NOR Flash 32256Mb IT, AT M25PE/M45PE Serial NOR Flash 416Mb IT M25P Serial NOR Flash 416Mb IT, AT NAND Flash PLP Products MT29 SLC, VLP NAND Flash 8Gb IT MT29 SLC, LP NAND Flash 14Gb IT MT29 SLC, SPI NAND Flash 14Gb IT NAND SLC, Small Page (SP) NAND Flash Mb *The partial part numbers referenced above are product family designators only. PLP parts are a select subset of Micron s portfolio; not all part types, configurations, densities, or options are included. For specific part numbers, refer to the PLP part list at or contact your sales representative. IT

51 Web Tools One-Stop Part Catalogs Visit micron.com to find all of our detailed product specification data, including part status, recommended parts (where applicable), disty stock and sample information, data sheets, and modeling tools. You also can find information about our plans for long-term product support, design webinars, and product FAQs. Resources Customizable Workspace The Micron Workspace is where you can save and organize part pages, data sheets, and links for easy access in the future. Save parts, documents, and pages for fast and easy access Organize documents and parts in folders Share parts, pages, or project folders with colleagues View secure documents that you already have access to view via My Documents Receive messages from Micron contacts in My Messages Micron Blog micronblogs.com Join the conversation at Micron s blog, where we highlight our recent technology developments from advanced storage solutions to the cutting edge of server, computing, and mobile memory. Extensive Support Resources micron.com/support Technical notes FBGA decoder Part numbering guides General FAQs Purchasing information Micron System Power Calculator micron.com/powercalc Sales Representative Lookup micron.com/how-to-buy Locate a sales representative in your area who can help you buy products, create a corporate account, and gain expertise Micron Technology, Inc. All rights reserved. Micron, the Micron logo, ClearNAND, and StrataFlash are trademarks of Micron Technology, Inc. RLDRAM is a trademark of Qimonda AG in various countries, and is used by Micron Technology, Inc. under license from Qimonda. CellularRAM is a registered trademark of Micron Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners. Lead is not intentionally added by Micron during the manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Products are warranted only to meet Micron s production data sheet specifications. Products and specifications are subject to change without notice. Rev. 11/13 EN.L

52 The memory Experts For data sheets, technical notes, and other product and sales information, visit Micron s Web site or phone us today. micron.com (208)