DDR3 SDRAM Memory SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.

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1 Product Guide SMSUNG ELECTRONICS RESERVES THE RIGHT TO CHNGE PRODUCTS, INFORMTION ND SPECIFICTIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. ll information discussed herein is provided on an "S IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. ll brand names, trademarks and registered trademarks belong to their respective owners. c 2012 Samsung Electronics Co., Ltd. ll rights reserved

2 1. DDR3 SDRM MEMORY ORDERING INFORMTION K 4 X X X X X X X - X X X X SMSUNG Memory DRM DRM Type Density it Organization Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) # of Internal anks 1. SMSUNG Memory : K 2. DRM : 4 3. DRM Type : DDR3 SDRM 4~5. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 8G : 8Gb G : 16Gb 6~7. it Organization 04 : x 4 08 : x 8 16 : x16 33 : x32 8. # of Internal anks 3 : 4 anks 4 : 8 anks 5 : 16 anks 9. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 10. Revision M : 1st Gen. : 2nd Gen. : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. H : 9th Gen. 11. "-" 12. Package Type H M E O 13. Temp & Power C Y K : (Halogen-free & Lead-free) : (Halogen-free & Lead-free, DDP) : (Halogen-free & Lead-free, Flip Chip) : (Lead-free & Halogen-free, QDP) : (Lead-free & Halogen-free, QDP for 64G LRDIMM) : Commercial Temp.( 0 C ~ 85 C) & Normal Power(1.5V) : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) & RS( Reduced Standby ) 14~15. Speed F7 : DDR3-800 CL=6, trcd=6, trp=6) F8 : DDR CL=7, trcd=7, trp=7) H9 : DDR CL=9, trcd=9, trp=9) K0 : DDR CL=11, trcd=11, trp=11) M: DDR CL=13, trcd=13, trp=13) - 2 -

3 2. DDR3 SDRM Component Product Guide Density anks Part Number 1Gb G-die 2Gb C-die 2Gb D-die 2Gb E-die 4Gb -die 4Gb C-die 4Gb D-die 8anks 8anks 8anks 8anks 8anks 8anks 8anks Package & Power, Temp. & Speed K41G0446G CF8/H9/K0/M 256M x 4 K41G0846G CF8/H9/K0/M 128M x 8 K41G0446G YF8/H9/K0 256M x 4 K41G0846G YF8/H9/K0 128M x 8 K42G0446C HCF8/H9/K0 512M x 4 K42G0846C HCF8/H9/K0 256M x 8 K42G0446C HYF8/H9 512M x 4 K42G0846C HYF8/H9 256M x 8 K42G0446D HCF8/H9/K0/M 512M x 4 K42G0846D HCF8/H9/K0/M 256M x 8 K42G0446D HYF8/H9/K0 512M x 4 K42G0846D HYF8/H9/K0 256M x 8 K42G0446E CH9/K0/M 512M x 4 K42G0846E CH9/K0/M 256M x 8 K42G0446E YH9/K0 512M x 4 K42G0846E YH9/K0 256M x 8 K44G0446 HCF8/H9/K0/M 1G x 4 K44G0846 HCF8/H9/K0/M 512M x 8 K44G1646 HCH9/K0 256M x 16 K44G0446 HYF8/H9/K0 1G x 4 K44G0846 HYF8/H9/K0 512M x 8 K44G1646 HYH9/K0 256M x 16 K44G0446C CH9/K0/M 1G x 4 K44G0846C CH9/K0/M 512M x 8 K44G0446C YH9/K0 1G x 4 K44G0846C YH9/K0 512M x 8 K44G0446D CH9/K0/M 1G x 4 K44G0846D CH9/K0/M 512M x 8 K44G0446D YH9/K0 1G x 4 K44G0846D YH9/K0 512M x 8 Org. VDD Voltage 1 PKG vail. NOTE 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V 1.35V 1Q 13 8G -die 8anks K48G1646 K48G1646 MCK0 MYH9/K0 DDP 512M x 16 DDP 512M x V 1.35V 96 ball K48G3346 MCH9/K0 DDP 256M x V 136 ball K48G3346 MYH9/K0 DDP 256M x V K4G0446 K4G0446 ECH9/K0 EYH9/K0 QDP 4G x 4 QDP 4G x 4 1.5V 1.35V 16G -die 8anks K4G0446 OCK0 QDP 4G x4 1.5V K4G0446 OYF8/H9/K0 QDP 4G x4 1.35V * NOTE V product is 1.5V operatable

4 3. DDR3 SDRM Module Ordering Information M X X X X X X X X X X - X X X X 1 Memory Module DIMM Type Data bits DRM Component Type Depth # of anks in Comp. & Interface it Organization 1. Memory Module : M 2. DIMM Type 3 : DIMM 4 : SODIMM 3~4. Data its 71 : x64 204pin Unbuffered SODIMM 74 : x72 204pin ECC Unbuffered SODIMM 78 : x64 240pin Unbuffered DIMM 86 : x72 240pin LR DIMM 90 : x72 240pin VLP Unbuffered DIMM 91 : x72 240pin ECC Unbuffered DIMM 92 : x72 240pin VLP Registered DIMM 93 : x72 240pin Registered DIMM 5. DRM Component Type : DDR3 SDRM 6~7. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G: 1G 2G: 2G 4G: 4G 8G: 8G 8. # of anks in comp. & Interface 7 : 8anks & SSTL-1.5V 9. it Organization 0 : x 4 3 : x 8 4 : x16 33 : 32M (for 128Mb/512Mb) 65 : 64M (for 128Mb/512Mb) 29 : 128M (for 128Mb/512Mb) 57 : 256M (for 512Mb/2Gb) 52 : 512M (for 512Mb/2Gb) 1K: 1G (for 2Gb) 2K: 2G (for 2Gb) 10. Component Revision M : 1st Gen. : 2nd Gen. : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. 11. Package Z : (Lead-free) H : (Lead-free & Halogen-free) J : (Lead-free, DDP) M : : (Lead-free & Halogen-free, DDP) (Halogen-free & Lead-free, Flip Chip) E O : : (Lead-free & Halogen-free, QDP) (Lead-free & Halogen-free, QDP for 64G LRDIMM) 12. PC Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev. 13. "_" 15~16. Speed 2 1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer 14. Temp & Power C : Commercial Temp.( 0 C ~ 85 C) & Normal Power(1.5V) Y : Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V) NOTE: 1. Only used for LRDIMM 2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC (DDR3-1333), PC (DDR3-1600) PC (DDR3-1866) Memory uffer Speed Temp & Power PC Revision Package Component Revision F7 : DDR3-800 CL=6, trcd=6, trp=6) F8 : DDR CL=7, trcd=7, trp=7) H9 : DDR CL=9, trcd=9, trp=9) K0 : DDR CL=11, trcd=11, trp=11) M: DDR CL=13, trcd=13, trp=13) 17. Memory uffer 0 : Inphi im02-gs02 1 : IDT 2 (Greendale) 2 : Montage M C0 3 : Inphi im02-gs02 4 : Montage M CI - 4 -

5 4. DDR3 SDRM Module Product Guide Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 CF8/H9/K0/M D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx Mx Mx 72 1Gx 64 2G 2G 4G 4G 8G Rank PKG Height vail. NOTE M CH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die M DH0 CF8/H9/K0/M (1Rx8) 256M x 8 * 8 pcs 2Gb D-die 8 1 M E0 CH9/K0/M 256M x 8 * 8 pcs 2Gb E-die M G0 CF8/H9/K0/M E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 M CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die M DH0 CF8/H9/K0/M D(1Rx8) 256M x 8 * 9 pcs 2Gb D-die 8 1 M E0 CH9/K0/M 256M x 8 * 9 pcs 2Gb E-die M CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die M DH0 CF8/H9/K0 (2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M E0 CH9/K0/M 256M x 8 * 16 pcs 2Gb E-die M C0 CK0 512M x 8 * 8 pcs 4Gb C-die D(1Rx8) 8 1 M D0 CK0/M 512M x 8 * 8 pcs 4Gb D-die 1Q 13 M CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die M DH0 CF8/H9/K0/M E(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M E0 CH9/K0/M 256M x 8 * 18 pcs 2Gb E-die M3781G73H0 CF8/H9/K0 512M x 8 * 16 pcs 4Gb -die M3781G73C0 CK0 (2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M D0 CK0/M 1G x 8 * 8 pcs 4Gb D-die 1Q 13 1Gx 72 8G M3911G73H0 CF8/H9/K0/M E(2Rx8) 512M x 8 * 18 pcs 4Gb -die Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 YF8/H9/K0 D(1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx 72 2G 4G Rank PKG Height vail. NOTE M G0 YF8/H9/K0 E(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 M CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die D(1Rx8) 8 1 M DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die M CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die E(2Rx8) 8 2 M DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die 1Gx 72 8G M3911G73H0 YF8/H9/K0 E(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 * NOTE : 1.35V product is 1.5V operatable

6 Pin DDR3 VLP Unbuffered DIMM (1.35V Product) 240Pin DDR3 VLP Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 256Mx 72 2G M DH0 YH9 J(1Rx8) 256M x 8 * 9pcs 2Gb D-die Mx 72 4G Rank PKG Height vail. NOTE 18.75mm M DH0 YH9 K(2Rx8) 256M x 8 * 18 pcs 2Gb D-die mm M H0 YH9 J(1Rx8) 256M x 8 * 18 pcs 4Gb -die 8 1 1Gx 72 8G M3901G73H0 YH9 K(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 * NOTE : 1.35V product is 1.5V operatable mm Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition 256Mx Mx 64 1Gx 64 2G 4G 8G Comp. Version Internal anks Rank PKG Height vail. NOTE M CHS CF8/H9/K0 256M x 8 * 8 pcs 2Gb C-die (1Rx8) 8 1 M DH0 CF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die M CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die M DH0 CF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M E0 CH9/K0 256M x 8 * 16 pcs 2Gb E-die M C0 CK0 512M x 8 * 8 pcs 4Gb C-die (1Rx8) 8 1 M D0 CH9/K0 512M x 8 * 8 pcs 4Gb D-die 1Q 13 M4711G73H0 CH9/K0 512M x 8 * 16 pcs 4Gb -die M4711G73C0 CK0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M4711G73D0 CH9/K0 512M x 8 * 16 pcs 4Gb D-die 1Q Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition 256Mx Mx 64 1Gx 64 2G 4G 8G Comp. Version Internal anks Rank PKG Height vail. NOTE M CHS YF8/H9 256M x 8 * 8 pcs 2Gb C-die (1Rx8) 8 1 M DH0 YF8/H9/K0 256M x 8 * 8 pcs 2Gb D-die M CH0 * NOTE : 1.35V product is 1.5V operatable. YF8/H9 256M x 8 * 16 pcs 2Gb C-die M DH0 YF8/H9/K0 F(2Rx8) 256M x 8 * 16 pcs 2Gb D-die 8 2 M E0 YK0 256M x 8 * 16 pcs 2Gb E-die M C0 YH9/K0 512M x 8 * 8 pcs 4Gb C-die (1Rx8) 8 1 M D0 YH9/K0 512M x 8 * 8 pcs 4Gb D-die 4Q 12 M4711G73H0 YF8/H9/K0 512M x 8 * 16 pcs 4Gb -die M4711G73C0 YH9/K0 F(2Rx8) 512M x 8 * 16 pcs 4Gb C-die 8 2 M4711G73D0 YH9/K0 512M x 8 * 16 pcs 4Gb D-die 4Q

7 Pin DDR3 ECC SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 256Mx 72 2G M DH0 YF8/H9 C(1Rx8) 256M x 8 * 9 pcs 2Gb D-die Mx 72 4G M DH0 YF8/H9 D(2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M H0 YF8/H9/K0 C(1Rx8) 256M x 8 * 18 pcs 2Gb -die 8 1 1Gx 72 8G M4741G73H0 YF8/H9/K0 D(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 NOTE : 1.35V product is 1.5V operatable. Rank PKG Height vail. NOTE Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 CH9/K0/M (1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M G0 CH9/K0/M (2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE M G0 CH9/K0/M C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 M CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die (1Rx8) 8 1 M DH0 CH9/K0/M 256M x 8 * 9 pcs 2Gb D-die M G0 CH9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 M G0 CH9/K0/M E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 M CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die M DH0 CH9/K0/M (2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M E0 CM 256M x 8 * 18 pcs 2Gb E-die M CH0 CH9/K0 512M x 4 * 18 pcs 2Gb C-die M DH0 CH9/K0/M C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 M E0 CH9/M 512M x 4 * 18 pcs 2Gb E-die M3931K73CH0 CF8/H9 256M x 8 * 36 pcs 2Gb C-die M3931K73DH0 CH9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 M3931K73E0 CH9 256M x 8 * 36 pcs 2Gb E-die M3931K70CH0 CF8/H9/K0 512M x 4 * 36 pcs 2Gb C-die M3931K70DH0 CH9/K0/M E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die 8 2 M3931K70E0 CH9/M 512M x 4 * 36 pcs 2Gb E-die M3931G73H0 CH9/K0/M (2Rx8) 512M x 8 * 18 pcs 4Gb -die M3931G70H0 CH9/K0/M C(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3932K70DM0 CF8/H9 (4Rx4) 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 M3932G70H0 CF8/H9 1G x 4 * 36 pcs 4Gb -die E(2Rx4) 8 2 M3932G70C0 CK0/M 1G x 4 * 36 pcs 4Gb C-die M3932G73H0 CF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb -die 8 4 M3932G70D0 CK0/M E(2Rx4) 1G x 4 * 36 pcs 4Gb D-die 8 2 1Q

8 Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 YF8/H9/K0 (1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M G0 YF8/H9/K0 (2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE M G0 YF8/H9/K0 C(1Rx4) 256M x 4 * 18 pcs 1Gb G-die 8 1 M CH0 YF8/H9 256M x 8 * 9 pcs 2Gb C-die (1Rx8) 8 1 M DH0 YF8/H9/K0 256M x 8 * 9 pcs 2Gb D-die M G0 YF8/H9 H(4Rx8) 128M x 8 * 36 pcs 1Gb G-die 8 4 M G0 YF8/H9/K0 E(2Rx4) 256M x 4 * 36 pcs 1Gb G-die 8 2 M CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M DH0 YF8/H9/K0 (2Rx8) 256M x 8 * 18 pcs 2Gb D-die 8 2 M E0 YH9/K0 256M x 8 * 18 pcs 2Gb E-die M CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die M DH0 YF8/H9/K0 C(1Rx4) 512M x 4 * 18 pcs 2Gb D-die 8 1 M E0 YH9/K0 512M x 4 * 18 pcs 2Gb E-die M3931K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die M3931K73DH0 YF8/H9 H(4Rx8) 256M x 8 * 36 pcs 2Gb D-die 8 4 M3931K73E0 YH9 256M x 8 * 36 pcs 2Gb E-die M3931K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die M3931K70DH0 YF8/H9/K0 E(2Rx4) 512M x 4 * 36 pcs 2Gb D-die 8 2 M3931K70E0 YH9/K0 512M x 4 * 36 pcs 2Gb E-die M3931G73H0 YF8/H9/K0 (2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 M3931G70H0 YF8/H9/K0 C(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3932K70DM0 YF8/H9 (4Rx4) 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 M3932G70H0 YF8/H9/K0 1G x 4 * 36 pcs 4Gb -die M3932G70C0 YH9/K0 E(2Rx4) 1G x 4 * 36 pcs 4Gb C-die 8 2 M3932G70D0 YH9/K0 1G x 4 * 36 pcs 4Gb D-die 1Q 13 M3932G73H0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb -die 8 4 4Gx 72 32G M3934G70M0 YF8/H9 (4Rx4) * NOTE : 1.35V product is 1.5V operatable. 2G DDP x 4 * 36 pcs 4Gb -die

9 Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 CF8/H9/K0/M K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M G0 CF8/H9/K0/M L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE 18.75mm M G0 CF8/H9/K0/M M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die mm M CH0 CF8/H9/K0 256M x 8 * 9 pcs 2Gb C-die K(1Rx8) M DH0 CF8/H9/K0/M 256M x 8 * 9 pcs 2Gb D-die M CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die L(2Rx8) 8 2 M DH0 CF8/H9/K0/M 256M x 8 * 18 pcs 2Gb D-die 18.75mm M CH0 CF8/H9/K0 512M x 4 * 18 pcs 2Gb C-die M(1Rx4) 8 1 M DH0 CF8/H9/K0/M 512M x 4 * 18 pcs 2Gb D-die M3921K73CM0 M3921K73DM0 M3921K70CM0 M3921K70DM0 CF8/H9 CF8/H9 CF8/H9/K0 CF8/H9/K0/M V(4Rx8) N(2Rx4) 512M DDP x 8 * 18 pcs 2Gb C-die M DDP x 8 * 18 pcs 2Gb D-die 1G DDP x 4 * 18 pcs 2Gb C-die 18.75mm 1G 8 2 x 4 * 18 pcs 2Gb D-die DDP M3921G73H0 CF8/H9/K0/M L(2Rx8) 512M x8 * 18 pcs 4Gb -die M3921G70H0 CF8/H9/K0/M M(1Rx4) 1G x4 * 18 pcs 4Gb -die 8 1 M3922G70M0 CF8/H9/K0/M N(2Rx4) M3922G73M0 CF8/H9 V(4Rx8) 4Gx 72 32G M3924G70E0 CF8/H9 U(4Rx4) 2G DDP x4 * 18 pcs 4Gb -die 8 2 1G 18.75mm x8 * 18 pcs 4Gb -die 8 4 DDP 4G QDP x4 * 18 pcs 4Gb -die mm - 9 -

10 Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal anks 128Mx 72 1G M G0 YF8/H9/K0 K(1Rx8) 128M x 8 * 9 pcs 1Gb G-die Mx Mx 72 1Gx 72 2Gx 72 2G 4G 8G 16G M G0 YF8/H9/K0 L(2Rx8) 128M x 8 * 18 pcs 1Gb G-die 8 2 Rank PKG Height vail. NOTE 18.75mm M G0 YF8/H9/K0 M(1Rx4) 256M x 4 * 18 pcs 1Gb G-die mm M CH0 YF8/H9 512M x 4 * 9 pcs 2Gb C-die K(1Rx8) 8 1 M DH0 YF8/H9/K0 512M x 4 * 9 pcs 2Gb D-die M CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die L(2Rx8) 8 2 M DH0 YF8/H9/K0 256M x 8 * 18 pcs 2Gb D-die 18.75mm M CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die M(1Rx4) 8 1 M DH0 YF8/H9/K0 512M x 4 * 18 pcs 2Gb D-die M3921K73CM0 M3921K73DM0 M3921K70CM0 M3921K70DM0 YF8/H9 YF8/H9 YF8/H9 YF8/H9/K0 V(4Rx8) N(2Rx4) 512M DDP x 8 * 18 pcs 2Gb C-die M DDP 18.75mm x 8 * 18 pcs 2Gb D-die 1G DDP x 4 * 18 pcs 2Gb C-die 8 2 1G DDP x 4 * 18 pcs 2Gb D-die M3921G73H0 YF8/H9/K0 L(2Rx8) 512M x 8 * 18 pcs 4Gb -die 8 2 M3921G70H0 YF8/H9/K0 M(1Rx4) 1G x 4 * 18 pcs 4Gb -die 8 1 M3922G70M0 YF8/H9/K0 N(2Rx4) M3922G73M0 YF8/H9 V(4Rx8) 4Gx 72 32G M3924G70E0 YF8/H9 U(4Rx4) * NOTE : 1.35V product is 1.5V operatable. 2G DDP x4 * 18 pcs 4Gb -die 8 2 1G 18.75mm x8 * 18 pcs 4Gb -die 8 4 DDP 4G QDP x4 * 18 pcs 4Gb -die mm

11 Pin DDR3 LRDIMM (1.5V Product) 240Pin DDR3 LDIMM Org. Density Part Number Speed Raw Card Composition 4G x 72 32G M3864G70M0 M3864G70DM0 CM CM C(4Rx4) 8G x 72 64G M3868G70O0 CK0 E(8Rx4) Comp. Version Internal anks Rank PKG Height vail. NOTE 2G DDP x 4 * 36 pcs 4Gb -die 8 4 2G 30.35mm x 4 * 36 pcs 4Gb D-die 2Q 13 DDP 4G QDP x 4 * 36 pcs 4Gb -die 8 8 * NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page mm 1) Pin DDR3 LRDIMM (1.35V Product) 240Pin DDR3 LDIMM Org. Density Part Number Speed Raw Card Composition 2G x 72 16G M3862G70DM0 YH9/K0 4G x 72 32G M3864G70M0 M3864G70DM0 YH9/K0 YH9/K0 C(4Rx4) 8G x 72 64G M3868G70O0 YF8/H9 E(8Rx4) Comp. Version Internal anks 1G DDP x 4 * 36 pcs 2Gb D-die 8 4 Rank PKG Height vail. NOTE 30.35mm 2G DDP x 4 * 36 pcs 4Gb -die 8 4 2G 30.35mm x 4 * 36 pcs 4Gb D-die 2Q 13 DDP 4G QDP x 4 * 36 pcs 4Gb -die 8 8 * NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page mm 1)

12 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 4G 2Rx8 PC R P2 Made in Korea M DH0-CK RCD Information - Example PKG RCD Vendor RCD Version(Rev.) JEDEC Description (Example - 4G 2Rx8 PC3(L) R XX) 1Gb F-die 2Gb C-die 4Gb -die 1Gb G-die 2Gb D-die 4Gb -die 2Gb E-die 2Gb E-die 4Gb C-die 4Gb D-die IDT HL(0) D2 Inphi GS04(1.5V)/LV-GS02(1.35V) P1 IDT 1(evergreen) D3 Inphi UV-GS02 P2 IDT 1 D4 Inphi XV-GS02 P3 * NOTE 1) PC3L is used for 1.35V 2) RCD information is subject to change

13 6. LRDIMM Memory uffer Information 6.1 Label Example 32G 4Rx4 PC3L L C0 Made in Korea M3864G70M0-YH Memory uffer Information - Example Voltage Vendor Revision Module P/N JEDEC Description On Label 1.35V Inphi im02-gs02 M3864G70M0-YH G 4Rx4 PC3L-10600L C0 Montage M C0 M3864G70M0-YH G 4Rx4 PC3L-10600L C0 Inphi im02-gs02 M3864G70M0-CM3 1 32G 4Rx4 PC L C0 1.5V IDT 2 M3864G70M0-CM1 1 32G 4Rx4 PC L C0 Montage M C1 M3864G70M0-CM4 1 32G 4Rx4 PC L C0 * NOTE 1) The 16th digit refers memory buffer vendor and revision. 0: Inphi im02-gs02 1: IDT 2 2: Montage M C0 3: Inphi im02-gs02 4: Montage M C1 2) Memory buffer information is subject to change

14 7. Package Dimension 78all for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8) x 8 = 6.40 (Datum ) #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N Solder ball (Post Reflow ) 0.2 M (1.90) (0.95) x 12 = 9.60 MOLDING RE OTTOM VIEW TOP VIEW 78all Flip chip for 2Gb E-die (x4/x8) x (Datum ) #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N Solder ball (Post Reflow ) 0.2 M (0.30) (0.60) x 12 = 9.60 MOLDING RE OTTOM VIEW TOP VIEW

15 78all DDP for 2Gb C-die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N Solder ball (Post Reflow ) 0.2 M OTTOM VIEW x 12 = TOP VIEW all DDP for 2Gb D-die (x4/x8) x (Datum ) #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N Solder ball (Post Reflow ) 0.2 M x 12 = OTTOM VIEW TOP VIEW

16 78all DDP for 4Gb -die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N x 12 = Solder ball (Post Reflow ) 0.2 M OTTOM VIEW TOP VIEW 78all DDP for 4Gb -die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N x 12 = Solder ball (Post Reflow ) 0.2 M OTTOM VIEW TOP VIEW

17 78all for 4Gb -die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N x 12 = Solder ball (Post Reflow ) 0.2 M (1.90) (0.95) MOLDING RE OTTOM VIEW TOP VIEW 78all for 4Gb C-die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N x 12 = Solder ball (Post Reflow ) 0.20 M (0.30) (0.60) MOLDING RE OTTOM VIEW TOP VIEW

18 78all for 4Gb D-die (x4/x8) (Datum ) x 8 = #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N x 12 = Solder ball (Post Reflow ) 0.20 M (0.30) (0.60) MOLDING RE OTTOM VIEW TOP VIEW 78all Flip chip for 1Gb G-die (x4/x8) x 8 = 6.40 (Datum ) #1 INDEX MRK # MX (Datum ) C D E F G H J K L M N Solder ball (Post Reflow ) 0.2 M (0.60) (0.30) x 12 = 9.60 MOLDING RE ottom Top

19 8. Module Dimension x64/x72 240pin DDR3 SDRM Unbuffered DIMM Units : Millimeters ± (4X)3.00 ± N/ (for x64) SPD ECC (for x72) ± 0.15 (2) Max 4.0 N/ (for x64) ECC (for x72) ± ± ± x 2.10 ± ± ±0.10 Detail 1.00 Detail

20 x72 240pin DDR3 SDRM ECC VLP UDIMM Units : Millimeters ± Max ± 0.15 SPD/TS D 1.0 max 1.27 ± 0.10 C ± ± x 2.10 ± ± ± (2)xR0.8 Detail Detail Detail C & D

21 x64 204pin DDR3 SDRM Unbuffered SODIMM Units : Millimeters ± Max SPD ± ± X M C (OPTIONL HOLES) X 4.00 ± M C ± ± ± MX Detail Detail

22 x pin DDR3 SDRM ECC Unbuffered SODIMM Units : Millimeters ± Max ± ± X M C (OPTIONL HOLES) SPD X 4.00 ± M C ± ± ± MX Detail Detail

23 x72 240pin DDR3 SDRM Registered DIMM ± C (2X)3.00 Max 4.0 Units : Millimeters Register Register ± max 1.27 ± ± ± ± ± R 0.50 Detail Detail Detail C 2x 2.10 ± 0.15 ddress, Command and Control lines

24 Registered DIMM Heat Spreader Design 1. FRONT PRT Outside ± ± ± 0.2 R / ± ± ± R ± ± Green Line : TIM ttatch Line ± ± Inside 0.4 Reg. pedestal line CK PRT Outside Inside Green Line : TIM ttatch Line

25 3. CLIP PRT 39.3 ± Upper ending Tilting Gap 0.1 ~ DDR3 RDIMM SS Y View Reference thickness total (Maximum) : 7.55mm (With Clip thickness) ± 0.1 R ± ± ± ± 0.12 D 19 ± 0.12 text mark D punch press_stamp Clip open size 2.6~

26 x72 240pin DDR3 SDRM VLP Registered DIMM Units : Millimeters ± C Max Register SPD/TS ± ± ± VTT Register VTT ± max 1.27 ± ±0.10 R 0.50 Detail Detail Detail C VTT SPD/TS VTT ddress, Command and Control lines

27 VLP Registered DIMM Heat Spreader Design (DDP) 1. FRONT PRT Outside Driver IC(DP:0.18mm) 14.3 Inside Driver IC(DP:0.18mm) 2. CK PRT Outside Driver IC(DP:0.18mm) Inside Driver IC(DP:0.18mm)

28 3. CLIP PRT 7.2 ± ± ± 0.12 Clip open size 3.0~ ± SIDE-L FRONT SIDE-R 4. SS Y VIEW Reference thickness total (Maximum) : 7.55 (With Clip thickness) TIM Thickness

29 VLP Registered DIMM Heat Spreader Design (QDP) 1. FRONT PRT Outside 127 ± Caution "Hot surfoce" ±0.15 Inside 2. CK PRT Outside Inside

30 3. CLIP PRT 7.40 ± ± ± Clip open size 3.85 ± ± 0.12 QU ± 0.05 SIDE-L FRONT SIDE-R 4. SS Y VIEW Reference thickness total (Maximum) : 8 (With Clip thickness) TIM Thickness

31 x72 240pin DDR3 SDRM LRDIMM Units : Millimeters ± 0.15 C (2X)3.00 Max ± ± ± ± ± R 0.50 Detail Detail Detail C VTT VTT VTT VTT VTT VTT VTT VTT M ddress, Command and Control lines

32 x72 244pin DDR3 SDRM Mini DIMM Units : Millimeters ± ± SPD ± ± ± 0.20 Max ± ± ± x 2.00 ± ± ± ± Detail Detail

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