The Electronics Packaging & Flexible Electronics Centers at Binghamton University

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1 The Electronics Packaging & Flexible Electronics Centers at Binghamton University November 20, :30 a.m. PST (US) Research Webinar 1

2 Agenda About S3IP IEEC Vision & Mission IEEC model History Annual symposium Staff Resources/facilities Key research thrusts Education Economic impact Partners Membership 2

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that will have a broad impact on society and our partners

4 Vision The IEEC will conduct transformational research in the area of electronic systems integration and packaging that will have a broad impact on society and our partners and will contribute to their technological and economic successes. 4

5 Mission To conduct world class electronics packaging research that provides significant technological advantage to our customers To provide physical and intellectual infrastructure and expertise that will help our customers be successful in their businesses To enable each of our partners to network and grow their customer and partner base To enable economic growth in the electronics industry throughout the region and the nation To provide high-quality and real-world relevant educational experiences to our students in the interdisciplinary field of electronics packaging 5

partners to network and grow their customer and partner base To enable economic growth in the electronics industry throughout the region and the

6 IEEC model 6

7 History Highlights 1991 founded as NSF I/UCRC at Binghamton University Lockheed Martin, UIC, BAE Systems, and IBM 1994 Sigrity began as an IEEC project Mid 90s Tear-down Reports 1996 Graduated from I/UCRC to a self-sustaining center Funding from New York State Increased member companies 2000 First IEEC laboratory 2014 Center of Excellence building $30M, 114,000 square feet 7

Graduated from I/UCRC to a self-sustaining center Funding from New York State Increased member

8 History Expertise has grown with the industry THT to SMT, Including PIP Peripherally Leaded to Area Array Pb-Free Studies Nano materials for EP 2.5D / 3D Integration 8

9 Annual symposium Topics include: 3D Packaging Thermal Challenges Sensors/MEMS Embedded Electronics Printed Electronics / Additive Mfg. HiTemp Electronics Mobile Electronics Flexible Electronics 9

10 Staff Our seven-member staff boasts 120+ years of electronics packaging industry experience. More than a dozen Binghamton University faculty researchers are affiliated with the center. 10

11 Resources/Facilities Assembly MPM Stencil Printer Universal AdVantis Placement Heller 1700W Reflow These next few slides show just a partial list of our resources/facilities, please see our website for the complete list 11

next few slides show just a partial list of our

12 Resources/Facilities Stress/Reliability Thermal Shock and Cycling HAST T/H Drop Shock Shaker w/ Temp Dage 4000 and

13 Resources/Facilities Analytical and Diagnostic Sample Preparation CSAM X-Ray CMM Profilometer 13

14 ADL Overview: Analytical and Diagnostics Laboratory (ADL) in the NY state Center of Excellence in Small Scale Systems Integration and Packaging (S 3 IP) 8000 sq-ft, state-of-the-art research facility Complete, advanced analytical lab accessible to industry and academic customers $21M NY state grant Opened in Fall 2007 Resources ADL Staff: PhD scientists, engineers, graduate research assistants, and technicians Materials Science & Engineering, Physics, Chemistry, and Mechanical Engineering background Extensive experience in microelectronics industry State-of-the-art Instrumentation BU Faculty

grant Opened in Fall 2007 Resources ADL Staff: PhD scientists, engineers, graduate research assistants, and technicians Materials Science &

15 ADL provides ADL Services Materials Analysis and Characterization Services Root cause physical failure analysis for industrial products Expert insight and solution to industrial manufacturing and development problems Access to analytical and characterization instruments Collaboration for product and process development with industries Long term research collaboration with industries Knowledge transfer and training

problems Access to analytical and characterization instruments Collaboration for product and process

16 ADL Capabilities Wide range of high-tech, analytical equipment under one roof Over 76 distinct instruments available through one user interface, over 58 in one facility. Electron Microscopy Non-destructive Testing Thermal Analysis Chemical Compositional Analysis Surface and Interface Analysis Crystallography and Particle Analysis Optical Microscopy Bio-materials analysis Electrical and Mechanical Testing Extensive Sample Prep Tools Device Fabrication and Processing

Electron Microscopy Non-destructive Testing Thermal Analysis Chemical Compositional Analysis Surface and Interface

17 Services Consultation: We are happy to answer electronics questions, with formality ranging from a phone call to a full report. Analytical work: The IEEC laboratories are as close as a phone call. We strive for rapid response on all requests for analysis, with same-day turn around when possible. Environmental stressing: Chamber time is easily scheduled. In addition to stressing, we can provide in situ continuity testing. 17

We strive for rapid response on all requests for analysis, with same-day turn around when possible.

18 Services Modeling: Microelectronic systems have peculiar thermal distributions and are prone to mechanical and thermomechanical stress failures. Finite Element Modeling can determine the thermal patterns in a given structure as well as the high stress points. Reliability assessments and failure analysis: We can identify failure mechanisms, isolating and analyzing failures. Materials evaluation: Our laboratories can measure material properties such as hardness, modulus, Tg, CTE, heat capacity and thermal conductivity. 18

Reliability assessments and failure analysis: We can identify failure mechanisms, isolating and analyzing failures.

19 Key research thrusts Source: M.P. Groover(Fund. of Modern Mfg.: Materials, Processes, and Systems) 19

20 pooled projects Materials for Hi-temp Electronics Assessment of Potential Impact of Additive Manufacturing on Microelectronics Fabrication Glass Interposers Cu Filling for High Aspect Through Holes Design Guidelines for 3D IC Packaging Reliability of Nano-Cu Alternatives to Hi-Temp Solders Dual-Wavelength Optical Interferometry for Characterization of EP Materials Characterization of the Microstructure and Reliability of Si/micro Cu pillar/solder/glass Assemblies Enhancement of Cu/EMC Interface Adhesion by Controlling Surface Finish of Cu 20

Alternatives to Hi-Temp Solders Dual-Wavelength Optical Interferometry for Characterization of EP Materials Characterization of the

21 Future research thrusts 3D Packaging Printed Electronics / Additive Manufacturing Flexible Electronics Healthcare/Medical Electronics Power Electronics Advanced Materials Development (e.g., nano materials) Sensors Photonics 21

22 Education 375+ graduates (PhD, MS, BS) with IEEC support A small sample of where they work: 22

23 Economic impact IEEC YEAR ( ) Total Economic Impact Total New & Retained Jobs SINCE 1996 $61.9M $412.4M >$1.0B $ Economic Impact per $1 NYS Funding $67.2 $88.0 $69.1 Based on letters of economic impact from partner companies 23

24 Partners ASTEELFLASH Kionix Kintner Equipment Leonardi Manufacturing EZRED GE Ventures GE Inspection Technologies RPA Electronics EMS Technologies 24

25 Member benefits 25

How to become a member Visit us online at: www.binghamton.

26 How to become a member Visit us online at: Contact us: Daryl Santos, director santos@binghamton.edu Bill Infantolino, associate director binfanto@binghamton.edu 26

27 Thank you! 27

CENTER OF EXCELLENCE CENTER FOR ADVANCED INSTITUTE OF MATERIALS RESEARCH (IMR) MICROELECTRONICS MANUFACTURING (CAMM) CENTER FOR ADVANCED

CENTER OF EXCELLENCE CENTER FOR ADVANCED INSTITUTE OF MATERIALS RESEARCH (IMR) MICROELECTRONICS MANUFACTURING (CAMM) CENTER FOR ADVANCED CENTER OF EXCELLENCE INSTITUTE OF MATERIALS RESEARCH (IMR) CENTER FOR ADVANCED MICROELECTRONICS MANUFACTURING (CAMM) 38 CENTER FOR ADVANCED SENSORS AND ENVIRONMENTAL SYSTEMS (CASE) THE INTEGRATED ELECTRONICS