Embedded Flash Storage Overview.5 & 1.8 Industrial SSD mini PCIeDOM msata SATA Slim CFast Indsutrial CF Card 6
.5 & 1.8 Industrial SSD Our wide selection of SSDs are designed for different applications, including industrial/ embedded, enterprise, aviation, defense, and other semi-industrial applications, such as thin clients, POS, and kiosk. Our SSDs come in i, and types, and support PATA/IDE pin, SATA II (3.0Gb/s), and SATA III (6.0Gb/s). Serial ATA Disk on Module () is the world s smallest form factor with exclusive Pin 7 VCC built-in, which simplifies motherboard design. it is robust and enhances the disk functions of various industrial and enterprise applications. supports the SATA II and SATA III interface with faster data transfer rates and is available in capacities ranging from 51MB up to 18GB. SATA Slim SATA Slim is compliant with the JEDEC MO-97 standard form factor and ATA protocol. It does not require drivers and can be configured as a boot device or a data storage device. With a 7+15 pin SATA interface, the SATA Slim supports most platforms with a standard SATA port. CF-SATA CF-SATA has excellent data transfer speed and the same mechanical design as the CompactFlash card. It becomes compliant with the Serial ATA by extracting the unused pin from the CF50 pins and replacing it with the SATA interface. The CF-SATA is an i flash type and has a thermal sensor built-in. msata msata is a low-profile interface connector, also known as a Mini-SATA. The connector is similar in appearance to a PCI Express Mini Card interface and is electrically compatible; however, the data signals need a connection to the SATA host controller instead of the PCI-express host controller. Innodisk s msata supports highperformance data transfer rates of 1.5 Gb/s, 3.0 Gb/s and 6.0 Gb/s. CFast CFast is a small form factor card standard with high data storage capacity. It is suitable for semiindustrial applications. Compliant with the CFast.0 standard, it is designed with a 7+17 pin connector and is SATA compatible. The Innodisk CFast offers data transfer rates of sequential read up to 70 MB/sec. and of sequential write up to 80MB/sec. Embedded Disk Card (EDC) Embedded Disk Card (EDC) complies with PCMCIA* ATA standards and fits into all platforms with an IDE connector. The Innodisk Embedded Disk Card comes in capacities ranging from 18MB to 3GB and is available in 0-pin and - pin connector packages. CompactFlash (CF) card Industrial CompactFlash Memory Card (icf) complies with the PCMCIA* ATA standard. Designed to replace traditional rotating disk drives, Innodisk icfs are embedded solid-state data storage systems that are designed for mobile computing and the industrial work place. Mini PCIeDOM Mini PCIeDOM is a Flash based disk module with standard Mini PCIe form factor, and PCI Express Gen.1 interface. It is suitable for board maker or SI to design in the product as a boot drive or a storage device. Meanwhile, it supports multiple operation systems and no driver needed, including Windows XP, Windows 7, and Linux based OS. SD & MicroSD Card SD and microsd cards are single-level flash devices built for rugged applications in the embedded field. As an industrialgrade SD/microSD card, these cards deliver outstanding performance of up to 0MB per second as well as excellent endurance and reliability, especially compared to other cards used in the mobile market.
Industrial SSD ID-.5" SATA SSD 3IE ID-.5" SATA SSD 3IE ID-.5" SATA SSD 3SE-P ID-.5" SATA SSD 3SE-P ID-.5 SATA SSD 3SE ID-.5 SATA SSD 3SE ID-.5" SATA SSD 3SR-P ID-.5" SATA SSD 3SR-P 1. Cost-effective industrial Flash 1. Built-in DRAM buffer 1. Intelligent error recovery system 1. Compliant with MIL-STD-810-F/G 1. Cost-effective industrial Flash 1. Built-in DRAM buffer 1. Intelligent error recovery system 1. Compliant with MIL-STD-810-F/G with i with i. Intelligent error recovery system. Intelligent error recovery system. Excellent data transfer speed. HW/SW Data Security (QEraser/. Lifespan 10 times longer than. Excellent data transfer speed 3. Excellent data transfer speed. HW/SW Data Security (QEraser/. Lifespan 10 times longer than 3. Excellent data transfer speed 3. idata Guard protection Destroy/ SEraser/ Write Protect) 3. Performance and data quality. idata Guard protection 3. idata Guard protection Destroy/ SEraser/ Write Protect) 3. Performance and data quality. idata Guard protection 3. supported, 100% data protection congruent to 3. supported, 100% data protection congruent to i i 8GB-56GB 8GB-56GB 8GB-56GB 8GB-56GB 8GB-56GB 8GB-56GB 8GB-56GB 8GB-56GB 500/0 500/0 70/30 70/30 90/30 90/30 90/30 90/30.3W (5V 870mA).3W (5V x 870mA) 3.15W (5Vx630mA) 3.15W (5Vx630mA).75W (5Vx550mA).75W (5Vx550mA) 3.5W (5Vx650mA) 3.5W (5Vx650mA) STD W/T STD :, W/T : Optional Optional 69.8 100.1 6.8 69.8 x 100.1 x 6.8 69.8 99.8 9. 69.8 X 99.8 X 9. 69.8 99.8 9. 69.8 X 99.8 X 9. 69.8 99.8 9. 69.8 X 99.8 X 9. Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C +95 C MTBF: >3 million hours Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours DHS5-XXXD06C*** DHS5-XXXD06C*** DES5-XXXD67SC***(P) DES5-XXXD67SC***(P) DES5-XXXD06SC*** DES5-XXXD06SC*** DRS5-XXXD67SC*** DRS5-XXXD67SC*** DHS5-XXXD06W*** DHS5-XXXD06W*** DES5-XXXD67SW***(P) DES5-XXXD67SW***(P) DES5-XXXD06SW*** DES5-XXXD06SW*** DRS5-XXXD67SW*** DRS5-XXXD67SW*** otes otes XXX density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %=Flash ***= flash configuration (internal control code) %=Flash ID-.5" SATA SSD 3ME ID-.5" SATA SSD 3ME ID-.5" SATA SSD 3MR-P ID-.5" SATA SSD 3MR-P ID-Slim SSD 3ME ID-Slim SSD 3ME ID-1.8" SATA SSD 3SR-P ID-1.8" SATA SSD 3SR-P 1. 7mm height mechanical design 1. Compliant with MIL-STD-810-F/G 1. 1.8" housing, 50% space saving 1. Compliant with MIL-STD-810-F/G 1. 7mm height mechanical design 1. Compliant with MIL-STD-810-F/G 1. 1.8" housing, 50% space saving 1. Compliant with MIL-STD-810-F/G. Low power consumption. HW/SW Data Security (QEraser/. SW Data Security (QEraser/Destroy/. Low power consumption. HW/SW Data Security (QEraser/. SW Data Security (QEraser/Destroy/ 3. Budget friendly -based solution Destroy/ SEraser/ Write Protect) SEraser/Write Protect) 3. Budget - friendly -based solution Destroy/ SEraser/ Write Protect) SEraser/Write Protect) 3. supported, 100% data protection 3. supported, 100% data protection 8GB-51GB 3GB-51GB 8GB~ 18GB 8GB~ 56GB 8GB-51GB 3GB-51GB 8GB~ 18GB 8GB~ 56GB 70/60 70/60 510/30 510/30 60/160 60/160 90/30 90/30.3W (5V 870mA).3W (5V x 870mA) 5W (5V 1A) 5W (5V x 1A) 1.6W(5V 310mA) 1.6W(5V x 310mA) 3W (5V 600mA) 3W (5V x 600mA) STD W/T STD :, W/T : 69.8 100.1 6.8 69.8 x 100.1 x 6.8 69.8 99.8 9. 69.8 x 99.8 x 9. 69.8 50.0 9.0 69.8 x 50.0 x 9.0 5.0 78.5 5.0 5.0 x 78.5 x 5.0 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C +95 C MTBF: >3 million Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million DES5-XXXD06%C*** DES5-XXXD06%C*** DES5-XXXD07%C*** DES5-XXXD07%C*** DRS5-XXXD67SC*** DRS5-XXXD67SC*** DEMLM-XXXD07%C*** DEMLM-XXXD07%C*** DRS18-XXXD67SC*** DRS18-XXXD67SC*** DES5-XXXD06%W*** DES5-XXXD06%W*** DES5-XXXD07%W*** DES5-XXXD07%W*** DRS5-XXXD67SW*** DRS5-XXXD67SW*** DEMLM-XXXD07%W*** DEMLM-XXXD07%W*** DRS18-XXXD67SW*** DRS18-XXXD67SW*** otes otes XXX density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %= ***= flash configuration (internal control code) %=
Key Features Flash Type Max. External Power DRAM Consumption Buffer External DRAM Buffer ATA Dimension Security(WxLxH) (mm) Dimension Standard Temp. (WxLxH) OP (0 C~+70 C) (mm) otes otes ID--ML 3SE-P ID--ML 3SE ID--MH 3SE 1. Vertical and low-profile design for 1U 1. Vertical and low-profile design for 1U 1. Low-profile design. High IOPS ID--ML 3SE-P. Write protect ID--ML 3SE. Write protect ID--MH 3SE 3. Write protect 3. High performance 3. High performance 1. Vertical and low-profile design for 1U 1. Vertical and low-profile design for 1U 1. Low-profile design. High performance. High IOPS. Write protect. Write protect 3. Write protect 3. High performance SATA III 6.0Gb/s 3. High performance SATA III 6.0Gb/s. High performance SATA 8GB-6GB III 6.0Gb/s SATA 8GB-6GB III 6.0Gb/s SATA GB-3GB III 6.0Gb/s 8GB-6GB 80/0 8GB-6GB 80/0 GB-3GB 300/130.79W (5Vx558mA).79W (5Vx558mA) 1.8W (5Vx360mA) 80/0 80/0 STD :, W/T : 300/130.79W (5Vx558mA).79W (5Vx558mA) 1.8W (5Vx360mA) STD :, W/T : 35.5 x 30 x 9.5 35.5 x 30 x 9.5 0.0 x 30.0 x 1.3 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million DESML-XXXD67SC***(F) 35.5 x 30 x 9.5 DESML-XXXD06SC***(F) 35.5 x 30 x 9.5 DESMH-XXXD07SC***(F) 0.0 x 30.0 x 1.3 DESML-XXXD67SW***(F) Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage DESML-XXXD06SW***(F) Temperature: -55 C ~ +95 C MTBF: >3 milliondesmh-xxxd07sw***(f) DESML-XXXD67SC***(F) = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, DESML-XXXD06SC***(F) 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, DESMH-XXXD07SC***(F) 51GB=C1 ) DESML-XXXD67SW***(F) ***= flash configuration (internal control code) %= DESML-XXXD06SW***(F) DESMH-XXXD07SW***(F) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %= Key Features Flash Type Power Consumption Sequential R/W (MB/sec, max) Max. External Power DRAM Consumption Buffer External DRAM Buffer ATA Dimension Security(WxLxH) (mm) Dimension Standard Temp. (WxLxH) OP (0 C~+70 C) (mm) otes otes ID--SL 3SE ID--SV 3SE ID--SH 3SE ID--SH Type D 3SE 1. Vertical and low-profile design for 1U 1. Vertical version 1. Low profile horizontal design 1. Low profile horizontal design ID--SL 3SE. Anti-vibration ID--SV mechanical 3SE design. Only ID--SH expose 1mm height 3SE on the ID--SH Type D 3SE. Best boot drive solution motherboard when applying in practical 1. 3. Vertical Lower power and low-profile consumption design for 1U 1. Vertical version 1. Low profile horizontal design 1. Low profile horizontal design. Anti-vibration mechanical design. Only expose 1mm height on the. Best boot drive SATA solution III 6.0Gb/s motherboard SATA when III applying 6.0Gb/s in practical 3. Lower power consumption 51MB-3GB SATA 51MB-3GB III 6.0Gb/s 51MB-3GB 51MB-3GB 51MB-3GB 300/130 51MB-3GB 300/130 51MB-3GB 300/130 51MB-3GB 300/130 0.65W (5V x 130mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) 300/130 300/130 STD :, W/T : 300/130 300/130 0.65W (5V x 130mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) 0.65W (5V x 130mA) STD :, W/T : 3.9 x 9.5 x 8 0.9 x 39.5 x 7.9 18.0 x 30.3 x 1.5 30.3 x 0.3 x 1.05 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 CMTBF: >3 million hours DESSL-XXXD07*C***(F) 3.9 x 9.5 x 8 DESSV-XXXD07SC***(F) 0.9 x 39.5 x 7.9 DESSH-XXXD07*C***(F) 18.0 x 30.3 x 1.5 DESSF-XXXD07*C***(F) 30.3 x 0.3 x 1.05 DESSL-XXXD07*W***(F) Vibration: 0G@7~000Hz DESSV-XXXD07SW***(F) Shock: 1500G@0.5ms Storage Temperature: DESSH-XXXD07*W***(F) -55 C ~ +95 CMTBF: >3 million hours DESSF-XXXD07*W***(F) DESSL-XXXD07*C***(F) = density (0GB=0G, DESSV-XXXD07SC***(F) 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, DESSH-XXXD07*C***(F) 6GB=6G, 18GB=A8, 56GB=B56, DESSF-XXXD07*C***(F) 51GB=C1 ) DESSL-XXXD07*W***(F) DESSV-XXXD07SW***(F) ***= flash configuration (internal control DESSH-XXXD07*W***(F) code) %= DESSF-XXXD07*W***(F) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %=
ID--ML 3MG-P ID--ML 3ME ID--MV 3ME ID--MH 3ME 1. Vertical, low-profile design for 1U 1. Vertical and low-profile design for 1U 1. Vertical version 1. Low-profile design. High IOPS ID--ML 3MG-P ID--ML 3ME. Write ID--MV protect 3ME. Write ID--MH protect 3ME 3. Write protect. Write protect 3. Anti-vibration mechanical design 1. Vertical, low-profile design for 1U. High performance 1. 3. Vertical High performance and low-profile design for 1U 1. Vertical version 1. Low-profile design. High IOPS. Write protect. Write protect 3. Write protect. Write protect 3. Anti-vibration SATA mechanical III 6.0Gb/s design. High performance 3. High performance SATA 16GB-18GB III 6.0Gb/s SATA 16GB-18GB III 6.0Gb/s SATA 16GB-18GB III 6.0Gb/s SATA 8GB-18GB III 6.0Gb/s Flash Type Power Consumption Max. External Power DRAM Consumption Buffer Thermal Sensor External DRAM Buffer ATA Dimension Security(WxLxH) (mm) Wide otes Temp. OP (-0 C~+85 C) 16GB-18GB 500/160 16GB-18GB 500/160 16GB-18GB 60/160 8GB-18GB 300/150.79W (5V x 558mA).79W (5V x 558mA) 1W (5V x 00mA) W (5Vx00mA) 500/160 500/160 STD :, W/T : 60/160 300/150.79W (5V x 558mA).79W (5V x 558mA) 1W (5V x 00mA) W (5Vx00mA) STD :, W/T : 35.5 x 30 x 9.5 35.5 x 30 x 9.5 5.3 X 1.5X 6.8 0.0 X 30.0 X1.3 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million 35.5 x 30 x 9.5 35.5 x 30 x 9.5 5.3 X 1.5X 6.8 0.0 X 30.0 X1.3 DGSML-XXXD67%C***(F) DESML-XXXD06%C***(F) DESMV-XXXD07%C***(F) DESMH-XXXD07%C***(F) Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: DESMV-XXXD06%C***(F) -55 C ~ +95 C MTBF: >3 million DGSML-XXXD67%W***(F) DGSML-XXXD67%C***(F) DESML-XXXDO6%W***(F) DESMV-XXXD07%W***(F) DESML-XXXD06%C***(F) DESMV-XXXD07%C***(F) DESMV-XXXD06%W***(F) DESMV-XXXD06%C***(F) DESMH-XXXD07%W***(F) DESMH-XXXD07%C***(F) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, DGSML-XXXD67%W***(F) DESML-XXXDO6%W***(F) DESMV-XXXD07%W***(F) 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control DESMH-XXXD07%W***(F) DESMV-XXXD06%W***(F) code) %= otes XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %= Key Features Flash Type Power Consumption Max. External Power DRAM Consumption Buffer Thermal Sensor External DRAM Buffer ATA Dimension Security(WxLxH) (mm) Dimension Standard Temp. (WxLxH) OP (0 C~+70 C) (mm) otes otes ID--SL 3ME ID--SV 3ME ID--SH 3ME ID--SH Type D 3ME 1. Vertical and low-profile design for 1U 1. Vertical version 1. Low profile horizontal design 1. Low profile horizontal design ID--SL 3ME. Anti-vibration ID--SV mechanical 3ME design. Best boot drive solution ID--SH 3ME ID--SH Type D 3ME 1. 3. Vertical Lower power and low-profile consumption design for 1U 1. Vertical version 1. Low profile horizontal design 1. Low profile horizontal design. Anti-vibration mechanical design. Best boot SATA drive III solution 6.0Gb/s 3. Lower power consumption SATA GB-6GB III 6.0Gb/s SATA GB-3GB III 6.0Gb/s SATA GB-3GB III 6.0Gb/s SATA GB-3GB III 6.0Gb/s 1 1 1 GB-6GB 300/80 GB-3GB 150/0 GB-3GB 150/0 GB-3GB 150/0 0.65W (5V x 15mA) 0.65W (5V x 115mA) 0.65W (5V 1x 15mA) 0.63W (5V x 116mA) 300/80 150/0 STD :, W/T : 150/0 150/0 0.65W (5V x 15mA) 0.65W (5V x 15mA) 0.65W (5V x 15mA) 0.63W (5V x 16mA) STD :, W/T : 3.9 x 9.5 x 8 0.9 x 39.5 x 8.1 18.0 x 30.3 x 1.5 30.3 x 0.3 x1.05 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours DESSL-XXXD07%C***(F) 3.9 x 9.5 x 8 DESSV-XXXD07%C***(F) 0.9 x 39.5 x 8.1 DESSV-XXXD07%C***(F) 18.0 x 30.3 x 1.5 DESSF-XXXD07%C***(F) 30.3 x 0.3 x1.05 DESSL-XXXD07%W***(F) Vibration: 0G@7~000Hz Shock: DESSV-XXXD07%W***(F) 1500G@0.5ms Storage Temperature: -55 C DESSV-XXXD07%W***(F) ~ +95 C MTBF: >3 million hours DESSF-XXXD07%W***(F) DESSL-XXXD07%C***(F) = density (0GB=0G, 0GB=0G, DESSV-XXXD07%C***(F) 08GB=08G, 16GB=16G, 3GB=3G, DESSV-XXXD07%C***(F) 6GB=6G, 18GB=A8, 56GB=B56, DESSF-XXXD07%C***(F) 51GB=C1 ) DESSL-XXXD07%W***(F) ***= flash configuration (internal control code) %= DESSV-XXXD07%W***(F) DESSV-XXXD07%W***(F) DESSF-XXXD07%W***(F) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %=
ID--ML 3IE ID--MV 3IE ID--SL 3IE ID--SV 3IE 1. Vertical & low-profile design for 1U 1. Vertical version 1. Vertical & low-profile design for 1U 1. Vertical version ID--ML 3IE. Cost-effective industrial Flash with i ID--MV 3IE. Cost-effective industrial Flash with i ID--SL 3IE. Cost-effective industrial Flash with i ID--SV 3IE. Cost-effective industrial Flash with i 1. 3. Vertical Write protect & low-profile design for 1U 1. 3. Vertical Lifespan version 10 times longer than 1. 3. Vertical Best boot & drive low-profile solution design for 1U 1. 3. Vertical Lifespan version 10 times longer than.. Cost-effective Lifespan 10 times industrial longer Flash than with i.. Cost-effective Performance and industrial data quality Flash with i.. Cost-effective Lifespan 10 times industrial longer Flash than with i.. Cost-effective Performance and industrial data quality Flash with i 3. 5. Write Performance protect & data quality 3. Lifespan congruent 10 to times longer than 3. 5. Best Performance boot drive & solution data quality 3. Lifespan congruent 10 to times longer than. Lifespan congruent 10 to times longer than. Performance and data quality. Lifespan congruent 10 to times longer than. Performance and data quality 5. Performance & data quality congruent to 5. Performance & data quality congruent to SATA6.0Gb/s congruent to congruent to SATA i III 6.0Gb/s SATA6.0Gb/s i SATA III i 6.0Gb/s SATA III i 6.0Gb/s Flash Type 8GB-6GB i 8GB-6GB i GB-3GB i GB-3GB i 8GB-6GB 8GB-6GB GB-3GB GB-3GB Max. Sequential Channel R/W (MB/sec, max) 500/300 70/0 300/190 300/190 Sequential Max. Power R/W Consumption (MB/sec, max).79w 500/300 (5V x 558mA) 1W (5V 70/0 x 00mA) 0.65W 300/190 (5V x 15mA) 0.65W 300/190 (5V x 15mA) Max. Thermal Power Sensor Consumption.79W (5V x 558mA) 1W (5V x 00mA) STD :, W/T : 0.65W (5V x 15mA) 0.65W (5V x 15mA) STD :, W/T : External DRAM Buffer ATA Security 35.5 x 30 x 9.5 5.3 x 1.5 x 6.8 3.9 x 9.5 x 8 0.9 x 39.5 x 8.1 Dimension (WxLxH) (mm) 35.5 x 30 x 9.5 Vibration: 0G@7~000Hz 5.3 Shock: x 1.5 1500G@0.5ms x 6.8 Storage Temperature: 3.9-55 C x 9.5 ~ +95 C x 8 MTBF: >3 million 0.9 x 39.5 x 8.1 DHSML-XXXD06C***(F) Vibration: 0G@7~000Hz DHSMV-XXXD06C***(F) Shock: 1500G@0.5ms Storage Temperature: DEDDL-XXXD07C***(F) -55 C ~ +95 C MTBF: >3 million DESSV-XXXD07C***(F) Standard Wide Temp. Temp. OP OP (-0 C~+85 C) (0 C~+70 C) DHSML-XXXD06W***(F) DHSML-XXXD06C***(F) DHSMV-XXXD06W***(F) DHSMV-XXXD06C***(F) DEDDL-XXXD07C***(F) DESSL-XXXD07W***(F) DESSV-XXXD07W***(F) DESSV-XXXD07C***(F) Wide otestemp. OP (-0 C~+85 C) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) DHSML-XXXD06W***(F) DHSMV-XXXD06W***(F) DESSL-XXXD07W***(F) DESSV-XXXD07W***(F) ***= flash configuration (internal control code) %= otes XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %= Mini PCIeDOM CF-SATA Key Features Key Features Flash Type Dimension (WxLxH) (mm) Standard Wide Temp. Temp. OP OP (-0 C~+85 C) (0 C~+70 C) Wide otestemp. OP (-0 C~+85 C) otes ID-Mini PCIeDOM 1SE ID-Mini PCIeDOM 1ME 1. Standard PCIe 1. Standard PCIe. Driver-less ID-Mini PCIeDOM 1SE. Driver-less ID-Mini PCIeDOM 1ME 1. Standard PCIe 1. Standard PCIe. Driver-less PCI Express Gen.1 x1. Driver-less PCI Express Gen.1 x1 PCI Express Gen.1 x1 PCI Express Gen.1 x1 GB~6GB 8GB~18GB GB~6GB 8GB~18GB 85/85 170/10.3 W (3.3V x 700 ma ) 85/85 W (3.3V x 600 ma ) 170/10.3 W (3.3V x 700 ma ) STD:, W/T: W (3.3V x 600 ma ) STD:, W/T: 30 x 50.95 x 5 30 x 50.95 x 5 Shock: 1500G@0.5ms 30 x 50.95 x 5 30 x 50.95 x 5 Storage Temperature: -55 C ~ +95 C Shock: MTBF: >3 1500G@0.5ms million hours Storage Temperature: -55 C ~ +95 C DEEDM-XXXJ30AC*** DEEDM-XXXD07SC*** MTBF: >3 million hours DEEDM-XXXJ30AW*** DEEDM-XXXJ30AC*** DEEDM-XXXD07SW*** DEEDM-XXXD07SC*** XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, DEEDM-XXXJ30AW*** DEEDM-XXXD07SW*** 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ID-CF-SATA 3IE 1. Replaced solution of CF 50 pins ID-CF-SATA 3IE with SATA signal Key Features 1. Replaced solution of CF 50 pins with SATA signal SATA III i 6.0Gb/s Flash Type 8GB~3GB i 8GB~3GB 310/180 1W (5V x 00mA) 310/180 Connectors 50pin CF connector 1W (5V x 00mA) Connectors 50pin CF connector.8 x 36. x3.3 Dimension (WxLxH) (mm) Shock: 1500G@0.5ms.8 x 36. x3.3 Storage Temperature: -55 C ~ +95 C Shock: MTBF: 1500G@0.5ms >3 million hours Storage DECFS-XXXD07C*** Temperature: -55 C ~ +95 C MTBF: >3 million hours Standard Wide Temp. Temp. OP OP (-0 C~+85 C) (0 C~+70 C) DECFS-XXXD07C*** DECFS-XXXD07W*** XXX = density (0GB=0G, 0GB=0G, Wide otestemp. OP (-0 C~+85 C) 08GB=08G, DECFS-XXXD07W*** 16GB=16G, 3GB=3G, 6GB=6G) otes XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G)
DHSLM-XXXD06SC*** DESLM-XXXD67SC*** DESLM-XXXD06SC*** DGSLM-XXXD67%C*** otes Industrial Flash Storage msata DHSLM-XXXD06SW*** DESLM-XXXD67SW*** DESLM-XXXD06SW*** DGSLM-XXXD67%W*** XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %= otes SATA Slim ID-mSATA 3IE ID-mSATA 3SE-P ID-mSATA 3SE ID-mSATA 3ME 1. Cost-effective industrial Flash with i. Lifespan 10 times longer than 1. Excellent data transfer speed and IOPS. Support command 1. Excellent data transfer speed and IOPS. High quality -based solution 1. Excellent data transfer speed and IOPS. Budget- friendly -based solution 3. Performance and data quality congruent to. Excellent data transfer speed 3. Built-in DRAM buffer i 8GB~6GB 8GB~6GB GB~6GB GB-18GB 60/ 350 90/60 510/50 510/160 1.1 W (3.3V x 335 ma ) 1. W (3.3V x 360 ma ) 1.1 W (3.3V x 319 ma ) 1.1W (3.3V x 335mA) STD :, W/T : 9.8 x 50.8 x. 9.8 x 50.8 x. 9.8 x 50.8 x. 9.8 x 50.8 x. Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours*** DHMSR-XXXD06C*** DHMSR-XXXD06W*** DEMSR-XXXD06SC*** DEMSR-XXXD67SC*** DEMSR-XXXD07SC*** DEMSR-XXXD06SW*** DEMSR-XXXD67SW*** DEMSR-XXXD07SW*** XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G) ***= flash configuration (internal control code) %= DEMSR-XXXD07%C*** DEMSR-XXXD06%C*** DEMSR-XXXD07%W*** DEMSR-XXXD06%W*** ID-SATA Slim 3IE ID-SATA Slim 3SE-P ID-SATA Slim 3SE 1. Cost-effective industrial Flash with i. Lifespan 10 times longer than 3. Performance and data quality congruent to 1. Half Slim, space saving. High quality -based solution 3. Excellent data transfer speed. Compatible with JEDEC MO97 1. Half Slim, space saving. High quality -based solution 3. Compatible with JEDEC MO97 i GB-18GB GB-18GB GB-18GB 60/370 80/330 60/360 ID-SATA Slim 3MG-P 1. EverGreen L² architecture. Excellent data transfer speed 3. Compatible with JEDEC MO97 8GB-56GB 60/0 otes 1.6W (5V x 315mA) 1.65W (5V x 330mA) 1.1W (5Vx0mA).1W (5V x 8mA) STD :, W/T : 5.0 x 39.8 x.0 5.0 x 39.8 x.0 5.0 x 39.8 x.0 5.0 x 39.8 x.0 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours DHSLM-XXXD06SC*** DESLM-XXXD67SC*** DESLM-XXXD06SC*** DGSLM-XXXD67%C*** DHSLM-XXXD06SW*** DESLM-XXXD67SW*** DESLM-XXXD06SW*** DGSLM-XXXD67%W*** XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8, 56GB=B56, 51GB=C1 ) ***= flash configuration (internal control code) %=
CFast Connector Connector Wide Standard Temp. Temp. OP (-0 C~+85 C) OP (0 C~+70 C) otes otes Industrial CF Card ID-CFast 3IE ID-CFast 3SE ID-CFast 3ME 1. Cost-effective industrial Flash with i. Lifespan 10 times ID-CFast longer 3IE than 3. 1. Performance Cost-effective and industrial data quality Flash congruent with ito 1. Compliant with CFast.0 standard. Excellent data transfer ID-CFast speed 3SE 3. 1. Wirte Compliant protect with CFast.0 standard 1. Compliant with CFast.0 satndard. Budget friendly -based ID-CFast 3ME solution 3. 1. Wirte Compliant protect with CFast.0 satndard.. Wirte Lifespan protect 10 times longer than. Excellent data transfer speed. Budget friendly -based solution 3. Performance and data quality congruent to 3. Wirte protect 3. Wirte protect. Wirte protect 7+17pin 7+17pin 7+17pin i 7+17pin 8GB~6GB 7+17pin GB~6GB 7+17pin GB~18GB i 8GB~6GB 310/80 GB~6GB 70/50 GB~18GB 300/150 1.1W (3.3V x 30mA) 1.1W (3.3V x 360mA) 1.1W (3.3V x 30mA) 310/80 70/50 STD :, W/T : 300/150 1.1W (3.3V x 30mA) 1.1W (3.3V x 360mA) 1.1W (3.3V x 30mA) STD :, W/T :.8 x 36. x3.6.8 x 36. x3.6.8 x 36. x3.6 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours.8 x 36. x3.6.8 x 36. x3.6.8 x 36. x3.6 DECFA-XXXD07AC*** DHCFA-XXXD07C*** DECFA-XXXD07%C*** Vibration: 0G@7~000Hz Shock: 1500G@0.5ms DECFA-XXXD06SC*** Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours DHCFA-XXXD07W*** DHCFA-XXXD07C*** DECFA-XXXD07AW*** DECFA-XXXD07AC*** DECFA-XXXD06SW*** DECFA-XXXD06SC*** DECFA-XXXD07%W*** DECFA-XXXD07%C*** XXX = density (0GB=0G, 0GB=0G, DECFA-XXXD07AW*** 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8) DHCFA-XXXD07W*** DECFA-XXXD07%W*** ***= flash configuration DECFA-XXXD06SW*** (internal control code) % = XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8) ***= flash configuration (internal control code) % = Connector Connector Sequential R/W (MB/sec, max) Max. Power Channel Consumption Max. Thermal Power Sensor Consumption ote otes otes ID-iCF 9000 ID-iCF 000 ID-iCF 1ME 1. High sustained data transfer speed. Enhanced power cycling ID-iCF management 9000 1. High quality -based solution ID-iCF 000 1. Budget friendly -based solution. Enhanced power cycling ID-iCF management 1ME 1. High sustained data transfer PATAspeed 1. High quality -based PATAsolution 1. Budget friendly -based PATAsolution. Enhanced power 50pin cycling CF connector management 50pin CF connector. Enhanced power 50pin cycling CF connector management PATA PATA PATA 50pin 1GB~6GB CF connector 50pin 18MB~8GB CF connector 50pin GB~18GB CF connector 1GB~6GB 100/95 18MB~8GB 35/5 GB~18GB 110/65 1.05W(5V x 10mA) 0.69W(3.3V 100/95 x 10mA) 0.75W(5V x 150mA) 0.5W(3.3V 35/5 x 150mA) 1.05w(5V x 150mA) 0.69W(3.3V 110/65 x 150 ma) 1.05W(5V x 10mA) 0.75W(5V x 150mA) 1.05w(5V x 150mA) 0.69W(3.3V x 10mA) 0.5W(3.3V x 150mA) 0.69W(3.3V x 150 ma).8 x 36. x 3.3.8 x 36. x 3.3.8 x 36. x 3.3 Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours.8 x 36. x 3.3 DC1M-XXXD71%C***.8 x 36. x 3.3 DC1M-XXXD31C***.8 x 36. x 3.3 DECFC-XXXD53%C*** Vibration: 0G@7~000Hz Shock: 1500G@0.5ms Storage Temperature: -55 C ~ +95 C MTBF: >3 million hours DC1M-XXXD71%W*** DC1M-XXXD31W*** DECFC-XXXD53%W*** DC1M-XXXD71%C*** PIO mode 0-6 DC1M-XXXD71%W*** UDMA mode 0-7 DC1M-XXXD31C*** PIO mode 0- DC1M-XXXD31W*** UDMA mode 0- DECFC-XXXD53%C*** PIO mode 0-6 DECFC-XXXD53%W*** UDMA mode 0-7 PIO XXX mode = 0-6 density (0GB=0G, 0GB=0G, 08GB=08G, PIO mode 16GB=16G, 0-3GB=3G, 6GB=6G, 18GB=A8) PIO mode 0-6 UDMA mode 0-7 ***= flash configuration (internal UDMA control mode code) 0- % = UDMA mode 0-7 XXX = density (0GB=0G, 0GB=0G, 08GB=08G, 16GB=16G, 3GB=3G, 6GB=6G, 18GB=A8) ***= flash configuration (internal control code) % =