SMD Side View LEDs (0.8mm) EAPL2812GA0

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PRELIMINARY Features Side view LED. Lead frame package with individual 2 pins. Wide viewing angle. Soldering methods: IR reflow soldering. ESD protection. Pb-free. The product itself will remain within RoHS compliant version. Description Due to the package design, this series has wide viewing angle, low power consumption and white LEDs are devices. This feature makes the LED ideal for light guide application. Applications LCD Back Light. Mobile phones. Indicators. Illuminations. Switch Lights. 1 www.everlightamericas.com

Device Selection Guide Chip Materials Emitted Color Resin Color InGaN Brilliant Green Water Clear Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Unit Reverse Voltage V R 5 V Forward Current I F 30 ma Peak Forward Current (Duty 1/10 @1KHz) I FP 100 ma Power Dissipation Pd 95 mw Junction Temperature T j 115 Operating Temperature T opr -40 ~ +85 Storage Temperature Tstg -40 ~ +90 Thermal Resistance ESD (Classification acc. AEC Q101) Soldering Temperature Rth J-A 600 K/W Rth J-S 400 K/W ESD HBM 2000 V ESD MM 200 V T sol Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. 2

Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 1120 ----- 2250 mcd I F =20mA Viewing Angle 2θ 1/2 ----- 120 ----- deg I F =20mA Peak Wavelength λp ----- 518 ----- nm I F =20mA Dominant Wavelength λd 520 ---- 535 nm I F =20mA Spectrum Radiation Bandwidth Δλ ----- 35 ----- nm I F =20mA Forward Voltage V F 2.75 ---- 3.65 V I F =20mA Reverse Current I R ----- ----- 50 μa V R =5V Note: 1. Tolerance of Luminous Intensity: ±11% 2. Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V 3

Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition W1 1120 1420 W2 1420 1800 X1 1800 2250 mcd I F =20mA Note: Tolerance of Luminous Intensity: ±11% Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition X 520 525 Y 525 530 Z 530 535 nm I F =20mA Note: Tolerance of Dominant Wavelength: ±1nm Bin Range of Forward Voltage Bin Code Min. Max. Unit Condition 5 2.75 3.05 6 3.05 3.35 7 3.35 3.65 V I F =20mA Note: Tolerance of Forward Voltage: ±0.1V 4

Typical Electro-Optical Characteristics Curves 5

Package Dimension Note: Tolerances unless mentioned ±0.1mm. Unit = mm 6

Moisture Resistant Packing Materials Label Explanation CPN: Customer s Product Number P/N: Product Number QTY: Packing Quantity CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank LOT No: Lot Number Reel Dimensions Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm 7

Moisture Resistant Packing Process Note: Tolerances unless mentioned ±0.1mm. Unit = mm Precautions for Use 1. Over-current-proof 1.1 Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). Above255 XC 30sec.Max. 3 XC/sec.Max. Pre-heating 150~200 XC 60~120sec. Above 217 XC 60~150sec. 260 XC Max. 10sec. Max. 6 XC/sec.Max. 2. Storage 2.1 Moisture proof bag should only be opened immediately prior to usage. 2.2 Environment should be less than 30 and 60% RH when moisture proof bag is opened. 2.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 2.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less 8

than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. Revision History Rev. Modified date File modified contents 1 2014/05/08 New Spec 9