Quad, High-Speed HDMI/DVI 2:1 Digital Video Switch

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19-0807; Rev 0; 4/07 EVALUATION KIT AVAILABLE Quad, High-Speed HDMI/DVI 2:1 Digital General Description The high-speed analog switch is ideal for HDMI/DVI switching applications, permitting 2:1 or 1:2 switching. The contains four differential pairs of 1:2 or 2:1 switches for RGB and clocking signals. The connects either one monitor to one of two digital video signals, or one HDMI/DVI source to one of two loads (sink). The set of differential switches is based on an nfet architecture with internal charge pump for gate overdrive. This advanced architecture results in an extremely low capacitance and on-resistance needed for the excellent return loss requirements for digital switching. An efficient internal charge-pump design offers very low quiescent current for power-sensitive notebook designs. The features 8Ω (typ) on-resistance and 2.5pF on-capacitance switches for routing RGB and CLK video signals. The is a high-frequency companion device to the MAX4929. These two devices combined perform the full 2:1 HDMI/DVI switching function. The is available in a space-saving, 42-pin, 3.5mm x 9.0mm TQFN package and operates over the extended -40 C to +85 C temperature range. HDTV Monitors/Receivers Video Projectors Notebook Computers Digital HDTV Switch Boxes/Tuners Multimedia Audio/ers Servers/Routers with DVI Interfaces Digital Video Recorders LVDS Switching 1000 Base-BX, Switching Applications Features Single +3.0V to +3.6V Power Supply Low On-Resistance (RON): 8Ω (typ) Low On-Capacitance (CON): 2.5pF (typ) Low Skew: 20ps (typ) 700µA Low Supply Current 2.6GHz (typ) Ultra-High Bandwidth 0.6dB (typ) Ultra-Low Insertion Loss High-Frequency Companion Device to MAX4929 Use and MAX4929 to Form a Complete HDMI/DVI 2:1 Switch 42-Pin, 3.5mm x 9.0mm, Space-Saving TQFN Ordering Information PART TEMP RANGE PIN- PACKAGE PKG CODE ETO+ -40 C to +85 C 42 TQFN-EP* T42359OM-1 +Denotes a lead-free package. *EP = Exposed paddle. EYE DIAGRAM ( = 3.3V, f = 2.6GHz 600mV P-P PRBS SIGNAL+) Eye Diagram Pin Configuration appears at end of data sheet. * PRBS = PSUEDORANDOM BIT SEQUENCE UI = 606ps Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.

ABSOLUTE MAXIMUM RATINGS (All voltages referenced to.)...-0.3v to +4V (Note 1)...-0.3V to ( + 0.3V) COM_, NC_, NO_...-0.3V to ( + 0.3V) Continuous Current Through Any Switch...±120mA Peak Current Through Any Switches (Pulsed at 1ms, 10% duty cycle)...±240ma Continuous Power Dissipation (T A = +70 C) 42-Pin Thin QFN-EP (derate 35.7mW/ C above +70 C)...2857.1mW Operating Temperature Range...-40 C to +85 C Storage Temperature Range...-65 C to +150 C Junction Temperature... +150 C Lead Temperature (soldering, 10s)...+300 C Note 1: Signal exceeding or are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = +3.0V to +3.6V, T A = T MIN to T MAX. Typical values are at = +3.3V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range 3.0 3.6 V Quiescent Supply Current I DD +3V +3.6V; = 0V or 600 1100 µa ANALOG SWITCH = +3V, 0V V COM_, I COM_ = -40mA ON = +3V, I COM_ = -40mA, 0 V COM_ 1.5V On-Resistance Matching (Notes 3, 4) On-Resistance Flatness (Note 3) ΔR ON R FLAT(ON) = +3V, 1.5V V COM_, I COM_ = -40mA = +3V, 0 V COM_ 1.5V, I COM_ = -40mA T A = +25 C 8 11 T A = T MIN to T MAX 15 T A = +25 C 8 11 T A = T MIN to T MAX 15 T A = +25 C 0.28 0.40 T A = T MIN to T MAX 0.8 T A = +25 C 0.28 0.40 T A = T MIN to T MAX 0.8 = +3V, T A = +25 C 0.02 0.60 I COM_ = -40mA, T A = T MIN to 1.5V < V COM_ < V 1 DD T MAX = +3V, I COM_ = -40mA, 0 V COM_ 1.5V T A = +25 C 0.02 0.60 T A = T MIN to T MAX 1 Ω Ω Ω Leakage Current I L = +3.6V, V COM_ = +0.3V, +3.3V, V NC_ or V NO_ = +3.3V, 0.3V -1 +1 µa SWITCH DYNAMIC Off-Capacitance C OFF f = 1MHz, V COM_ = V NC_ or V NO_ 1.5 pf 2

ELECTRICAL CHARACTERISTICS (continued) ( = +3.0V to +3.6V, T A = T MIN to T MAX. Typical values are at = +3.3V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS On-Capacitance C ON f = 1MHz, V COM_ = V NC_ or V NO_ 2.5 pf Propagation Delay t PD1, t PD2 R S = R L = 50Ω (Figure 2) 100 ps Output Skew Between Ports t SKEW1 Skew between any two ports, R S = R L = 50Ω (Figure 3) Skew Between Same Ports t SKEW2 R S = R L = 50Ω, skew between any two ports (Figure 3) SWITCH AC PERFORMANCE 20 ps 20 ps On-Channel -3dB Bandwidth BW R S = R L = 50Ω (Figure 4) 2.6 GHz Insertion Loss I LOS R S = R L = 50Ω, f = 50M Hz ( Fi gur e 4) 0.6 db Off-Isolation V ISO R S = R L = 50Ω, single-ended, f = 50MHz (Figure 4) -58 db Crosstalk V CT1 Crosstalk between any two switches, R S = R L = 50Ω, f = 50MHz (Figure 4) -49 db LOGIC INPUTS () Input-Low Voltage V IL = +3.0V 0.8 V Input-High Voltage V IH = +3.6V 2.0 V Input-Voltage Hysteresis V HYST 100 mv Input Leakage Current I LEAK = +3.6V, V COM_ or V NC_ or V NO_ = 0V -1 +1 µa Note 2: Maximum and minimum limits over temperature are guaranteed by design and characterization. Device is production tested at T A = +25 C. Note 3: Negative current is going into COM_ and out of NO_ or NC_. Note 4: Guaranteed by design. 3

(T A = +25 C, unless otherwise noted.) ON-RESISTANCE vs. V COM_ 8.2 ON-RESISTANCE (Ω) 8.1 = 3V = 3.3V 8.0 7.9 7.8 7.7 = 3.6V 7.6 7.5 toc01 ON-RESISTANCE (Ω) 10 9 8 7 6 5 4 3 ON-RESISTANCE vs. TEMPERATURE T A = +85 C T A = +25 C T A = -40 C Typical Operating Characteristics toc02 SUPPLY CURRENT (μa) SUPPLY CURRENT vs. SUPPLY VOLTAGE 700 650 T A = +85 C 600 T A = +25 C 550 T A = -40 C 500 toc03 7.4 7.3 2 1 450 7.2 0 0.6 1.2 1.8 2.4 3.0 3.6 V COM_ (V) 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 V COM_ (V) 400 3.0 3.1 3.2 3.3 3.4 3.5 3.6 (V) LEAKAGE CURRENT (na) 10 1 LEAKAGE CURRENT vs. TEMPERATURE toc04 ON-LOSS (db) 0-1 -2-3 -4-5 -6 FREQUENCY RESPONSE toc05-7 0.1-40 -15 10 35 60 85 TEMPERATURE ( C) -8 1 10 100 1000 10,000 FREQUENCY (MHz) 4

PIN NAME FUNCTION 1, 4, 10, 14, 17, 19, 21, 39, 41 5, 8, 13, 18, 20, 30, 40, 42 Ground Pin Description Power-Supply Voltage Input. Bypass to with a 0.1μF or larger ceramic capacitor. 2 COM1+ Data Signal Inputs/Outputs 3 COM1- Data Signal Inputs/Outputs 6 COM2+ Data Signal Inputs/Outputs 7 COM2- Data Signal Inputs/Outputs 9 Select Input. Logic input for switch connection (see Table 1). 11 COM3+ Data Signal Inputs/Outputs 12 COM3- Data Signal Inputs/Outputs 15 COM4+ Data Signal Inputs/Outputs 16 COM4- Data Signal Inputs/Outputs 22 NO4- Differential Pair. Data Signal Inputs/Outputs. 23 NO4+ Differential Pair. Data Signal Inputs/Outputs. 24 NO3- Differential Pair. Data Signal Inputs/Outputs. 25 NO3+ Differential Pair. Data Signal Inputs/Outputs. 26 NC4- Differential Pair. Data Signal Inputs/Outputs. 27 NC4+ Differential Pair. Data Signal Inputs/Outputs. 28 NC3- Differential Pair. Data Signal Inputs/Outputs. 29 NC3+ Differential Pair. Data Signal Inputs/Outputs. 31 NO2- Differential Pair. Data Signal Inputs/Outputs. 32 NO2+ Differential Pair. Data Signal Inputs/Outputs. 33 NO1- Differential Pair. Data Signal Inputs/Outputs. 34 NO1+ Differential Pair. Data Signal Inputs/Outputs. 35 NC2- Differential Pair. Data Signal Inputs/Outputs. 36 NC2+ Differential Pair. Data Signal Inputs/Outputs. 37 NC1- Differential Pair. Data Signal Inputs/Outputs. 38 Differential Pair. Data Signal Inputs/Outputs. EP EP Exposed Paddle. Connect EP to. 5

NC3+ NC3- COM1+ COM1- COM2+ COM2- COM3+ COM3- COM4+ COM4- Functional Diagram NO3+ NO3- NC4+ NC4- NO4+ NO4- NO1+ NO1- NC2+ NC2- NO2+ NO2- Detailed Description The high-speed analog switch is ideal for HDMI/DVI switching applications, permitting 2:1 or 1:2 switching. The contains four differential pairs for HDMI or DVI switching. The connects either one monitor to one of two digital video signals or one HDMI/DVI output to one of two connectors or loads. The differential switches are based on an nfet architecture with an internal charge pump for gate overdrive. This advanced architecture results in an extremely low capacitance and on-resistance needed for an excellent returns loss. The features an 8Ω (typ) on-resistance and 2.5pF on-capacitance switches for routing RGB and CLK video signals. Table 1. Switch Truth Table 0 COM_ to NC_ 1 COM_ to NO_ FUNCTION The switches are identical, and any of the switches can be used to route RGB and CLK video signals. The device will also be useful in other high-speed switching applications such as LVDS and LVPECL. Analog-Signal Levels Signal inputs over the full voltage range (0V to VDD) are passed through the switch with minimal change in onresistance (see the Typical Operating Characteristics section). The switches are bidirectional. Therefore, COM_, NC_, and NO_ can be either inputs or outputs. Logic Inputs () The has a logic input that controls the switch on/off function. Use to switch COM_ to NO_ or COM_ to NC_. Table 1 and the Functional Diagram illustrate the Truth Table. Applications Information Power-Supply Bypassing and Sequencing Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device. Always sequence on first, followed by the switch inputs and the logic inputs. Bypass at least one input to ground with a 0.1µF capacitor as close to the device as possible. Use the smallest physical size possible for optimal performance. It is also recommended to bypass more than one input. A good strategy is to bypass one VDD input with a 0.1µF capacitor and at least a second VDD input with a 1nF to 10nF capacitor. (Use 0603 or smaller physical size ceramic capacitor). PC Board (PCB) Layout High-speed switches such as the require proper PCB layout for optimum performance. Ensure that impedance-controlled PCB traces for high-speed signals are matched in length, and as short as possible. Connect the exposed paddle to a solid ground plane. 6

V N_ NC_ OR NO_ Timing Circuits/Timing Diagrams COM_ V OUT R L C L LOGIC INPUT C L INCLUDES FIXTURE AND STRAY CAPACITANCE. V OUT = V N_ ( R L R L + R ON ) Figure 1. Switching Time +3.3V IN+ COM1+ OUT+ COM1- NC1- IN- OUT- COM1+ IN+ COM1- IN- OUT+ t PD1 t PD2 NC1- OUT- Figure 2. Propagation Delay 7

IN+ Timing Circuits/Timing Diagrams (continued) +3.3V COM1+ OUT+ COM1- NC1- IN- OUT- COM1+ IN+ COM1- IN- t PLH1 t PLH1 OUT+ t PLH2 t PLH2 50% 50% 50% 50% NC1- OUT- Figure 3. Skew Measurements Additional Applications Information In a typical application (see Figure 5), the and MAX4929 are used to route the TMDS signals and low-frequency signals between two HDMI inputs. In another application (see Figure 6), the is used in a notebook to route high-frequency DVI port on the computer or to the connector on the docking station. The routes four differential signals (RGB and CLK) either to the DVI connector or to the docking station port. The switch is inherently bilateral and may be used as a 2:1 or 1:2 mux without penalties. PROCESS: BiCMOS Connect exposed paddle to. Chip Information 8

3dB BANDWIDTH/INSERTION LOSS NETWORK ANALYZER Timing Circuits/Timing Diagrams (continued) COM1+ 2 38 NETWORK ANALYZER NETWORK ANALYZER CROSSTALK COM2+ 6 NC2+ 36 R13 49.9Ω NETWORK ANALYZER COM2-7 NC2-35 R14 49.9Ω NETWORK ANALYZER OFF-ISOLATION R15 49.9Ω COM3+ 11 NC3+ 29 NETWORK ANALYZER Figure 4. On-Loss, Off-Isolation, and Crosstalk Typical Application Diagrams HDMI1 TMDS 8 LOW-FREQUENCY SIGNALS NC_ R TMDS R X COM_+ COM_- G B HDMI2 CK TMDS NC_ 8 MAX4929 MCU HPIR HPD 5V (HPIR), HPD, DDC/SCL, DDC/SDA EDID EEPROM Figure 5. TV/Monitor Application 9

DVI SIGNALS COM1+ COM1- COM2+ COM2- Typical Application Diagrams (continued) NO1+ NO3+ NO3- NO1- NO2+ NO2- NO4+ NO4- DOCKING STATION COM3+ COM3- NCI- COM4+ COM4- NC2+ NC2- NC3+ NC3- DVI CONNECTOR MONITOR NC4+ _DOCK NC4- Figure 6. Notebook Application Pin Configuration TOP VIEW 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 39 21 40 20 41 42 + 19 18 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 COM1+ COM2- COM1- VDD COM2+ COM4- VDD COM3+ VDD COM4+ COM3- NC2- NC1- NC2+ NO1- NO1+ NO2- NO2+ NC3- VDD NC3+ NO4- NC4+ NO3+ NO4+ NC4- NO3- *EP TQFN *CONNECT EXPOSED PADDLE TO GROUND. 10

Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 42L THIN QFN.EPS 11

Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. Boblet