AN Contact reader ICs - TDA product support packages. Document information

Similar documents
Using the RS232 serial evaluation boards on a USB port

AN Boot mode jumper settings for LPC1800 and LPC4300. Document information

AN AES encryption and decryption software on LPC microcontrollers. Document information

AN1991. Audio decibel level detector with meter driver

ES_LPC4357/53/37/33. Errata sheet LPC4357/53/37/33. Document information

Planar PIN diode in a SOD323 very small plastic SMD package.

AN11008 Flash based non-volatile storage

AN10866 LPC1700 secondary USB bootloader

Schottky barrier quadruple diode

AN BGU8009 Matching Options for 850 MHz / 2400 MHz Jammer Immunity. Document information. Keywords

UM Vertical Alignment (VA) displays and NXP LCD drivers

MIFARE ISO/IEC PICC

HEF4011B. 1. General description. 2. Features and benefits. 3. Ordering information. 4. Functional diagram. Quad 2-input NAND gate

AN TDA8026ET - 5 slots smart card interface. Document information

PN7120 Windows IoT Porting Guidelines. Rev October

10 ma LED driver in SOT457

IP4220CZ6. 1. Product profile. Dual USB 2.0 integrated ESD protection. 1.1 General description. 1.2 Features and benefits. 1.

NPN wideband transistor in a SOT89 plastic package.

1-of-4 decoder/demultiplexer

Low forward voltage High breakdown voltage Guard-ring protected Hermetically sealed glass SMD package

AN LPC24XX external memory bus example. Document information

HEF4021B. 1. General description. 2. Features and benefits. 3. Ordering information. 8-bit static shift register

Quad 2-input NAND Schmitt trigger

SiGe:C Low Noise High Linearity Amplifier

AN LPC1700 timer triggered memory to GPIO data transfer. Document information. LPC1700, GPIO, DMA, Timer0, Sleep Mode

Passivated, sensitive gate triacs in a SOT54 plastic package. General purpose switching and phase control

The sensor can be operated at any frequency between DC and 1 MHz.

3-to-8 line decoder, demultiplexer with address latches

The 74LVC1G11 provides a single 3-input AND gate.

BAT54 series SOT23 Schottky barrier diodes Rev. 5 5 October 2012 Product data sheet 1. Product profile 1.1 General description

High-speed switching diodes. Type number Package Configuration Package NXP JEITA JEDEC

DISCRETE SEMICONDUCTORS DATA SHEET. dbook, halfpage M3D088. BB201 Low-voltage variable capacitance double diode. Product specification 2001 Oct 12

HEF4013B. 1. General description. 2. Features and benefits. 3. Applications. 4. Ordering information. Dual D-type flip-flop

DISCRETE SEMICONDUCTORS DATA SHEET M3D848. CGD MHz, 20 db gain power doubler amplifier. Product specification 2002 Oct 08

Triple single-pole double-throw analog switch

MFRD52x. Mifare Contactless Smart Card Reader Reference Design. Document information

74HC377; 74HCT General description. 2. Features and benefits. 3. Ordering information

AN Single stage 5-6 GHz WLAN LNA with BFU730F. document information

Mounting instructions for SOT78 (TO-220AB); SOT186A (TO-220F)

8-channel analog multiplexer/demultiplexer

AN Software Design Guide for POS Development Kit OM5597/RD2663. Rev August Application note COMPANY PUBLIC

AN Designing RC snubbers

74HC175; 74HCT175. Quad D-type flip-flop with reset; positive-edge trigger

Low-power configurable multiple function gate

74HC02; 74HCT General description. 2. Features and benefits. Ordering information. Quad 2-input NOR gate

74HC107; 74HCT107. Dual JK flip-flop with reset; negative-edge trigger

14-stage ripple-carry binary counter/divider and oscillator

LIN-bus ESD protection diode

Ultrafast, epitaxial rectifier diode in a SOD59 (TO-220AC) plastic package

BAS16 series. 1. Product profile. High-speed switching diodes. 1.1 General description. 1.2 Features and benefits. 1.

AN LPC1700 RTC hardware auto calibration. Document information. RTC, Hardware Auto Calibration, LPC1700, Graphic LCD

SMARTCARD XPRO. Preface. SMART ARM-based Microcontrollers USER GUIDE

45 V, 100 ma NPN general-purpose transistors

General purpose low power phase control General purpose low power switching Solid-state relay. Symbol Parameter Conditions Min Typ Max Unit V DRM

74HC238; 74HCT to-8 line decoder/demultiplexer

AN10811 Programming SPI flash on EA3131 boards Rev May 2009 Application note Document information Info Content Keywords Abstract

AN Level shifting techniques in I 2 C-bus design. Document information

AN10860_1. Contact information. NXP Semiconductors. LPC313x NAND flash data and bad block management

DISCRETE SEMICONDUCTORS DATA SHEET. BT151 series C Thyristors

74HC4040; 74HCT stage binary ripple counter

74HC165; 74HCT bit parallel-in/serial out shift register

74HC154; 74HCT to-16 line decoder/demultiplexer

8-bit synchronous binary down counter

74HC2G02; 74HCT2G General description. 2. Features and benefits. 3. Ordering information. Dual 2-input NOR gate

BLL6G1214L Product profile. LDMOS L-band radar power transistor. 1.1 General description. 1.2 Features and benefits. 1.

AN Failure signature of electrical overstress on power MOSFETs. Document information

DATA SHEET. BF245A; BF245B; BF245C N-channel silicon field-effect transistors DISCRETE SEMICONDUCTORS

8-bit binary counter with output register; 3-state

74HC393; 74HCT393. Dual 4-bit binary ripple counter

74HCU General description. 2. Features and benefits. 3. Ordering information. Hex unbuffered inverter

BT E. 1. General description. 2. Features and benefits. 3. Applications. Quick reference data. 4Q Triac 30 August 2013 Product data sheet

74HC574; 74HCT574. Octal D-type flip-flop; positive edge-trigger; 3-state

Femtofarad bidirectional ESD protection diode

74HC138; 74HCT to-8 line decoder/demultiplexer; inverting

AN Quick Start Up Guide for EXPLORE NFC working with Raspberry Pi. Application note COMPANY PUBLIC. Rev December

AN Using RC Thermal Models. Document information

IP4294CZ10-TBR. ESD protection for ultra high-speed interfaces

74HC74; 74HCT General description. 2. Features and benefits. 3. Ordering information

QUADRO POWER GUIDELINES

NPN wideband silicon germanium RF transistor

NPN wideband silicon RF transistor

N-channel TrenchMOS logic level FET

AN Water and condensation safe touch sensing with the NXP capacitive touch sensors. Document information

Hex buffer with open-drain outputs

How To Add A Usb Secondary Ipo Bootloader To An Lpc23Xx Flash Device To A Flash Device

74HC4067; 74HCT channel analog multiplexer/demultiplexer

R_ Smart lighting: A bright idea whose time has come. Rev December Document information

The 74LVC1G04 provides one inverting buffer.

AN4128 Application note

ESD protection for high-speed interfaces

74HC573; 74HCT General description. 2. Features and benefits. Octal D-type transparent latch; 3-state

AND8336. Design Examples of On Board Dual Supply Voltage Logic Translators. Prepared by: Jim Lepkowski ON Semiconductor.

BZT52H series. Single Zener diodes in a SOD123F package

BT139B General description. 2. Features and benefits. 3. Applications. Quick reference data. 4Q Triac 27 September 2013 Product data sheet

MF1 IC S General description. Functional specification. 1.1 Contactless Energy and Data Transfer. 1.2 Anticollision. Energy

PUSB3FR4. 1. Product profile. ESD protection for ultra high-speed interfaces. 1.1 General description. 1.2 Features and benefits. 1.

USER GUIDE EDBG. Description

74HC595; 74HCT General description. 2. Features and benefits. 3. Applications

HEF4013B. 1. General description. 2. Features and benefits. 3. Applications. 4. Ordering information. Dual D-type flip-flop

AT88CK490 Evaluation Kit

Transcription:

Rev. 1.0 23 May 2011 Application note Document information Info Content Keywords Contact reader ICs, TDA8034, TDA8035, TDA8024, TDA8026, TDA8023, TDA8029, TDA8007B, Motherboard, Daughterboard, Software, EMV Level1, Payment, NDS Abstract This product gives a summary of all available product support packages for the contact reader ICs, the TDA family.

Revision history Rev Date Description 1.0 20110523 Initial version Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 2 of 27

1. Introduction NXP has shipped more than 600 million reader ICs and its product architecture has become the reference standard across the industry. NXP s strength in cryptography and security has enabled smartcard readers that support the high data rates and security required by advanced applications. NXP, the world leader in contact reader ICs, supports the Pay TV as well as POS and PC market with a series of optimized solutions that deliver high-level protection to the smartcard and the system. 1.1 Scope This application note gives an overview of all product support introduced together with our contact reader ICs, such as: Documentation Development board Software 1.2 Abbreviations These abbreviations are used in this application note. Table 1. Abbreviations Abbreviation Meaning SAM SW Doc Secure Application Module Hardware Software Documentation All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 3 of 27

2. Contact reader IC product overview 2.1 Introduction NXP, the world leader in contact reader ICs, supports the Pay TV as well as POS and PC market with a series of optimized solutions that deliver high-level protection to the smartcard and the system. Table 2. Overview of contact reader IC portfolio Product Description Features Compliant NDS EMV TDA8035 Latest single card interface Wide VDD range Low power consumption in inactive mode TDA8034 Cost efficient single card interface Cost optimized solution Limited VDD range Low power consumption in inactive mode TDA8024 Reference single card interface Market proven solution for Pay TV market TDA8023 Single card interface tailored for the payment market Simple logic tailored for payment TDA8026 Multi (5) slot card interface for multiple SAMs/contact cards One single IC can act as a front end for up to 5 contact cards, PCI PED compliant. TDA8007B Dual card interface with embedded contact UART Easy integration due to integrated UART. TDA8029 Smart card controller integrating the whole protocol layer Very easy integration due to available protocol stack. The TDA8024, TDA8034, and TDA8035 are low-cost, contact-based smartcard reader ICs that read the majority of viewing cards issued by broadcasters. They are NDS and ISO 7816 compliant, so they offer high levels of design flexibility and support all three levels of smartcard classes. The TDA8007 is tailored for the requirements for the POS market, enabling with two frontends in addition to an included UART an easy integration into the POS reader, having the EMV L1 certification available. The TDA8023 enables due to its availability of simple logic to include easily the payment functionality into the payment reader. Several SAMs on top of the contact reader IC may be included through the TDA8026, having 5 smart card interfaces on board. All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 4 of 27

The TDA8029 includes a microcontroller on top of a UART and a smart card interface; as such the integration into existing solutions is only low effort as the protocol is handled by the contact reader IC. 3. Contact reader IC product support packages 3.1 TDA8035 product support package The TDA8035 is the successor of the well established integrated contact smart card reader IC TDA8024. Table 3. TDA8035 product support package overview Nr. Item Name Type Short Description Ordering Information 1 Daughter Board TDA8035 2 Mother Board 3 4 5 6 7 8 Migration Board TDA8035 AN: Design migration from TDA8024 to TDA8035 AN: TDA8035 Smart Card Reader AN: TDA8035 Demo board description TDA8035HN Smart card interface EMV Certification Report Doc Doc Doc Doc Doc Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 1 Daughter board TDA8035) Cake8035_01_D This motherboard can be stacked together with a number of daughter boards and enables to run a SW together with your PC (see Fig 2 Motherboard TDA contact reader ICs This board shows the migration from TDA8024 to TDA8035 and can be used in the migration phase as a reference implementation. Application Note describing the steps for migration from TDA8024 to TDA8035 AN11058 Application Note describing features and hints to design in TDA8035 AN10997 Application note describing Cake8035_01_D AN10999 Datasheet of the TDA8035 EMV certification report of debugging session at FIME: N C10RAP12-06-02 9 TDA8035 sample TDA8035 sample 10 Cake80xxMBA FW SW Firmware running on the Motherboard (see Fig 2 Motherboard TDA contact reader ICs Caen/F using the following ID: Cake80xxMBA Cake8024_8035 Per e-mail TDA8035HN Per e-mail All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 5 of 27

11 SCRTester SW Graphical User Interface, communicating with the evaluation board together with the mother board Available on web, specific scripts available over e-mail. No Windows7 64 bit support Fig 1. Daughter board TDA8035 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 6 of 27

Fig 2. Motherboard TDA contact reader ICs All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 7 of 27

Fig 3. Migration board Part 1 Cake8024_8035_1 Fig 4. Migration board Part 2 Cake8024_0835_2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 8 of 27

Fig 5. Migration board Part 3Cake8024_8035_3 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 9 of 27

3.2 TDA8034 product support package The TDA8034 is the cost efficient contact smart card reader IC frontend within the TDA product portfolio. Table 4. TDA8034 product support package overview Nr. Item Name Type Short Description Ordering Information 1 2 3 4 Daughter Board TDA8034T Daughter Board TDA8034HN Daughter Board TDA8034AT AN10792 for TDA8034HN Doc 5 AN10794 Doc 6 7 8 9 10 AN10807 for TDA8034T/AT EMV Certification Report TDA8034AT/C1 sample TDA8034T/C1 sample TDA8034HN/C1 sample Doc Doc 11 Cake80xxMBA FW SW 12 SCRTester SW Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 6 Daughter board TDA8034T) Cake8034_01_D, Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 7 Daughter board TDA8034HN) Cake8034_02_D Evaluation Board, which needs to be stacked on top of the Mother Board Application Note describing the smart card interface integrated circuit TDA8034HN Application Note describing Cake8034_01_D and Cake8034_02_D demo boards: schematics, layout and use of this boards Application Note describing the smart card interface integrated circuit TDA8034T/AT EMV certification report of debugging session at FIME: N C11RAP03-17-2 TDA8034AT sample TDA8034T sample TDA8034HN/C1 sample Firmware for TDA8034T/HN/AT running on the Motherboard Graphical User Interface, communicating with the evaluation board together with the mother board Caen/F using the following ID: Cake8034_03_D Per e-mail 935289276000 935288349000 935288352000 Per e-mail Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 10 of 27

Fig 6. Daughter board TDA8034T Fig 7. Daughter board TDA8034HN All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 11 of 27

3.3 TDA8029 product support package The TDA8029 is a smart card controller integrating the whole protocol layer. Table 5. TDA8029 product support package overview Nr. Item Name Type Short Description Ordering Information 1 2 Eval Board Cake8029_11_D Eval Board Cake8029_12_D 4 AN10207 Doc 5 UM10338 Doc 6 TDA8029Demo SW 7 ArmTDA8029i2c Driver SW Evaluation board for serial link to the host (BD9) for direct connection to a computer (see Fig 8 Evaluation Board TDA8029 Cake8029_11_D Evaluation Board for I²C communication to the TDA8029, has a connection to PN53 (see Fig 9 Evaluation Board TDA8029 Cake8029_12_D) Application Note describing the software implemented in both TDA8029HL/C20 and TDA8029HL/C207 masks in order to handle a communication between a system controller and a smart card. User manual describing the Cake8029_12_D Microsoft Visual C++ project to demonstrate access to the Cake8029_11_D from a windows computer. Source code for an ARM7core CPU to drive the TDA8029 in I²C mode together with Cake_8029_12_D 8 TDA8029HL/C207 TDA8029HL/C207 sample 9 SCRTester SW Graphical User Interface, communicating with the evaluation board together with the mother board Caen/F using the following ID: Cake8029_11_D Cake8029_12_D TDA8029Demo ArmTDA8029i2cDriver 935274733000 Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 12 of 27

Fig 8. Evaluation Board TDA8029 Cake8029_11_D Fig 9. Evaluation Board TDA8029 Cake8029_12_D All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 13 of 27

3.4 TDA8026 product support package The TDA8026 is a multi slot card interface for multiple SAMs and contact cards. Table 6. TDA8026 product support package overview Nr. Item Name Type Short Description Ordering Information 1 Daughter Board TDA8026 4 AN10724 Doc 5 UM10319 Doc 7 8 EMV Certification Report TDA8026ET/C2 sample Doc 9 Cake80xxMBA FW SW 10 SCRTester SW Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 10 Daughter board TDA8026 and Fig 11 Demo TDA8026 Application Note describing the smart card interface integrated circuit TDA8026ET. User Manual describing how to use the Cake8026_02_D EMV certification report of debugging session at FIME: N C11RAP03-23-3 TDA8026 sample Firmware running on the Motherboard Graphical User Interface, communicating with the evaluation board together with the mother board Caen/F using the following ID: Cake8026_02_D Per e-mail 935288286000 Per e-mail Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 14 of 27

Fig 10. Daughter board TDA8026 Fig 11. Demo TDA8026 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 15 of 27

3.5 TDA8024 product support package The TDA8024 is a low-cost, contact-based reference single card interface offering a high level of design flexibility. Table 7. TDA8024 product support package overview Nr. Item Name Type Short Description Ordering Information 1 2 Daughter Board TDA8024TT Daugther Board TDA8024T 3 AN10141 Doc Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 12 Daughter board TDA8024TT) Cake8024_11_D Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 13 Daughter board TDA8024T) Cake8024_12_D Application Note describing the TDA8024T and TDA8024TT Caen/F using the following ID: 4 AN10265 Doc 5 6 7 TDA8024AT/C1 sample TDA8024TT/C1 sample TDA8024T/C1 sample Hw 8 Cake80xxMBA FW SW 9 SCRTester SW Application Note describing DC/DC as voltage follower TDA8024AT/C1 sample TDA8024T/C1 sample TDA8024TT/C1 sample Firmware running on the Motherboard Graphical User Interface, communicating with the evaluation board together with the mother board 935277261000 935273723000 935271342000 Per e-mail Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 16 of 27

Fig 12. Daughter board TDA8024TT Fig 13. Daughter board TDA8024T All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 17 of 27

3.6 TDA8023 product support package The TDA8023 is a single card interface tailored for the payment market. Table 8. TDA8023 product support package overview Nr. Item Name Type Short Description Ordering Information 1 Daughter Board TDA8023 2 AN10267 Doc 3 TDA8023TT/C1 sample 4 Cake80xxMBA FW SW 5 SCRTester SW Evaluation Board, which needs to be stacked on top of the Mother Board (see Fig 14 Daughter board TDA8023 Application Note describing the TDA8023 TDA8023TT/C1 sample Firmware running on the Motherboard Graphical User Interface, communicating with the evaluation board together with the mother board Caen/F using the following ID: ) Cake8023_06_D 935274975000 Per e-mail Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 18 of 27

Fig 14. Daughter board TDA8023 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 19 of 27

3.7 TDA8007B product support package Dual card interface with embedded contact UART and is tailored for the requirements in the POS market. Table 9. TDA8007 product support package overview Nr. Item Name Type Short Description Ordering Information 1 Eval board TDA8007B 2 AN01054 Doc 3 AN10677 Doc 4 5 EMV Certification Report TDA8007BHL/C3 sample Doc Evaluation board with a serial link (DB9), microcontroller ARM7 LPC2212 (see Fig 15 Evaluation board TDA8007) Application Note describing the use of the TDA8007BHL/C2 or C3 and handles a communication between a system controller and two or three smart cards. Application Note describing how to do a complete reset of the TDA8007B chip without a power on/off. EMV certification report of debugging session at FIME: N C11RAP03-23-2 TDA8007BHL/C3 sample 6 TDA8007BHL/C4sample TDA8007BHL/C4 sample representative over our NFC sample desk in Caen/F using the following ID: Cake8007_01_D Per e-mail representative over our NFC sample desk in 935272525000 representative over our NFC sample desk in Caen/F 7 Cake8007MBA FW SW 8 SCRTester SW Firmware running on the motherboard which implements TDA8007 driver, all ISO7816 asynchronous protocols, ALPAR link to the host Graphical User Interface, communicating with the evaluation board together with the mother board Per e-mail Available on web, specific scripts available over e-mail. No Windows7 64 bit support All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 20 of 27

Fig 15. Evaluation board TDA8007 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 21 of 27

4. References [1] Data sheet TDA8035HN Smart card interface, available on NXP web or per e-mail [2] Data sheet TDA8034T/AT Smart card interface, available on NXP web [3] Data sheet TDA8029 Low power single card reader, available on NXP web [4] Data sheet TDA8026 Multiple smart card slot interface IC, available on NXP web [5] Data sheet TDA8024 IC card interface, available on NXP web [6] Data sheet TDA8023 Low power IC card interface, available on NXP web [7] Data sheet TDA8007BHL Multiprotocol IC card interface, available on NXP web [8] Application Note TDA8035 Smart card reader, available on NXP web or per e-mail [9] Application Note TDA8035 Demonstration board description, available per e-mail [10] Application Note TDA8034HN Smart Card reader interface, available on NXP web or per e-mail [11] Application Note TDA8034 Demonstration boards description, available on NXP web or per e-mail [12] Application Note TDA8034T/AT Smart Card reader interface, available on NXP web or per e-mail [13] Application Note Smart Card reader application with TDA8029 Mask07, available on NXP web or per e-mail [14] Application Note TDA8026ET 5 slots smart card interface available on NXP web or per e-mail [15] Application Note TDA8024 describing DC/DC as voltage follower, available on NXP web or per e-mail [16] Application Note Smart Card interface using TDA8007BHL/C2/C3, available on NXP web or per e-mail [17] Application Note Reset of the TDA8007B using delay pin, available on NXP web or per e-mail [18] Application Note Differences between TDA8007BHLC3 and TDA8007BHL/C4, available on NXP web or per e-mail [19] Application Note ARM Microcontroller + TDA8007B, available on NXP web or per e-mail [20] Application Note TDA8007B CRED Issue, available on NXP web or per e-mail [21] User Manual Description of the TDA8029 I2C Demo Board, available on NXP web or per e-mail [22] User Manual Getting started with the TDA8026 Demo Bard, available on NXP web or per e-mail [23] EMV Certification Report TDA8035 (N C10RAP12-06-02), available per e-mail [24] EMV Certification Report TDA8034 (N C11RAP03-17-2), available per e-mail All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 22 of 27

[25] EMV Certification Report TDA8026 (N C11RAP03-23-3), available per e-mail [26] EMV Certification Report TDA8007 (N C11RAP03-23-2), available per e-mail [27] Software Cake80xxMBA Firmware, available per e-mail [28] Software SCR Tester, available on web [29] Software TDA8029 Demo, available per e-mail [30] Software ArmTDA8029i2c Driver, available over NFC sample desk All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 23 of 27

5. Legal information 5.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 5.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 5.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. MIFARE is a trademark of NXP B.V. MIFARE Plus is a trademark of NXP B.V. MIFARE Ultralight is a trademark of NXP B.V. DESFire is a trademark of NXP B.V. All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 24 of 27

6. List of figures Fig 1. Daughter board TDA8035... 6 Fig 2. Motherboard TDA contact reader ICs... 7 Fig 3. Migration board Part 1 Cake8024_8035_1... 8 Fig 4. Migration board Part 2 Cake8024_0835_2... 8 Fig 5. Migration board Part 3Cake8024_8035_3... 9 Fig 6. Daughter board TDA8034T... 11 Fig 7. Daughter board TDA8034HN... 11 Fig 8. Evaluation Board TDA8029 Cake8029_11_D. 13 Fig 9. Evaluation Board TDA8029 Cake8029_12_D. 13 Fig 10. Daughter board TDA8026... 15 Fig 11. Demo TDA8026... 15 Fig 12. Daughter board TDA8024TT... 17 Fig 13. Daughter board TDA8024T... 17 Fig 14. Daughter board TDA8023... 19 Fig 15. Evaluation board TDA8007... 21 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 25 of 27

7. List of tables Table 1. Abbreviations... 3 Table 2. Overview of contact reader IC portfolio... 4 Table 3. TDA8035 product support package overview... 5 Table 4. TDA8034 product support package overview. 10 Table 5. TDA8029 product support package overview. 12 Table 6. TDA8026 product support package overview. 14 Table 7. TDA8024 product support package overview. 16 Table 8. TDA8023 product support package overview. 18 Table 9. TDA8007 product support package overview. 20 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Application note Rev. 1.0 23 May 2011 26 of 27

8. Contents 1. Introduction... 3 1.1 Scope... 3 1.2 Abbreviations... 3 2. Contact reader IC product overview... 4 2.1 Introduction... 4 3. Contact reader IC product support packages... 5 3.1 TDA8035 product support package... 5 3.2 TDA8034 product support package... 10 3.3 3.4 TDA8029 product support package... 12 TDA8026 product support package... 14 3.5 TDA8024 product support package... 16 3.6 3.7 TDA8023 product support package... 18 TDA8007B product support package... 20 4. References... 22 5. Legal information... 24 5.1 Definitions... 24 5.2 Disclaimers... 24 5.3 Trademarks... 24 6. List of figures... 25 7. List of tables... 26 8. Contents... 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. NXP B.V. 2011. All rights reserved. For more information, visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 May 2011 Document identifier: