AN Single stage 5-6 GHz WLAN LNA with BFU730F. document information
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1 Single stage 5-6 GHz WLAN LNA with BFU730F Rev November 2012 Application note document information Info Content Keywords BFU730F, LNA, a & n MIMO WLAN Abstract The document provides circuit, layout, BOM and performance information on 5-6 GHz band LNA equipped with NXP s BFU730F wide band transistor. This Application note is related to evaluation board OM7691/BFU730F,598 12nC
2 Revision history Rev Date Description Initial document Chapter added about switching time. Contact information For additional information, please visit: For sales office addresses, please send an to: [email protected] All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
3 1. Introduction The BFU730F is a discrete HBT that is produced using NXP Semiconductors advanced 110 GHz f T SiGe:C BiCmos process. SiGe:C is a normal silicon germanium process with the addition of Carbon in the base layer of the NPN transistor. The presence of carbon in the base layer suppresses the boron diffusion during wafer processing. This allows steeper and narrower SiGe HBT base and a heavier doped base. As a result, lower base resistance, lower noise and higher cut off frequency can be achieved. The BFU730F is one of a series of transistors made in SiGe:C. BFU710F; BFU760 and BFU790 are the other types, BFU710 is intended for ultra low current applications. The BFU760F and BFU790F are high current types and are intended for application where linearity is key. The BFU7XXF are ideal in all kind of applications where cost matters. It also gives design flexibility. 2. Requirements and design of the 5-6 GHz WLAN LNA The circuit shown in this application note is intended to demonstrate the performance of the BFU730 in a for e.g & n MIMO WLAN applications. Key requirements for this application as are: NF Gain Turn on turn of time Linearity. The target for this circuit is listed in table 1. Table 1. Target spec. Target specification of the 5-6GHz LNA. Vcc Icc NF Gain IRL ORL 3 10 <2 >15 >10 >10 V ma db db db db 3. Design The consists of one stage BFU730F amplifier. For this amplifier 12 external components are used, for matching, biasing and decoupling. The design has been conducted using Agilent s Advanced Design System (ADS). The 2D EM Momentum tool has been used to co simulate the PCB see Fig 1. Results are given in paragraph 4.5. The LNA shows a Gain of 14 GHz, NF of 1.3 db, with only 10 ma it shows a high input P1 db compression of 7.5 dbm, as well as a input IP3 of +10 dbm. Finally the LNA is unconditional stable 10 MHz-20 GHz. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
4 3.1 BFU730F 5-6 GHz-ADS Simulation circuit Fig 1. ADS simulation circuit for 5-6 GHz WLAN LNA All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
5 3.2 BFU730F 5-6 GHz - ADS Gain and match simulation results Fig 2. ADS Gain and match simulation results for 5-6 GHz WLAN LNA All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
6 3.3 BFU730F 5-6 GHz-ADS NF simulation Fig 3. ADS Noise Figure simulation results of 5-6 GHz WLAN LNA All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
7 3.4 BFU730F 5-6 GHz-ADS Stability simulation As K 1 and Mu 1, the LNA is unconditionally stable for the whole frequency band Fig 4. ADS stability simulation results of 5-6 GHz WLAN LNA All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
8 4. Implementation 4.1 Schematic GND Vcc GND C4 R1 R2 R3 C5 RF_INPUT C3 L2 L3 R4 RF_OUTPUT C1 C2 C6 L4 C7 L1 Fig 5. schematic (019aab113) All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
9 4.2 Layout and assembly Fig 6. Layout and assembly info of All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
10 Table 2. Bill of materials Designator Description Size Value Type Note Q1 BFU730F 2X2 mm NXP Semiconductors HBT PCB 20X35 mm C1,C7 Capacitor pf MurataGRM1555 input/output match C2,C6 Capacitor pf MurataGRM1555 input/output match C3 Capacitor nf MurataGRM1555 C4 Capacitor pf MurataGRM1555 C5 Capacitor pf MurataGRM1555 L1,L4 Inductor nh Murata LQP15 input/output match L2 Inductor nh Murata LQW15 input match L3 Inductor nh Murata LQW15 output match R1 Resistor K Bias Setting R2 Resistor Ohm Bias Setting Hfe and Temp spread cancellation R3 Resistor Ohm Stability R4 Resistor Ohm NA X1,X2 SMA RF connector - Johnson, End launch SMA RF input/ RF output X3 DC header - Molex, PCB header, Right Angle, 1 row, 3 way Bias connector 4.3 PCB layout. A good PCB Layout is an essential part of an RF circuit design. The EVB of the BFU730 can serve as a guideline for laying out a board using either the BFU730 or one of the other SiGe.C HBTs in the SOT343F package. Use controlled impedance lines for all high frequency inputs and outputs. Bypass V CC with decoupling capacitors, preferable located as close as possible to the device. For long bias lines it may be necessary to add decoupling capacitors along the line further away from the device. Proper grounding the emitters is also essential for the performance. Either connect the emitters directly to the ground plane ore through vias, or do both. The material that has been used for the EVB is FR4 using the stack shown in Fig 7. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
11 (1) Material supplier is Isola Duraver; Er= Tδ=0.02 Fig 7. PCB material stack 4.4 LNA View Fig 8. EVB All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
12 4.5 Measurement results Table 3. Typical measurement results measured on the evaluation board. Temp=25 C, frequency is 5.5 GHz unless otherwise specified. Parameter Symbol Value Unit Remarks Supply Voltage V cc 3 V Supply Current I cc 10 ma Noise Figure NF [1] 1.3 db 5.0 GHz 15.8 db Power Gain 5.5 GHz 14.7 db G P 6.0 GHz 13.7 db Input return Loss IRL 12 db Output return Loss ORL 13.5 db Input 1 db Gain compression Point P i1db -7.5 dbm Output 1 db Gain compression Point P o1db +6.5 dbm Input third order intercept point IP3 i +10 dbm Output third order intercept point IP3 o +24 dbm Power settling time Ton 160 µs Toff 28 ns [1] The NF and Gain figures are being measured at the SMA connectors of the evaluation board, so the losses of the connectors and the PCB of approximately 0.1dB are not subtracted Faster switching time. <1 µs If no switching speed is required in the application, the recommendation is to keep the BOM as is presented in this application not. However if the LNA is applied in e.g. a WLAN application where power settling time is required to be <1 µs, the value of C3 should be changed to 67pF. This will result in a Ton power settling time of 890ns and the Toff power settling time stays 28ns. However this change in capacitor values will result in about 5dB of degradation of the IP3 figures reported in Table 3 All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
13 4.5.2 Gain and match typical results Fig 9. Gain and match measured values All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
14 4.5.3 NF and Gain- typical values (1) NF is measured at SMA connectors so no correction was done. Fig 10. Typical NF curve All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
15 4.5.4 Stability Fig 11. Stability typical measurement results All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
16 dB compression point- typical values. (1) P i1db=-7.4 dbm P o1db=6.5 dbm Fig 12. Typical 1 db compression point curve. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
17 4.5.6 Linearity IP3 typical values (1) IP3 o=-6.2+(( )/2)=+24 dbm; IP3 i= -20 dbm+60.5/2= = Fig 13. IM3 - typical values All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
18 4.5.7 Power settling time (1) Curve1 is power supply; curve 2 is output of the detector diode. Fig 14. t on Power on settling time All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
19 (1) curve1 is power supply; curve 2 is de output of the detection diode. Fig 15. t off Power off settling time All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
20 5. Legal information 5.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 5.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 5.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
21 6. List of figures Fig 1. ADS simulation circuit for 5-6 GHz WLAN LNA 4 Fig 2. ADS Gain and match simulation results for 5-6 GHz WLAN LNA... 5 Fig 3. ADS Noise Figure simulation results of 5-6 GHz WLAN LNA... 6 Fig 4. ADS stability simulation results of 5-6 GHz WLAN LNA... 7 Fig 5. schematic (019aab113)... 8 Fig 6. Layout and assembly info of... 9 Fig 7. PCB material stack Fig 8. EVB Fig 9. Gain and match measured values Fig 10. Typical NF curve Fig 11. Stability typical measurement results Fig 12. Typical 1 db compression point curve Fig 13. IM3 - typical values Fig 14. t on Power on settling time Fig 15. t off Power off settling time All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
22 7. List of tables Table 1. Target spec Table 2. Bill of materials Table 3. Typical measurement results measured on the evaluation board All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Application note Rev November of 23
23 8. Contents 1. Introduction Requirements and design of the 5-6 GHz WLAN LNA Design BFU730F 5-6 GHz-ADS Simulation circuit BFU730F 5-6 GHz - ADS Gain and match simulation results BFU730F 5-6 GHz-ADS NF simulation BFU730F 5-6 GHz-ADS Stability simulation Implementation Schematic Layout and assembly PCB layout LNA View Measurement results Faster switching time. <1 µs Gain and match typical results NF and Gain- typical values Stability dB compression point- typical values Linearity IP3 typical values Power settling time Legal information Definitions Disclaimers Trademarks List of figures List of tables Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. NXP B.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: [email protected] Date of release: 20 November 2012 Document identifier:
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Rev. 01 21 July 2009 Product data sheet BOTTOM VIEW 1. Product profile 1.1 General description NPN single switching transistor in a SOT883 (SC-101) leadless ultra small Surface-Mounted Device (SMD) plastic
Symbol Parameters Units Frequency Min. Typ. Max. 850 MHz 14.8 16.3 17.8
Product Description Sirenza Microdevices SGC-689Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active-bias network. The active bias network provides
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Rev. 5 3 February 2016 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Ordering information The is a with a clock input (CP), an overriding asynchronous master reset
IP4294CZ10-TBR. ESD protection for ultra high-speed interfaces
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Rev. 12 6 ugust 2012 Product data sheet 1. General description The provides one inverting buffer. Input can be driven from either 3.3 V or 5 V devices. These features allow the use of these devices in
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Rev. 3 24 February 2016 Product data sheet 1. General description The is an 8-bit binary counter with a storage register and 3-state outputs. The storage register has parallel (Q0 to Q7) outputs. The binary
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Rev. 6 22 May 2015 Product data sheet 1. General description The is a single-pole 16-throw analog switch (SP16T) suitable for use in analog or digital 16:1 multiplexer/demultiplexer applications. The switch
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DATA SHEET SE2425U : 2.4 GHz Bluetooth Power Amplifier IC. Applications. Product Description. Features. Ordering Information
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Silicon Schottky Barrier Diode Bondable Chips and Beam Leads
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Rev. 5 4 September 202 Product data sheet. General description The is a quad 2-input OR gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages
74HC165; 74HCT165. 8-bit parallel-in/serial out shift register
Rev. 4 28 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Ordering information The is an 8-bit serial or parallel-in/serial-out shift register. The device
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Hex buffer with open-drain outputs
Rev. 5 27 October 20 Product data sheet. General description The provides six non-inverting buffers. The outputs are open-drain and can be connected to other open-drain outputs to implement active-low
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Rev. 11 29 June 2012 Product data sheet 1. General description The provides the non-inverting buffer. The output of this device is an open drain and can be connected to other open-drain outputs to implement
PUSB3FR4. 1. Product profile. ESD protection for ultra high-speed interfaces. 1.1 General description. 1.2 Features and benefits. 1.
XSON1 Rev. 1 26 January 215 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as SuperSpeed USB 3.1 at 1 Gbps, High-Definition Multimedia
30 V, single N-channel Trench MOSFET
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Rev. 8 3 December 2015 Product data sheet 1. General description The is a quad single pole, single throw analog switch. Each switch features two input/output terminals (ny and nz) and an active HIGH enable
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Rev. 7 4 March 2016 Product data sheet 1. General description The is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE
SKY16406-381LF: 2.2-2.8 GHz Two-Way, 0 Degrees Power Divider
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SMS7630-061: Surface Mount, 0201 Zero Bias Silicon Schottky Detector Diode
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BZT52H series. Single Zener diodes in a SOD123F package
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APN1001: Circuit Models for Plastic Packaged Microwave Diodes
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Rev. 9 19 January 2015 Product data sheet 1. General description The are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with
CAN bus ESD protection diode
Rev. 04 15 February 2008 Product data sheet 1. Product profile 1.1 General description in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller
ES_LPC4357/53/37/33. Errata sheet LPC4357/53/37/33. Document information
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P D 215 1.25 Operating Junction Temperature T J 200 C Storage Temperature Range T stg 65 to +150 C
SEMICONDUCTOR TECHNICAL DATA Order this document by /D The RF Line The is designed for output stages in band IV and V TV transmitter amplifiers. It incorporates high value emitter ballast resistors, gold
UM10689. SSL2109ADB1121 4-channel DC-to-DC LED driver demo board. Document information
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BIPOLAR ANALOG INTEGRATED CIRCUIT
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VCC1,2. H/L Lin. Bias, Enable, Detector Circuits
Applications DSSS 5 GHz WLAN (IEEE802.11an) Access Points, PCMCIA, PC cards Features 5GHz Matched 22dBm Power Amplifier Integrated power amplifier enable pin (VEN) Buffered, temperature compensated power
AN10441. Level shifting techniques in I 2 C-bus design. Document information
Rev. 01 18 June 2007 Application note Document information Info Keywords Abstract Content I2C-bus, level shifting Logic level shifting may be required when interfacing legacy devices with newer devices
HEF4013B. 1. General description. 2. Features and benefits. 3. Applications. 4. Ordering information. Dual D-type flip-flop
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45 V, 100 ma NPN/PNP general-purpose transistor
Rev. 4 18 February 29 Product data sheet 1. Product profile 1.1 General description NPN/PNP general-purpose transistor pair in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package.
SKY13380-350LF: 20 MHz-3.0 GHz High Power SP4T Switch With Decoder
DATA SHEET SKY13380-350LF: 20 MHz-3.0 GHz High Power SP4T Switch With Decoder Applications GSM/WCDMA/EDGE datacards and handsets Mobile high power switching systems Features Broadband frequency range:
PRTR5V0U2F; PRTR5V0U2K
Rev. 02 19 February 2009 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection devices in leadless ultra small
