BYG2K-E3/HE3, BYG2M-E3/HE3 Fast Avalanche SMD Rectifier DO-24AC (SMA) PRIMARY CHARACTERISTICS I F(AV).5 A V RRM 8 V, V I FSM 3 A I R. μa V F.6 V t rr 2 ns E R 2 mj T J max. 5 C Package DO-24AC (SMA) Diode variation Single die FEATURES Low profile package Ideal for automated placement Glass passivated pellet chip junction Low reverse current Soft recovery characteristic Fast reverse recovery time Meets MSL level, per J-STD-2, LF maximum peak of 26 C AEC-Q qualified Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 TYPICAL APPLICATIONS For use in fast switching rectification of power supply, inverters, converters, and freewheeling diodes for consumer, automotive, and telecommunication. MECHANICAL DATA Case: DO-24AC (SMA) Molding compound meets UL 94 V- flammability rating Base P/N-E3 - RoHS-compliant, commercial grade Base P/NHE3 - RoHS-compliant, AEC-Q qualified Terminals: Matte tin plated leads, solderable per J-STD-2 and JESD 22-B2 E3 suffix meets JESD 2 class 2 whisker test, HE3 suffix meets JESD 2 class 2 whisker test Polarity: Color band denotes the cathode end MAXIMUM RATINGS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL BYG2K BYG2M UNIT Device marking code BYG2K BYG2M Maximum repetitive peak reverse voltage V RRM 8 V Average forward current I F(AV).5 A Peak forward surge current ms single half sine-wave superimposed on rated load I FSM 3 A Pulse energy in avalanche mode, non repetitive (inductive load switch off) I (BR)R = A, T J = 25 C E R 2 mj Operating junction and storage temperature range T J, T STG -55 to +5 C Revision: 23-Feb-6 Document Number: 8896
Average Forward Current (A) www.vishay.com BYG2K-E3/HE3, BYG2M-E3/HE3 ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL BYG2K BYG2M UNIT Maximum instantaneous I F = A.5 T forward voltage J = 25 C V () F I F =.5 A.6 T J = 25 C Maximum reverse current I R T J = C Maximum reverse recovery time I F =.5 A, I R =. A, I rr =.25 A Note () Pulse test: 3 μs pulse width, % duty cycle t rr 2 ns V µa THERMAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL BYG2K BYG2M UNIT Typical thermal resistance, junction to lead, T L = const. R JL 25 C/W Typical thermal resistance, junction to ambient Notes () Mounted on epoxy-glass hard tissue (2) Mounted on epoxy-glass hard tissue, 5 mm 2 35 μm Cu (3) Mounted on Al-oxide-ceramic (Al 2 O 3 ), 5 mm 2 35 μm Cu R JA () 5 R (2) JA 25 R (3) JA C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE BYG2K-E3/TR.64 TR 8 7" diameter plastic tape and reel BYG2K-E3/TR3.64 TR3 75 3" diameter plastic tape and reel BYG2KHE3/TR ().64 TR 8 7" diameter plastic tape and reel BYG2KHE3/TR3 ().64 TR3 75 3" diameter plastic tape and reel Note () AEC-Q qualified RATINGS AND CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted).6 T J = 5 C.4 R θja = 25 K/W Half Sine-Wave Forward Current (A).. T J = 25 C.2..8.6.4 R θja = 25 K/W R θja = 5 K/W.2..5..5 2. 2.5 3. 3.5 Forward Voltage (V) Fig. - Forward Current vs. Forward Voltage. 25 5 75 25 5 Ambient Temperature ( C) Fig. 2 - Max. Average Forward Current vs. Ambient Temperature Revision: 23-Feb-6 2 Document Number: 8896
Diode Capacitance (pf) www.vishay.com BYG2K-E3/HE3, BYG2M-E3/HE3 2 Reverse Current (µa) 25 5 75 25 5 Junction Temperature ( C) Reverse Recovery Charge (nc) T A = 25 C 5 T A = C T A = 75 C T A = 5 C T A = 25 C 5 I R =.5 A, i R =.25 A.2.4.6.8. Forward Current (A) Fig. 3 - Reverse Current vs. Junction Temperature Fig. 6 - Max. Reverse Recovery Charge vs. Forward Current Reverse Power Dissipation (mw) 2 8 6 4 2 P R - Limit at 8 % V R 25 5 75 25 5 Junction Temperature ( C) P R - Limit at % V R Fig. 4 - Max. Reverse Power Dissipation vs. Junction Temperature Thermal Resistance for Pulse Cond. (K/W) 25 K/W DC t p /T =.5 t p /T =.2 t p /T =. t p /T =.5 t p /T =.2 Single Pulse t p /T =. -5-4 -3-2 - 2 Pulse Length (s) Fig. 7 - Thermal Response 25 f = MHz 2 5 5. Reverse Voltage (V) Fig. 5 - Diode Capacitance vs. Reverse Voltage Revision: 23-Feb-6 3 Document Number: 8896
BYG2K-E3/HE3, BYG2M-E3/HE3 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-24AC (SMA) Cathode Band Mounting Pad Layout.65 (.65).49 (.25). (2.79). (2.54).66 (.68) MIN..74 (.88) MAX..77 (4.5).57 (3.99).2 (.35).6 (.52).6 (.52) MIN..9 (2.29).78 (.98).28 (5.28) REF..6 (.52).3 (.76).8 (.23) ().28 (5.28).94 (4.93) Revision: 23-Feb-6 4 Document Number: 8896
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