Table of Contents 1. Product Description 2 2. Outline Dimensions 3 3. Electrical and Optical Characteristics 4 Electrical and Optical Characteristics at IF=75mA and TA=25 C Absolute Maximum Ratings 4. Typical Characteristics Curves 5 Typical Light Distribution Curve Typical Angle Radiation Pattern Forward Current vs Relative Luminous Flux Forward Current Derating Curve Electrical Characteristics Curve Relative Flux vs Junction Temperature Relative Spectral Power Distribution Reflow Temperature Time Curve 5. Reliability Items Test Conditions 7 6. Soldering Conditions 7 1
1. Product Description Product features: Super High Flux Output and Luminance Designed for High Current Operation Low Thermal Resistance : 12 C SMT Solder capability Lead Free - CE and RoHS Compliant 3 Year Warranty ISO 91 Certified Manufacturing Conditions Applications: General Illumination Outdoor & Indoor Architectural Lighting Decorative Lighting Agricultural and Horticultural lighting Portable Lighting Traffic Signalling 2
2. Outline Dimensions Internal Circuit Notes: Anode - + All dimensions in millimetres (tolerance :+/-.2) Appearances may vary slightly for improvement without notice. Chip Size 45mil EPILED - 38-39nm 19.8 14.5 5.45 2.57 Cathode 4.2.3 8.5 1.6 3
3. Electrical and Optical Characteristics Electrical and Optical Characteristics at IF=75mA and TA=25 C Parameter Symbol Min Typical Max Unit Radiation Flux φe 16 ~ 19 mw Wavelength λd 38 ~ 39 nm Forward Voltage VF 3.5 ~ 4.5 V Power Dissipation PD 2.63 ~ 3.38 W View Angle 2θ1/2 ~ 12 ~ deg Thermal Resistance Rθ J-B ~ 12 ~ C/W Lifespan ~ 5, ~ ~ Hours Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 75 ma Junction Temperature Tj 115 C Operating Temperature Topr -4~+6 C Storage Temperature Tstg ~+6 C ESD Sensitivity ~ +/- 2, V HBM ~ Temperature Coefficient of voltage ~ -5 mv/ C DC Pulse Current(@ 1 KHz,1% duty cycle) IFP 1 ma Reverse Voltage VR No reverse operation Notes: Tolerance of Luminous Flux is +/- 3% Tolerance of Forward Voltage is +/-.1v 4
4. Typical Characteristic Curves 4.1 Typical Light Distribution Relative Intensity (%) 1% 9% 8% 7% 6% 5% 4% 3% 2% 1% % -9-7 -5-3 -1 1 3 5 7 9 Angular Displacement (degrees) 4.3 Forward Current vs Relative Luminous Flux Curve Normalised Luminous Flux 25 2 15 1 5 2 4 6 8 1 4.5 Electrical Characteristics White, Royal Blue, Blue, Green, Violet 1 9 8 7 6 5 4 3 2 1. 1. 2. 3. 4. 5. Forward Voltage (V) 16 17 4.2 Typical Light-Emitting Angle Radiation Pattern 15 14 13 12 11 1 9 8 18 15 12 9 6 3 3 6 9 12 15 18 Typical Polar Radiation Pattern for Lambertian 4.4 Forward Current Derating Curve, (Derating based on timax = 125 C) Amber, Red, Deep Red, Far Red 9 75 6 45 3 15 15 9 75 6 45 3 15.5 2 4 6 8 1 12 Base Temperature ( C) Forward Voltage (V) 7 6 5 1 1.5 2 2.5 3 4 3 2 1 5
4.6 Relative Flux vs Junction Temperature (if 35mA) White, Royal Blue, Blue, Green, Violet Relative Luminous Flux (%) 1% 9% 8% 7% 6% 5% 4% 3% 2% 1% White Blue Green Royal Blue / Violet % 2 4 6 8 1 115 Junction Temperature ( C) 4.8 Relative Spectral Power Distribution 4.9 Reflow Temperature Time Curve (Temperature C) 255 24 217 2 15 (6-12) sec 4.7 Relative Flux vs Junction Temperature (if 4mA) Amber, Red, Deep Red Relative Luminous Flux (%) (Time) 1% 9% 8% 7% 6% 5% 4% 3% Yellow 2% Red, Deep Red 1% % 2 4 6 8 1 115 Junction Temperature ( C) Recommend Solder Profile Minimum Solder Profile Ramp-up Preheat Maximum Solder Profile 1 Sec Max (6-15) sec Ramp-down 26 (+ /-5) 245 (+ /-5) 235 (+ /-5) 6
5. Reliability Items and Test Conditions Test Items Test Condition Test Hours Cycle Sample Size Ac/Re DC Aging Hot and Cold Shock Ta = 25 C if 75mA -4 C/3min +1 C/3min 1H 22 /1 1 Cycles 22 /1 High Temperature Storage Ta=1 C 1H 22 /1 High Temperature High Humidity 85 C/85%RH 1H 22 /1 Low Temperature Storage Ta=-4 C 1H 22 /1 ESD (HBM) 2V HBM 1Time 1 /1 Criteria for Judging Damage Items Symbol Test Condition Criteria for Judging Damage Forward Voltage VF IF=75mA Initial Data±1% Reverse Current IR VR=5V IR 1μA Luminous Flux φv IF=75mA 6. Soldering Conditions Reflow Soldering High Temperature PC Preheat 1-14 C 18-2 C Heat Up Time 12sec Max 12sec Max Peak Temperature 18 C Max 26 C Max Condition of Soldering Time Average φv degradation 2% Single LED φv degradation 3% 5sec Max Manual Welding Moulding Products Temperature Soldering Time 1sec Max Highest 35 C 3sec once 7