MP V, 2.5A, High Frequency Half-bridge Gate Driver

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The Future of Analog IC Technology MP1907 100V, 2.5A, High Frequency Half-bridge Gate Driver DESCRIPTION The MP1907 is a high frequency, 100V half bridge N-channel power MOSFET driver. Its low side and high side driver channels are independently controlled and matched with less than 5ns in time delay. Under-voltage lock-out both high side and low side supplies force their outputs low in case of insufficient supply. Both outputs will remain low until a rising edge on either input is detected. The integrated bootstrap diode reduces external component count. FEATURES Drives N-channel MOSFET half bridge 100V V BST voltage range Input signal overlap protection On-chip bootstrap diode Typical 20ns propagation delay time Less than 5ns gate drive mismatch Drive 1nF load with 12ns/9ns rise/fall times with 12V VDD TTL compatible input Less than 150μA quiescent current Less than 5μA shutdown current UVLO for both high side and low side In 3 3mm QFN10 Packages APPLICATIONS Battery Powered Hand Tool Telecom half bridge power supplies Avionics DC-DC converters Active-clamp Forward Converters All MPS parts are lead-free and adhere to the RoHS directive. For MPS green status, please visit MPS website under Products, Quality Assurance page. MPS and The Future of Analog IC Technology are registered trademarks of Monolithic Power Systems, Inc. TYPICAL APPLICATION 3.3V BATT VDD 1 3 BST M Micro Controller INH EN 7 8 6 CONTROL Floating Driver 4 5 Low -side 10 Driver 9 MP1907 VSS SW MP1907 Rev. 1.2 www.monolithicpower.com 1

ORDERING INFORMATION Part Number* Package Top Marking MP1907GQ QFN10 (3 x 3 mm) ADE * For Tape & Reel, add suffix Z (e.g. MP1907GQ Z); PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (V DD )...-0.3V to +20V SW Voltage (V SW )...-5.0V to 105V BST Voltage (V BST )...-0.3V to 110V BST to SW...-0.3V to +18V to SW... -0.3V to (BST-SW) +0.3V to VSS... -0.3V to (V DD +0.3V) All Other Pins...-0.3V to 20V Continuous Power Dissipation (T A =+25 C) (2) QFN10 (3x3)... 2.5W Junction Temperature...150 C Lead Temperature...260 C Storage Temperature... -65 C to +150 C Recommended Operating Conditions (3) Supply Voltage (V DD )... +4.5V to 18V (4) SW Voltage (V SW )...-1.0V to 100V SW slew rate...<50v/nsec Operating Junction Temp. (T J ). -40 C to +125 C Thermal Resistance (5) θ JA θ JC QFN10 (3x3)... 50... 12... C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature T J (MAX), the junction-to-ambient thermal resistance θ JA, and the ambient temperature T A. The maximum allowable continuous power dissipation at any ambient temperature is calculated by P D (MAX) = (T J (MAX)- T A )/θ JA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) 4.5V is only a typical value for minimum supply voltage at V DD falling 5) Measured on JESD51-7, 4-layer PCB. MP1907 Rev. 1.2 www.monolithicpower.com 2

ELECTRICAL CHARACTERISTICS V DD = V BST -V SW =12V, V SS =V SW = 0V, V EN =3.3V, No load at and, T A = +25 C, unless otherwise noted. Parameter Symbol Condition Min Typ Max Units Supply Current VDD Shutdown Current I SHDN V EN =0, 0 1 µa VDD quiescent current I DDQ =INH=0 80 100 µa VDD operating current I DDO fsw=500khz 2.8 3.5 ma Floating driver quiescent current I BSTQ =0, INH=0 or 1 55 70 µa Floating driver operating current I BSTO fsw=500khz 2.1 3 ma Leakage Current I LK BST=SW=100V 0.05 1 μa Inputs /INH High 2.4 V /INH Low 1 V /INH Hysteresis 0.6 V /INH internal pull-down resistance Under Voltage Protection R IN 185 kω VDD rising threshold V DDR 4.6 5.0 5.4 V VDD falling threshold V DDF 4.1 4.5 4.9 V (BST-SW) rising threshold V BSTR 4.6 5.0 5.4 V (BST-SW) falling threshold V BSTF 4.1 4.5 4.9 V EN Input Logic Low 0.7 V EN Input Logic High 1.5 V EN Hysteresis 100 mv EN Input Current I EN V EN =2V, T A =+25 C 10 µa V EN =5V, T A =-10 C to +70 C 35 (6) µa EN internal pull-down resistance R EN 200 kω Bootstrap Diode Bootstrap diode VF @ 100uA V F1 0.55 V Bootstrap diode VF @ 100mA V F2 1 V Bootstrap diode dynamic R R D @ 100mA 2.7 Ω Low Side Gate Driver Low level output voltage V OLL I O =100mA 0.15 0.22 V High level output voltage to rail V OHL I O =-100mA 0.45 0.6 V V =0V, V DD =4.5V (8) 0.15 A Peak pull-up current (7) I OHL V =0V, V DD =12V 1.5 A V =0V, V DD =16V 2.5 A V =V DD =4.5V (8) 0.25 A Peak pull-down current (7) I OLL V =V DD =12V 2.5 A V =V DD=16V 3.5 A Floating Gate Driver Low level output voltage V OLH I O =100mA 0.15 0.22 V MP1907 Rev. 1.2 www.monolithicpower.com 3

ELECTRICAL CHARACTERISTICS (continued) V DD = V BST -V SW =12V, V SS =V SW = 0V, V EN =3.3V, No load at and, T A = +25 C, unless otherwise noted. Parameter Symbol Condition Min Typ Max Units High level output voltage to rail V OHH I O =-100mA 0.45 0.6 V V =0V, V BST - V SW =5V (9) 0.25 A Peak pull-up current (7) I OHH V =0V, V DD =12V 1.5 A V =0V, V DD=16V 2.5 A V =V BST - V SW =5V (9) 0.65 A Peak pull-down current (7) I OLH V =V DD =12V 2.5 A V =V DD =16V 3.5 A Switching Spec. --- Low Side Gate Driver Turn-off propagation delay falling to falling T DLFF 20 ns Turn-on propagation delay rising to rising T DLRR 20 ns rise time C L =1nF 12 ns fall time C L =1nF 9 ns Switching Spec. --- Floating Gate Driver Turn-off propagation delay falling to falling Turn-on propagation delay rising to rising T DHFF 20 ns T DHRR 18 ns rise time C L =1nF 12 ns fall time C L =1nF 9 ns Switching Spec. --- Matching Floating driver turn-off to low side drive turn-on Low side driver turn-off to floating driver turn-on Minimum input pulse width that changes the output Bootstrap diode turn-on or turn-off time Note: 6) Based on characterization data. Not production tested. 7) Guaranteed by design. 8) After startup VDD fall to 4.5V 9) After startup VBST- VSW fall to 5V INPUT (INH, ) T MON 1 5 ns T MOFF 1 5 ns T PW 50 (7) ns T BS 10 (7) ns T DHRR, T DLRR INH OUTPUT (, ) T DHFF, T DLFF T MON T MOFF Figure 1 Timing Diagram MP1907 Rev. 1.2 www.monolithicpower.com 4

PIN FUNCTIONS Package Pin # Name Description 1 VDD Supply input. This pin supplies power to all the internal circuitry. A decoupling capacitor to ground must be placed close to this pin to ensure stable and clean supply. 2 NC No Connection. 3 BST Bootstrap. This is the positive power supply for the internal floating high-side MOSFET driver. Connect a bypass capacitor between this pin and SW pin. 4 Floating driver output. 5 SW Switching node. 6 EN On/off Control. 7 INH Control signal input for the floating driver. 8 Control signal input for the low side driver. 9 VSS, Exposed Pad Chip ground. Connect to Exposed pad to VSS for proper thermal operation. 10 Low side driver output. MP1907 Rev. 1.2 www.monolithicpower.com 5

TYPICAL PERFORMANCE CHARACTERISTICS V DD =12V, V SS =V SW = 0V, T A = +25 C, unless otherwise noted. I DDO Operation Current vs. I BSTO Operation Current vs. Frequency Frequency 6 5 4 3 2 1 T=0 o C 0 0 200 400 600 800 1000 4 3 2 1 0 0 200 400 600 800 1000 V OHL,V OHH (V) High Level Output Voltage vs.temperature 0.50 0.45 V BST =V DD =12V 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00-50 0 50 100 150 V OLL,V OLH (V) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Low Level Output Voltage vs. Temperature V BST =V DD =12V 0.00-50 0 50 100 150 V BSTR,V DDR (V) 5.10 5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 Undervoltage Lockout Threshold vs.temperature V BSTR V DDR 4.92-50 0 50 100 150 V BSTH,V DDH (mv) 510 500 490 480 470 460 Undervoltage Lockout Hysteresis vs.temperature V BSTH V DDH 450-50 0 50 100 150 20 19 18 17 16 15 14 Propagation Delay vs. Temperature T DLRR T DHRR T DHFF T DLFF 13-50 0 50 100 150 FORWARD CURRENT (A) 1 0.1 0.01 0.001 Bootstrap Diode I-V Characteristics 0.0001 0.5 0.6 0.7 0.8 0.9 1 FORWARD VOLTAGE (V) 90 80 70 60 50 40 30 20 Quiescent Current vs. Voltage I DDQ vs. V DD I BSTQ vs. V BST 10 0 4 8 12 16 20 V DD,V BST (V) MP1907 Rev. 1.2 www.monolithicpower.com 6

TYPICAL PERFORMANCE CHARACTERISTICS (continued) V DD =12V, V SS =V SW = 0V, T A = +25 C, unless otherwise noted. Peak Current vs. V DD Voltage 4 3.5 PEAK CURRENT (A) 3 2.5 2 1.5 1 0.5 I OLH I OLL I OHL I OHH 0 8 10 12 14 16 18 20 V DD (V) MP1907 Rev. 1.2 www.monolithicpower.com 7

TYPICAL PERFORMANCE CHARACTERISTICS (continued) V DD =12V, V SS =V SW = 0V, T A = +25 C, unless otherwise noted. Turn-on Propagation Delay Turn-on Propagation Delay Turn-off Protection Delay 20ns 20ns 18ns INH IINH Turn-off Protection Delay Drive Rise Time (1nF Load) Drive Rise Time (1nF Load) 18ns 12ns 8ns Drive Fall Time (1nF Load) Drive Fall Time (1nF Load) Input Signal Overlap Protection 5.2ns 5.2ns & INH 10V/div. 10V/div. MP1907 Rev. 1.2 www.monolithicpower.com 8

TYPICAL PERFORMANCE CHARACTERISTICS (continued) V DD =5V, after startup V DD falls to 5V, V SS =V SW = 0V, T A = +25 C, unless otherwise noted. I DDO Operation Current vs. Frequency 1.0 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 I BSTO Operation Current vs. Frequency V BST - V SW =5V V OHL,V OHH (V) 1.2 1.0 0.8 0.6 0.4 0.2 High Level Output Voltage vs.temperature V BST =V DD =5V 0.0 0 200 400 600 800 1000 FREQUENCY (khz) 0.0 0 200 400 600 800 1000 FREQUENCY (khz) 0.0-50 0 50 100 150 0.40 0.35 0.30 Low Level Output Voltage vs. Temperature V BST =V DD =5V 45 40 Propagation Delay vs. Temperature V OLL,V OLH (V) 0.25 0.20 0.15 0.10 0.05 0.00-50 0 50 100 150 35 T DLRR 30 T DLFF 25 20-50 0 50 100 150 MP1907 Rev. 1.2 www.monolithicpower.com 9

TYPICAL PERFORMANCE CHARACTERISTICS (continued) V DD =5V, after startup V DD falls to 5V, V SS =V SW = 0V, T A = +25 C, unless otherwise noted. Turn-on Propagation Delay Turn-off Propagation Delay Drive Rise Time (1nF Load) 28ns 30ns 20ns Drive Fall Time (1nF Load) 8ns MP1907 Rev. 1.2 www.monolithicpower.com 10

BLOCK DIAGRAM Figure 2 Function Block Diagram MP1907 Rev. 1.2 www.monolithicpower.com 11

OPERATION Switch Shoot-through Protection The input signals of INH and are controlled independently. Input shoot-through protection circuitry is implemented to prevent shootthrough between the HSFET and LSFET outputs. Only one of the FET drivers can be ON at one time. If both INH and are high at the same time, both HSFET and LSFET will be OFF. Under Voltage Lock Out When VDD or BST goes below their respective UVLO thresholds, both and outputs will go low to turn off both FETs. Once VDD rises above the UVLO threshold, both and will stay low until a rising edge is detected on either INH or. The truth table in Table 1 details the operation of the HSFET and LSFET under different INH, and UVLO conditions Table1 States of Driver Output under different conditions EN BST-SW Voltage V DD Voltage INH 0 X X X X Open 1 200kΩ pull down UVLO Latch status X X 0 0 0 0 X X X 1 1 0 0 X X Above UVLO 0 1 0 1 Normal Above UVLO Above UVLO 1 0 1 0 Normal Falls below Normal to Above UVLO X X 0 0 UVLO Tripped Above Falls below Normal to X X 0 0 UVLO UVLO Tripped X Above UVLO 0 or 1 0 or 1 0 0 Tripped X Below UVLO X X 0 0 Tripped X Above UVLO 0 to 1 0 to 1 0 0 Tripped, Reset by & INH X Above UVLO 1 to 0 1 0 0 to 1 Tripped, Reset by INH Falling Below Tripped, Reset Above UVLO 1 1 to 0 0 0 UVLO by Falling Above Tripped, Reset Above UVLO 1 1 to 0 0 to 1 0 UVLO by Falling Below Tripped, Reset Above UVLO 0 0 to 1 0 0 to 1 UVLO by Below Above UVLO 0 to 1 0 0 0 Tripped, Reset UVLO Above UVLO Above UVLO 0 to 1 0 0 to 1 0 X by INH Tripped, Reset by INH Operating Condition X Normal Operation Normal-to-Tripped Transition When UVLO latch is tripped. Tripped to Normal Transition Note: x = Don t Care.. MP1907 Rev. 1.2 www.monolithicpower.com 12

APPLICATION INFORMATION Reference Design Circuits Half Bridge Motor Driver T In half-bridge converter topology, the MOSFETs are driven alternately with some dead time. Therefore, INH and are driven with alternating signals from the PWM controller. The input voltage can be up to 100V in this application. Up to 100V + M EN INH 6 7 8 EN INH MP1907 SW BST 5 4 3 9 VSS NC 2 10 VDD 1 10µF VDD 4.5V to 18V Figure 3 Half-Bridge Motor Driver MP1907 Rev. 1.2 www.monolithicpower.com 13

Active-Clamp Forward Converter In active-clamp forward converter topology, the MOSFETs are driven alternately. The high-side MOSFET, along with capacitor C reset, is used to reset the power transformer in a lossless manner. This topology lends itself well to run at duty cycles exceeding 50%. For these reasons, the input voltage may not be able to run at 100V for this application. Up to 100V + Secondary Circuit + Creset EN INH 6 7 8 EN INH MP1907 SW BST 5 4 3 9 VSS NC 2 10 VDD 1 10µF VDD 9V to 18V Figure 4 Active-clamp Forward Converter MP1907 Rev. 1.2 www.monolithicpower.com 14

PACKAGE INFORMATION QFN10 (3 3 mm) PIN 1 ID MARKING 2.90 3.10 0.18 0.30 0.30 0.50 10 1.45 1.75 1 PIN 1 ID SEE DETAIL A PIN 1 ID INDEX AREA 2.90 3.10 0.50 BSC 2.25 2.55 6 5 TOP VIEW BOTTOM VIEW 0.20 REF 0.80 1.00 PIN 1 ID OPTION A R0.20 TYP. PIN 1 ID OPTION B R0.20 TYP. 0.00 0.05 SIDE VIEW DETAIL A 2.90 NOTE: 0.25 0.70 1.70 1) ALL DIMENSIONS ARE IN MILLIMETERS. 2) EXPOSED PADDLE SIZE DOES NOT INCLUDE MOLD FLASH. 3) LEAD COPLANARITY SHALL BE 0.10 MILLIMETER MAX. 4) DRAWING CONFORMS TO JEDEC MO-229, VARIATION VEED-5. 5) DRAWING IS NOT TO SCALE. 0.50 2.50 RECOMMENDED LAND PATTERN NOTICE: The information in this document is subject to change without notice. Please contact MPS for current specifications. Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not assume any legal responsibility for any said applications. MP1907 Rev. 1.2 www.monolithicpower.com 15

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Monolithic Power Systems (MPS): MP1907GQ-Z MP1907GQ-P MP1907AGQ-Z MP1907AGQ-P