2014 37th ISSE International Spring Technology Seminar in Electronics (ISSE 2014) Dresden, Germany 7-11 May 2014 IEEE Catalog Number: CFP14509-POD ISBN: 978-1-4799-4454-5
Table of Contents Autors Title Pages Paul Gierth, Lars Rebenklau Michal Jurcisin, Stanislav Slosarcik, Slavomfr Kardos Wettability of Rapid Thermal Firing Silver-Pastes Heat Dissipation Based on LTCC - HTCC Heterostructure 1-6 7-10 Andrea Marie, Nelu Blaz, Goran Radosavljevic, Sasa Toskov, Ljiljana Zivanov Affect of Peak Sintering Temperature Variation on LTCC Ferrite Tape Complex Permeability 11-15 Marco Steinhauser, Gerhard Eckart, Gudrun Lange Electron Beam Brazing of Copper and Aluminium 16-20 Sasa Toskov, Nenad Krcic, Goran Radosavljevic LTCC Lamination Process Using PMMA 21-26 Fugitive Material Dirk Seehase, Heiko Huth, Arne Neiser, Mathias Nowottnick Attila Geczy, Laszlo Gal, Istvan Hajdu, Balint Kovacs, Daniel Nagy, Miklos Ruszinko Peter Lukacs, Alena Pietrikova, Lubomir Livovsky Reactive Paste for Reflow Soldering of Large Components Optimizing Solder Joints on Biodegradable PCBs with Vapour Phase Soldering Analysis of Mechanical Properties of LTCC Substrates 27-32 33-38 39-43 Stoyan Stoyanov, Alexander Dabek, Chris Bailey Hot Nitrogen Deballing of Ball Grid Arrays 44-49 A. G. Staat, T. Hohlfeld, T. Standau, 1. Weimann, R. Bauer, K. Harre Substrates Based on Renewable Resources for Printed Circuit Boards 50-53 Alexandra Fodor, Rajmond Jano, Dan Pitica Thermal Influences on IC Packages During Manual Soldering Process 54-57 iii 37th Int. Spring Seminar on Electronics Technology
P. Fulmek, G. Langer, F.-P. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, J. Nicolics Direct Junction Temperature Measurement in High-Power LEDs 58-63 Przemystew Krystian Matkowski Comparative Thermal Analysis of Commercial and Novel Hybrid Thermal Greases 64-69 Bartosz Ptetek, Tomasz Fafat, Jan Felba Ciprian lonescu, Detlef Bonfert, Mihai Branzei Michal Stekovic, Josef Sandera Ryszard Kisiel, Bartosz Platek, Marcin Mysliwiec Paul Svasta, Andrei Marghescu, Traian Neacsa Cryptographic Evaluation of the Interfacial Resistance Between Carbon Nanotube and Silicon by Using Molecular Dynamics Simulations Investigation on Thermal Properties of Substrates for Printed Electronics Fabrication of Electrochemical Sensor in Low Temperature Co-Fired Ceramics Thermal Properties of Ag Sintered Layer Used as Interconnect Material in Microelectronics Packaging Coprocessor for Data Integrity Algorithms 70-74 75-80 81-86 87-90 91-94 Karel Hromadka, Jiri Stulik, Jan Reboun Martin Klima, Jakub Somer, Lucie Blahova, Michal Prochazka, Ivan Szendiuch Thick Printed Copper Conductors on Alumina Substrates Usage of Low-Temperature Co-Fired Ceramic in Hermetic Packaging 95-98 99-103 Jerzy Szatepak, Aleksander Gados, Konrad Kietbasihski, Anna Mbzniak, Jakub Krzemihski, Marian Teodorczyk, Tomasz Kowaluk, Malgorzata Jakubowska Nanosilver Sintered Joints on Elastic Substrates 104 Pavel Mach, David Busek Oliver Krammer Study of Thermomechanical Properties of One- and Two-Component Conductive Adhesives Correcting Factor of Solder Paste Volume Calculation for Pin-in-Paste Technology 105-108 109-113 iv 37^ Int. Spring Seminar on Electronics Technology
Agility Kornel Ruman, Alena Pietrikova, Igor Vehec, Tibor Rovensky, Pavol Galajda Integration of Microstrip LP and BP Filters to Multilayer Structure Based on Various LTCC 114-119 Katharina Schulz, Daniel Ernst, Siegfried Menzel, Thomas Gemming, Juergen Eckert, Klaus-Juergen Wolter Thermosonic Platinum Wire Bonding on Platinum 120-124 Daniel Ernst, Michael Melzer, Denys Makarov, Falk Bahr, Wilfried Hofmann, Oliver G. Schmidt, Thomas Zerna Packaging Technologies for (Ultra-)Thin Sensor Applications in Active Magnetic Bearings 125-129 Lukas Lorenz, Sebastian Sohr, Ralf Rieske, Krzysztof Nieweglowski, Thomas Zerna, Klaus-Jurgen Wolter Development of a Wafer-Level Integration Technology for Photonic Transceivers Based on Planar Lightwave Circuits 130-136 Paul Gierth, Michael Zieschank, Lars Rebenklau Evaluation of Long Time Stability of Solder Joints on Ag Thick Film Conductors on AI2O3 137-142 Tomas Blecha Screen Printed Chipless RFID Tags 143-146 Martin Hirman, Karel Rendl, Frantisek Steiner, Vaclav Wirth Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu 147-151 Balazs Hies, Barbara Horvath Martin Molhanec, Ivana Beshajova-Pelikanova Tin Whisker Growth from Low Ag Content Micro-Alloyed SAC Solders Employing Model Based Failure Mode and Effect Analysis for Screen Printing 152-157 158-163 Martin Molhanec, Rajmond Jano, Alexandra Fodor Extreme - Manufacturing to Greater Productivity and Quality Soldering Profile Optimization for Through-Hole and Surface Mounted Ceramic Capacitors 164-169 170-175 V 37 Int. Spring Seminar on Electronics Technology
Damian Nowak, Andrzej Dziedzic Reliability of Fine-Line Thick-Film and LTCC Conductors at High-Temperature Operation 176-179 Arne Neiser, Dirk Seehase, Andreas Fink, Kevin Lehnzen, Helmut Beikirch Thermoelectric Generator for Stand- Alone Electronic Device Operation in Temperature Test Cabinets 180-184 Karel Dusek, Martin Placek, David Busek, Klara Dvofakova, Alexandra. Rudajevova Study of Influence of Thermal Capacity and Flux Activity on the Solderability 185-188 Karel Dusek, Ivana Beshajova Pelikanova, David Busek, Marek Zeidler Measurements of Solder Paste Viscosity During Its Tempering and Aging 189-192 Martin Placek, Karel Dusek, Jan Urbanek A. Otahal, M. Adamek, 1. Szendiuch A. Pietrikova, J. Durisin, M. Bazu, V. Mian Whiskers Growth on Thick Tin Layers and Various Types of Surfaces Impact of Solder Paste Drying on the Solderability Influence of Different Methods of Ageing on Microstructure of Solder Joints 193-197 198-201 202-205 Adrian Tulbure, Emilian Ceuca, Dirk Turschner Arduino Based Power Semiconductors Tester for Urban Traction Systems 206-210 Pavel Mach, Martin Horak Ageing of Self-Healing Polypropylene Film Capacitors by Non-Sinusoidal Voltage 211-214 Attila Geczy, Marta Fejos, Laszlo Tersztyanszky, Andras Kemler, Andras Szabo Tibor Rovensky, Alena Pietrikova, Kornel Ruman, Igor Vehec Dan-Sebastian Filip, Dorin Petreus loan Plotog, Marian Vladescu Investigating Printed Circuit Board Shrinkage During Reflow Soldering Stability of LTCC Substrates in High Frequency Area After Accelerated Aging Tests Wireless Energy Transfer Using Resonant Induction Working Temperatures Influence Over the Solder Joints Properties 215-220 221-224 225-230 231-236 vi 37 Int. Spring Seminar on Electronics Technology
Goran Miskovic, Luka Vuckovic, Javier Fernandez, Heinz Homolka, Michael Unger, Goran Radosavljevic Investigation on physical and electrical behaviour of LTCC dielectric tapes 237-242 Przemystaw Krystian Matkowski, Tomasz Fatat, Zbigniew Zaluk, Jan Felba, Andrzej Moscicki Structure of the Thermal Interface Connection Made of Sintered Nano Silver 243-246 Krzysztof Jerzy Urbahski, Tomasz Fatet, Przemystaw Matkowski, Marcin Szczerba, Jan Felba, Andrzej Moscicki Investigation of Electrical Properties of Contacts Made of Materials Based on Sintered Nano-Ag Particles 247-251 Mihai Branzei, Bogdan Mihailescu, Ion Pencea Balint Medgyes, Istvan Hajdu, Richard Berenyi, Laszlo Gal, Miklos Ruszinko, Gabor Harsanyi Lead / Lead-Free Solder Alloys Shear Tests Correlations with Structure at Different Temperatures Electrochemical Migration of Silver on Conventional and Biodegradable Substrates in Microelectronics 252-255 256-260 Anna Andonova, George Angelov, Peter Chernev Diagnostics of Packaged ICs By Infrared Thermography 261-266 Anna Andonova, Ivaylo Zhivkov, Yavor Georgiev, George Angelov, Jana Honova, Martin Weiter Thermographic Control of Organic Solar Cells 267-272 Krystian Jankowski, Artur Wymystowski Acceleration of Life Prediction of Solder Joints Using Multi-Failure Criteria 273-277 Elitsa Gieva, Rostislav Rusev, George Angelov, Rossen Radonov, Marin Hristov Microelectronic Circuits Analogous to Hydrogen Bonding Networks in Michaelis Complex of Beta-Lactamase Protein 278-283 vii 37th Int. Spring Seminar on Electronics Technology
Radu Gabriel Bozomitu, Vlad Cehan, Robert Gabriel Lupu A New CMOS Differential Input FM Quadrature Demodulator 284-289 Boleslav Psota, Alexandr Otahal, Ivan Szendiuch Mechanical Testing of PCB Using Computer Simulations 290-293 Robert Gabriel Lupu, Radu Gabriel Bozomitu, Vlad Cehan Jan Simota, Jin Tupa Snezhana Pleshkova- Bekyarska, Aleksandar Bekyarski S. G. Pleshkova, K. Peeva, A. Bekyarski Detection of Gaze Direction by Using Improved Eye-Tracking Technique Implementation of SPC Methodology to Service Processes Multicore DSPs Thermal Image for Real Time Sequence Processing Motion Detection in Thermal Surveillance System Received Thermal Images Quality Estimation in Thermo Vision Communication Systems 294-297 298-302 303-308 309-314 David Kurzmanowski, Jurgen Wilde Using Layout Data for Predicting Effects on Production Processes in PCB- Manufacturing E. Ceuca, A. Tulbure Modeling and Practical Strategy for PWM 1. M. Costea, C. 1. Dumitrescu, N. Dumitru, B. Soare Control in Heating Applications Biomedical Signals Analysis Techniques Using the Signal Processor TMS320C6211B 315-320 321-326 327-331 1. M. Costea, P. A. Tanasa, 1. Barbu, 1. Cojocaru, N. Dumitru Automatic Traffic Monitoring System 332-335 Aurelian Botau, Detlef Bonfert, Catalin Negrea Electrical and Thermal Behavior for DC and Pulsed Stress on Chip Resistors 336-340 Martin Bursik, Vladimir Sitko, Michal Rezmcek, Ivan Szendiuch, Jaroslav Jankovsky Analytic Method for Monitoring of Cleaning Process Efficiency 341-344 Dorin Petreus, Toma Patarau, Radu. Etz, Tiberiu Frentiu Portable System for Heavy Metals Detection Based on Spectral Analysis 345-349 viii 37th Int. Spring Seminaron Electronics Technology
Manuela Franz, Ivan Szendiuch Grzegorz Wroblewski, Marcin Stoma, Daniel Janczak, Anna Mtozniak, Mafgorzata Jakubowska Distribution of Free-Field Photovoltaic Plants in Europe and Exemplarily in South Moravia, Czech Republic Electroluminescent Structures With Nanomaterials for Direct Printing of Interactive Packages and Labels 350-354 357-360 Alexandr Knapek, Filip Mika, Jan Prasek, Petra Majzlfkova SEM Characterization of Carbon Nanotubes Based Active Layers of Chemical Sensors 361-364 Tomasz Falat, Przemyslaw Matkowski, Zbigniew Zaluk, Jan Felba, Andrzej Moscicki Mechanical Strength of Joints Based on nano-ag Sintering Phenomena 365-368 Attila Bonyar, Balazs Wimmer, Istvan Csarnovics Irina Y. Uvarova, Roman M. Rudenko, Elena A. Voitsihovska, Ivan 1. Yaskovets, Boris A. Danilchenko Eugen Coca, Vlad Cehan Development of a Localised Surface Plasmon Resonance Sensor Based on Gold Nanoparticles Accumulation and Recovery of Radiation- Induced Damages in Single-Walled Carbon Nanotube Bundles Laboratory Study of Electromagnetic Waves Reflectivity of Certain Materials 369-374 375-379 380-384 C. A. Tamas, N. D. Codreanu, C. Grecu, 1. Marghescu Dan Tudor Vuza, Marian Vladescu Arkadiusz P. Dabrowski, Leszek J. Golonka Investigations on Silicon and PCB Ground System Design for New 1.2V DDR4 Power Sources Solving an EMC/EMI Problem Occurred Inside a Complex Programmable Logic Device LTCC/PZT Differential Pressure Sensor Utilizing Ultrasonic Wave Resonator 385-389 390-394 395-401 Tamas Garami, Norbert Reti, Oliver Krammer Controlling the Cooling Rate of Soldering Processes with PIC Microcontroller 402-406 Radek Soukup, Ales Hamacek, Lukas Mracek, Jan Reboun Textile Based Temperature and Humidity Sensor Elements for Healthcare Applications 407-411 ix 37th Int. Spring Seminar on Electronics Technology
Hristo Ivanov, Marin Valkov Emil lontchev, Radostin Kenov, Rossen Miletiev, Ivaylo Simeonov, Yavor Isaev Milica G. Kisic, Nelu V. Blaz, Andrea M. Marie, Goran J. Radosavljevic, Ljiljana D. Zivanov, Mirjana S. Damnjanovic Application of Sensors and Control Microsystems to Improve Efficiency and Service Life Durability of LED Lighting Equipment Hardware Implementation of Quad Microelectromechanical Sensor Structure for Inertial Systems Influence of Coil Design on Sensing Performance of Pressure Sensor with Polyimide Membrane 412-416 417-420 421-426 Oleksandr Bogdan, Anatolii Orlov, Gennady Pashkevich, Veronika Ulianova, Yurii Yakimenko, Andrii Zazerin Optimal Parameters Determination for Nanostructure-Enhanced Surface Acoustic Waves Sensor 427-431 Nikolay Dodev, Nencho Nenov, Emil Dimitrov, Venelin Pavlov Electronic Measurement System of Flexi-Coil Suspension Springs Test Stand 432-437 Nelu Blaz, Andrea Marie, Sasa Toskov, Goran Miskovic, Goran Radosavljevic, Ljiljana Zivanov Capacitive Sensor for Quantity Detection of Known Liquid Present in Distilled Water 438-441 Norocel Codreanu, Gaudentiu Varzaru, Ciprian lonescu David Wagner, Bertram Schmidt, Markus Detert Roland Wuchrer, Georg Lautenschlager, Rene Metasch, Mike Rollig, Thomas Fleischer, Thomas Hartling Solar Powered Wireless Multi-Sensor Device for an Irrigation System Challenges to the Electronics Packaging Technologies for the Volume Integration of Components in Medical Tools and Instruments Filter-Based Interrogation of Fiber Bragg Grating Sensors 442-447 448-452 453-457 X 37 Int. Spring Seminaron Electronics Technology
Ondrej Kainz, Slavomir Kardos, Stanislav Slosarclk, Michal Jurcisin, Pavol Cabuk Virtual Factory for PCB and Thick-Film Circuits Fabrication 458-462 James Morris, Lisa Weasel, Peter Moeck, Juna Snow Nanotechnology Courses for General Education 463-467 Florin Draghici, Mihaela Pantazica, Norocel Dragos Codreanu, Paul Svasta - Hands-On Project Key Issue in the Education of Future Electronic Engineers 468-473 A. Ktossowicz, P. Winiarski, M. Zawierta, W. St plewski, A. Dziedzic Analysis oflong-term Stability of Capacitors Embedded in Printed Circuit Boards 474-479 Jan Macioszczyk, Piotr Slobodzian, Leszek Golonka Improvement of the Frequency Bandwidth of LTCC Meander Antenna 480-485 Yurii Yakimenko, Andrii Zazerin, Anatolii Orlov, Oleksandr Bogdan Film Bulk Acoustic Resonator Finite Element Model in Active Filter Design 486-490 Timo Kordass, Jorg Franke Galvanic Plating for 3D-MID Applications 491-495 xi 37 Int. Spring Seminar on Electronics Technology