Setting the standard PRODUCTION & TEST. Gen3 Systems MANUFACTURES & SUPPLIES ELECTRONIC ASSEMBLY & TEST EQUIPMENT. Contaminometer CM+ NANO-COAT

Similar documents
Auditing Contract Manufacturing Processes

Technical Info Sheet. Ionic contamination testing in a no-clean soldering process. Scope

How to Avoid Conductive Anodic Filaments (CAF)

Logistics. EMS manufacturing solutions can be supplied in any format to suit a customer s requirements, including;

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

PCB Quality Inspection. Student Manual

Good Boards = Results

Ultraprint 2000 HiE. Ultraprint 2000 HiE Features MODULAR DESIGN ENSURES SUPERIOR ADAPTABILITY

PIN IN PASTE APPLICATION NOTE.

IPC-SM-840C. Qualification and Performance of Permanent Solder Mask IPC-SM-840C. The Institute for. Interconnecting. and Packaging Electronic Circuits

A and M Electronics Contract Manufacturing Circuit Board Assembly Avenue Kearny Valencia, Ca (661) or (800)

Electronic Board Assembly

Flexible Circuits and Interconnection Solutions

WCAP-CSGP Ceramic Capacitors

Prototype to Full Production and Box Build. Delivering a superior end product in rapid response time.

Electrical tests on PCB insulation materials and investigation of influence of solder fillets geometry on partial discharge

Investigation of Components Attachment onto Low Temperature Flex Circuit

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3

Your Product. - Our Key Competence. Moulding and Encapsulation Cable Assembly Customizing Fiber Cable Assembly Assembly Projects

Lead & Magnet Wire Connection Methods Using the Tin Fusing Method Joyal A Division of AWE, Inc.

Cleanliness of Electronic PCB Assemblies Leads to Medical Device Reliability

Edition Published by Infineon Technologies AG Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.

Technical Spotlight. The Use of Ion Chromatography in the Printed Circuit Board Industry

Bob Willis leadfreesoldering.com

Fraunhofer ISIT, Itzehoe 14. Juni Fraunhofer Institut Siliziumtechnologie (ISIT)

Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing

Siemens Chemnitz Siemens AG Alle Rechte vorbehalten.

TAILOR MADE TECHNOLOGY

JOINT INDUSTRY STANDARD

Manufacturing Capabilities

The Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540

Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions

A comprehensive range

RMS Power. The Meaning of Average

Overview. Building Partnerships for Tomorrow... INTRODUCTION. Houston

MANUFACTURING INNOVATION

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Keysight Technologies Quickly Identify and Characterize Thermal Measurement Points

PCB Board Design. PCB boards. What is a PCB board


A thermal cure is then applied to obtain final properties of the paint film.

LO5: Understand commercial circuit manufacture

50 W Power Resistor, Thick Film Technology, TO-220

FLEXIBLE CIRCUITS MANUFACTURING

Auditing a Printed Circuit Board Fabrication Facility Greg Caswell

Kemet DIAMOND PRODUCTS

In-line 3D Sputtering Coating System. Fully automated. pst line

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Flex Circuit Design and Manufacture.

SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current

TAIYO PSR-4000MP LIQUID PHOTOIMAGEABLE SOLDER MASK

How do you create a RoHS Compliancy-Lead-free Roadmap?

Customized solutions Rigid, flexible and rigid-flexible printed circuit boards of the very highest quality

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com

1.1.2 Polypropylene The polypropylene must be a white opaque film, 1 2 mil thick. Biaxial orientation is preferred.

Manufacturing Capability profile

STRAIN GAGE INSTALLATION HOLE DRILLING

INTEGRATED CIRCUITS DATA SHEET. SAA digit LED-driver with I 2 C-Bus interface. Product specification File under Integrated Circuits, IC01

handbook, 2 columns handbook, halfpage 085 CS

PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices

Good Manufacturing Practices for the Production of Packaging Inks formulated for use on the non food contact surfaces of food packaging and articles

White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

TEMPERATURE SENSORS AND PROBES FOR BIO-MEDICAL APPLICATIONS

SURFACE INSULATION RESISTANCE TESTING OF SOLDERING PASTES AND FLUXES

Momentum Series MPM. Printing System. A cost-effective, high-performance printing solution featuring innovative technology and outstanding capability.

8-bit Atmel Microcontrollers. Application Note. Atmel AVR211: Wafer Level Chip Scale Packages

SELECTION GUIDE INPUT CHARACTERISTICS. Voltage set point accuracy. Overall voltage error. Temperature coefficient of output voltage (slope)

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Precision Thin Film Chip Resistors

3M Thermally Conductive Adhesive Transfer Tapes

li-ion Polymer Battery Specification

MADP T. Non Magnetic MELF PIN Diode

WELCOME TO VIASION.

TECHNICAL DATASHEET. Ronascreen TM SPSR 5900 SP / HL-3

The table below lists the symbols used on the Clamp and/or in this manual. Important Information. See manual.

Company Profile 2014 October 2014

For the modifications listed below, the Qualification Approval tests in IEC and IEC 61646, shall be used as a guideline by the assessor:

TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 1206, 0805, 0603

Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Presentation of the France Transfo factories

Handling and Processing Details for Ceramic LEDs Application Note

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!

Polyimide labels for Printed Circuit Boards

3 Thermal Transfer Acrylate Label Material 3921

Global Asset Tagging & Identification System for Hydraulic Hose Assemblies

TAIYO PSR-4000 AUS703

INTERNATIONAL STANDARD

Reliance. Precision Limited. Electro-Mechanical, Opto-Mechanical Assemblies and Specialist Geared Components

Design qualification and type approval of PV modules

Automatic Defluxing Systems. Stencil Cleaning Systems. Ionic Contamination (Cleanliness) Testers. Cleaning Chemicals

CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC

Ultrasonic Cleaning Lines for Aerospace Applications

INDUSTRIAL SITE SERVICES. sharing responsibility

Assembly and Cleaning. Prototype FDC Wire Boards

RG 7 Accreditation for Inspection Bodies Performing Non-Destructive Testing

Troubleshooting the Stencil Printing Process

Transcription:

Gen3 Systems MANUFACTURES & SUPPLIES ELECTRONIC ASSEMBLY & TEST EQUIPMENT Setting the standard Gen3 Systems is a specialist manufacturer of award-winning industry standard benchmark test and measurement equipment used to improve electronic circuit reliability. We also design and manufacture conformal coating process equipment both bench-top and inline systems and offer a range of test services. We provide award-winning contributions to the standards development bodies IEC (International Electro- Technical Commission), ISO (International Standards Organisation) and IPC (Association Connecting Electronics Industries - USA). We work extensively with the British National Physical Laboratory (NPL) through whose science research, ELECTRONICS we employ and evolve new measurement techniques and test equipment. PRODUCTION & TEST Contaminometer CM+ NANO-COAT Gensonic Solder Saver MUST AutoSIR2 AutoCAF2 Z-Check

Gen3 Systems MANUFACTURES & SUPPLIES ELECTRONIC ASSEMBLY & TEST EQUIPMENT Setting the standard Gen3 Systems is a specialist manufacturer of award-winning industry standard benchmark test and measurement equipment used to improve electronic circuit reliability. We also design and manufacture conformal coating process equipment both bench-top and inline systems and offer a range of test services. We provide award-winning contributions to the standards development bodies IEC (International Electro- Technical Commission), ISO (International Standards Organisation) and IPC (Association Connecting Electronics Industries - USA). We work extensively with the British National Physical Laboratory (NPL) through whose science research, we employ and evolve new measurement techniques and test equipment. Contaminometer CM+ NANO-COAT Gensonic Solder Saver MUST AutoSIR2 AutoCAF2 Z-Check

Gen3 Systems... Gen3 Systems is a financially independent, 3rd generation, family owned business that has its roots going back 45 years. Originally a heavy engineering based business, it was the family s 2nd generation that diversified it into the then fast growing electronics business, establishing Concoat in 1979. Concoat, that was a familiar name in Europe, Asia and much of North America, was sold in 2005 but its equipment business was retained to become Gen3 Systems. Gen3 Systems is a specialist manufacturer of test and measurement equipment used to predict the reliability of electronic circuits and systems. This began when we acquired Multicore SPCID business from Henkel in 2002. We continue to design and manufacture conformal coating process equipment of both in-line and bench-top formats as we have done for almost 40 years. To help develop our Distribution Business in the UK market, in 2008 we acquired Process Support Products (PSP). This opened opportunities in selective soldering, AOI, and cleaning system applications. These further expanded into robotic dispensing and coating systems and, most recently, into Micro-Electronics Systems. For over 30 years, Gen3 Systems has worked closely with the National Physical Laboratory (NPL). This unique relationship has helped in our development of our various test systems as well as helping us define new measurement techniques and equipment. Our combined knowledge and experience is also offered to provide training and advice to customers and a comprehensive in-house testing service for solderability, SIR and cleanliness evaluations....at your service

Production Ionic Contamination Process Control Contaminometer CM+ Accurate measurement of ionic contamination in accordance with international specifications from IPC and IEC. For over 30 years the Benchmark for Ionic Contamination Testing. PICT Process Ionic Contamination Testing the new process control metric introduced by Gen3 Systems. 6 test systems for optimum test capability: CM11+ CM22+ CM33+ CM33L+ CM60 Unique Bare Board Tester: CM-BBT Dip & Spray Coating Systems NANO-COAT Ultra Precision Dip Coating Systems that can apply coatings from <60nm to >50μm at >3% accuracy. A variable speed controlled oleo-pneumatic system ensures smooth judder-free motion during the immersion and withdrawal strokes. Nano-Coat Dip Systems are totally safe to use with all coating materials including flammable liquids, for the very widest range of applications. Systems for the laboratory to large-scale in-line coating and curing systems. Stencil Cleaning Gensonic Our Gensonic Stencil Cleaning system uses a 40kHz on-contact ultrasonic transducer for high efficiency cleaning of stencil apertures. The Gensonic can be used either in conjunction with our Stencil Cleaning Centres or portable enough to be taken directly to the printer. Designed, Developed and Manufactured by Gen3 Systems in the UK at a price you won t believe. Solder Dross Recovery Solder Saver The Solder-Saver offers companies who use wave soldering the opportunity to instantly recycle dross created in the wave solder pot, thereby saving up to 50% in new solder bar purchases. It can be used with either leaded, lead free, or unleaded alloys. Environment and user friendly it has a very fast pay-back / ROI. Wizard Thermal Profiling ΔT Delta T - Wizard Thermal Profiling - a 5 channel temperature logger and user friendly software. Capable - Simple - Adaptable - Flexible - Accurate - Economic

Test Solderability MUST Solderability Testing, your first line of defence against counterfeit components. The industry benchmark for solderability testing, the MUST is capable of measuring down to 0.001mN making it THE most accurate and comprehensively equipped test system of its type in the world. It performs solderability testing in accordance with all major international standards and is supplied with everything necessary for all forms of solderability tests. SIR / ECM AutoSIR2 Automated precision Surface Insulation Resistance (SIR) measurement. AutoSIR2 has set the standard in SIR testing for more than 20 years. It is in use with most leading research and commercial laboratories around the world as well as many major electronic manufacturing groups. Testing up to 256 sites at selectable intervals, test and measurement voltages, with a measurement range of 10 6 Ω to 10 14 Ω CAF AutoCAF2 Measuring the influences of sub-surface electro-chemical reactions in printed circuit boards under conditions of high humidity and temperature to all recognised standards. Testing up to 256 sites at selectable intervals, test and measurement voltages, with a measurement range of 10 6 Ω to 10 14 Ω Test Voltages: 5v, 10v, ±50v and ±100v. Optional external power supply selectable up to 800v. Solder Paste Inspection Z-Check Non-contact solder paste measuring systems, designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Z-Check 3D - 3D Automatic Solder Paste Measuring System Z-Check 900 - Non Contact Solder Paste Measuring System with automatic positioning stage and laser alignment Z-Check 600 - Non Contact Solder Paste Measuring System with laser pointer Z-Check 100 - Manual Solder Paste Measuring System

www.gen3systems.com Distributor: A BRITISH MANUFACTURER Gen3 Systems Limited B2, Armstrong Mall, Southwood Business Park, Farnborough, Hampshire, GU14 0NR. UK Telephone: +44 (0)12 5252 1500 Fax: +44 (0)1252 521 515 Email: sales@gen3systems.com E&OE