SUCCESS - Miniaturized Radar Sensors. J. Christoph Scheytt 1,2

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SUCCESS - Miniaturized Radar Sensors RF-MST Cluster Workshop on MEMSWAVE 2013 J. Christoph Scheytt 1,2 1 IHP Leibnizinstitut für Innovative Mikroelektronik, Frankfurt (Oder) 2 Heinz Nixdorf Institut, Universität Paderborn

2 Content Motivation The SUCCESS Project 122 GHz Transceiver SoC w. basic BIST Miniaturized Radar Systems using SiP technology

3 Silicon Technologies for > 100 GHz Advanced silicon technology, (both CMOS, SiGe), enables operation frequencies beyond 100 GHz. Example: 245 GHz Transmitter 1 1 dbm output power at 245 GHz 0.13 µm SiGe BiCMOS (SG13G2) from IHP with f T, f max of 300, 500 GHz 245 GHz Transmitter IC 1 K. Schmalz et al., RFIC 2012 chip area 710 µm x 450 µm

4 Antennas for > 100 GHz Beyond 100 GHz wavelength in air becomes < 3mm allows for tiny mm-size antennas. /2 Example: Dipole antenna Small Antennas Extreme compact radar systems 122 GHz 4-element patch array antenna by KIT Even on-chip antennas cost-efficient

5 Challenges for Applications > 100 GHz Still there are no real high-volume applications at >100 GHz (neither Si or III-V) So, why? Challenges: Silicon at >100 GHz: low TX power, high RX noise figure tight link budget volume applications? No standard low-cost packaging solutions available How to achieve mm-wave low-cost packaging? IC production test at >100 GHz is extremely expensive, if feasible at all.

6 SUCCESS Project SUCCESS: Silicon Ultra-Compact Cost-Efficient Sensor System EU-Project (STREP) with 9 Partners: IHP, Bosch, ST Micro, KIT, SELMIC, Silicon Radar GmbH, HighTec, Evatronix, University of Toronto Goal: Complete Radar system with ultra-low-cost & extreme miniaturisation ( System-on-chip, System-In-Package, SMD package, integrated antennas, mm-wave self-testing) Start: Dec. 1st 2010 End: May 30th 2013

7 SUCCESS S/T Objectives S/T Objectives S/T Objective 1: Low-cost mm-wave SiP technology platform and design methodology: plastic SMD-type package, 3D-integration of planar antenna technology on low-cost substrate together with SiGe BiCMOS technology; co-design of antenna, package, and chip S/T Objective 2: mm-wave SoC design: SoC integration by means of digital-controlled mm-wave frontend and asynchronous digital baseband processor design S/T Objective 3: mm-wave Design for Test (DFT): developing novel methods for mm-wave Built-In-Self-Test (BIST) and mm-wave sensor System-In-Package test

8 Vision of mm-wave SoC mm-wave Radio ADC Processor Monopulse Radar mm-wave FE Dig. Controlled LO Bits in, mm-wave out Radio ~ 1 mm^2 chip area BB processor ADC SPI Interface signal combining and freq. translation Complete mm-wave SoC area dominated by digital content ~ 4 to 10 mm^2 Complete electronics ~ 1

9 Vision of mm-wave SiP System-In-Package (SiP) Integration of antennas SMD-type plastic package Precision HF substrate Allows for low cost package and easy assembly on PCB

10 SUCCESS Radar Sensor SUCCESS Sensor Principle / Application Frequency-modulated continous wave (FMCW) Radar Distance and Speed With multi-channel sensor: Angle-of-incidence Continuous Wave (CW) Radar Doppler-Radar, Speed Principle of FMCW Radar Operation in 122 GHz band Frequency Band-width Transmit power in air 122.5 GHz 1 GHz 100 mw EIRP 2.5 mm 245 GHz 2 GHz (20 dbm) 1.25 mm

11 SUCCESS Radar Sensor Radar Sensor Requirements Operating frequency 122 GHz Antenna gain (G RX, G TX ) : ~10 dbi per antenna Range: ~5 m Transmit power > 0 dbm RX P1dB > -15 dbm (20 db isolation) NF 10 db Frequency calibration, ramp linearization, self-testing Digitally controlled RF

12 SUCCESS Radar Sensor IC Radar Transceiver Block Diagram 1 1 For details see: Y. Sun et al. A low-cost miniature 120GHz SiP FMCW/CW radar sensor with software linearization., ISSCC 2013

13 SUCCESS Radar Sensor IC Radar Transceiver Block Diagram BIST example

14 SUCCESS Radar Sensor IC Example of mm-wave BIST Function Edge-coupled bi-directional coupler and power detectors for forward & backward wave Measurement of transmitted and reflected power at 122 GHz from 2 DC voltages (via analog MUX) Measure P out & S11 Allows for self-test of TX power and antenna interface matching

15 DC output (V) DC output (V) SUCCESS Radar Sensor IC Example of mm-wave BIST Function 1 Detector core Test IC 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 fwd back -16-11 -6-1 4 120 GHz input (dbm) Output matched (probes down) 1.2 1 0.8 0.6 0.4 0.2 0 fwd back -20-15 -10-5 0 5 120 GHz input (dbm) Output open (probes up) 1 EuMIC 2011, Sun et al. pp. 97-100

16 SUCCESS Radar Sensor IC Radar Transceiver Block Diagram Software linearization of frequency ramping

SUCCESS Radar Sensor IC Software-Linearized Frequency Ramping 17 VCO controlled by DAC and Counter Tuning-curve linarized by SRAM-LUT between Counter and DAC LUT values obtained automatically in calibration phase

18 SUCCESS Radar Sensor IC 120 GHz Radar System-On-Chip (SoC) Complete Radar System for FMCW / CW, on-chip calibration, digital control via SPI Ca. 4 mm 2 few electronic cost 0.13 µm BiCMOS (SG13S) from IHP TX power 0dBm RX NF ~ 11 db P diss = 0.35 W Only 1 external device XTAL Contribution from IHP, Silicon Radar GmbH

19 SUCCESS Radar Sensor I 8 mm 122 GHz SiP w. Integrated Antennas 8 mm 8 mm Small antennas enable integration of antennas into a compact SMD package Flip-chip technology for robust chip-antenna-interface Thin polyimde antenna substrate

20 SiP Technology Novel mm-wave SiP Technology using Flip-Chip Uses thin polymide substrate for chip-antenna conncection and antenna Flip-chip interconnect gives very good RF interface (very broadband, no compensation structures needed) Half-wave cap for low-loss encapsulation Contribution by KIT, SELMIC, Hightec MC

21 Applications for Short-Range Radar

22 Thank you.

Acknowledgements Y. Sun, A. Ergintav, K. Schmalz; IHP J. Hasch, D. Eichel, J. Seidel; Bosch B. Sautreuil; ST Micro T. Zwick, S. Beer; Karlsruhe Inst. of Technology W. Winkler, W. Debski; Silicon Radar GmbH J. Paaso; SELMIC OY T. Debski; Hightec MC AG P. Penkala, M. Zys; Evatronix S. Voinigescu; University of Toronto 24 This activity is supported by the European Community Framework Programme 7, Silicon-based Ultra-Compact Cost-Efficient System Design for mm-wave Sensors (SUCCESS), grant agreement no. 248120