Powering the Next Mobile Generation An overview of UFS. Samsung Semiconductor, Inc Memory Marketing

Powering the Next Mobile Generation An overview of UFS Samsung Semiconductor, Inc Memory Marketing

Panelists Kathy Choe Thomas Sr. Product Marketing Manager, Samsung John Geldman Director, Industry Standards, Micron Semiconductor Zachi Friedman Director of Product Marketing, Arasan Chip Systems Perry Keller Application and Standards Program Lead, Agilent Technologies, Inc. Moderator: Janine Love, UBM Tech Source: Cisco VNI Global Forecast, 2011 2016 Joel Goergen

UFS Propelling the Mobile Revolution Kathy Choe Thomas Samsung Semiconductor, Inc. Sr. Product Mktg Mgr, NAND Flash Products UFSA Board of Director, Marketing Committee Charirman

Shift in User Environment: PC Mobile + Cloud Units, M Computing Growth Drivers Over Time 10X IoE 100,000 10,000 1,000 100 10 1 Mainframe Minicomputer Wired Internet (Billion Devices) PC Mobile Internet (10 Billion Devices) 1960 1970 1980 1990 2000 2010 2020 Source: Morgan Stanley 2012: Mobile connected devices exceeded the world's population

Mobile Data Traffic Growth More Connections More Users >10B Devices 134EB Faster Speeds 2G 3G 4G More Video 5EB: The total data created between the dawn of civilization and 2003

Smartphone Adoption Continues to Grow > 80% of world s population has a mobile phone But only ~1/4 th of the world s population has a smartphone Smartphone adoption still has huge upside for global penetration

Tablet Growth Faster Than Smartphones Tablet shipments surpassed DT/NB PC s in Q4-12 < 3 Yrs from Intro! Large Screen Computing Device Demand is strong Mix favors Tablets, not PCs Sources: KPCB, Morgan Stanley Research, Gartner

Mobile Era Continues Evolving: IoE 99% of things in the physical world still not yet connected... Internet of Things Devices Internet Internet of People Social Networking Crowd Sourcing Internet of Everything P2P P2M M2M 2010: # Connected Devices Surpassed # of people in the world 2012: # Mobile Devices Surpassed # of people in the world 2020: 50+ Billion things will be connected & will talk to each other Sources: Cisco VNI

Mobile Device Evolution: The New PC Productivity/Creation Voice/Face Recog Input Comm HD Video Editing/Rendering True Multitasking 3D Graphics PC/Console-like Gaming 13MP, Burst Mode Photo Editing 4K Content Computing Productivity Camera Content Apps Apps for Everything Security Reliability BYOE Mobile Shopping Connectivity AOAC Smarter, faster, & more The New powerful devices Multiple Personal Sensors Require Smarter Computer & faster memory Cross Platforms IoE

Performance Improves But Power Still An Issue Smartphone performance exploding Battery capacity not keeping up 2010 (vs. 2010) 2020 Cellular 2~5Mbps x20 50~100Mbps 150~300Mbps x30 (B/W) Key Mobile Memory Requirements Wi-Fi Faster Performance & More Capability Display 7Gbps 720p x17 4,000p (Resolution) While Maintaining Low Power Consumption Video (Resolution) x34 720p H.264 4Kp H.265 Battery 5.76W/h x2.2 13W/h Source : ARM

Mobile Storage What s Needed? High Performance Efficiency/Responsiveness Low Power Longer Battery Life Instant ON Instant Play Multi-tasking Multi-Processing Productivity Apps PC-like Gaming Fast App Loading/ App Swapping Security Reliability New Security Challenges Robust Memory Enterprise/BYOD Mobile Shopping High Capacity More Memory More Apps, Richer Apps HD Video, High Res Photos 3D Graphics/4K Content Small Package Thinner is Better Quad/Octa-Core CPU Multi-tasking Larger screens AOAC High Capacity in Small Form Factor Small & Slim Pkg: Z-height is Key

Mobile-centric Storage: emmc UFS JEDEC Defined Storage Solutions Optimized for Mobile Devices emmc: Open Mobile Storage w/ Low Power (Mature, Not Scalable) UFS : Scalable, Higher Performance while maintaining Low Power emmc4.41 emmc4.5,5.0 UFS2.0 I/F Speed 100MBps 200MBps 400MBps 600MBps x 2 Lane End Products 2010 2012 2013 2014 Booting Partitioning Security Data integrity Interface Improvement Performance Enhancement Expandability/Scalability Serial interface, Multi-lane Higher Random IOPS Low Latency, High Efficiency UFS = Evolutionary progression of JEDEC standards for Mobile Storage

What is UFS... Universal Flash Storage In a nutshell: Tiny SSD for Mobile Devices & Beyond

UFS Advantage: The Fastest Interface UFS 2.0 exceeds current SSD interface of SATA 3.0 (6Gbps). Supports up to Gear 3 at 600MBps per lane with multi-lane support (Up to 1200MBps w/ 2 Lane) 2lane 2400 MB/s If 2 lanes used. 2lane 1200 MB/s 1200 MB/s 200 MB/s emmc 4.51 300 MB/s UFS 1.1 400 MB/s 300 MB/s emmc 5.0 600 MB/s SATA 3.0 600 MB/s UFS 2.0 UFS 3.0

UFS Advantage: Selectable & Scalable Speed UFS supports multiple interface speeds Host can adjust interface based on its needs in real time HS G3 HS G1 HS G2 PWM G4 PWM G1 PWM G2 PWM G3 3~9Mb/s 6~18Mb/s 12~36Mb/s 24~72Mb/s 1.25~1.5Gb/s 2.5~3Gb/s 6 Gb/s Less Power consumption More Performance

emmc vs. UFS: Interface Race Which do you prefer for your next mobile device? Congested Parallel Interface Simpler & Faster Serial Interface emmc High Speed Serial Interface Future expandability/scalability built-in Multi-Lane Support

UFS Advantage: Queuing & Asynch I/O Multiple Commands/Tasks, Multi-processing Demands Inefficiencies of emmc = Traffic Jam & back-up UFS Solution: Async I/O, Command Queuing & Reordering Higher Efficiency, Faster Completion

UFS Advantage: Higher Performance = Better UX Mobile OS Storage Pattern Analysis Random Write x1 x3 Seq Write, 12% Ran Write, 18% Seq Read, 28% emmc UFS Ran Read, 42% Better End User Experience! Source : Source: Samsung Samsung Internal Research

UFS Advantage: Battery Life Improvement estorage is the slowest device in system Performance Bottleneck UFS faster while consuming less system power emmc Seq. Write 12% Rnd. Write 18% Seq. Read 28% emmc Active Standby DRAM AP Rnd. Read 42% Samsung User Daily Workload Analysis UFS Sequential Read 3x Random Read 2x Ran Write 3x Total System Power Savings UFS DRAM AP Active Standby

UFS: Accelerated Migration for Mobile Evolution UFS: SSD s for Mobile Higher Performance & Efficiency with lower total power in small BGA pkg 2.4 GB/s Better, faster, scalable for future Higher efficiency UFS 3.0 (tentative) SCSI Based Async Protocol 1.2GB/s Good, sufficient performance, fuel-efficient UFS 2.0 UFS 2.x (tentative) Legacy Memory Card Based Sync Protocol 400 MB/s emmc4.3 emmc4.4 emmc4.41 emmc4.5 emmc5.0 emmc5.1 (tentative) 2009 2010 2011 2012 2013 2014 2015~16

UFS In Summary... Mobile Industry evolving quickly along with its flash needs Seeking higher performance and improved capabilities Enable next generation of smart & powerful mobile devices UFS succeeding emmc as the next generation of mobile flash Less Total Power Consumption Less Latency Less time to complete tasks Suitable for multi-processing and multi-processor environments SSD for Mobile

UFS In Summary... The UFS Advantage is clear... Less Total Power Consumption More Performance Less Latency More Efficiency Less time to complete tasks More Features UFS enables the next generation of smart & powerful devices for mobile & beyond...

What exactly is SSD for Mobile? John Geldman Director, Industry Standards Micron Technology

Mobile & SSD heritage Low Latency SSD/SAS Low Power UFS M-PHY Size is Right e MMC High Bandwidth January 30, 2014 M-PHY is trademark of MIPI

MIPI s MPHY a high bandwidth enabler UFS 2.0 supports multiple High Speed GEARS (see the M-PHY from www.mipi.org) Gear HS-G1 HS-G2 HS-G3 Transitions per second 1.25 to 1.45 Gtps 2.5 to 2.9 Gtps 5 to 5.8 Gtps UFS supports one or two lanes (for 2x bandwidth) UFS supports performance ranges from 125 MB/s (one lane of HS-G1) to 1.2 GB/s (two lanes of HS-G3) January 30, 2014 26

The SCSI queuing architecture a low latency enabler A single threaded command sequence Note: processing the write holds off starting the next command Command 1 (write) Payload 1 Status 1 Command 2 (read) Payload 2 Status 2 A multiple threaded in-order command sequence Note: Command 1 is completed before Payload 2 Command 1 (write) Command 2 Payload 1 Command 3 Status 1 (read) Payload 2 Status 2 A multiple threaded out-of-order command sequence Note: the bus is used at maximum performance Command 1 (write) Command 2 Payload 1 Command 3 Payload 2 Status 2 Status 1 (read) January 30, 2014 27

Low power mobile needs MPHY & SCSI Limit power draw of an idle interface M-PHY s Hibern8te state Control logical device power SCSI: START STOP UNIT command Low interface power on active transfers The differential voltage swing is 200 mv (terminated) CMOS power is proportion to C * V 2 * F Note: NAND array performance is proportional to array power: All UFS can do is minimize interface power January 30, 2014 28

Size matters for mobile BGA is the initial UFS form factor Does 12mm x 16mm work for you? Device Types X (mm) Y (mm) Area (mm 2 ) CompactFlash 42.8 36.4 1558 msata 24.2 48 1161 SD (standard) 24 32 768 M2 26 30 780 UFS 14 18 252 UFS 12 16 192 microsd 11 15 165 UFS 11.5 13 150 NAND package inside NAND die inside A micro card is in scope of UFS, but is only in discussions January 30, 2014 29

Low Latency Low Power Thank you! Size is Right High Bandwidth January 30, 2014

Creating a UFS Implementation Zachi Friedman Director of Product Marketing Arasan Chip Systems

Agenda UFS Architecture Implementation Challenges Complexity Challenge Physical Challenge Validating the Design

UFS Layered Architecture UFS-SCSI Command Set Layer (UCS) Application SW & Stacks UFS Transport Protocol Layer (UTP) UFS Inter-Connect Layer (UIC) UniPro M-PHY L4 = Transport L3 = Network L2 = Data Link L1.5 = Phy adapt L1 = M-PHY UFS Controller Host / Device (Digital) PHY (Analog)

UFS Host & Device Block Diagram SoC / Application Processor UFS Host IP System Bus UFS Device Controller UFS Device IP System Bus System Bus Interface Unit (BIU) System Bus Interface Unit (BIU) UFS Registers UFS Host Controller Interface (HCI) UFS Registers UFS Device Controller Interface UFS Transport Protocol Layer (UTP) UFS Transport Protocol Layer (UTP) UniPro UniPro Transport Layer (L4) Transport Layer (L4) Device Management Entity Network Layer (L3) Data Link Layer (L2) Device Management Entity Network Layer (L3) Data Link Layer (L2) PHY Adapter Layer (L 1.5) PHY Adapter Layer (L 1.5) M-PHY (L1) M-PHY (L1)

The Complexity Challenge A lot to implement M-PHY UniPro UFS Protocol Glue everything together Arasan s most complex IP to date!

The Physical Challenge 5.8 GHz channel Manage skew between 2 lanes Clock & Data Recovery (CDR) within short bursts M-PHY is a very complex PHY

The Validation Challenge Host Device Complex high speed protocols involved Validation equipment cannot be an after-thought Reference Validation equipment the need for Golden model Golden Host for validating device implementation Golden Device for validating host implementation

Bootstrapping the UFS Ecosystem Perry Keller Digital Applications and Standards Program Lead Memory Program Manager Member - Jedec and UFSA Board of Directors Chairman Jedec UFS (JC64.5) and UFSA Compliance Committees

UFS is Unique Developed in a truly open fashion Over 50 companies and a dozen separate committees across Jedec, MIPI Alliance and UFSA participated Everyone has equal opportunity to contribute and vote Big Boys don t always get their way Freedom from legacy support enables UFS to use Best of Class practices across the board Implements lessons learned from dozens of existing standards Applies to UFS technology AND entire enabling ecosystem 40 Bootstrapping the UFS Ecosystem DesignCon UFS Panel 2014

UFS Ecosystem Technical Standards T10 Test Procedures Technical Seminars UFS IP, Silicon, OS and System Developers Tools Marketing Collateral Logo Management Test and Measurement Equipment Providers BoD: Samsung, Micron, SK Hynix, Agilent, Phison, Silicon Motion Compliance Validation Process Workshops Plugfests Tools Authorized Test Centers Compliance Test Reports Logo License 41 Bootstrapping the UFS Ecosystem DesignCon UFS Panel 2014

42 Bootstrapping the UFS Ecosystem DesignCon UFS Panel 2014 The Universal Flash Storage Association (UFSA) was founded in 2010 as an open Trade Association to promote widespread industry adoption and acceptance of the UFS standard. Primary Missions: UFS technology promotion & infrastructure enablement Product compliance and UFS logo certification management Technical input into JEDEC for future specifications Current Board Members: Samsung, Micron, SK Hynix, Agilent, Phison & Silicon Motion www.universalflash.org

UFS Enablement Milestones 1H 2012 2H 1H 2013 2H 1H 2014 Jedec UFS 1.1 HCI 1.1 UFS Test 1.0 UFS 2.0 UFS Test 2.0 Industry UFS Prototype DUT MIPI Unipro 1.41 M-PHY 2.0 Unipro 1.61 M-PHY 3.0 M-Phy Test 1.0 Unipro Test 1.0 UFSA Compliance Committee Marketing Committee Board of Directors Website Logo Registration FAQ, Briefing slides Whitepapers Promotional/planning tours CTS 0.59 CTS 1.0 UFS Workshops & Plugfests ATC Certification UFS roadmap informative only and no guarantee on schedules 43 Bootstrapping the UFS Ecosystem DesignCon UFS Panel 2014

UFS Logo Certification Process Adopter Member Products Accredited Labs Compliance Certificate Logo Committee Success Criteria JC 64.5 Compliance Test Spec Logo License UTP Test Spec What & How to Measure UFS Test Spec Compliance Committee MIPI M-Phy & Unipro Test WGs M-Phy/Unipro Test Spec Certified Product

UFSA Compliance Test Events UFS Workshop By invitation only Test the Test Specification Potential early certification UFS Plugfest Open to UFSA members Pre-compliance test Potential Certification Certification Test Service provides by Authorized Test Centers Anyone can request testing Logo application requires UFSA membership AND compliance certification 45 Bootstrapping the UFS Ecosystem DesignCon UFS Panel 2014