SuperSpeed USB Update

Transcription

1 SuperSpeed USB Update Mobile World Congress 2014 Brad Saunders, USB-IF Chairman of the Board

2 Agenda SuperSpeed USB Key Messages USB New Developments Overview SuperSpeed USB Inter-Chip Summary USB Implementers Forum

3 SuperSpeed USB Key Messages A single source for audio/video that can drive Ultra-HD (4K) displays and deliver data and power simultaneously all over a single USB cable/port for every conceivable platform and mobile device End-to-end solutions available to consumers worldwide 1,000+ certified products SuperSpeed USB delivers Excellent Performance with speeds up to 10 Gbps USB Power Delivery helps simplify the lives of consumers by providing a seamless computing experience SuperSpeed USB works with all USB products USB Implementers Forum

4 USB Type-C Connector Key characteristics of the USB Type-C connector solution include: An entirely new design tailored to work well with emerging product designs New smaller size Similar in size to the existing USB 2.0 Micro-B Usability enhancements Users no longer need to be concerned with plug orientation/cable direction Makes it easier to plug in The Type-C connector/cable will support scalable power charging Scalability The connector design will scale for future USB bus performance CONFIDENTIAL USB Implementers Forum

5 SuperSpeed USB 10 Gbps Delivers 10 Gbps USB data rate 2x improvement over current SuperSpeed USB 5 Gbps data rate Improved data encoding for more efficient data transfer leading to higher through-put and improved I/O power efficiency Compatible with USB 3.0 software stacks and device protocols Works with both existing 5 Gbps and new 10 Gbps USB 3.0 hubs and devices, as well as USB 2.0 products CONFIDENTIAL USB Implementers Forum

6 USB Power Delivery: Taking a Great Idea Broad international adoption of USB Battery Charging standard for mobile devices China, Europe drove standardization as a means to increase charger reuse and reduce electronic waste 2.5W 4.5W 7.5W Agreement reached on Micro-USB connector and the standard for the USB 2.0 USB 3.0 USB BC 1.2 common mobile charger CENELEC and the USB Implementers Forum reach agreement on memorandum of understanding BRUSSELS March 1, 2011 A Memorandum of Understanding (MoU) was signed today between the USB-IF and CENELEC, the European Committee for Electrotechnical Standardization. USB Implementers Forum

7 USB Power Delivery: Taking a Great Idea and Making it Even Better SSD HDD 2.5W 4.5W 7.5W 65W 100W USB 2.0 USB 3.0 USB BC 1.2 Extend ease of use, reduce clutter, reduce even more waste Audio / Video Data Power USB Implementers Forum

8 Media Agnostic (MA) USB Allows wireless devices and docking stations to communicate over the USB protocol, without a physical USB connection A design goal of MA USB is to achieve wireless gigabit transfer rates while leveraging existing USB infrastructure WiGig Serial Extension (WSE) v1.2 specification from the Wi-Fi Alliance provides the initial foundation Multiple media types supported: WiGig 60Ghz Wi-Fi 2.4 and 5Ghz WiMedia UWB radios operating between Ghz, Other existing or new media types that want to use USB as the transport MA USB will be compliant with: SuperSpeed USB (USB 3.0) Hi-Speed USB (USB 2.0) CONFIDENTIAL USB Implementers Forum

9 SuperSpeed USB Inter-Chip (SSIC) Looking to fill these gaps! 5Gbps Key Objectives: SuperSpeed USB Inter-Chip (SSIC) supports USB 3.0 speeds up to 5 Gbps High-Speed Inter-Chip (HSIC) supports USB 2.0 speeds up to 480 Mbps 480Mbps Deliver a platform scalable chip-to-chip interconnect solution for SuperSpeed USB devices Preserve USB software ecosystem Minimize USB silicon ecosystem impact SPEED 12Mbps?????? HSIC & IC- USB Handheld Devices USB 2.0 Tablets and PCs USB 3.0 USB 2.0 Cabled Peripherals Inside-the-box uses USB Implementers Forum

10 USB SuperSpeed Inter-Chip (SSIC) SuperSpeed USB for inside-the-box applications Scalable speeds up to 5 Gbps Lower voltage/power than external USB 3.0 Optimized for mobile devices as well as PCs + = SSIC Software Model & SuperSpeed USB Protocol M-PHY SM Physical Layer USB Implementers Forum 2012

11 USB SuperSpeed Inter-Chip (SSIC) Why use SSIC for your mobile product? 1. Enables the logical transition from USB HSIC products for higher bandwidth with a physical layer optimized for low power mobile platforms Three times bandwidth for same power as HSIC 2. Leverage SuperSpeed USB protocol enhancements and infrastructure Hardware IP, Verification IP, Software OS Support SSIC specification is now available Included in the USB 3.0 Specification.zip download as: Inter-Chip Supplement to the USB Revision 3.0 Specification USB Implementers Forum 2012

12 USB SuperSpeed Inter-Chip (SSIC) Physical Layer: Replace the SuperSpeed USB PHY with a MIPI M-PHY SM PHY Adapter (PA): M-PHY Control and Management USB Link Layer: LTSSM changes for M-PHY USB Protocol and above: No changes Existing USB SW stack preserved USB Implementers Forum 2012

13 Worldwide Shipment of USB-enabled Devices USB is the most successful interface in the history of PC Device charging over USB has become a major consumer feature USB installed base is 10+ billion units and growing at 4+ billion units a year Shipments will reach roughly 5.1 billion devices by 2018, an increase of over 19% from 2012 Source: Multimedia Research Group, February 2014 USB Implementers Forum

14 Summary A single source for audio/video that can drive Ultra-HD (4K) displays and deliver data and power simultaneously all over a single USB cable/port for every conceivable platform and mobile device SuperSpeed USB delivers Excellent Performance with speeds up to 10 Gbps USB Power Delivery helps simplify the lives of consumers by providing a seamless computing experience USB SuperSpeed Inter-Chip (SSIC) delivers a platform scalable chip-to-chip interconnect solution for SuperSpeed USB devices USB Type-C connector is being developed to help enable thinner and sleeker product designs, enhance usability and provide a growth path for performance enhancements for future versions of USB Infinite Possibilities! USB Implementers Forum

15 Questions? Press kit available at: Follow-up: Lori Mesecke/Liz Nardozza +1 (512) USB Implementers Forum

16 Back-Up 16

17 USB Specification Developments Power Delivery Specification Published July 2012 Product enabling/development underway Enables high voltage and current in order to deliver power up to 100W Compatible with existing cables and connectors Enables voltage and current values to be negotiated over the USB power pins Switchable source of power delivery without changing cable direction SSIC Specification Published May 2012 Product enabling/development underway Defines chip-to-chip USB-based interconnect optimized for mobile device internal use Spec will combine MIPI s M- PHY high bandwidth and low power with the performance enhancements of SuperSpeed USB USB Implementers Forum

18 USB Specification Developments Audio/Video Class Specification Published December 2011 Supports transfer of A/V data over USB for smartphones, cameras, webcams, large HD displays & TVs Enables manufacturers to develop single-cable devices, providing A/V, data and power over a single USB cable Provides consumers with a solution that supplies data transfer, A/V capabilities power, mass storage and more Mobile Broadband Interface Model Specification Supports multiple IP connections per a single USB interface Enables flexible, efficient, low-cost, low-power implementations Minimizes overhead, data transfer efficiency by sending raw IP frames, eliminating need for Ethernet headers USB Implementers Forum

19 USB Power Delivery Profiles Source capabilities organized as profiles Hand-held devices, today s peripherals PROFILE 1 2A 10W Default start-up profile Tablets, netbooks, most peripherals PROFILE 2 2A 1.5A 18W Thinner notebooks, larger peripherals Larger notebooks, hubs, docks PROFILE 3 PROFILE 4 2A 3A 2A 3A 3A 36W 60W Limit for Micro-A/B Requires new detectable cables for >1.5A or >5V Workstations, hubs, docks PROFILE 5 2A 5A 5A 100W Limit for Standard A/B Source and Sink capabilities within a given product are not required to be the same USB Implementers Forum