SiC 2014 SiC propagates over all industrial segments. Contagion has begun

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1 SiC 2014 SiC propagates over all industrial segments. Contagion has begun Alstom II-VI AIST Denso CREE Mitsubishi Dow corning , cours Emile ZOLA, F Villeurbanne, France Tel: Fax: Web:

2 Projection of SiC Power Device Market Size Split by application Source: Yole Développement Executive Summary

3 Where Are SiC Chips Used Over the Entire Power Industry Value Chain Other Passives Power Stack Laminated Busbar Capacitors Assembly Drivers Protection Connectors Cooling Systems Power Modules SiC Chips Power Inverter Semiconductor Devices SiC vs. Si Market

4 Commercial SiC Diode Products Date introduced to the marketplace 1.2kV SBD Feb V JBS July kV SBD April V SBD Jan th gen. SBD 650V Sept Based on thin-wafer 8kV SBD Nov 2013 Dual 600V SBD Jan V SBD Feb 09 SBD May 2010 SBD Gen 2 July kV/15&30A SBD Mar V/12A SBD April kV / 50A SBD March kV SBD Dec kV SBD Sept V & 1.2kV SBD Sept th gen. SBD 1,200V July rd gen. SBD Feb kV SBD Nov PFC Market > 2018

5 PV Inverters Commercial Products with SiC Hybrid Si/SiC products. Source: SystemPlus Consulting Power One (US): Aurora Micro-inverter 205W (Micro-0.25-I-OUTD-230) 2 CREE SiC diodes 1200V/5A (TO263) + 2 CREE diodes 600V/4A (TO252) Courtesy of System+ Consulting PV Inverter

6 Market Size of Motor AC Drives by Application and Type Yole Développement May 2013 Over a total of ~$xxb in 2013 White-goods are not implemented here as it uses mostly IPM, not power modules Motor Drive Market

7 Roadmap for SiC implementation in rail traction, by main players Current Prototype Market Hybrid Si/SiC Full SiC Prototype full-sic with Rohm& Danfoss. 1.7kV Waiting for device availability to start R&D Waiting for device availability to start R&D Full SiC. 1.7kV No information No information Full SiC Full SiC There are two possible strategies for SiC in rail traction: Integrate SiC diodes (hybrid modules) and then Full-SiC Mitsubishi Work on Full SiC from scratch, and skip Si/SiC hybrid step Alstom, bombardier It save additional design developments and R&D investments

8 China Wide Band-gap Power Semiconductor Industry Alliance (2/2) Wafer Epi wafer Device Module and system

9 BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: ORDER FORM SiC Market PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F Lyon, France, Bank code: 30056, Branch code : Account No: , SWIFT or BIC code: CCFRFRPP, IBAN: FR / Date: PRODUCT ORDER Please enter my order for above named report : One user license*: Euro 3,990 Multi user license: Euro 5,990 *One user license means only one person at the company can use the report. Please be aware that our publication will be watermarked on each page with the name of the recipient and of the organization (the name mentioned on the PO). This watermark will also mention that the report sharing is not allowed. For price in dollars, please use the day s exchange rate. All reports are delivered 20% for VAT I hereby accept Yole Développement s Terms and Conditions of Sale (1) Signature: RETURN ORDER BY FAX: +33 (0) MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, Villeurbanne/Lyon - France SALES CONTACTS North America: David Jourdan - [email protected] Asia: Takashi Onozawa - [email protected] Europe & RoW: Jean-Christophe Eloy - [email protected] Korea: Hailey Yang - [email protected] General: [email protected] (1) Our Terms and Conditions of Sale are available at The present document is valid 24 months after its publishing date: September 22 th, 2014 SHIPPING CONTACT First Name: Last Name: Phone: ABOUT YOLE DEVELOPPEMENT Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CONSULTING Market data & research, marketing analysis Technology analysis Reverse engineering & costing services Strategy consulting Patent analysis More information on FINANCIAL SERVICES Mergers & Acquisitions Due diligence Fundraising Coaching of emerging companies IP portfolio management & optimization More information on REPORTS Collection of technology & market reports Manufacturing cost simulation tools Component reverse engineering & costing analysis Patent investigation More information on MEDIA & EVENTS i-micronews.com, online disruptive technologies weekly e-newsletter Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics Communication & webcasts services Events: Yole Seminars, Market Briefings More information on CONTACTS For more information about : Consulting Services: Jean-Christophe Eloy ([email protected]) Financial Services: Géraldine Andrieux-Gustin ([email protected]) Report Business: David Jourdan ([email protected]) Corporate Communication: Sandrine Leroy ([email protected])

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