Innovative development and deployment of Intuitive Human Machine Interface for embedded applications
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1 Innovative development and deployment of Intuitive Human Machine Interface for embedded applications
2 Glance MSC is operating in two business areas Distribution Technical Department Boards Systems Impact Description Distribution of electronic components Service Support around Europe including Design-In, Supply Chain Management and many more MSC-GE ranks 4th among the Distributors in Germany Customised Engineering and Design-In of PCBA s Medical technology Industrial-PC Embedded Computer Display & Grafik Assembly of boards USP by combination with our distribution department USP with integrated customdesigned circuits Synergistic effect associated with distribution side Engineering & production of components, systems and devices for OEM customers Complete manufacture Komplette Fertigung from concept to finished system Historically with focus on medical technology, Displays and Industrial-PC s Aktive Diversifizierungsstrategie ca. 64 % ca. 36 %
3 Agenda Smart Monitor for Intuitive HMI MSC nanorisc module for deeply Embedded Applications. Seite 3
4 CYBERSCREEN: The Smart Monitor for Intuitive HMI Seite 4
5 CYBERSCREEN Main Board Block Diagram Seite 5
6 Implementation scalable up/down Flash Page Description (.txt)/ Graphics (.bmp) User parameters to interface all TFT types SDRAM/ DDR1/2/3 SDRAM/ DDR1/2/3 Ctrl SPI/ Parallel Flash Display Controller TFT Wishbone Touch Sw application Sw API IQ-Engine SW / Touch screen Mico32 UART/S PI/ I2C UART/ SPI/ I2C /Parallel IQ-GraphBlit 2D Accelerator Markets: Vending Machine, Dashboard, GPS Navigation, Medical Surveillance, Generic Remote Terminal Automotive, PLC, Heating System, etc... Scalable/Migrable Lattice products: XO ECP3-17 ECP2-12 Seite 6
7 IQ-Engine Capabilities & GUI Elements Capabilities: Highly optimized graphics engine running on the Lattice Mico32 CPU and/or external CPU such as ARM Utilizes the IQ-GraphBlit FPGA-based 2D Graphics accelerator to render high quality 2D graphics GUI elements: Renders touch screen user interfaces composed out of standard elements: Labels and images Push-buttons and Toggle-buttons Sliders, scrollbars and knobs Indicators Numeric, text and message fields Dynamic graphics Bar-graphs Gauges Trends Import external objects Seite 7
8 IQ-Engine: Graphical Tool to design GUI IQ-Editor WYSIWYG GUI Editor Allows touch screen HMI interfaces to be designed in a graphical environment Standard graphics themes Fully custom graphics GUI elements can be bound to the Tag database or assigned UI actions Visualization of Tag data Modification of Tag data Video mixing settings can be controlled directly from the GUI Seite 8
9 Display Ecosystem Versatile & Scalable The IQ-Display ecosystem consists of: FPGA components IQ-DispLite display controller IP core IQ-GraphBlit graphic accelerator IP core Optional: IQ-MEM memory controller IQ-LinkSPI SPI bridge Firmware components IQ-Engine embedded graphics engine Software components IQ-Editor WYSIWYG HMI project editor Seite 9
10 Embedded Computer Technology Products Embedded Computer Technology Computer-On-Modules COM Express ETX/ET(e) Nanorisk Qseven EXM32 BIOS Customer specific developments System Integration
11 nanorisc Performance Range New COM family from MSC The main targets: CPU range from ARM9 up to ARM Cortex-A9 multi core... and more Performance up to medium x86 level Deeply-embedded interface (easy system integration) Low power / passive cooling (mostly no heat sink required) Low cost / small form factor 11
12 nanorisc nanorisc - Target Markets Target markets: POI Terminals POS / Cash Register Terminals Any kind of low and medium HMI Medical Equipment Industrial Equipment (non ruggedized) Low to medium Digital Signage Home Automation (Domotics) V2oIP (Video and Voice over IP) Video Surveillance Taxi Meters w/ Navigation and Multimedia Mobile Devices Small panel PC Embedded PC 12
13 nanorisc Typical application Backside view Display with electronics CPU Module (Scalable Family) Display Back Side Fixation Plate Carrier-board (Customer or MSC) Display Connector 13
14 nanorisc System I/O of the Module 2 x USB (2 Host, 1 OTG / Client) System IO MIN MAX 3 x UART LAN 10/100/ (1000, FFU) 1 1 MMC / SD x I2C SPI x SPI I2C 1 2 UART 1 3 UART Debug 1 1 Display (TTL, TFT 18/24Bit) (MIPI alternative) Touch (4 wire IF) USB Host 0 2 USB Client or OTG 0 1 Display 18/24 TTL, (AO) 1 1 HDMI, (AO) 0 1 Audio, digital 1 1 TV Out 0 1 Touch 0 1 Camera 0 1 PCIe x 1, (FFU) 0 1 DDR 2 SDRAM 128MByte - 2GByte ARM Processor Camera IF 1 x MMC / SD Card CF Card GPIO (PWM / Timer / Counter ) Audio (AC97 / I2S / PCM / SPDIF) CAN Controller MCP2515 Connector MXM 230 PIN SATA, (FFU) 0 1 Local Bus 0 1 CF Card 0 1 PWM 2 2 NAND FLASH 128MByte - 2GByte Ethernet 10/100 MAC PHY ENC624J600 Local Bus (8 or 16 bit bus) LAN Timer 2 2 CAN, (AO) 0 1 MIPI, (AO) 0 1 JTAG 0 1 Battery Management 1 1 Note: (FFU) = For Future Use (AO) = Assembly Otion Clock Distribution SEEPROM microsd Card Slot JTAG - UART CPU Specific GPIOs PMIC-W3810 -Power- Management 5VDC Supply Lithium Battery 14
15 nanorisc System I/O per Module System IO MIN MAX Note LAN 10/100/ (1000, FFU) 1 1 S5PV210 Cortex A8 S5PC100 Cortex A8 Module Support AM335x Cortex A8 S3C2416 ARM 9 plan of record Cortex A9 MAC / PHY on board, Transformer on carrier 1 1 1(2) 1 1 MMC / SD 1 2 One micro SD Slot on module SPI I2C UART 1 2(3) Tx / Rx / RTSn / CTSn 2(3) 2(3) 2(3) 2(3) 2(3) UART Debug 1 1 Debug UART on module USB Host (2.0) 1 (1.1) 1 (2.0) 1 (1.1) 1 (2.0) USB Client or OTG (OTG, 2.0) 1 (OTG, 2.0) 1 (OTG, 2.0) 1 (Client, 1.1) 1 (OTG, 2.0) Display 18/24 TTL, (AO) HDMI / LVDS (AO) 0 1 1/0 1/0 0/0 0/0 1/2 Max. Resolution HDMI /LVDS 1920x x720 n.a. 1920x1080 Max.Resolution TTL 1366x x x x x768 Audio, digital 1 1 I2S, option AC97, PCM or HDA 1 (I2S or AC97 or PCM) 1 (I2S or AC97 or PCM) 1 (I2S) 1 (I2S or AC97 or PCM) TV Out Touch wire Touch Camera PCIe x 1, (FFU) 0 1 for future use SATA, (FFU) 0 1 for future use Local Bus CF Card 0 1 shared with Local Bus PWM 0 2 Timer 2 2 *) max. not specified because of multi functions pins *) max. not specified because of multi functions pins CAN, (AO) MIPI, (AO) 0 1 only present if supported by CPU 1 (Full) 1 (Full) JTAG 0 1 JTAG on module Battery Management Note: 1 (I2S) (FFU) = For Future Use (AO) = Assembly Otion 15
16 nanorisc System I/O Evaluation Board MB2 Evaluation Board MB2 2 x USB (2 Host, 1 OTG / Client) 2 x UART 2 x I2C USB Power RS232 PHY 2 x Type A, 1 x Type B, 1 x OTG 2 x DSUB 9 Graphics connector 50 pin 2 x SPI Graphics connector 50 pin Display (TTL, TFT 18 /24Bit) (MIPI alternative) Graphics connector 50pin & 40 pin Touch (4 wire IF) FFC, 4 pin MSC Camera IF 1 x MMC / SD Card IDC Connector, 1 x 20 pin MMC/SD Connector Low Cost HDMI / DVI HDMI Connector RISC Module Backlight control Audio (AC97) Audio Codec IDC Connector, 20 pin Audio Connector 1x CAN CAN PHY IDC Connector, 10 pin LAN ETH Transformer RJ 45 Local Bus IDC Connector 50pin CPU Specific GPIOs / SPI IDC Connector 20 pin Power Supply Power Connectors Lithium Batterie Gold Capacitor 16
17 nanorisc Mechanical Data (1) Form Factor 17
18 Mechanical Data (2) nanorisc Form Factor Module PCB Standard use Depending of socket used Carrier PCB max. 6.00, typ (depending on module)0 0.1 max optional: Heatspreader Module PCB Depending of socket used Carrier PCB Note: 1. Component height on module top max. 5.50mm 2. Component height on module bottom max. 2.50mm 3. Tolerance if not noted 0.20mm 4. Depending on the used connector the total height varies between 12.2 and 9.9 mm (without heatspreader) If heat sink is required 18
19 nanorisc AM335x Module NANORISC-AM335x Texas Instruments AM335x Cortex -A8 from 300MHz up to 800MHz Up to 512MByte DDR3 SDRAM soldered Up to 512MByte SLC NAND Flash soldered Up to 64Gbyte emmc Flash 10/100 Base-T Ethernet Interface Optional 2nd 10/100 or GbE LAN USB 2.0 High Speed (Host + OTG) Versatile Graphics Interface RGB 16/18/24 bit up to 1366 x 768 CAN 2.0B, 3x UART, 2x SPI, 2x I²C I²S Audio Interface SD V2.0 / SDIO V1.0 / MMC V4.2 19
20 nanorisc AM335x Module Highlights ARM Cortex-A8 32-bit RISC CPU at 300MHz, 500MHz, 600MHz or 800MHz NEON SIMD Coprocessor 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity) 256KB of L2 Cache with Error Correcting Code (ECC) SGX530 Graphics Accelerator Engine (option) LCD Controller supporting up to 1366 x 768 resolution (HD) Real-Time Clock (RTC) USB 2.0 High-Speed Host and OTG Ports with integrated PHY 10/100 Base-T Ethernet Optional GbE or 2nd 10/100 LAN Interface; optional RT-Ethernet Serial Interfaces including: Controller Area Network Port (CAN) 2x UARTs, 2x I2C Ports, 2x SPI Interfaces Audio Interfaces: I2S, SPDIF, McASP MMC / SD Interface and 1x CF Card Port microsd Card Socket soldered on Module Watchdog Timer Battery Charger supporting 1x Lithium Cell LED Backlight Interface incl. Current Source for LED Backlight 20
21 nanorisc Base Board MB2 nanorisc Baseboard MB2 Mi ni HDMI LAN USB Host USB OTG Headphone LineOu t LineIn MIC CAN Connector Power 1 COM 0 & COM 1 Power 2 Camera Port Backlight Graphic LVDS SD Card Graphic 50 pin GPIO Connector Power, Support depends on PMIC program Backlight External Bus Interface Reset 21
22 nanorisc Software Support Model Software LINUX (Android - future) WinCE Customer Application Application MSC Operating System Drivers LINUX 2.6 Drivers WinCE 6.0 / 7 MSC Bootloader UBOOT EBOOT WinCE BSP and Support is in preparation at a partner company 22
23 nanorisc Main Advantages Summary Why should I use nanorisc Modules? Huge CPU scalability from ARM9 (400MHz) to Cortex A8 (300MHz 1GHz) ARM CPUs offer a lot of interfaces without additional cost for the baseboard Low cost module designed for high quantities Low power, usually no cooling requirements Provided interface ideal for embedded solutions Full Linux and WinCE support 23
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